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    Chip-scale cooling device having through-silicon vias and flow directing features
    41.
    发明授权
    Chip-scale cooling device having through-silicon vias and flow directing features 有权

    公开(公告)号：US10157817B1

    公开(公告)日：2018-12-18

    申请号：US15881443

    申请日：2018-01-26

    Applicant: Toyota Motor Engineering & Manufacturing North America, Inc.

    Inventor： Feng Zhou ,  Ercan M. Dede

    IPC: H01L23/433 ,  H01L23/498 ,  H01L21/48 ,  H01L23/495 ,  H01L23/427

    Abstract: A cooling structure includes a first substrate layer including an array of cooling channels, a second substrate layer including a nozzle structure, an outlet manifold, and an outlet, a third substrate layer including an inlet, and inlet manifold, and one or more flow directing features are disposed within the inlet manifold. The one or more flow directing features include one or more micro-pillars extending into the cooling fluid flow path from the inlet manifold, the first substrate layer includes one or more first substrate layer through-holes, the second substrate layer includes one or more second substrate layer-through holes, and the third substrate layer includes one or more third-substrate layer through holes. The first substrate layer through-holes, the second substrate layer through-holes, and the third substrate layer through-holes are aligned into one or more TSVs and metallized.

    PROGRAMMABLE ULTRASONIC THERMAL DIODES
    43.
    发明申请
    PROGRAMMABLE ULTRASONIC THERMAL DIODES 审中-公开

    公开(公告)号：US20170328648A1

    公开(公告)日：2017-11-16

    申请号：US15151679

    申请日：2016-05-11

    Applicant: Toyota Motor Engineering & Manufacturing North America, Inc.

    Inventor： Ercan M. Dede ,  Feng Zhou ,  Shailesh N. Joshi

    IPC: F28D15/06 ,  F28D15/04

    CPC classification number: F28D15/025 ,  F28D15/0233 ,  F28D15/04 ,  F28D15/06 ,  F28F13/10 ,  F28F2245/02

    Abstract: Heat transfer apparatuses and methods for directing heat transfer are disclosed. A heat transfer apparatus includes a vapor chamber having a first surface and a second surface where the first surface and the second surface define a chamber space and at least one of the first surface and the second surface includes a hydrophilic coating. The heat transfer apparatus also includes one or more first ultrasonic oscillators coupled to the first surface, one or more second ultrasonic oscillators coupled to the second surface, and a controller having a non-transitory, processor-readable storage medium storing programming instructions for selectively activating the one or more first ultrasonic oscillators or the one or more second ultrasonic oscillators based on an intended direction of heat flux.

    TWO-PHASE JET IMPINGEMENT COOLING DEVICES AND ELECTRONIC DEVICE ASSEMBLIES INCORPORATING THE SAME
    45.
    发明申请
    TWO-PHASE JET IMPINGEMENT COOLING DEVICES AND ELECTRONIC DEVICE ASSEMBLIES INCORPORATING THE SAME 有权

    公开(公告)号：US20170094837A1

    公开(公告)日：2017-03-30

    申请号：US14870962

    申请日：2015-09-30

    Applicant: Toyota Motor Engineering & Manufacturing North America, Inc.

    Inventor： Shailesh N. Joshi ,  Ercan M. Dede

    IPC: H05K7/20

    CPC classification number: H05K7/20327 ,  H05K7/20345

    Abstract: Two-phase jet impingement cooling devices and electronic device assemblies are disclosed. In one embodiment, a cooling device includes a manifold having a fluid inlet surface, a fluid outlet surface defining an outlet manifold, and a fluid outlet. The fluid inlet surface includes an inlet channel fluidly coupled to a first jet region and a second jet region each including a plurality of jet orifices and a plurality of surface features extending from the fluid inlet surface. A target plate is coupled to the fluid outlet surface of the manifold that includes a target surface, a first heat sink, and a second heat sink. A cover plate is coupled to the fluid inlet surface of the manifold, which includes a fluid inlet port fluidly coupled to the inlet channel of the manifold, and a fluid outlet port fluidly coupled to the fluid outlet of the manifold.

    Two-phase cooling systems, power electronics modules, and methods for extending maximum heat flux
    46.
    发明授权
    Two-phase cooling systems, power electronics modules, and methods for extending maximum heat flux 有权
    两相冷却系统，电力电子模块和扩展最大热通量的方法

    公开(公告)号：US09320171B2

    公开(公告)日：2016-04-19

    申请号：US14297043

    申请日：2014-06-05

    Applicant: Toyota Motor Engineering & Manufacturing North America, Inc.

    Inventor： Shailesh N. Joshi ,  Ercan M. Dede

    IPC: H05K7/20

    CPC classification number: H05K7/2029 ,  H01L23/427 ,  H01L2924/0002 ,  H05K7/2039 ,  H05K7/20927 ,  H05K7/20936 ,  H01L2924/00

    Abstract: Two-phase cooling systems, power electronics modules, and methods for extending a maximum heat flux point of a two-phase cooling device are disclosed. In one embodiment, a method of operating a two-phase cooling device having an inlet, a chamber fluidly coupled to the inlet, and a heat transfer surface configured to receive heat flux from a heat generating device includes detecting at least one two-phase process parameter of the two-phase cooling device, and controlling a temperature of a coolant fluid at the inlet such that it is a first inlet temperature Tin1 when the at least one two-phase process parameter is less than a threshold. The method further includes controlling a temperature of the coolant fluid at the inlet such that it is a second inlet temperature Tin2, where Tin2 is less than Tin1.

    Abstract translation: 公开了用于延长两相冷却装置的最大热通量点的两相冷却系统，电力电子模块和方法。 在一个实施例中，一种操作两相冷却装置的方法，所述两相冷却装置具有入口，与所述入口流体耦合的室，以及被配置为从热生成装置接收热通量的传热表面，包括检测至少一个两相过程 参数，并且当所述至少一个两相过程参数小于阈值时，控制所述入口处的冷却剂流体的温度，使得其为第一入口温度Tin1。 该方法还包括控制入口处的冷却剂流体的温度，使得其为Tin2小于Tin1的第二入口温度Tin2。

    Circuit Boards With Thermal Control and Methods for Their Design
    47.
    发明申请
    Circuit Boards With Thermal Control and Methods for Their Design 有权
    具有热控制的电路板及其设计方法

    公开(公告)号：US20160029476A1

    公开(公告)日：2016-01-28

    申请号：US14340886

    申请日：2014-07-25

    Applicant: Toyota Motor Engineering & Manufacturing North America, Inc.

    Inventor： Paul D. Schmalenberg ,  Ercan M. Dede ,  Tsuyoshi Nomura

    IPC: H05K1/02 ,  G06F17/50

    CPC classification number: G06F17/5077 ,  G06F17/5081 ,  G06F2217/78 ,  G06F2217/80 ,  H05K1/0203 ,  H05K1/0298 ,  H05K3/0005 ,  H05K2201/09781 ,  H05K2203/304

    Abstract: Circuit boards and computer-implemented methods for designing circuit boards are disclosed. In one embodiment, a method of designing a circuit board having an insulator substrate includes determining, by a computer, a plurality of thermal conductor traces that is arranged to direct heat flux generated by a heat generating component away from a temperature sensitive component, and determining a plurality of electrical connection traces based on an input schematic. At least a portion of the plurality of electrical connection traces incorporate at least a portion of the plurality of thermal conductor traces to define a conductive trace pattern that electrically connects pins of two or more components located on the substrate. The conductive trace pattern includes the plurality of thermal conductor traces and the plurality of electrical connection traces. Disruption of the plurality of thermal conductor traces is avoided while determining the plurality of electrical connection traces.

    Abstract translation: 公开了用于设计电路板的电路板和计算机实现的方法。 在一个实施例中，设计具有绝缘体衬底的电路板的方法包括由计算机确定多个热导体迹线，其布置成将由发热组件产生的热通量引导远离温度敏感部件，并且确定 基于输入原理图的多个电连接迹线。 多个电连接迹线的至少一部分包含多个热导体迹线的至少一部分，以限定电连接位于衬底上的两个或更多个部件的引脚的导电迹线图案。 导电迹线图案包括多个热导体迹线和多个电连接迹线。 在确定多个电连接迹线的同时避免了多个热导体迹线的破坏。

    TWO-PHASE COOLING SYSTEMS, POWER ELECTRONICS MODULES, AND METHODS FOR EXTENDING MAXIMUM HEAT FLUX
    48.
    发明申请
    TWO-PHASE COOLING SYSTEMS, POWER ELECTRONICS MODULES, AND METHODS FOR EXTENDING MAXIMUM HEAT FLUX 有权
    两相冷却系统，功率电子模块和扩展最大热通量的方法

    公开(公告)号：US20150359133A1

    公开(公告)日：2015-12-10

    申请号：US14297043

    申请日：2014-06-05

    Applicant: Toyota Motor Engineering & Manufacturing North America, Inc.

    Inventor： Shailesh N. Joshi ,  Ercan M. Dede

    IPC: H05K7/20

    CPC classification number: H05K7/2029 ,  H01L23/427 ,  H01L2924/0002 ,  H05K7/2039 ,  H05K7/20927 ,  H05K7/20936 ,  H01L2924/00

    Abstract: Two-phase cooling systems, power electronics modules, and methods for extending a maximum heat flux point of a two-phase cooling device are disclosed. In one embodiment, a method of operating a two-phase cooling device having an inlet, a chamber fluidly coupled to the inlet, and a heat transfer surface configured to receive heat flux from a heat generating device includes detecting at least one two-phase process parameter of the two-phase cooling device, and controlling a temperature of a coolant fluid at the inlet such that it is e a first inlet temperature Tin1 when the at least one two-phase process parameter is less than a threshold. The method further includes controlling a temperature of the coolant fluid at the inlet such that it is a second inlet temperature Tin2, where Tin2 is less than Tin1.

    Abstract translation: 公开了用于延长两相冷却装置的最大热通量点的两相冷却系统，电力电子模块和方法。 在一个实施例中，一种操作两相冷却装置的方法，所述两相冷却装置具有入口，与所述入口流体耦合的室，以及被配置为从热生成装置接收热通量的传热表面，包括检测至少一个两相过程 参数，并且控制入口处的冷却剂流体的温度，使得当至少一个两相过程参数小于阈值时，其为第一入口温度Tin1。 该方法还包括控制入口处的冷却剂流体的温度，使得其为Tin2小于Tin1的第二入口温度Tin2。

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