-
51.发明授权Thin film multi-layer wiring substrate having a coaxial wiring structure in at least one layer 有权在至少一层中具有同轴布线结构的薄膜多层布线基板公开(公告)号：US06943447B2
公开(公告)日：2005-09-13
申请号：US10338646
申请日：2003-01-09
CPC分类号： H05K1/0221 , H01L2223/6622 , H05K3/4647 , H05K3/467 , H05K2201/09809 , H05K2203/0733 , Y10T428/24917 , Y10T428/24926
摘要： A thin film multi-layer wiring substrate comprising a plurality of wiring layers, each adjacent pair of wiring layers being separated by an insulating layer, wherein at least one of the wiring layers includes wiring formed by an inner conductor member and a conductor layer surrounding the periphery thereof through an insulating material.
摘要翻译： 一种薄膜多层布线基板，包括多个布线层，每个相邻的一对布线层被绝缘层隔开，其中至少一个布线层包括由内部导体构件形成的布线和围绕该布线层的导体层 其周边通过绝缘材料。
-
公开(公告)号：US06894396B2
公开(公告)日：2005-05-17
申请号：US10619483
申请日：2003-07-16
IPC分类号： H01L23/12 , H01L21/60 , H01L23/31 , H01L23/50 , H01L23/64 , H01L25/00 , H01L27/01 , H05K1/02 , H05K1/18 , H01L23/48
CPC分类号： H01L23/50 , H01L23/3107 , H01L23/642 , H01L24/48 , H01L24/81 , H01L27/016 , H01L2224/05599 , H01L2224/16225 , H01L2224/16265 , H01L2224/32225 , H01L2224/45099 , H01L2224/48247 , H01L2224/73204 , H01L2224/81801 , H01L2224/85399 , H01L2924/00014 , H01L2924/01012 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/10253 , H01L2924/14 , H01L2924/15151 , H01L2924/15311 , H01L2924/181 , H01L2924/19041 , H01L2924/19103 , H01L2924/19104 , H01L2924/19106 , H01L2924/30107 , H05K1/0231 , H05K1/182 , H05K2201/10515 , H05K2201/1053 , H05K2201/10734 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： A semiconductor device comprises a carrier substrate, an integrated circuit chip mounted on the carrier substrate via bumps, and a capacitor provided to stabilize operation of the integrated circuit chip at high frequencies. In the semiconductor device, the capacitor is electrically connected to pads on bottom of the integrated circuit chip, and the capacitor is provided to have a height on the carrier substrate that is smaller than or equal to a height of the bumps on the carrier substrate.
摘要翻译： 半导体器件包括载体衬底，通过凸块安装在载体衬底上的集成电路芯片，以及用于稳定集成电路芯片在高频下的操作的电容器。 在半导体器件中，电容器电连接到集成电路芯片的底部的焊盘，并且电容器被设置为具有小于或等于载体衬底上的凸块的高度的载体衬底上的高度。
-
公开(公告)号：US06879739B2
公开(公告)日：2005-04-12
申请号：US10082269
申请日：2002-02-26
摘要： An optical deflector including an optical waveguide of a dielectric material having electrooptical effect; and a pair of electrodes opposed to each other across the optical waveguide. An electric field is applied between the opposed electrodes to change a refractive index of the dielectric material to thereby control a propagating direction of signal light propagating in the optical waveguide, wherein the dielectric material has a first refractive index in its initial state, has a second refractive index by application of an electric field of a first polarity, and retains as a third refractive index a refractive index obtained after the electric field has been removed. The dielectric material having the third refractive index has the first refractive index by the application of an electric field of a second polarity different from the first polarity and removal of the electric field.
摘要翻译： 一种光偏转器，包括具有电光效应的介电材料的光波导; 以及在光波导上彼此相对的一对电极。 在相对电极之间施加电场以改变介电材料的折射率，从而控制在光波导中传播的信号光的传播方向，其中电介质材料在其初始状态下具有第一折射率，具有第二 通过施加第一极性的电场的折射率，并且将电场去除之后获得的折射率保持为第三折射率。 具有第三折射率的介电材料通过施加与第一极性不同的第二极性的电场和电场的去除而具有第一折射率。
-
公开(公告)号：US20050058399A1
公开(公告)日：2005-03-17
申请号：US10937881
申请日：2004-09-10
CPC分类号： G02B6/4214 , G02B6/4204 , G02B6/421 , G02B6/4292
摘要： An optical waveguide structure capable of optically coupling a surface type optical device, such as a surface emitting laser diode or a photodiode, and a transmission medium, such as an optical fiber, located so that their light output surface and light input surface will form an angle of about 90° with each other simply and easily. The optical waveguide structure comprises a first clad section having a curved surface for gradually turning the direction in which light travels almost squarely and a groove formed in the curved surface along the direction in which light travels, a core section which is made from a transparent material with a refractive index higher than the refractive index of the first clad section and with which the groove is filled in, and a second clad section which covers an exposed surface of the core section and the curved surface of the first clad section and which is integrated with the first clad section.
摘要翻译： 能够使诸如表面发射激光二极管或光电二极管的表面型光学器件和诸如光纤的传输介质光学耦合的光波导结构，使得它们的光输出表面和光输入表面将形成 约90°的角度简单而容易。 光波导结构包括第一包层部分，其具有用于逐渐转动光线几乎正交的方向的弯曲表面和沿着光线行进的方向在曲面中形成的槽，由透明材料制成的芯部分 其折射率高于第一包层部分的折射率并且其中填充有凹槽;以及第二包层部分，其覆盖芯部的暴露表面和第一包层部分的弯曲表面，并且其被集成 与第一包层部分。
-
公开(公告)号：US06846549B2
公开(公告)日：2005-01-25
申请号：US09962126
申请日：2001-09-26
CPC分类号： H05K1/0366 , B32B15/04 , B32B17/04 , B32B27/38 , B32B37/0015 , B32B2457/08 , D03D15/08 , H05K3/4602 , H05K2201/0209 , H05K2201/029 , H05K2201/09536 , Y10T428/24917 , Y10T442/2008 , Y10T442/2041 , Y10T442/2049 , Y10T442/209 , Y10T442/2418 , Y10T442/2475 , Y10T442/2926 , Y10T442/2951 , Y10T442/2992 , Y10T442/3008
摘要： A multilayer printed wiring board includes a core member having a plurality of glass clothes impregnated with a resin. Each of the glass clothes is woven with glass yarns each of which includes a bundle of glass filaments. One or more buildup layers are laminated on one or each surface of the core member. The core member has an elastic modulus which is no less than 100 times that of the buildup layer at 240° C.
摘要翻译： 多层印刷电路板包括具有浸渍有树脂的多个玻璃衣服的芯构件。 每个玻璃衣服都用玻璃纱编织，每条玻璃纱都包括一束玻璃丝。 一个或多个堆积层层压在芯构件的一个或每个表面上。 芯构件的弹性模量不小于在240℃下积聚层的弹性模量的100倍。
-
56.发明授权公开(公告)号：US06806118B2
公开(公告)日：2004-10-19
申请号：US10347224
申请日：2003-01-21
IPC分类号： H01L2144
CPC分类号： H05K3/328 , H01L21/563 , H01L24/29 , H01L2224/13109 , H01L2224/13111 , H01L2224/29109 , H01L2224/29111 , H01L2224/2919 , H01L2224/73104 , H01L2224/73203 , H01L2224/83101 , H01L2224/83193 , H01L2924/01005 , H01L2924/01006 , H01L2924/01018 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01078 , H01L2924/01082 , H01L2924/0132 , H01L2924/0133 , H01L2924/1579 , H01L2924/3511 , H05K3/3489 , H01L2924/01083 , H01L2924/00014 , H01L2924/0665
摘要： An electrode connecting method of connecting a first electrode and a second electrode is disclosed. The respective bonding surfaces of the first and second electrodes are activated. Then, each of the first and second electrodes having the activated surfaces is coated with a coating member for maintaining an activated state. A solid state bond between the first electrode and the second electrode is formed by pressure welding the first electrode and the second electrode so that the first and second electrodes break through the coating members.
摘要翻译： 公开了一种连接第一电极和第二电极的电极连接方法。 第一和第二电极的各自的接合表面被激活。 然后，具有活化表面的第一和第二电极中的每一个涂覆有用于保持激活状态的涂层构件。 第一电极和第二电极之间的固态键合是通过对第一电极和第二电极进行加压焊接形成的，以使第一和第二电极穿过涂覆部件。
-
公开(公告)号：US06662345B2
公开(公告)日：2003-12-09
申请号：US10155115
申请日：2002-05-28
申请人： Hiroki Uchida , Yasuo Yamagishi
发明人： Hiroki Uchida , Yasuo Yamagishi
IPC分类号： G06F1750
CPC分类号： G06F17/50 , G06F17/5018 , G06F17/5036 , G06F17/5072 , G06F2217/80 , H05K3/0005 , H05K3/3494
摘要： A thermal analysis in heating a print-circuit board in a reflowing furnace is simulated by a processor using data required for the design and thermal analysis of the printed-circuit board that carries solder-bonded components. The result of simulation indicates the possibility of existence of unmelted solder bonds heated at peak temperature below a predetermined lower limit and solder bonds heated at temperature above a predetermined upper limit. On the basis of the result, the components that are likely to be heated at inapplicable temperature are redesigned so that they can actually be heated at temperature in the predetermined range. The modification of design is displayed.
-
58.发明授权Insulating material for wiring substrate and method of producing multi-layered wiring substrate 失效配线基板用绝缘材料及多层布线基板的制造方法
公开(公告)号：US5349155A
公开(公告)日：1994-09-20
申请号：US5105
申请日：1993-01-15
申请人： Yasuo Yamagishi , Tamotsu Owada
发明人： Yasuo Yamagishi , Tamotsu Owada
CPC分类号： B23K26/0624 , B23K26/066 , B23K26/382 , B23K26/386 , B23K26/40 , B23K26/402 , H01L21/4857 , H01L23/49822 , H05K1/0353 , B23K2201/42 , B23K2203/16 , B23K2203/42 , B23K2203/50 , B23K2203/52 , H01L2924/0002 , H01L2924/09701
摘要： This invention relates to an insulating material for a wiring substrate and to a method of producing a multi-layered wiring substrate, and is directed to put into practical application a multi-layered wiring substrate suitable for processing high speed signals. The production method of the multi-layered wiring substrate of this invention uses an insulating material prepared by allowing voids of a porous perfluorocarbon polymer film to be impregnated with a thermosetting resin containing a benzocyclobutene ring, and thermally setting the resin, and comprises laminating alternately a wiring layer and an insulating layer made of the insulating material for the wiring substrate on a rigid support substrate.
摘要翻译： 本发明涉及一种用于布线基板的绝缘材料和一种多层布线基板的制造方法，并且涉及实际应用中适用于处理高速信号的多层布线基板。 本发明的多层布线基板的制造方法使用通过使多孔全氟碳聚合物膜的空隙浸渍在含有苯并环丁烯环的热固性树脂中并将树脂热固化而制备的绝缘材料，并且包括交替层压 布线层和由刚性支撑基板上的用于布线基板的绝缘材料制成的绝缘层。
-
公开(公告)号：US5231440A
公开(公告)日：1993-07-27
申请号：US906354
申请日：1992-06-30
CPC分类号： G03H1/18 , G03F7/001 , G03H1/0248 , G03H2001/186 , G03H2260/12
摘要： A method of and apparatus for forming a volume type phase hologram comprising the steps of, after exposure of a holographic material comprising a polymeric matrix having a radiation active substance associated therewith to an interference pattern of radiation, dipping the pattern-wise exposed holographic material in a swelling solution consisting of a first solvent which can act as a good solvent for the polymer of the matrix and a second solvent which can act as a poor solvent for the polymer and has a higher boiling point than that of the first solvent, and then pulling the swollen holographic material up from the swelling solution, whereby uniformly developed holograms having a large size and high qualities can be easily produced by a simple production process.
摘要翻译： 一种用于形成体积型相位全息图的方法和装置，包括以下步骤：在将包含与其相关联的辐射活性物质的聚合物基质的全息材料曝光于辐射的干涉图案之后，将图案方式曝光的全息材料浸入 由可以作为基质聚合物的良溶剂的第一溶剂和可以作为聚合物不良溶剂并且沸点高于第一溶剂的第二溶剂组成的溶胀溶液，然后 从溶胀溶液中拉出膨胀的全息材料，由此可以通过简单的制造工艺容易地制造具有大尺寸和高质量的均匀显影的全息图。
-
公开(公告)号：US5154994A
公开(公告)日：1992-10-13
申请号：US416943
申请日：1989-10-04
CPC分类号： G03H1/18 , G03F7/001 , G03H1/182 , G03H2001/186
摘要： A method of and apparatus for forming a volume type phase hologram comprising the steps of, after exposure of a holographic material comprising a polymeric matrix having a radiation active substance associated therewith to an interference pattern of radiation, dipping the pattern-wise exposed holographic material in a swelling solution consisting of a first solvent which can act as a good solvent for the polymer of the matrix and a second solvent which can act as a poor solvent for the polymer and has a higher boiling point than that of the first solvent, and then pulling the swollen holographic material up from the swelling solution, whereby uniformly developed holograms having a large size and high qualities can be easily produced by a simple production process.
-
-
-
-
-
-
-
-
-
搜索结果
60 条记录 (耗时 0.037 秒)
