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    High speed electroplating metallic conductors
    47.
    发明授权
    High speed electroplating metallic conductors 有权
    高速电镀金属导体

    公开(公告)号：US09530653B2

    公开(公告)日：2016-12-27

    申请号：US15002342

    申请日：2016-01-20

    申请人： Uri Cohen

    发明人： Uri Cohen

    IPC分类号： C25D5/08 ,  H01L21/77 ,  H01L21/288 ,  C25D5/02 ,  H01L21/768 ,  H05K3/42 ,  C25D7/12 ,  C25D21/10 ,  H01L23/522 ,  H05K3/06 ,  H05K3/10 ,  H01L23/48 ,  H01L21/321 ,  H01L23/532

    CPC分类号： C25D5/026 ,  C25D5/022 ,  C25D5/028 ,  C25D5/08 ,  C25D7/123 ,  C25D21/10 ,  H01L21/2885 ,  H01L21/3212 ,  H01L21/7684 ,  H01L21/76843 ,  H01L21/76873 ,  H01L21/76877 ,  H01L21/76879 ,  H01L21/7688 ,  H01L23/481 ,  H01L23/5226 ,  H01L23/53238 ,  H01L2924/0002 ,  H05K3/06 ,  H05K3/107 ,  H05K3/423 ,  H01L2924/00

    摘要： One embodiment is a method for producing void-free electroplated metallic conductors inside openings by electrochemical deposition (ECD), said method including steps of: forming at least one opening in a substrate, said at least one opening having an aspect ratio in a range from 8:1 to 28:1; forming at least one barrier layer over the sidewalls of the at least one opening; depositing at least one seed layer over the at least one barrier layer; immersing the substrate in an electrolyte contained in an ECD cell, the ECD cell including at least one anode and a cathode, wherein the electrolyte includes plating metallic ions and at least one inhibitor additive; providing agitation of the electrolyte across the surface of the substrate by moving multiple non-contacting wiping blades relative to the substrate, wherein the agitation facilitates a limiting current density larger by at least an order of magnitude than a limiting current density without the agitation; and applying an average electroplating current density on the substrate, wherein the agitation, the concentrations of the metallic ions and the inhibitor additive, and the average electroplating current density are such as to produce void-free, electroplated metallic filling inside the at least one opening.

    摘要翻译： 一个实施方案是一种通过电化学沉积（ECD）在开口内产生无空隙的电镀金属导体的方法，所述方法包括以下步骤：在基底中形成至少一个开口，所述至少一个开口的纵横比范围从 8：1到28：1; 在所述至少一个开口的侧壁上形成至少一个阻挡层; 在所述至少一个阻挡层上沉积至少一个种子层; 将所述衬底浸入包含在ECD电池中的电解质中，所述ECD电池包括至少一个阳极和阴极，其中所述电解质包括电镀金属离子和至少一种抑制剂添加剂; 通过相对于基底移动多个非接触式擦拭刮板来提供电解质跨过衬底的表面的搅动，其中搅拌有助于极限电流密度比不受搅拌的极限电流密度大至少一个数量级; 以及在所述衬底上施加平均电镀电流密度，其中所述搅拌，所述金属离子和所述抑制剂添加剂的浓度以及所述平均电镀电流密度在所述至少一个开口内部产生无空隙的电镀金属填充物 。

    Electro-plating and apparatus for performing the same
    48.
    发明授权
    Electro-plating and apparatus for performing the same 有权
    电镀及其设备

    公开(公告)号：US09518334B2

    公开(公告)日：2016-12-13

    申请号：US13871712

    申请日：2013-04-26

    申请人： Taiwan Semiconductor Manufacturing Company, Ltd.

    发明人： Chen-Yuan Kao ,  Hung-Wen Su ,  Minghsing Tsai

    IPC分类号： C25D21/12 ,  C25D21/10 ,  C25D17/00 ,  C25D7/12

    CPC分类号： C25D21/12 ,  C25D7/12 ,  C25D7/123 ,  C25D17/001 ,  C25D17/004 ,  C25D17/005 ,  C25D21/10

    摘要： A method of plating a metal layer on a work piece includes exposing a surface of the work piece to a plating solution, and supplying a first voltage at a negative end of a power supply source to an edge portion of the work piece. A second voltage is supplied to an inner portion of the work piece, wherein the inner portion is closer to a center of the work piece than the edge portion. A positive end of the power supply source is connected to a metal plate, wherein the metal plate and the work piece are spaced apart from each other by, and are in contact with, the plating solution.

    摘要翻译： 在工件上镀覆金属层的方法包括将工件的表面暴露于镀液，并将电源的负端的第一电压提供给工件的边缘部分。 第二电压被提供给工件的内部，其中内部部分比边缘部分更靠近工件的中心。 电源的正端与金属板连接，金属板和工件通过电镀液相互隔开并与电镀液接触。

    SUBSTRATE PLATING DEVICE
    50.
    发明申请
    SUBSTRATE PLATING DEVICE 审中-公开
    基板镀层器件

    公开(公告)号：US20160138181A1

    公开(公告)日：2016-05-19

    申请号：US14889954

    申请日：2014-03-27

    申请人： JCU CORPORATION

    发明人： Junichiro YOSHIOKA ,  Takashi MURAYAMA

    IPC分类号： C25D21/10 ,  C25D17/00

    CPC分类号： C25D21/10 ,  C25D17/001

    摘要： A plating device includes a pl,ting bath containing therein a plating solution, a substrate holder for detachably holding a substrate, an anode disposed opposite to the substrate held by the substrate holder, a rail part stretched across an upper portion of the plating bath in parallel to the substrate holder, and a paddle suspended by the rail part and capable of reciprocating along the rail part. The paddle is vertically provided with a vane part rotatable round or pivotable on an axis part. The plating device can increase flow rate of a plating solution without installing a circulating pump outside a plating bath, and further can achieve same flow rate of the plating solution from a bottom of the plating bath to a level of the solution, enabling plating that forms a plating film having a uniform thickness on an entire region of a substrate and exhibits a high deposition rate.

    摘要翻译： 电镀装置包括其中含有电镀液的电镀液，用于可拆卸地保持基板的基板保持器，与由基板保持件保持的基板相对设置的阳极，横跨电镀槽的上部延伸的轨道部分 平行于基板保持器，以及由轨道部分悬挂并能够沿着轨道部分往复运动的桨叶。 桨叶垂直地设置有可在轴部分上旋转或可枢转的叶片部分。 电镀装置可以增加电镀液的流速，而不需要在电镀槽之外安装循环泵，并且还可以使电镀液从电镀槽的底部达到相同的溶液流量，从而能够进行电镀 在基板的整个区域上具有均匀厚度的镀膜，并且表现出高的沉积速率。