公开(公告)号：US06600224B1

公开(公告)日：2003-07-29

申请号：US09703062

申请日：2000-10-31

申请人： Donald S. Farquhar ,  Raymond T. Galasco ,  Sung Kwon Kang ,  Mark D. Poliks ,  Chandrika Prasad ,  Roy Yu

发明人： Donald S. Farquhar ,  Raymond T. Galasco ,  Sung Kwon Kang ,  Mark D. Poliks ,  Chandrika Prasad ,  Roy Yu

IPC分类号： H01L2312

CPC分类号： H01L24/83 ,  H01L24/29 ,  H01L24/90 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05644 ,  H01L2224/13111 ,  H01L2224/16225 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/29116 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29311 ,  H01L2224/29339 ,  H01L2224/73267 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/07811 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/1579 ,  H05K3/244 ,  H05K3/3457 ,  H05K3/4602 ,  H05K3/4614 ,  H05K3/4688 ,  H05K2201/0154 ,  H05K2203/0307 ,  H05K2203/061 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2924/00014 ,  H01L2924/01083

摘要： An electronic interconnection assembly having a thin film bonded to either a glass ceramic or to an organic laminate substrate, and a method for attaching a thin film wiring package to the substrate. Provided is the utilization of adhesives which may be processed at significantly lower temperatures so as to avoid damaging components, the wiring package and interconnection joints. Moreover, pursuant to specific aspects, the joining of the thin film to the substrate may be implemented with the utilization of dendrites.

摘要翻译： 具有与玻璃陶瓷或有机层叠基板结合的薄膜的电子互连组件，以及将薄膜布线包装件附着到基板上的方法。 提供了可以在显着较低温度下处理的粘合剂的使用，以避免损坏组件，布线包和互连接头。 此外，根据具体方面，可以利用枝晶来实现薄膜与基底的接合。

公开(公告)号：US5194930A

公开(公告)日：1993-03-16

申请号：US760654

申请日：1991-09-16

申请人： Kostas Papathomas ,  Mark D. Poliks ,  David W. Wang ,  Frederick R. Christie

发明人： Kostas Papathomas ,  Mark D. Poliks ,  David W. Wang ,  Frederick R. Christie

IPC分类号： C09J163/00 ,  H01L21/56 ,  H01L23/29 ,  H01L23/31

CPC分类号： H01L21/563 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01087 ,  H01L2924/10253

摘要： Composition and solder interconnection structure for its use, wherein the gap created by solder connections between a carrier substrate and a semiconductor chip device mounted thereon is filled with the solvent free formulation obtained by curing a preparation containing a cycloaliphatic polyepoxide and/or curable cyanate ester or prepolymer thereof, polyol, and filler which is substantially free of alpha particle emissions.

摘要翻译： 用于其使用的组合物和焊料互连结构，其中通过在载体衬底和安装在其上的半导体芯片器件之间的焊料连接产生的间隙填充有通过固化含有脂环族聚环氧化物和/或可固化氰酸酯的制剂而获得的无溶剂配方，或 其预聚物，多元醇和基本上不含α粒子排放物的填料。

公开(公告)号：US06967705B2

公开(公告)日：2005-11-22

申请号：US10925021

申请日：2004-08-25

申请人： Donald S. Farquhar ,  Mark D. Poliks

发明人： Donald S. Farquhar ,  Mark D. Poliks

IPC分类号： G02F1/13 ,  B32B7/04 ,  B32B37/00 ,  C09K19/00 ,  H05K1/03 ,  H05K3/46

CPC分类号： H05K3/4632 ,  B32B7/04 ,  B32B37/00 ,  B32B37/0046 ,  B32B2037/0092 ,  B32B2305/34 ,  B32B2305/55 ,  B32B2307/204 ,  B32B2307/3065 ,  B32B2307/5825 ,  B32B2309/02 ,  B32B2311/00 ,  C09K19/00 ,  H05K1/0313 ,  H05K3/4641 ,  H05K2201/0141 ,  H05K2201/0195 ,  H05K2201/09318 ,  Y10T428/24273 ,  Y10T428/24331

摘要： A multi-layered structure and method of formation. A page is generated by stacking N substructures (N≧2) in an ordered sequence. A first substructure of each pair of adjacent substructures comprises liquid crystal polymer (LCP) dielectric material to be bonded with a second substructure of a pair of the adjacent substructure. The page is subjected to a temperature less than the lowest nematic-to-isotropic transition temperature of the LCP dielectric materials within the page. The dwell time and elevated pressure are sufficient to cause all LCP dielectric material within the page to plastically deform and laminate each pair of adjacent substructures without any extrinsic adhesive layer disposed between the first and second substructures of each pair of adjacent substructures.

摘要翻译： 多层结构和形成方法。 通过以有序的顺序堆叠N个子结构（N> = 2）来生成页面。 每对相邻子结构的第一子结构包括要与一对相邻子结构的第二子结构结合的液晶聚合物（LCP）电介质材料。 该页面经受低于页内LCP介电材料的最低向列 - 各向同性转变温度的温度。 停留时间和升高的压力足以使页内的所有LCP电介质材料塑性变形并层压每对相邻的子结构，而不会在每对相邻子结构的第一和第二子结构之间设置任何外在粘合剂层。

公开(公告)号：US06645607B2

公开(公告)日：2003-11-11

申请号：US10213646

申请日：2002-08-06

申请人： Brian E. Curcio ,  Donald S. Farquhar ,  Konstantinos I. Papathomas ,  Mark D. Poliks

发明人： Brian E. Curcio ,  Donald S. Farquhar ,  Konstantinos I. Papathomas ,  Mark D. Poliks

IPC分类号： B32B300

CPC分类号： H05K3/462 ,  H05K3/386 ,  H05K3/4069 ,  H05K3/4623 ,  H05K3/4641 ,  H05K2201/0959 ,  H05K2201/096 ,  H05K2201/10378 ,  H05K2203/0353 ,  H05K2203/0384 ,  H05K2203/0554 ,  H05K2203/063 ,  Y10T29/49002 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T428/24917

摘要： A method of forming a core for and forming a composite wiring board. The core has an electrically conductive coating on at least one face of a dielectric substrate. At least one opening is formed through the substrate extending from one face to the other and through each conductive coating. An electrically conductive material is dispensed in each of the openings extending through the conducting coating. At least a portion of the surface of the conductive coating on one face is removed to allow a nub of the conductive material to extend above the substrate face and any remaining conductive material to thereby form a core that can be electrically joined face-to-face with a second core member or other circuitized structure.

公开(公告)号：US06254972B1

公开(公告)日：2001-07-03

申请号：US09343079

申请日：1999-06-29

申请人： Donald S. Farquhar ,  Konstantinos I. Papathomas ,  Mark D. Poliks

发明人： Donald S. Farquhar ,  Konstantinos I. Papathomas ,  Mark D. Poliks

IPC分类号： B32B300

CPC分类号： H05K1/036 ,  H01L2224/16 ,  H01L2924/15311 ,  H05K1/0269 ,  H05K1/034 ,  H05K1/0373 ,  H05K3/386 ,  H05K2201/0116 ,  H05K2201/015 ,  H05K2201/0209 ,  H05K2203/122 ,  H05K2203/161 ,  Y10T428/24917 ,  Y10T428/249958 ,  Y10T428/25 ,  Y10T428/252 ,  Y10T428/256 ,  Y10T428/31544

摘要： A semiconductor device having a thermoset-containing, dielectric material and methods for fabricating the same is provided. The device may take the form of a printed circuit board, an integrated circuit chip carrier, or the like. The dielectric material is a non-fibrillated, fluoropolymer matrix that has inorganic particles distributed therein and is impregnated with a thermoset material.

公开(公告)号：US06207595B1

公开(公告)日：2001-03-27

申请号：US09033505

申请日：1998-03-02

申请人： Bernd K. Appelt ,  Lawrence R. Blumberg ,  William T. Fotorny ,  Ross D. Havens ,  Robert M. Japp ,  Kostas Papathomas ,  Jan Obrzut ,  Mark D. Poliks ,  Amarjit S. Rai

发明人： Bernd K. Appelt ,  Lawrence R. Blumberg ,  William T. Fotorny ,  Ross D. Havens ,  Robert M. Japp ,  Kostas Papathomas ,  Jan Obrzut ,  Mark D. Poliks ,  Amarjit S. Rai

IPC分类号： B32B2704

CPC分类号： H01L23/564 ,  H01L23/08 ,  H01L23/145 ,  H01L2924/0002 ,  H05K1/0366 ,  H05K2201/029 ,  H05K2201/0761 ,  Y10T442/2475 ,  Y10T442/2959 ,  Y10T442/2992 ,  H01L2924/00

摘要： A fabric material and method of its manufacture suitable for use in electronic packages including chip carriers. High insulation resistance is exhibited when subjected to high temperatures and humidity stress conditions.

摘要翻译： 一种其制造的织物材料及其制造方法，其适用于包括芯片载体的电子封装。 当受到高温和高湿度条件的影响时，表现出高的绝缘电阻。