公开(公告)号：US20160155912A1

公开(公告)日：2016-06-02

申请号：US14908252

申请日：2014-07-30

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： Markus Burger ,  Tobias Gebuhr ,  Ion Stoll

IPC: H01L33/56 ,  H01L33/60 ,  H01L33/50

CPC classification number: H01L33/56 ,  H01L33/486 ,  H01L33/502 ,  H01L33/505 ,  H01L33/60 ,  H01L2933/0041 ,  H01L2933/005 ,  H01L2933/0058 ,  H01L2933/0083 ,  H01L2933/0091

Abstract: A method of producing a cover element for an optoelectronic component includes producing a frame having a multiplicity of openings, wherein the frame is made of a material having embedded particles of TiO2, ZrO2, Al2O3, AlN, SiO2, or another optically reflective material and/or an embedded colored pigment; introducing a material into a multiplicity of the openings; and dividing the frame.

Abstract translation: 一种制造光电元件用覆盖元件的方法包括制造具有多个开口的框架，其中该框架由具有TiO 2，ZrO 2，Al 2 O 3，AlN，SiO 2或其它光学反射材料的嵌入颗粒的材料制成，和/ 或嵌入的有色颜料; 将材料引入多个开口中; 并分割框架。

公开(公告)号：US09209367B2

公开(公告)日：2015-12-08

申请号：US14410956

申请日：2013-06-18

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Markus Boss ,  Markus Pindl ,  Tobias Gebuhr ,  Simon Jerebic ,  Martin Brandl

IPC: H01L33/00 ,  H01L33/54 ,  H01L33/48 ,  H01L33/62 ,  H01L21/56 ,  H01L21/78 ,  H01L23/29 ,  H01L23/498 ,  H01L33/58

CPC classification number: H01L33/54 ,  H01L21/565 ,  H01L21/78 ,  H01L23/29 ,  H01L23/49811 ,  H01L23/49861 ,  H01L33/486 ,  H01L33/58 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2933/005 ,  H01L2924/00014

Abstract: An electrical component includes a closed lead frame with a passage opening at least one electrical component arranged within the passage opening, the electrical component including a first contact pad on one side of the electrical component and a second contact pad on a second side of the electric component, wherein the second side faces the first side and the second contact pad is electrically coupled to the lead frame; and an encapsulation which mechanically couples the electrical component to the lead frame, wherein the lead frame includes a recess on one side, the recess extending from an edge of the lead frame to the passage opening and connecting at least one electrical connecting element from the edge of the lead frame to the component arranged in the passage opening.

Abstract translation: 电气部件包括具有通道开口的封闭引线框架，所述通道开口至少设置在通道开口内的电气部件，所述电气部件包括在所述电气部件的一侧上的第一接触焊盘和所述电气部件的第二侧上的第二接触焊盘 其中所述第二侧面向所述第一侧，并且所述第二接触焊盘电耦合到所述引线框架; 以及封装，其将所述电气部件机械耦合到所述引线框架，其中所述引线框架包括在一侧上的凹部，所述凹部从所述引线框架的边缘延伸到所述通道开口，并且将至少一个电连接元件从所述边缘 引导框架布置在通道开口中的部件。

公开(公告)号：US20150228873A1

公开(公告)日：2015-08-13

申请号：US14426072

申请日：2013-08-28

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Tobias Gebuhr ,  Matthias Knörr ,  Klaus Müller ,  Thomas Schwarz ,  Frank Singer ,  Michael Zitzlsperger

IPC: H01L33/62 ,  H01L21/56 ,  H01L21/48 ,  H01L51/56 ,  H01L51/52

CPC classification number: H01L33/483 ,  H01L21/4828 ,  H01L21/565 ,  H01L23/49861 ,  H01L24/32 ,  H01L25/0753 ,  H01L33/62 ,  H01L51/5237 ,  H01L51/5246 ,  H01L51/5296 ,  H01L51/56 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48471 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/83385 ,  H01L2224/92247 ,  H01L2924/12041 ,  H01L2924/12044 ,  H01L2924/181 ,  H01L2933/0033 ,  H01L2933/0066 ,  Y10T29/49121 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A housing for an optical component is provided in various embodiments. The housing has a leadframe section and a mold compound. The leadframe section is formed from an electrically conductive material and has a first side and a second side facing away from the first side. On the first side, the leadframe section has at least one first receiving region for receiving the optical component and/or at least one contact region for electrically contacting the optical component. The leadframe section has at least one trench which is formed in the leadframe section on the first side thereof alongside the receiving region and/or the contact region. The leadframe section is embedded in the mold compound. The mold compound has at least one receiving recess in which the first receiving region and/or the contact region and the trench are arranged.

Abstract translation: 在各种实施例中提供了用于光学部件的壳体。 壳体具有引线框架部分和模具复合体。 引线框架部分由导电材料形成，并且具有背离第一侧的第一侧和第二侧。 在第一侧，引线框架部分具有用于接收光学部件的至少一个第一接收区域和/或用于电接触光学部件的至少一个接触区域。 引线框架部分具有沿着接收区域和/或接触区域在其第一侧上的引线框架部分中形成的至少一个沟槽。 引线框架部分嵌入模具化合物中。 模具化合物具有至少一个容纳凹槽，其中布置有第一接收区域和/或接触区域和沟槽。

公开(公告)号：US11345068B2

公开(公告)日：2022-05-31

申请号：US16227789

申请日：2018-12-20

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Peter Nagel ,  Tobias Gebuhr

IPC: B29C45/14 ,  B29C33/14 ,  B29L31/34 ,  B29C45/26 ,  B29L31/00 ,  B29C39/10 ,  B29C33/42 ,  B29C33/00 ,  B29D11/00

Abstract: A method of embedding opto-electronic components in a layer, wherein the components are disposed beside one another to be spaced apart on a carrier, including providing a molding tool having a bearing plate, wherein the bearing plate on a lower side includes resilient bearing regions, bringing the bearing plate by way of the resilient bearing regions to bear on upper sides of the components, filling an intermediate space between the components, the carrier, and the bearing plate with a molding material, curing the molding material to form the layer, and removing the molding tool from the layer and the embedded components.

公开(公告)号：US10886145B2

公开(公告)日：2021-01-05

申请号：US16072993

申请日：2017-01-26

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Michael Zitzlsperger ,  Tobias Gebuhr ,  Stephan Eicher

IPC: H01L21/40 ,  H01L23/495 ,  H01L21/48 ,  H01L23/00 ,  H01L23/31 ,  H01L33/62 ,  H01L33/52 ,  H01L21/56 ,  H01L33/00 ,  H01L33/48 ,  H01L25/075

Abstract: A method of producing a surface-mountable multi-chip component includes providing a chip arrangement including a metallic conductor structure exposed at a rear side, a plurality of semiconductor chips and an housing material; and forming a solder stop coating on a rear side of the chip arrangement, wherein the solder stop coating separates connection regions of the conductor structure.

公开(公告)号：US10297537B2

公开(公告)日：2019-05-21

申请号：US15541765

申请日：2016-01-07

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Martin Brandl ,  Tobias Gebuhr

IPC: H01L23/495 ,  H01L33/00 ,  H01L33/62 ,  H01L23/00 ,  H01L33/48 ,  H01L21/56

Abstract: A lead frame used to produce a chip package includes a first lead frame section and a second lead frame section connected to one another by a bar, wherein the bar includes a first longitudinal section, a second longitudinal section and a third longitudinal section, the first longitudinal section adjoins the first lead frame section and the third longitudinal section adjoins the second lead frame section, the first longitudinal section and the third longitudinal section are oriented parallel to one another, the first longitudinal section and the second longitudinal section form an angle not equal to 180° and not equal to 90°, and the lead frame is planar.

公开(公告)号：US20180182934A1

公开(公告)日：2018-06-28

申请号：US15389213

申请日：2016-12-22

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： I-Hsin Lin-Lefebvre ,  Reinhard Streitel ,  Darshan Kundaliya ,  Tobias Gebuhr

IPC: H01L33/50 ,  H01L33/62

CPC classification number: H01L33/508 ,  H01L33/502 ,  H01L33/505 ,  H01L33/507 ,  H01L33/54 ,  H01L33/62 ,  H01L2224/16245 ,  H01L2224/48091 ,  H01L2933/0041 ,  H01L2933/005 ,  H01L2933/0066 ,  H01L2924/00014

Abstract: A light emitting unit includes a light emitting semiconductor chip and a wavelength converter for the light of the semiconductor chip. The wavelength converter has a substrate with a first surface. The first surface includes a rough surface with recesses. The wavelength converter has a conversion layer that is arranged on the first surface of the substrate. The conversion layer has luminescent materials. A connecting layer is arranged between the wavelength converter and a light emitting surface of the light emitting semiconductor chip.

公开(公告)号：US09947843B2

公开(公告)日：2018-04-17

申请号：US14908252

申请日：2014-07-30

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Markus Burger ,  Tobias Gebuhr ,  Ion Stoll

IPC: H01L33/00 ,  H01L33/56 ,  H01L33/50 ,  H01L33/60 ,  H01L33/48

CPC classification number: H01L33/56 ,  H01L33/486 ,  H01L33/502 ,  H01L33/505 ,  H01L33/60 ,  H01L2933/0041 ,  H01L2933/005 ,  H01L2933/0058 ,  H01L2933/0083 ,  H01L2933/0091

Abstract: A method of producing a cover element for an optoelectronic component includes producing a frame having a multiplicity of openings, wherein the frame is made of a material having embedded particles of TiO2, ZrO2, Al2O3, AlN, SiO2, or another optically reflective material and/or an embedded colored pigment; introducing a material into a multiplicity of the openings; and dividing the frame.

公开(公告)号：US20170288108A1

公开(公告)日：2017-10-05

申请号：US15507767

申请日：2015-08-31

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Michael Schumann ,  Tobias Gebuhr ,  David Racz ,  Matthias Sperl

IPC: H01L33/62 ,  H01L33/50 ,  H05K3/32 ,  H01L33/58 ,  H05K1/18 ,  H01L33/56 ,  H01L33/60

CPC classification number: H01L33/62 ,  H01L33/486 ,  H01L33/502 ,  H01L33/56 ,  H01L33/58 ,  H01L33/60 ,  H01L2224/05555 ,  H01L2224/0603 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2933/0041 ,  H01L2933/005 ,  H01L2933/0058 ,  H01L2933/0066 ,  H05K1/18 ,  H05K3/284 ,  H05K3/32 ,  H05K2201/10106 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: An optoelectronic device includes a printed circuit board, and a light source arranged on a surface of the printed circuit board, said light source comprising at least one luminous face formed by at least one light-emitting diode wherein the light-emitting diode is electrically connected to the printed circuit board, wherein the light-emitting diode is at least partly enclosed by molding by a potting compound.

公开(公告)号：US09741616B2

公开(公告)日：2017-08-22

申请号：US14405393

申请日：2013-05-03

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Thomas Schlereth ,  Michael Bestele ,  Christian Gaertner ,  Tobias Gebuhr ,  Hans-Christoph Gallmeier ,  Peter Holzer ,  Karlheinz Arndt ,  Albert Schneider

IPC: G01R31/27 ,  H01L21/78 ,  H01L33/00 ,  H01L33/62 ,  H01L21/50 ,  H01L21/66 ,  G01R31/26 ,  H01L33/48 ,  H01L23/495

CPC classification number: H01L21/78 ,  G01R31/2635 ,  H01L21/50 ,  H01L22/10 ,  H01L23/49541 ,  H01L23/49565 ,  H01L33/0095 ,  H01L33/486 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2933/0033 ,  H01L2933/0066 ,  H01L2924/00014

Abstract: In one embodiment, the method is configured for producing optoelectronic semiconductor components (1) and includes the steps of: providing a leadframe assembly (20) with a multiplicity of leadframes (2), each having at least two leadframe parts (21, 22); forming at least a part of the leadframe assembly (20) with a housing material for housing bodies (4); dividing the leadframe assembly (20) between at least one part of the columns (C) and/or the rows (R), wherein the leadframes (2) remain arranged in a matrix-like manner; equipping the leadframes (2) with at least one optoelectronic semiconductor chip (3); testing at least one part of the leadframes (2) equipped with the semiconductor chips (3) and formed with the housing material after the step of dividing; and separating to form the semiconductor components (1) after the step of forming and after the step of testing.