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    CIRCUIT BOARD AND METHOD OF MOUNTING ELECTRONIC COMPONENT ON PRINTED BOARD
    41.
    发明申请
    CIRCUIT BOARD AND METHOD OF MOUNTING ELECTRONIC COMPONENT ON PRINTED BOARD 失效
    电路板和打印板上电子元件安装方法

    公开(公告)号：US20100315794A1

    公开(公告)日：2010-12-16

    申请号：US12744295

    申请日：2008-12-22

    Applicant: Hitoshi Kidokoro

    Inventor： Hitoshi Kidokoro

    IPC: H05K7/00 ,  H05K3/30

    CPC classification number: H05K1/18 ,  H05K2201/10454 ,  H05K2201/10484 ,  H05K2201/10522 ,  H05K2201/1053 ,  H05K2201/10651 ,  Y10T29/4913

    Abstract: When U-shape formed electronic components having an axial lead shape are mounted upright on a printed board, two U-shape formed electronic components having an axial lead shape are arranged so as not to be in the same straight line, and a wiring pattern is formed in a state where bent-side lead wires have the same electric potential, and the electronic components are inclined so as to place the bent-side lead wires close to each other, whereby the electronic components that tend to fall in the inclined direction can be mutually supported by the bent-side lead wires. Thus, the electronic components can be prevented from falling without spoiling a heat dissipation performance of the electronic component and the board, and without greatly deteriorating an assembly performance of the board.

    Abstract translation: 当具有轴向引线形状的U形形成的电子部件竖直地安装在印刷电路板上时，具有轴向引线形状的两个U形成形的电子部件被布置成不成为相同的直线，并且布线图案 形成在弯曲侧引线具有相同电位的状态下，并且电子部件倾斜以使弯曲侧引线彼此靠近，从而倾斜倾斜方向的电子部件可以 由弯曲侧引线相互支撑。 因此，可以防止电子部件落下而不会破坏电子部件和电路板的散热性能，并且不会极大地降低电路板的组装性能。

    CIRCUIT MODULE
    43.
    发明申请
    CIRCUIT MODULE 审中-公开
    电路模块

    公开(公告)号：US20100032198A1

    公开(公告)日：2010-02-11

    申请号：US12528401

    申请日：2008-02-20

    Applicant: Hirobumi Inoue

    Inventor： Hirobumi Inoue

    IPC: H05K1/02

    CPC classification number: H05K1/025 ,  H05K1/0218 ,  H05K1/024 ,  H05K1/183 ,  H05K3/403 ,  H05K2201/0715 ,  H05K2201/091 ,  H05K2201/09154 ,  H05K2201/09827 ,  H05K2201/10446 ,  H05K2201/10484

    Abstract: An inclined peripheral portion 103 having a tapered shape in a cross-sectional view, in which the thickness thereof is reduced toward the edge of an interconnection substrate 102, is provided at the edge of the interconnection substrate 102. In addition, inner layers 112 are provided such that the distance therebetween is reduced toward the edge of the interconnection substrate in the inclined peripheral portion 103. A first interconnection conductor 104 and a second interconnection conductor 105 are provided on both inclined planes of the inclined peripheral portion 103 so as to be electrically connected to each other at the leading end of the inclined peripheral portion 103.

    Abstract translation: 在互连基板102的边缘处设置有在横截面视图中具有锥形形状的倾斜周边部分103，其中其厚度朝向互连基板102的边缘减小。另外，内层112 被设置为使得它们之间的距离朝向倾斜周边部分103中的互连基板的边缘减小。第一互连导体104和第二互连导体105设置在倾斜周边部分103的两个倾斜平面上，以便电 在倾斜周边部103的前端彼此连接。

    Printed wiring board and method for manufacturing the same
    44.
    发明申请
    Printed wiring board and method for manufacturing the same 有权
    印刷电路板及其制造方法

    公开(公告)号：US20090290318A1

    公开(公告)日：2009-11-26

    申请号：US12453718

    申请日：2009-05-20

    Applicant: Michimasa Takahashi

    Inventor： Michimasa Takahashi

    IPC: H05K1/14 ,  H05K3/36

    CPC classification number: H05K1/183 ,  H01L2224/45144 ,  H01L2224/48091 ,  H05K1/141 ,  H05K1/142 ,  H05K1/185 ,  H05K3/4602 ,  H05K3/4694 ,  H05K2201/10484 ,  H05K2203/049 ,  Y10T29/49126 ,  H01L2924/00014 ,  H01L2924/00

    Abstract: A printed wiring board includes a first substrate having a recess portion and multiple conductors, a second substrate having multiple conductors and inserted in the recess portion of the first substrate such that the first substrate has a surface exposing at least a portion of a surface of the second substrate. The multiple conductors in the first substrate is electrically connected to the multiple conductors in the second substrate, and the second substrate has density of the conductors which is higher than density of the conductors of the first substrate.

    Abstract translation: 印刷布线板包括具有凹部和多个导体的第一基板，具有多个导体的第二基板，并插入在第一基板的凹部中，使得第一基板具有暴露出第一基板的表面的至少一部分的表面 第二基板。 第一衬底中的多个导体电连接到第二衬底中的多个导体，并且第二衬底具有比第一衬底的导体的密度高的导体的密度。

    METHOD OF CONNECTING A SERIES OF INTEGRATED DEVICES UTILIZING FLEXIBLE CIRCUITS IN A SEMI-STACKING CONFIGURATION
    45.
    发明申请
    METHOD OF CONNECTING A SERIES OF INTEGRATED DEVICES UTILIZING FLEXIBLE CIRCUITS IN A SEMI-STACKING CONFIGURATION 审中-公开
    连接使用柔性电路的一系列集成器件在半封装配置中的方法

    公开(公告)号：US20090183364A1

    公开(公告)日：2009-07-23

    申请号：US12016261

    申请日：2008-01-18

    Applicant: Gerald K. Bartley ,  Darryl J. Becker ,  Paul E. Dahlen ,  Philip R. Germann ,  Andrew B. Maki ,  Mark O. Maxson

    Inventor： Gerald K. Bartley ,  Darryl J. Becker ,  Paul E. Dahlen ,  Philip R. Germann ,  Andrew B. Maki ,  Mark O. Maxson

    IPC: H05K3/30

    CPC classification number: H05K1/147 ,  H01L2224/16227 ,  H01L2224/73253 ,  H05K1/0203 ,  H05K1/141 ,  H05K2201/046 ,  H05K2201/10159 ,  H05K2201/10484 ,  H05K2201/10515 ,  Y10T29/4913

    Abstract: A method of serially connecting devices utilizing flexible circuits in a semi-stacking configuration includes positioning a first flexible circuit on a carrier, the first flexible circuit includes a bottom surface and a top surface, a portion of the bottom surface is mounted to the carrier while another portion of the bottom surface is elevated at a first angle with respect to the carrier; coupling a first device on a portion of the top surface of the first flexible circuit, the first device being elevated at the first angle; positioning a second flexible circuit on the carrier, the second flexible circuit having an upper surface and a lower surface, a portion of the lower surface is mounted to the carrier while another portion of the lower surface is elevated at a second angle with respect to the carrier and overlapped over a top surface portion of the first device; and coupling a second device on a portion of the upper surface of the second flexible circuit, the second device being elevated at the second angle.

    Abstract translation: 使用半堆叠配置中的柔性电路串联连接装置的方法包括将第一柔性电路定位在载体上，第一柔性电路包括底表面和顶表面，底表面的一部分安装到载体上， 底表面的另一部分相对于载体以第一角度升高; 将第一装置联接在第一柔性电路的顶表面的一部分上，第一装置以第一角度升高; 将第二柔性电路定位在所述载体上，所述第二柔性电路具有上表面和下表面，所述下表面的一部分安装到所述载体上，而所述下表面的另一部分相对于所述下表面以第二角度升高 载体并重叠在第一装置的顶表面部分上; 以及将所述第二装置联接在所述第二柔性电路的所述上表面的一部分上，所述第二装置以第二角度升高。

    LIGHT SOURCE DEVICE
    46.
    发明申请
    LIGHT SOURCE DEVICE 有权
    光源设备

    公开(公告)号：US20090135599A1

    公开(公告)日：2009-05-28

    申请号：US11964627

    申请日：2007-12-26

    Applicant: Jian-Shian Lin ,  Chieh-Lung Lai

    Inventor： Jian-Shian Lin ,  Chieh-Lung Lai

    IPC: F21V21/00

    CPC classification number: H05K3/301 ,  F21K9/00 ,  F21Y2107/50 ,  F21Y2115/10 ,  H05K2201/10106 ,  H05K2201/10484 ,  H05K2201/10606

    Abstract: A light source device is disclosed, which involves forming a plurality of carrier planes on a substrate with at least one of the carrier planes forming an angle relative to the substrate, and respectively mounting LEDs on the carrier planes and electrically connecting the LEDs with the carrier planes so as to obtain a preferred light distribution effect, thereby eliminating the need of additional light control element in the prior art and enhancing light emitting efficiency of the light source device.

    Abstract translation: 公开了一种光源装置，其涉及在基板上形成多个载体平面，其中至少一个载体平面相对于基板形成一角度，并且分别将LED安装在载体平面上并将LED与载体电连接 平面，从而获得优选的配光效果，从而消除了现有技术中额外的光控制元件的需要，并提高了光源装置的发光效率。

    SYSTEMS AND METHODS FOR A TILTED OPTICAL RECEIVER ASSEMBLY
    47.
    发明申请
    SYSTEMS AND METHODS FOR A TILTED OPTICAL RECEIVER ASSEMBLY 失效
    倾斜光接收机组件的系统和方法

    公开(公告)号：US20090065678A1

    公开(公告)日：2009-03-12

    申请号：US11852506

    申请日：2007-09-10

    Applicant: Mark Vandermeulen ,  Robert E. Hawke ,  David Roy ,  William F. Hill

    Inventor： Mark Vandermeulen ,  Robert E. Hawke ,  David Roy ,  William F. Hill

    IPC: G01J1/44 ,  B23K35/14 ,  G01J1/20 ,  H01J40/14

    CPC classification number: G01J1/02 ,  G01J1/0271 ,  G01J1/04 ,  G01J1/0403 ,  H05K3/3436 ,  H05K2201/094 ,  H05K2201/10121 ,  H05K2201/10484 ,  Y02P70/613

    Abstract: Systems and methods are provided for depositing solder in a first pattern over a first bonding pad on the substrate; depositing solder in a second pattern over a second bonding pad on the substrate, wherein the second pattern defines a larger area than the first pattern; placing the electronic device on the substrate such that pads on the electronic device are aligned with the first and second bonding pads; and reflowing the solder between the pads on the electronic device and the first and second bonding pads, causing the solder deposited on the first bonding pad to form a first solder joint and the solder deposited on the second bonding pad to form a second solder joint. The second solder joint is larger than the first solder joint causing the electronic device to be attached at an angle relative to the substrate.

    Abstract translation: 提供了用于在衬底上的第一焊盘上以第一图案沉积焊料的系统和方法; 在衬底上的第二接合焊盘上以第二图案沉积焊料，其中所述第二图案限定比所述第一图案更大的面积; 将所述电子设备放置在所述基板上，使得所述电子设备上的焊盘与所述第一和第二焊盘对准; 以及在所述电子设备上的所述焊盘与所述第一和第二接合焊盘之间回流焊料，使得沉积在所述第一接合焊盘上的所述焊料形成第一焊接接头，并且所述焊料沉积在所述第二接合焊盘上以形成第二焊接接头。 第二焊点比第一焊点大，导致电子器件相对于衬底以一定角度附着。

    Component Adapted for Being Mounted on a Substrate and a Method of Mounting a Surface Mounted Device
    48.
    发明申请
    Component Adapted for Being Mounted on a Substrate and a Method of Mounting a Surface Mounted Device 有权
    适用于安装在基板上的部件和安装表面贴装设备的方法

    公开(公告)号：US20080314624A1

    公开(公告)日：2008-12-25

    申请号：US12090884

    申请日：2006-10-13

    Applicant: Maurice Alexander Hugo Donners

    Inventor： Maurice Alexander Hugo Donners

    IPC: H05K1/03 ,  H05K3/30

    CPC classification number: H05K3/301 ,  H05K3/3442 ,  H05K2201/10106 ,  H05K2201/10325 ,  H05K2201/10484 ,  H05K2201/10636 ,  H05K2201/10651 ,  Y02P70/611 ,  Y10T29/4913

    Abstract: A supporting component (1) adapted for being mounted on a substrate (11) and for serving as a support for a surface mounted device (15) comprises a body (2) having a first surface (3) adapted for being mounted on the substrate (11), and a second surface (4) being adapted for supporting the surface mounted device (15). The second surface (4) is inclined in relation to the first surface (3). The supporting component (1) further comprises a first supporting component conductor (6) adapted for forming an electrical contact between a first substrate conductor (12) of the substrate (11) and a first electrode (16) of the surface mounted device (15). In a method of mounting a surface mounted device (15) in an inclined manner on a substrate (11) the supporting component (1) is mounted on the substrate (11) with the surface mounted device (15) on top of it.

    Abstract translation: 适于安装在基板（11）上并用作表面安装装置（15）的支撑件的支撑部件（1）包括具有适于安装在基板上的第一表面（3）的主体（2） （11），以及适于支撑所述表面安装装置（15）的第二表面（4）。 第二表面（4）相对于第一表面（3）倾斜。 支撑部件（1）还包括适于在基板（11）的第一基板导体（12）和表面安装装置（15）的第一电极（16）之间形成电接触的第一支撑部件导体（6） ）。 在将表面安装的装置（15）以倾斜的方式安装在基板（11）上的方法中，支撑部件（1）安装在基板（11）上，表面安装装置（15）位于其上。

    Level/position sensor and related electronic circuitry for interactive toy
    49.
    发明授权
    Level/position sensor and related electronic circuitry for interactive toy 失效
    水平/位置传感器及相关电子电路用于交互式玩具

    公开(公告)号：US07450025B2

    公开(公告)日：2008-11-11

    申请号：US11186042

    申请日：2005-07-21

    Applicant: Peter Sui Lun Fong

    Inventor： Peter Sui Lun Fong

    IPC: G08B21/00

    CPC classification number: H01H35/025 ,  H05K1/18 ,  H05K2201/10053 ,  H05K2201/10151 ,  H05K2201/10484 ,  H05K2201/10522

    Abstract: A sensor for use in an interactive electronic device. The sensor is operative to generate a plurality of different output signals corresponding to respective positions of the sensor relative to a reference plane. The movement of the sensor relative to the reference plane facilitates the movement of one or more actuation balls of respective switches of the sensor, which in turn results in the generation of differing conditions or output signals corresponding to closed or open circuit conditions selectively created by the switches.

    Abstract translation: 用于交互式电子设备的传感器。 传感器可操作以产生对应于传感器相对于参考平面的相应位置的多个不同的输出信号。 传感器相对于参考平面的移动便于传感器各个开关的一个或多个致动球的移动，这进而导致产生对应于由所述传感器选择性地创建的闭合或开路状态的不同条件或输出信号 开关。

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