公开(公告)号：US20200064555A1

公开(公告)日：2020-02-27

申请号：US16072240

申请日：2016-04-01

Applicant: Intel Corporation

Inventor： Sasha N. OSTER ,  Johanna M. SWAN ,  Feras EID ,  Thomas L. SOUNART ,  Aleksandar ALEKSOV ,  Shawna M. LIFF ,  Baris BICEN ,  Valluri R. RAO

IPC: G02B6/35 ,  H04Q11/00 ,  H04B10/25

Abstract: Embodiments of the invention include an optical routing device that includes an organic substrate. According to an embodiment, an array of cavities are formed into the organic substrate and an array of piezoelectrically actuated mirrors may be anchored to the organic substrate with each piezoelectrically actuated mirror extending over a cavity. In order to properly rout incoming optical signals, the optical routing device may also include a routing die mounted on the organic substrate. The routing die may be electrically coupled to each of the piezoelectrically actuated mirrors and is able to generated a voltage across the first and second electrodes of each piezoelectrically actuated mirror. Additionally, a photodetector may be electrically coupled to the routing die. According to an embodiment, an array of fiber optic cables may be optically coupled with one of the piezoelectrically actuated mirrors and optically coupled with the photodetector.

公开(公告)号：US20200051743A1

公开(公告)日：2020-02-13

申请号：US16606130

申请日：2017-06-27

Applicant: Intel Corporation

Inventor： Thomas L. SOUNART ,  Aleksandar ALEKSOV ,  Feras EID ,  Georgios C. DOGIAMIS ,  Johanna M. SWAN ,  Kristof DARMAWIKARTA

IPC: H01G4/14 ,  H05K1/02 ,  H05K1/03

Abstract: Embodiments of the invention include a microelectronic device that includes a plurality of organic dielectric layers and a capacitor formed in-situ with at least one organic dielectric layer of the plurality of organic dielectric layers. The capacitor includes first and second conductive electrodes and an ultra-high-k dielectric layer that is positioned between the first and second conductive electrodes.

公开(公告)号：US20190326258A1

公开(公告)日：2019-10-24

申请号：US16399726

申请日：2019-04-30

Applicant: INTEL CORPORATION

Inventor： Fay HUA ,  Telesphor KAMGAING ,  Johanna M. SWAN

IPC: H01L25/065 ,  H01L23/00 ,  H01L23/64 ,  H01L21/02 ,  H01L23/29 ,  H01L23/48 ,  H01L23/31 ,  H01L25/00

Abstract: Embodiments include devices and methods, including a device including a substrate comprising a semiconductor, the substrate including a front side comprising active elements and a backside opposite the front side. The device includes a dielectric layer on the backside, and a passive component on the dielectric layer on the backside. In certain embodiments, the passive device is formed on a self-assembled monolayer (SAM). Other embodiments are described and claimed.

公开(公告)号：US20190188976A1

公开(公告)日：2019-06-20

申请号：US16327252

申请日：2016-10-01

Applicant: Intel Corporation

Inventor： Aleksandar ALEKSOV ,  Georgios C. DOGIAMIS ,  Johanna M. SWAN

IPC: G08B6/00 ,  G06F1/16 ,  H01L23/538 ,  H01L25/18 ,  H01L23/367 ,  G06F1/20 ,  B23K1/20

CPC classification number: G08B6/00 ,  B23K1/203 ,  G04G21/00 ,  G06F1/16 ,  G06F1/163 ,  G06F1/203 ,  G06F3/01 ,  G06F3/016 ,  H01L23/3675 ,  H01L23/5383 ,  H01L23/5384 ,  H01L23/5386 ,  H01L23/5389 ,  H01L25/18 ,  H04B1/385

Abstract: In accordance with disclosed embodiments, there are provided systems, methods, and apparatuses for implementing increased human perception of haptic feedback systems. For instance, there is disclosed in accordance with one embodiment there is wearable device, having therein: a wearable device case; a plurality of actuators within the wearable device case, each of which to vibrate independently or in combination; one or more pins attached to each of the plurality of actuators, one end of each of the plurality of pins affixed to the actuators extrudes beyond surface of the wearable device case and is exposed outside of the wearable device case; electrical interconnects from each of the plurality of actuators to internal semiconductor components of the wearable device. Other related embodiments are disclosed.

公开(公告)号：US20190036004A1

公开(公告)日：2019-01-31

申请号：US16071992

申请日：2016-04-01

Applicant: Intel Corporation

Inventor： Feras EID ,  Sasha N. OSTER ,  Shawna M. LIFF ,  Johanna M. SWAN ,  Thomas L. SOUNART ,  Aleksandar ALEKSOV ,  Valluri R. RAO ,  Baris BICEN

IPC: H01L41/113 ,  H01L41/047 ,  H01L41/253 ,  H01L41/29 ,  H01L41/316 ,  H01L41/332 ,  H01L41/317 ,  H01L27/20 ,  G01L1/16

Abstract: Embodiments of the invention include a piezoelectric sensor system. According to an embodiment of the invention, the piezoelectric sensor system may include a piezoelectric sensor, a signal conditioning circuit, and a light source each formed on an organic or flexible substrate. In embodiments of the invention, the piezoelectric sensor may be a discrete component or the piezo electric sensor may be integrated into the substrate. According to an embodiment, a piezoelectric sensor that is integrated into the substrate may comprise, a cavity formed into the organic substrate and a moveable beam formed over the cavity and anchored to the organic substrate. Additionally, the piezoelectric sensor may include a piezoelectric region formed over an end portion of the moveable beam and extending at least partially over the cavity. The piezoelectric sensor may also include a top electrode formed over a top surface of the piezoelectric region.

公开(公告)号：US20180286834A1

公开(公告)日：2018-10-04

申请号：US15476872

申请日：2017-03-31

Applicant: INTEL CORPORATION

Inventor： Fay HUA ,  Telesphor KAMGAING ,  Johanna M. SWAN

IPC: H01L25/065 ,  H01L23/48 ,  H01L23/00 ,  H01L23/31 ,  H01L25/00 ,  H01L21/02 ,  H01L23/29

CPC classification number: H01L25/0657 ,  H01L21/022 ,  H01L23/293 ,  H01L23/3128 ,  H01L23/3192 ,  H01L23/481 ,  H01L23/64 ,  H01L23/66 ,  H01L24/03 ,  H01L24/05 ,  H01L24/06 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L25/50 ,  H01L2223/6677 ,  H01L2224/02311 ,  H01L2224/02313 ,  H01L2224/02315 ,  H01L2224/02372 ,  H01L2224/0239 ,  H01L2224/024 ,  H01L2224/0401 ,  H01L2224/05164 ,  H01L2224/06181 ,  H01L2224/16113 ,  H01L2224/16146 ,  H01L2224/16148 ,  H01L2224/16225 ,  H01L2224/17181 ,  H01L2224/73204 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2924/01029 ,  H01L2924/1903 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/00014

Abstract: Embodiments include devices and methods, including a device including a substrate comprising a semiconductor, the substrate including a front side comprising active elements and a backside opposite the front side. The device includes a dielectric layer on the backside, and a passive component on the dielectric layer on the backside. In certain embodiments, the passive device is formed on a self-assembled monolayer (SAM). Other embodiments are described and claimed.

公开(公告)号：US20180097693A1

公开(公告)日：2018-04-05

申请号：US15283129

申请日：2016-09-30

Applicant: Intel Corporation

Inventor： Shawna M. LIFF ,  Adel A. ELSHERBINI ,  Sasha N. OSTER ,  Feras EID ,  Georgios C. DOGIAMIS ,  Thomas L. SOUNART ,  Johanna M. SWAN

IPC: H04L12/24 ,  H01H57/00 ,  H01L41/047 ,  H01L41/187 ,  A61B5/0205 ,  A61B5/00

CPC classification number: H04L41/0816 ,  A61B5/02055 ,  A61B5/021 ,  A61B5/02405 ,  A61B5/08 ,  A61B5/145 ,  A61B5/4266 ,  A61B5/4824 ,  A61B5/7282 ,  A61B5/7285 ,  A61B2560/0462 ,  H01H57/00 ,  H01L41/0471 ,  H01L41/187 ,  H01L41/1873 ,  H01L41/1876 ,  H04L41/0886

Abstract: Embodiments of the invention include a physiological sensor system. According to an embodiment the sensor system may include a package substrate, a plurality of sensors formed on the substrate, a second electrical component, and an encryption bank formed along a data transmission path between the plurality of sensors and the second electrical component. In an embodiment the encryption bank may include a plurality of portions that each have one or more switches integrated into the package substrate. In an embodiment each sensor transmits data to the second electrical component along different portions of the encryption bank. In some embodiments, the switches may be piezoelectrically actuated. In other embodiments the switches may be actuated by thermal expansion. Additional embodiments may include tri- or bi-stable mechanical switches.

公开(公告)号：US20170288635A1

公开(公告)日：2017-10-05

申请号：US15088814

申请日：2016-04-01

Applicant: Intel Corporation

Inventor： Adel A. ELSHERBINI ,  Feras EID ,  Baris BICEN ,  Telesphor KAMGAING ,  Vijay K. NAIR ,  Johanna M. SWAN ,  Georgios C. DOGIAMIS ,  Valluri R. RAO

IPC: H03H9/02 ,  H03H9/17

CPC classification number: H03H9/02259 ,  H03H9/17 ,  H03H9/2463 ,  H03H2009/02291 ,  H03H2009/155

Abstract: Embodiments of the invention include a piezoelectric resonator which includes an input transducer having a first piezoelectric material, a vibrating structure coupled to the input transducer, and an output transducer coupled to the vibrating structure. In one example, the vibrating structure is positioned above a cavity of an organic substrate. The output transducer includes a second piezoelectric material. In operation the input transducer causes an input electrical signal to be converted into mechanical vibrations which propagate across the vibrating structure to the output transducer.

公开(公告)号：US20170286731A1

公开(公告)日：2017-10-05

申请号：US15586820

申请日：2017-05-04

Applicant: Intel Corporation

Inventor： Adel A. ELSHERBINI ,  Telesphor KAMGAING ,  Feras EID ,  Vijay K. NAIR ,  Georgios C. DOGIAMIS ,  Johanna M. SWAN ,  Valluri R. RAO

IPC: G06K7/10 ,  H03H9/17 ,  H03H9/205 ,  H03H9/30

CPC classification number: G06K7/10297 ,  G06K7/10316 ,  G06K19/0672 ,  G06K19/0675 ,  H03H9/30

Abstract: Embodiments of the invention include delay line circuitry that is integrated with an organic substrate. Organic dielectric material and a plurality of conductive layers form the organic substrate. The delay line circuitry includes a piezoelectric transducer to receive a guided electromagnetic wave signal and to generate an acoustic wave signal to be transmitted with an acoustic transmission medium. An acoustic reflector is communicatively coupled to the acoustic transmission medium. The acoustic reflector receives a plurality of acoustic wave signals from the acoustic transmission medium and reflects acoustic wave signals to the piezoelectric transducer using the acoustic transmission medium. The transducer converts the reflected acoustic signals into electromagnetic waves which are then transmitted back through the antenna and decoded by the reader.

公开(公告)号：US20170133296A1

公开(公告)日：2017-05-11

申请号：US15410625

申请日：2017-01-19

Applicant: Intel Corporation

Inventor： Chandra M. Jha ,  Feras EID ,  Johanna M. SWAN ,  Ashish GUPTA

IPC: H01L23/373 ,  H01L23/00

CPC classification number: H01L23/3733 ,  H01L23/3736 ,  H01L23/3737 ,  H01L23/433 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/0401 ,  H01L2224/04026 ,  H01L2224/05568 ,  H01L2224/05647 ,  H01L2224/1133 ,  H01L2224/1147 ,  H01L2224/1182 ,  H01L2224/11826 ,  H01L2224/13017 ,  H01L2224/13019 ,  H01L2224/13078 ,  H01L2224/13147 ,  H01L2224/13193 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16245 ,  H01L2224/271 ,  H01L2224/27436 ,  H01L2224/2745 ,  H01L2224/29193 ,  H01L2224/2929 ,  H01L2224/29347 ,  H01L2224/29393 ,  H01L2224/29499 ,  H01L2224/32058 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/81011 ,  H01L2224/81191 ,  H01L2224/83104 ,  H01L2224/83191 ,  H01L2224/92125 ,  H01L2224/94 ,  H01L2225/06524 ,  H01L2225/06589 ,  H01L2924/15311 ,  H01L2924/16251 ,  H01L2924/16724 ,  H01L2924/16747 ,  H01L2924/3511 ,  Y10T428/249921 ,  Y10T428/26 ,  H01L2224/27 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/0665 ,  H01L2924/00014

Abstract: A copper nanorod thermal interface material (TIM) is described. The copper nanorod TIM includes a plurality of copper nanorods having a first end thermally coupled with a first surface, and a second end extending toward a second surface. A plurality of copper nanorod branches are formed on the second end. The copper nanorod branches are metallurgically bonded to a second surface. The first surface may be the back side of a die. The second surface may be a heat spread or a second die. The TIM may include a matrix material surrounding the copper nanorods. In an embodiment, the copper nanorods are formed in clusters.