公开(公告)号：US07332423B2

公开(公告)日：2008-02-19

申请号：US11170188

申请日：2005-06-29

Applicant: Robert Starkston ,  Sridhar Narasimhan ,  Chia-Pin Chiu ,  Suzana Prstic ,  Patrick N Stover ,  Hong Xie

Inventor： Robert Starkston ,  Sridhar Narasimhan ,  Chia-Pin Chiu ,  Suzana Prstic ,  Patrick N Stover ,  Hong Xie

IPC: H01L21/44

CPC classification number: H01L24/81 ,  H01L21/563 ,  H01L2224/14051 ,  H01L2224/73203 ,  H01L2224/81141 ,  H01L2224/81193 ,  H01L2224/81345 ,  H01L2224/81801 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H05K3/303 ,  H05K3/3436 ,  H05K3/3457 ,  H05K2201/094 ,  H05K2201/09781 ,  H05K2201/10674 ,  H05K2203/167 ,  Y02P70/613

Abstract: One example electronic assembly includes a substrate that has a plurality of contacts which become bonded to a plurality of contacts on a die. The electronic assembly further includes a male member that extends from at least one of the substrate and the die and a female member that extends from the other of the substrate and the die. The male member is inserted into the female member to align the die relative to the substrate. The male member and the female member may have any configuration as long as one or more portions of the male member extend partially, or wholly, into the female member. An example method includes aligning a die relative to a substrate by inserting a male member that extends from one of the die and the substrate into a female member that extends from the other of the die and the substrate.

Abstract translation: 一个示例性电子组件包括具有多个接触件的基板，该多个触点被结合到模具上的多个触点。 电子组件还包括从基板和模具中的至少一个延伸的阳构件和从基板和模具中的另一个延伸的阴构件。 将阳构件插入阴构件中以使模具相对于衬底对准。 阳构件和阴构件可以具有任何构造，只要阳构件的一个或多个部分部分地或全部地延伸到阴构件中即可。 一种示例性方法包括通过将从模具和基板中的一个延伸的阳构件插入从模具和基板中的另一个延伸的凹形构件中来相对于基板对准模具。

公开(公告)号：US07327028B2

公开(公告)日：2008-02-05

申请号：US10788071

申请日：2004-02-24

Applicant: Chia-Pin Chiu

Inventor： Chia-Pin Chiu

IPC: H01L23/34

CPC classification number: H01L25/0652 ,  H01L23/5387 ,  H01L2224/48227 ,  H05K1/0206

Abstract: In some embodiments, a T-shaped heat spreader may be provided centrally within a folded stacked chip-scale package. The dice may be situated around the T-shaped heat spreader which may be made of high conductivity material. Heat may be dissipated through the T-shaped spreader 24 and downwardly through thermal vias into a printed circuit board.

Abstract translation: 在一些实施例中，T形散热器可以在折叠的堆叠芯片级封装内集中提供。 骰子可以位于可由高导电性材料制成的T形散热器周围。 热量可以通过T形吊具24散开，并通过热通孔向下散布到印刷电路板中。

公开(公告)号：US07202111B2

公开(公告)日：2007-04-10

申请号：US10882511

申请日：2004-06-30

Applicant: Chia-Pin Chiu

Inventor： Chia-Pin Chiu

IPC: H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC classification number: H01L23/36 ,  H01L21/563 ,  H01L23/04 ,  H01L23/3128 ,  H01L23/42 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/01079 ,  H01L2924/1433 ,  H01L2924/15311 ,  H01L2924/16151 ,  H01L2924/16152 ,  H01L2924/16251 ,  H01L2924/00

Abstract: A microelectronic package and a method of forming the same comprising a microelectronic device attached by an active surface to a substrate. A heat dissipation device having a base portion is positioned over a back surface of the microelectronic device and having at least one lip portion extending from the base portion which is attached to the substrate. An inlet extends through the heat dissipation device base portion and is positioned to be over the microelectronic device back surface. A thermal interface material is dispensed through the inlet and by capillary action is drawn between the microelectronic device back surface and the heat dissipation device base portion.

Abstract translation: 一种微电子封装及其形成方法，包括通过有源表面附着到衬底的微电子器件。 具有基部的散热装置位于微电子装置的后表面上方，并且具有至少一个从附接到基板的基部延伸的唇部。 入口延伸穿过散热装置底座部分并且定位成位于微电子器件背面上方。 通过入口分配热界面材料，并且通过在微电子器件背表面和散热装置基部之间的毛细作用被拉伸。

公开(公告)号：US20070001318A1

公开(公告)日：2007-01-04

申请号：US11170188

申请日：2005-06-29

Applicant: Robert Starkston ,  Sridhar Narasimhan ,  Chia-Pin Chiu ,  Suzana Prstic ,  Patrick Stover ,  Hong Xie

Inventor： Robert Starkston ,  Sridhar Narasimhan ,  Chia-Pin Chiu ,  Suzana Prstic ,  Patrick Stover ,  Hong Xie

IPC: H01L23/48

CPC classification number: H01L24/81 ,  H01L21/563 ,  H01L2224/14051 ,  H01L2224/73203 ,  H01L2224/81141 ,  H01L2224/81193 ,  H01L2224/81345 ,  H01L2224/81801 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H05K3/303 ,  H05K3/3436 ,  H05K3/3457 ,  H05K2201/094 ,  H05K2201/09781 ,  H05K2201/10674 ,  H05K2203/167 ,  Y02P70/613

Abstract: One example electronic assembly includes a substrate that has a plurality of contacts which become bonded to a plurality of contacts on a die. The electronic assembly further includes a male member that extends from at least one of the substrate and the die and a female member that extends from the other of the substrate and the die. The male member is inserted into the female member to align the die relative to the substrate. The male member and the female member may have any configuration as long as one or more portions of the male member extend partially, or wholly, into the female member. An example method includes aligning a die relative to a substrate by inserting a male member that extends from one of the die and the substrate into a female member that extends from the other of the die and the substrate.

Abstract translation: 一个示例性电子组件包括具有多个接触件的基板，该多个触点被结合到模具上的多个触点。 电子组件还包括从基板和模具中的至少一个延伸的阳构件和从基板和模具中的另一个延伸的阴构件。 将阳构件插入阴构件中以使模具相对于衬底对准。 阳构件和阴构件可以具有任何构造，只要阳构件的一个或多个部分部分地或全部地延伸到阴构件中即可。 一种示例性方法包括通过将从模具和基板中的一个延伸的阳构件插入从模具和基板中的另一个延伸的凹形构件中来相对于基板对准模具。

公开(公告)号：US20050245060A1

公开(公告)日：2005-11-03

申请号：US10836329

申请日：2004-05-03

Applicant: Chia-Pin Chiu

Inventor： Chia-Pin Chiu

IPC: H01L21/50 ,  H01L23/367

CPC classification number: H01L23/3677 ,  H01L24/73 ,  H01L2224/1403 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06568 ,  H01L2924/01078 ,  H01L2924/01087 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15151 ,  H01L2924/15159 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A substrate is provided that may include an area designated for mounting of an integrated circuit and one or more areas for retaining a thermal interface material proximate the integrated circuit mounting area. A thermal interface material containment area(s) may be formed by creating a through-hole in the substrate, or a recess in the substrate that opens either to the die placement side or the opposite side of the substrate.

Abstract translation: 提供了一种基板，其可以包括指定用于集成电路的安装的区域和用于在靠近集成电路安装区域保持热界面材料的一个或多个区域。 热界面材料容纳区域可以通过在基板中形成通孔而形成，或者在基板中的凹槽中形成，该凹槽向基板的模具放置侧或相对侧开口。

公开(公告)号：US06840794B2

公开(公告)日：2005-01-11

申请号：US10403648

申请日：2003-03-31

Applicant: Chia-Pin Chiu

Inventor： Chia-Pin Chiu

IPC: H01L23/467 ,  H05K7/10 ,  H05K7/20 ,  H01R4/60 ,  H01R13/00

CPC classification number: H01L23/467 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05024 ,  H01L2224/05548 ,  H01L2224/05569 ,  H01L2224/0557 ,  H01L2224/16 ,  H05K7/1092 ,  H05K7/20 ,  H01L2224/05611 ,  H01L2924/00014 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05111 ,  H01L2224/05144 ,  H01L2224/05147

Abstract: Contact pin temperature of a semiconductor package is reduced by forcing air into a region between a circuit board and a socket body. A sealant around the perimeter of the socket body at least in part seals the socket body with the circuit board, allowing the forced gas to flow through cavities containing the contacts, thereby cooling the contacts and the package pins. The contact-pin temperature may be reduced, allowing power pins to carry more current. Accordingly, microprocessors and processing systems may be operated at higher data rates without reducing reliability or increasing contact-pin oxidation.

Abstract translation: 通过迫使空气进入电路板和插座体之间的区域来减小半导体封装的接触针温度。 围绕插座主体的周边的密封剂至少部分地将插座主体与电路板密封，从而允许强制气体流过包含触点的空腔，从而冷却触点和封装引脚。 触点引脚温度可能会降低，从而允许电源引脚承载更多的电流。 因此，微处理器和处理系统可以以更高的数据速率运行，而不降低可靠性或增加接触针氧化。

公开(公告)号：US06794748B1

公开(公告)日：2004-09-21

申请号：US10421310

申请日：2003-04-22

Applicant: Chia-Pin Chiu

Inventor： Chia-Pin Chiu

IPC: H01L2334

CPC classification number: H01L21/563 ,  H01L23/36 ,  H01L23/427 ,  H01L24/48 ,  H01L25/0657 ,  H01L2224/05001 ,  H01L2224/05023 ,  H01L2224/05568 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2225/06517 ,  H01L2225/06555 ,  H01L2225/06582 ,  H01L2225/06586 ,  H01L2225/06589 ,  H01L2924/00014 ,  H01L2924/00015 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2224/85399 ,  H01L2924/00012 ,  H01L2224/05099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A microelectronic die assembly including a heat dissipation device serving as a support structure for the assembly is described. A first microelectronic die is attached by a back surface to a first surface of the heat dissipation device. A first plurality of interconnects are disposed on an active surface of the first microelectronic die. A second microelectronic die is attached by a back surface to the first microelectronic die active surface. A second plurality of interconnects are disposed on an active surface of the second microelectronic die. Any appropriate number of microelectronic dice may be stacked in a like fashion.

Abstract translation: 描述了一种微电子模具组件，其包括用作组件的支撑结构的散热装置。 第一微电子管芯通过后表面附接到散热装置的第一表面。 第一多个互连件设置在第一微电子管芯的有源表面上。 第二微电子管芯通过后表面附接到第一微电子管芯有源表面。 第二多个互连设置在第二微电子管芯的有源表面上。 任何适当数量的微电子管芯可以以类似的方式堆叠。

公开(公告)号：US06767765B2

公开(公告)日：2004-07-27

申请号：US10112834

申请日：2002-03-27

Applicant: Chia-Pin Chiu

Inventor： Chia-Pin Chiu

IPC: H01L2144

CPC classification number: H01L23/36 ,  H01L21/563 ,  H01L23/04 ,  H01L23/3128 ,  H01L23/42 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/01079 ,  H01L2924/1433 ,  H01L2924/15311 ,  H01L2924/16151 ,  H01L2924/16152 ,  H01L2924/16251 ,  H01L2924/00

Abstract: A microelectronic package and a method of forming the same comprising a microelectronic device attached by an active surface to a substrate. A heat dissipation device having a base portion is positioned over a back surface of the microelectronic device and having at least one lip portion extending from the base portion which is attached to the substrate. An inlet extends through the heat dissipation device base portion and is positioned to be over the microelectronic device back surface. A thermal interface material is dispensed through the inlet and by capillary action is drawn between the microelectronic device back surface and the heat dissipation device base portion.

公开(公告)号：US06626681B2

公开(公告)日：2003-09-30

申请号：US10080867

申请日：2002-02-21

Applicant: Chia-Pin Chiu

Inventor： Chia-Pin Chiu

IPC: H01R1200

CPC classification number: H05K7/1092 ,  G06F1/183 ,  Y10S439/946

Abstract: A socket comprises a socket body having a bottom surface at which the socket can be mounted to a motherboard, a top surface, and several side surfaces. The top surface has an array of electrical contacts at which a package containing a microprocessor can be coupled to the socket. One or more of the side surfaces have a slot, which includes an electrical interface at which a circuit card containing cache memory for use by the microprocessor can be removably inserted into the socket body parallel to the motherboard.

Abstract translation: 插座包括具有底表面的插座本体，该插座可以在该底表面处安装到主板，顶表面和几个侧表面。 顶表面具有电触头阵列，在该触点阵列处，包含微处理器的封装可以耦合到插座。 一个或多个侧表面具有槽，其包括电接口，在该电接口处包含用于由微处理器使用的高速缓冲存储器的电路卡可以在该电接口处平行于主板可拆卸地插入到插座主体中。

公开(公告)号：US06580611B1

公开(公告)日：2003-06-17

申请号：US10126200

申请日：2002-04-19

Applicant: Gilroy J. Vandentop ,  Raj Nair ,  Chia-Pin Chiu ,  Yuan-Liang Li

Inventor： Gilroy J. Vandentop ,  Raj Nair ,  Chia-Pin Chiu ,  Yuan-Liang Li

IPC: H05K720

CPC classification number: H01L23/4006 ,  H01L23/13 ,  H01L23/367 ,  H01L23/3677 ,  H01L23/4093 ,  H01L23/5389 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/0657 ,  H01L2023/405 ,  H01L2023/4056 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/732 ,  H01L2224/73253 ,  H01L2924/01004 ,  H01L2924/01057 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/1427 ,  H01L2924/1433 ,  H01L2924/1434 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/19041 ,  H01L2924/19042 ,  H05K1/0204 ,  H05K1/182 ,  H05K2201/09054 ,  H05K2201/10378 ,  H05K2201/10409 ,  H05K2201/10477 ,  H05K2201/10734 ,  H05K2203/1572

Abstract: The present invention describes a method and apparatus for mounting a microelectronic device parallel to a substrate with an interposer and two heat sinks, one on each side of the substrate.

Abstract translation: 本发明描述了一种用于将微电子器件平行于具有插入器和两个散热器的基板安装在基板的每一侧上的方法和装置。