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287 条记录 (耗时 0.014 秒)

    Method for calibrating surface mounting processes in printed circuit board assembly manufacturing
    41.
    发明授权
    Method for calibrating surface mounting processes in printed circuit board assembly manufacturing 失效
    校准印刷电路板组件制造中表面安装工艺的方法

    公开(公告)号：US5978093A

    公开(公告)日：1999-11-02

    申请号：US895766

    申请日：1997-07-17

    申请人： Steve Abrahamson

    发明人： Steve Abrahamson

    IPC分类号： H05K1/02 ,  H05K3/30 ,  H05K13/04 ,  G01B11/00 ,  G01J1/02 ,  G06K9/00 ,  H01L21/66

    CPC分类号： H05K3/305 ,  H05K13/0465 ,  H05K1/0269 ,  H05K2201/0108 ,  H05K2201/10204 ,  H05K2203/161 ,  H05K2203/162 ,  Y02P70/613

    摘要： A method and apparatus for calibrating surface mounting processes in the manufacturing of printed circuit board assemblies. In one embodiment of a method in accordance with the invention, a test pad of adhesive is deposited onto a substrate, and then a test module is mounted to the substrate at the test pad. The test module is representative of an electrical component that is to be mounted to a printed circuit board, and the test module is mounted to the substrate in a manner in which the electrical component is to be mounted to a printed circuit board. After the test module is mounted to the substrate, the profile of the test pad is detected through the substrate and/or the test module to determine whether the test pad contacts enough of the test module to sufficiently adhere the test module to the substrate without interfering with the terminals of the test module. Accordingly, this embodiment of the inventive method provides an indication or estimate of the desired volume of an adhesive pad to mount a specific component to a PCB.

    摘要翻译： 一种用于校准印刷电路板组件制造中的表面安装工艺的方法和装置。 在根据本发明的方法的一个实施例中，将粘合剂测试垫沉积到基底上，然后在测试垫处将测试模块安装到基底上。 测试模块代表要安装到印刷电路板的电气部件，并且测试模块以将电气部件安装到印刷电路板的方式安装到基板。 在将测试模块安装到衬底之后，通过衬底和/或测试模块检测测试焊盘的轮廓，以确定测试焊盘是否接触足够的测试模块，以充分地将测试模块粘附到衬底而不干扰 与测试模块的终端。 因此，本发明方法的该实施例提供了将特定部件安装到PCB的粘合垫的期望体积的指示或估计。

    Method for forming an electrode
    43.
    发明授权
    Method for forming an electrode 失效
    电极形成方法

    公开(公告)号：US5352479A

    公开(公告)日：1994-10-04

    申请号：US88731

    申请日：1993-07-08

    申请人： Masaru Iida ,  Akihiro Konno ,  Michio Yamada

    发明人： Masaru Iida ,  Akihiro Konno ,  Michio Yamada

    IPC分类号： H05K1/02 ,  H05K1/09 ,  B05D5/12

    CPC分类号： H05K1/0266 ,  H05K1/0269 ,  H05K1/092 ,  H05K2201/0108 ,  H05K2203/161

    摘要： The present invention provides a method for forming an electrode, which comprises printing and drying on a glass substrate a thick film paste (a) having an inorganic powder containing an inorganic pigment as the main component, dispersed in an organic binder, then printing a thick film paste (b) having an inorganic powder containing a metal power and a glass powder as the main components, dispersed in an organic binder, to cover at least a part of said thick film paste (a), followed by baking at a temperature of from 400.degree. to 800.degree. C., and then removing (a) at the portion which is not covered by (b), to form an electrode which exhibits a desired color as observed from the side opposite to the printed side. According to the present invention, an electrode which exhibits a desired color as observed from the side of the glass substrate on which no electrode is formed, can be formed with excellent productivity.

    摘要翻译： 本发明提供一种形成电极的方法，包括在玻璃基板上印刷和干燥具有分散在有机粘合剂中的无机颜料作为主要成分的无机粉末的厚膜糊（a），然后印刷厚 将具有金属粉末和玻璃粉末的无机粉末作为主要成分的膜糊（b）分散在有机粘合剂中，覆盖至少一部分所述厚膜糊（a），然后在 400℃至800℃，然后在（b）未被覆盖的部分除去（a），以形成从与印刷侧相反侧观察到的所需颜色的电极。 根据本发明，可以以优异的生产率形成从玻璃基板的没有形成电极的侧面观察到所期望的颜色的电极。

    Method and material for checking drilled printed circuit boards
    45.
    发明授权
    Method and material for checking drilled printed circuit boards 失效
    检查钻孔印刷电路板的方法和材料

    公开(公告)号：US4818617A

    公开(公告)日：1989-04-04

    申请号：US896472

    申请日：1986-08-14

    申请人： Larry A. Stock

    发明人： Larry A. Stock

    IPC分类号： H05K1/02 ,  H05K3/00 ,  B32B27/36

    CPC分类号： H05K1/0269 ,  H05K3/0002 ,  H05K2203/161 ,  H05K2203/163 ,  H05K3/0044 ,  H05K3/0047 ,  Y10T428/31507 ,  Y10T428/31696 ,  Y10T428/31786 ,  Y10T428/31935

    摘要： A method and material are provided for checking the location of holes drilled in copper-coated printed circuit boards. The material is a translucent, dimensionally stable plastic sheet having a blue-green or yellow-green color and a light transmissivity in the range from about 25 to 40%. The use of this particular material has been found to provide optimum contrast between a dark background created when the material overlays the copper printed circuit board, and transmitted light and light reflected from the copper surface when the holes on the printed circuit board are misaligned.

    摘要翻译： 提供了一种方法和材料，用于检查在铜涂布印刷电路板上钻孔的位置。 该材料是半透明的，尺寸稳定的塑料片，其具有蓝绿色或黄绿色和透光率在约25至40％的范围内。 已经发现，使用这种特定的材料可以在材料覆盖铜印刷电路板时产生的深色背景和当印刷电路板上的孔不对准时从铜表面反射的透射光和光之间提供最佳对比。

    Print circuit board
    46.
    发明授权
    Print circuit board 失效
    印刷电路板

    公开(公告)号：US4704318A

    公开(公告)日：1987-11-03

    申请号：US838823

    申请日：1986-03-12

    申请人： Masayuki Saito ,  Hirosi Oodaira

    发明人： Masayuki Saito ,  Hirosi Oodaira

    IPC分类号： H01C17/065 ,  H01C17/242 ,  H05K1/03 ,  H05K1/05 ,  H05K1/09 ,  H05K1/16 ,  B32B3/00 ,  B32B15/08 ,  B32B27/32 ,  H05K1/00

    CPC分类号： H01C17/065 ,  H01C17/242 ,  H05K1/056 ,  H05K1/032 ,  H05K1/095 ,  H05K1/16 ,  H05K2203/161 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/31696 ,  Y10T428/31931

    摘要： There is disclosed a wiring substrate comprising a wiring circuit pattern formed on a metal substrate with an insulating resinous layer interposed therebetween. In this wiring substrate, the insulating resinous layer is formed of a high molecular composition comprising thermosetting 1,2-polybutadiene containing 5 to 30% by weight of a high molecular softening agent such as hydrogenated polybutadiene. A method of manufacturing such a wiring substrate is also disclosed, wherein a light-reflecting pigment is included in the insulating resinous layer for the convenience of the subsequent laser trimming.

    摘要翻译： 公开了一种布线基板，其包括在金属基板上形成有绝缘树脂层的布线电路图案。 在该布线基板中，绝缘树脂层由含有5〜30重量％的高分子软化剂如氢化聚丁二烯的热固性1,2-聚丁二烯的高分子组成形成。 还公开了一种制造这种布线基板的方法，其中为了便于后续的激光修整，在绝缘树脂层中包含光反射颜料。

    Light diffusing or spectral coating for printed circuit boards and the like
    47.
    发明授权
    Light diffusing or spectral coating for printed circuit boards and the like 失效
    用于印刷电路板等的光漫射或光谱涂层

    公开(公告)号：US4183767A

    公开(公告)日：1980-01-15

    申请号：US944190

    申请日：1978-09-20

    申请人： Stanley Kessler

    发明人： Stanley Kessler

    IPC分类号： C09D5/00 ,  H05K3/28 ,  C08J3/02

    CPC分类号： H05K3/282 ,  C09D5/00 ,  H05K2203/161

    摘要： A glare-reducing coating to aid visual inspection of bright surfaces such as on printed circuit boards and assemblies, which, when applied from a liquid solution, selectively diffuses light on metal surfaces while remaining transparent over plastic substrates. The optical, tack-free coating is readily cleaned from surfaces by conventional soldering flux solvents and aqueous cleaning solutions. The tack-free, solderable coating greatly aids the visual inspection of the coated circuit board by eliminating spectral glare, and becomes transparent when heated to soldering temperature to indicate the area of rework. The coating comprises a combination of a thermoplastic rosin, suitable as a soldering flux, and DMSO in a suitable solvent, preferably consisting of or including chlorinated solvents such as methylene dichloride, thus to insure a non-flammable coating which is readily applied by dipping, brushing, or spraying.

    摘要翻译： 一种防眩光涂层，以帮助对诸如印刷电路板和组件之类的明亮表面进行目视检查，当从液体溶液中施加时，该表面选择性地将光扩散到金属表面上，同时在塑料基板上保持透明。 通过常规的助焊剂溶剂和含水清洁溶液，可以很容易地从表面清除光学，无粘性涂层。 无粘性，可焊接的涂层大大有助于通过消除光谱眩光对涂覆的电路板进行目视检查，并在加热到焊接温度时变得透明，以指示返工的面积。 涂层包括适合作为助焊剂的热塑性松香与DMSO在合适的溶剂中的组合，优选由氯化溶剂如二氯甲烷组成或包括氯化溶剂，从而确保容易通过浸渍施加的不易燃涂层， 刷牙或喷涂。