III-NITRIDE FLIP-CHIP SOLAR CELLS
    53.
    发明申请
    III-NITRIDE FLIP-CHIP SOLAR CELLS 审中-公开
    III-NITRIDE FLIP-CHIP太阳能电池

    公开(公告)号:US20120180868A1

    公开(公告)日:2012-07-19

    申请号:US13279131

    申请日:2011-10-21

    IPC分类号: H01L31/0264 H01L31/18

    摘要: A III-nitride photovoltaic device structure and method for fabricating the III-nitride photovoltaic device that increases the light collection efficiency of the III-nitride photovoltaic device. The III-nitride photovoltaic device includes one or more III-nitride device layers, and the III-nitride photovoltaic device functions by collecting light that is incident on the back-side of the III-nitride device layers. The III-nitride device layers are grown on a substrate, wherein the III-nitride device layers are exposed when the substrate is removed and the exposed III-nitride device layers are then intentionally roughened to enhance their light collection efficiency. The collection of the incident light via the back-side of the device simplifies the fabrication of the multiple junctions in the device. The III-nitride photovoltaic device may include grid-like contacts, transparent or semi-transparent contacts, or reflective contacts.

    摘要翻译: 用于制造III族氮化物光伏器件的III族氮化物光伏器件结构和方法,其增加了III族氮化物光伏器件的光收集效率。 III族氮化物光伏器件包括一个或多个III族氮化物器件层,并且III族氮化物光伏器件通过收集入射在III族氮化物器件层的背面上的光而起作用。 III族氮化物器件层在衬底上生长,其中当除去衬底时,III族氮化物器件层被暴露,然后有意地暴露暴露的III族氮化物器件层以增强它们的光收集效率。 通过设备背面的入射光的收集简化了器件中多个结的制造。 III族氮化物光伏器件可以包括格栅状触点,透明或半透明触点或反射触点。

    TECHNIQUES FOR ACHIEVING LOW RESISTANCE CONTACTS TO NONPOLAR AND SEMIPOLAR P-TYPE (Al,Ga,In)N
    60.
    发明申请
    TECHNIQUES FOR ACHIEVING LOW RESISTANCE CONTACTS TO NONPOLAR AND SEMIPOLAR P-TYPE (Al,Ga,In)N 审中-公开
    用于实现非绝缘和双极P型(Al,Ga,In)N的低电阻接触的技术

    公开(公告)号:US20110169138A1

    公开(公告)日:2011-07-14

    申请号:US12909702

    申请日:2010-10-21

    IPC分类号: H01L29/20 H01L21/20 H01L21/28

    摘要: A method of fabricating a p-type contact on a nonpolar or semipolar (Al,Ga,In)N device, includes the steps of growing a p-type layer on an (Al,Ga,In)N device, wherein the (Al,Ga,In)N device is a nonpolar or semipolar (Al,Ga,In)N device, and the p-type layer is a nonpolar or semipolar (Al,Ga,In)N layer; and cooling the p-type layer down, in the presence of Bis(Cyclopentadienyl)Magnesium (Cp2Mg), to form a magnesium-nitride (MgxNy) layer on the p-type layer. A metal deposition is performed to fabricate a p-type contact on the p-type layer of the (Al,Ga,In)N device, after the cooling step, wherein the p-type contact has a contact resistivity lower than a p-type contact of a polar (Al,Ga,In)N device with substantially similar composition. A hydrogen chloride (HCl) pre-treatment of the p-type layer may be performed, after the cooling step and before the metal deposition step.

    摘要翻译: 在非极性或半极性(Al,Ga,In)N器件上制造p型接触的方法包括在(Al,Ga,In)N器件上生长p型层的步骤,其中(Al ,Ga,In)N器件是非极性或半极性(Al,Ga,In)N器件,p型层是非极性或半极性(Al,Ga,In)N层; 并在双(环戊二烯基)镁(Cp2Mg)的存在下,向下冷却p型层,以在p型层上形成氮化镁(Mg x N y)层。 在冷却步骤之后,进行金属沉积以在(Al,Ga,In)N器件的p型层上制造p型接触,其中p型接触的接触电阻低于p- 极性(Al,Ga,In)N器件的类型接触具有基本相似的组成。 可以在冷却步骤之后和金属沉积步骤之前进行p型层的氯化氢(HCl)预处理。