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    Universal systems printed circuit board for interconnections
    43.
    发明授权
    Universal systems printed circuit board for interconnections 失效
    通用系统用于互连的印刷电路板

    公开(公告)号：US07425684B2

    公开(公告)日：2008-09-16

    申请号：US12075336

    申请日：2008-01-30

    Applicant: Sang Henry Ta

    Inventor： Sang Henry Ta

    IPC: H05K1/00

    CPC classification number: H05K1/142 ,  H05K1/0287 ,  H05K1/029 ,  H05K3/42 ,  H05K2201/09627 ,  H05K2201/09963 ,  H05K2201/10363 ,  H05K2203/173

    Abstract: In Electronics, there exists three distinctive areas namely, discrete components or devices, circuits, and systems. A circuit is built from devices and a system is built from circuits. This invention aims at reducing the implementation of electronic systems down to just three steps namely, systems design, printed-circuit-board planar assembly, and systems test when-as a plurality of Universal Systems Printed-Circuit Blocks of pre-defined sizes is used. Each of said Universal Systems Printed-Circuit Blocks being usable and reusable for prototypes and production is built from a printed circuit board having thereon a functional circuit and a variety of circuit patterns and interconnection structures such that, any of said blocks, when joined together with other blocks on the same plane by standard connectors or electrically conductive compounds to form a systems board, can send and receive signals and voltages to and from any other blocks.

    Abstract translation: 在电子学中，存在三个独特的领域，即分立元件或器件，电路和系统。 电路由设备构成，系统由电路构成。 本发明旨在将电子系统的实现降低到三个步骤，即系统设计，印刷电路板平面组装和系统测试 - 当使用预定义尺寸的多个通用系统印刷电路块 。 每个所述通用系统印刷电路块可用于和可重复使用的原型和生产由其上具有功能电路和各种电路图案和互连结构的印刷电路板构成，使得任何所述块当与 通过标准连接器或导电化合物形成系统板的同一平面上的其他块可以向任何其他块发送和接收信号和电压。

    UNIVERSAL SYSTEMS PRINTED CIRCUIT BOARD FOR INTERCONNECTIONS
    44.
    发明申请
    UNIVERSAL SYSTEMS PRINTED CIRCUIT BOARD FOR INTERCONNECTIONS 失效
    通用系统印刷电路板互连

    公开(公告)号：US20080173474A1

    公开(公告)日：2008-07-24

    申请号：US12075336

    申请日：2008-01-30

    Applicant: Sang Henry Ta

    Inventor： Sang Henry Ta

    IPC: H05K1/11

    CPC classification number: H05K1/142 ,  H05K1/0287 ,  H05K1/029 ,  H05K3/42 ,  H05K2201/09627 ,  H05K2201/09963 ,  H05K2201/10363 ,  H05K2203/173

    Abstract: In Electronics, there exists three distinctive areas namely, discrete components or devices, circuits, and systems. A circuit is built from devices and a system is built from circuits. This invention aims at reducing the implementation of electronic systems down to just three steps namely, systems design, printed-circuit-board planar assembly, and systems test when-as a plurality of Universal Systems Printed-Circuit Blocks of pre-defined sizes is used. Each of said Universal Systems Printed-Circuit Blocks being usable and reusable for prototypes and production is built from a printed circuit board having thereon a functional circuit and a variety of circuit patterns and interconnection structures such that, any of said blocks, when joined together with other blocks on the same plane by standard connectors or electrically conductive compounds to form a systems board, can send and receive signals and voltages to and from any other blocks.

    Abstract translation: 在电子学中，存在三个独特的领域，即分立元件或器件，电路和系统。 电路由设备构成，系统由电路构成。 本发明旨在将电子系统的实现降低到三个步骤，即系统设计，印刷电路板平面组装和系统测试 - 当使用预定义尺寸的多个通用系统印刷电路块 。 每个所述通用系统印刷电路块可用于和可重复使用的原型和生产由其上具有功能电路和各种电路图案和互连结构的印刷电路板构成，使得任何所述块当与 通过标准连接器或导电化合物形成系统板的同一平面上的其他块可以向任何其他块发送和接收信号和电压。

    Method for producing a light emitting diode arrangement, and light emitting diode arrangement
    45.
    发明申请
    Method for producing a light emitting diode arrangement, and light emitting diode arrangement 有权
    用于制造发光二极管装置的方法和发光二极管装置

    公开(公告)号：US20080087903A1

    公开(公告)日：2008-04-17

    申请号：US11904170

    申请日：2007-09-26

    Applicant: Harald Stoyan

    Inventor： Harald Stoyan

    IPC: H01L29/18 ,  H01L21/02

    CPC classification number: H05K1/141 ,  F21S2/005 ,  F21V21/005 ,  F21V23/06 ,  F21Y2115/10 ,  H05K1/142 ,  H05K1/147 ,  H05K1/148 ,  H05K3/3442 ,  H05K3/363 ,  H05K2201/046 ,  H05K2201/09963 ,  H05K2201/10106

    Abstract: A method for producing a light emitting diode arrangement. A plurality of LED modules (110, 120, 130) are provided, which in each case comprise at least one radiation emitting semiconductor component (1000) on a carrier body (1300). At least one separately fabricated connection carrier (200) is provided. The LED modules are arranged in such a way that they are adjacent to one another in pairs. A mechanically stable and electrically conductive connection between the carrier bodies of two LED modules is produced by means of the connection carrier. Furthermore, a light emitting diode arrangement is disclosed.

    Abstract translation: 一种制造发光二极管装置的方法。 提供了多个LED模块（110,120,130），其在每种情况下都包括在载体主体（1300）上的至少一个辐射发射半导体部件（1000）。 提供至少一个单独制造的连接支架（200）。 LED模块以彼此成对相邻的方式布置。 通过连接载体产生两个LED模块的载体之间的机械稳定且导电的连接。 此外，公开了一种发光二极管装置。

    Memory module
    47.
    发明授权
    Memory module 失效
    内存模块

    公开(公告)号：US07215540B2

    公开(公告)日：2007-05-08

    申请号：US11008901

    申请日：2004-12-10

    Applicant: Shih-Hsiung Lien

    Inventor： Shih-Hsiung Lien

    IPC: G06F1/16 ,  H05K5/00 ,  H05K7/00 ,  H05K1/14 ,  H01R12/16

    CPC classification number: H05K1/142 ,  H05K2201/09172 ,  H05K2201/09181 ,  H05K2201/09963 ,  H05K2201/10159 ,  H05K2201/209

    Abstract: A memory module includes a plurality of memory units, an assembling holder and an engaging arrangement. The assembling holder includes an elongated unit housing having at least an elongated receiving slot extended therealong. The engaging arrangement includes a first assembling joint provided at a side edge portion of one of the memory substrates, and a second assembling joint provided at a corresponding side edge portion of an adjacent memory substrate, wherein the first assembling joint is fittedly and detachably engaged with the second assembling joint of the adjacent memory unit to alignedly couple the memory units with each other in an edge to edge manner to inset into the receiving slot of the elongated unit housing.

    Abstract translation: 存储器模块包括多个存储器单元，组装保持器和接合装置。 组装保持器包括细长单元壳体，其具有沿其延伸的至少一个细长的接收槽。 接合装置包括设置在其中一个存储器基板的侧边缘部分处的第一组装接头和设置在相邻存储器基板的相应侧边缘部分处的第二组装接头，其中第一组装接头可以与 相邻存储器单元的第二组装接头，以边缘到边缘方式彼此对准地将存储单元彼此对准地插入到细长单元壳体的接收槽中。

    Memory module
    48.
    发明申请
    Memory module 失效
    内存模块

    公开(公告)号：US20050146856A1

    公开(公告)日：2005-07-07

    申请号：US11008901

    申请日：2004-12-10

    Applicant: Shih-Hsiung Lien

    Inventor： Shih-Hsiung Lien

    IPC: H05K1/14 ,  H05K5/00

    CPC classification number: H05K1/142 ,  H05K2201/09172 ,  H05K2201/09181 ,  H05K2201/09963 ,  H05K2201/10159 ,  H05K2201/209

    Abstract: A memory module includes a plurality of memory units, an assembling holder and an engaging arrangement. The assembling holder includes an elongated unit housing having at least an elongated receiving slot extended therealong. The engaging arrangement includes a first assembling joint provided at a side edge portion of one of the memory substrates, and a second assembling joint provided at a corresponding side edge portion of an adjacent memory substrate, wherein the first assembling joint is fittedly and detachably engaged with the second assembling joint of the adjacent memory unit to alignedly couple the memory units with each other in an edge to edge manner to inset into the receiving slot of the elongated unit housing.

    Abstract translation: 存储器模块包括多个存储器单元，组装保持器和接合装置。 组装保持器包括细长单元壳体，其具有沿其延伸的至少一个细长的接收槽。 接合装置包括设置在其中一个存储器基板的侧边缘部分处的第一组装接头和设置在相邻存储器基板的相应侧边缘部分处的第二组装接头，其中第一组装接头可以与 相邻存储器单元的第二组装接头，以边缘到边缘方式彼此对准地将存储单元彼此对准地插入到细长单元壳体的接收槽中。

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