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公开(公告)号:US07091561B2
公开(公告)日:2006-08-15
申请号:US10863226
申请日:2004-06-09
IPC分类号: H01L27/01 , H01L27/12 , H01L31/0392
CPC分类号: H01L29/785 , H01L21/84 , H01L27/1203 , H01L29/66795 , H01L29/7842 , H01L29/78603 , H01L2924/0002 , H01L2924/00
摘要: There is provided a field effect transistor including: a first insulating film formed on a semiconductor substrate, and including at least a metal oxide having a crystallinity and different in a lattice distance of a crystal on an interface from the semiconductor substrate; a convex channel region formed above the first insulating film, and different in the lattice distance from the semiconductor substrate; a source region and a drain region formed above the first insulating film on side surfaces of the channel region, respectively; a second insulating film formed right above the channel region; a gate insulating film formed on a side surface of the channel region different from the side surfaces of the channel region on which the source region and the drain regions are formed; and a gate electrode formed through the gate insulating film on at least the side surface of the channel region different from the side surfaces of the channel region on which the source region and the drain region are formed.
摘要翻译: 提供了一种场效应晶体管,包括:第一绝缘膜,形成在半导体衬底上,并且至少包括具有与半导体衬底的界面上的晶体的晶格距离不同的结晶度的金属氧化物; 形成在所述第一绝缘膜的上方的与所述半导体基板的晶格距离不同的凸状沟道区域; 源极区域和漏极区域,分别在沟道区域的侧表面上形成在第一绝缘膜的上方; 在通道区域正上方形成的第二绝缘膜; 形成在与形成有源极区域和漏极区域的沟道区域的侧面不同的沟道区域的侧面的栅极绝缘膜; 以及在与形成有源极区域和漏极区域的沟道区域的侧面不同的沟道区域的至少侧面上通过栅极绝缘膜形成的栅极电极。
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公开(公告)号:US20050230759A1
公开(公告)日:2005-10-20
申请号:US11049661
申请日:2005-02-04
IPC分类号: H01L21/322 , H01L21/28 , H01L21/316 , H01L21/336 , H01L29/49 , H01L29/51 , H01L29/76 , H01L29/78
CPC分类号: H01L29/513 , H01L21/02123 , H01L21/02142 , H01L21/022 , H01L21/28194 , H01L21/31604 , H01L21/31641 , H01L21/31645 , H01L21/31691 , H01L29/4966 , H01L29/51 , H01L29/517
摘要: A semiconductor device includes a semiconductor substrate containing Si as a main component, and an active element formed on the semiconductor substrate and including an insulating metal silicide thin film formed on the semiconductor substrate, dangling bonds of Si of the semiconductor substrate being terminated by the insulating metal silicide thin film.
摘要翻译: 半导体器件包括以Si为主要成分的半导体衬底和形成在半导体衬底上的有源元件,并且包括形成在半导体衬底上的绝缘金属硅化物薄膜,半导体衬底的Si与绝缘体端接的悬挂键 金属硅化物薄膜。
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公开(公告)号:US6005263A
公开(公告)日:1999-12-21
申请号:US976916
申请日:1997-11-24
CPC分类号: H01L33/025 , H01L33/007 , H01L33/0087
摘要: A semiconductor device includes a first semiconductor layer formed of first semiconductor, a second semiconductor layer formed on the first semiconductor layer and formed of second semiconductor of a group different from a group to which the first semiconductor belongs, and a third semiconductor layer formed between the first and second semiconductor layers, the third semiconductor layer being one of a layer formed of third semiconductor of the same group as the first semiconductor and having an impurity concentration higher than the first semiconductor layer and a layer formed of fourth semiconductor of the same group as the second semiconductor and having an impurity concentration higher than the second semiconductor layer.
摘要翻译: 半导体器件包括由第一半导体形成的第一半导体层,形成在第一半导体层上并由不同于第一半导体所属的基团的第二半导体形成的第二半导体层以及形成在第一半导体之间的第三半导体层 第一和第二半导体层,第三半导体层是由与第一半导体相同的组的第三半导体形成的层,其杂质浓度高于第一半导体层,由与第一半导体层相同的第四半导体形成的层 所述第二半导体具有高于所述第二半导体层的杂质浓度。
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公开(公告)号:US5864171A
公开(公告)日:1999-01-26
申请号:US623829
申请日:1996-03-29
申请人: Masahiro Yamamoto , Hidetoshi Fujimoto , Yoshihiro Kokubun , Masayuki Ishikawa , Shinji Saito , Yukie Nishikawa , John Rennie
发明人: Masahiro Yamamoto , Hidetoshi Fujimoto , Yoshihiro Kokubun , Masayuki Ishikawa , Shinji Saito , Yukie Nishikawa , John Rennie
IPC分类号: H01L21/203 , H01L21/301 , H01L21/31 , H01L33/06 , H01L33/16 , H01L33/20 , H01L33/24 , H01L33/28 , H01L33/32 , H01L33/34 , H01S5/00 , H01S5/02 , H01S5/30 , H01S5/32 , H01S5/323 , H01S5/327 , H01L33/00 , H01S3/19
CPC分类号: H01L33/20 , H01L33/16 , H01S5/0202 , H01S5/0213 , H01S5/3202 , H01S5/3226 , H01S5/32341 , Y10S438/973 , Y10S438/975
摘要: The present invention is intended to provide a semiconductor optoelectric device with high luminescent efficiency and a method of manufacturing the same. The semiconductor optoelectric device 18 according to the present invention is constructed by depositing compound-semiconductor layers 13 and 14 on a monocrystalline substrate 11 of a hexagonal close-packed structure. The shape of the monocrystalline substrate 11 is a parallelogram. Individual sides of the parallelogram are parallel to a orientation. As the monocrystalline substrate, sapphire, zinc oxide or silicon carbide may be used. As the compound-semiconductor layers, an n-type GaN layer 13 and p-type GaN layer 14 may be used.
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55.
公开(公告)号:US5202895A
公开(公告)日:1993-04-13
申请号:US695088
申请日:1991-05-03
申请人: Koichi Nitta , Masayuki Ishikawa , Yukie Nishikawa , Hideto Sugawara , Minoru Watanabe , Masaki Okajima , Genichi Hatakoshi
发明人: Koichi Nitta , Masayuki Ishikawa , Yukie Nishikawa , Hideto Sugawara , Minoru Watanabe , Masaki Okajima , Genichi Hatakoshi
CPC分类号: B82Y20/00 , H01S5/2231 , H01S5/34326 , H01S5/2206 , H01S5/2209 , H01S5/221 , H01S5/3201 , H01S5/321 , H01S5/32325
摘要: A semiconductor laser device comprises a compound semiconductor substrate, a first cladding layer formed on the substrate, an active layer formed on the first cladding layer, made of In.sub.1-y (Ga.sub.1-x Al.sub.x).sub.y P material (0.ltoreq.x
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公开(公告)号:US5048035A
公开(公告)日:1991-09-10
申请号:US530120
申请日:1990-05-29
IPC分类号: H01L33/00 , H01L33/14 , H01L33/30 , H01L33/38 , H01S5/042 , H01S5/183 , H01S5/22 , H01S5/30 , H01S5/32 , H01S5/343
CPC分类号: H01L33/38 , B82Y20/00 , H01L33/0025 , H01L33/14 , H01L33/145 , H01L33/30 , H01L33/387
摘要: A semiconductor light emitting device, especially, a light emitting diode includes a compound semiconductor substrate of a first conductivity type, an InGaAlP layer formed on the substrate and having a light emitting region, a GaAlAs layer of a second conductivity type formed on the InGaAlP layer and having a larger band gap than that of the InGaAlP layer, and an electrode formed on a part of the GaAlAs layer. The light emitting diode emits light from a surface at the electrode side except for the electrode. A current from the electrode is widely spread by the GaAlAs layer to widely spread a light emitting region.
摘要翻译: 一种半导体发光器件,特别是发光二极管,包括第一导电类型的化合物半导体衬底,形成在衬底上并具有发光区域的InGaAlP层,形成在InGaAlP层上的第二导电类型的GaAlAs层 并且具有比InGaAlP层更大的带隙,以及形成在GaAlAs层的一部分上的电极。 发光二极管从除了电极之外的电极侧的表面发光。 来自电极的电流被GaAlAs层广泛扩散,以广泛扩散发光区域。
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公开(公告)号:US5034957A
公开(公告)日:1991-07-23
申请号:US307278
申请日:1989-02-07
申请人: Yasuo Ohba , Yukie Nishikawa , Hajime Okuda , Masayuki Ishikawa , Hideto Sugawara , Hideo Shiozawa , Yoshihiro Kokubun
发明人: Yasuo Ohba , Yukie Nishikawa , Hajime Okuda , Masayuki Ishikawa , Hideto Sugawara , Hideo Shiozawa , Yoshihiro Kokubun
CPC分类号: H01S5/20 , H01L33/0062 , H01S5/305 , H01S5/32325 , H01S5/2059 , H01S5/2206 , H01S5/2231 , H01S5/3054
摘要: A semiconductor laser device using double heterostructure comprised of In.sub.x Ga.sub.y Al.sub.1-x-y P (0.ltoreq.x.ltoreq.1, 0.ltoreq.y.ltoreq.1), capable of preventing the leakage of the carriers and thereby reducing the threshold current, being operative with small threshold current density and at high temperature, and having a long lifetime. The device may include a double heterostructure formed on the GaAs substrate, comprised of In.sub.x Ga.sub.y Al.sub.1-x-y P (0.ltoreq.x.ltoreq.1, 0.ltoreq.y.ltoreq.1) including an active layer, the active layer having an impurity concentration not greater than 5.times.10.sup.16 cm.sup.-3. The device may include a double heterostructure formed on the GaAs substrate, comprised of InGaP active layer and p-type In.sub.q (Ga.sub.1-z Al.sub.z).sub.q P (0.ltoreq.q.ltoreq.1, 0.ltoreq.z.ltoreq.1) cladding layer with a value of z between 0.65 and 0.75. The device may include a double heterostructure formed on the GaAs substrate, comprised of In.sub.x Ga.sub.y Al.sub.1-x-y P (0.ltoreq.x.ltoreq.1, 0.ltoreq.y.ltoreq.1) including an n-type cladding layer and an p-type cladding layer, one of the n-type cladding layer and the p-type cladding layer being Si-doped. A method of manufacturing the device is also disclosed.
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