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    METHOD OF PRODUCING AN OPTOELECTRONIC COMPONENT, AND OPTOELECTRONIC COMPONENT
    51.
    发明申请
    METHOD OF PRODUCING AN OPTOELECTRONIC COMPONENT, AND OPTOELECTRONIC COMPONENT 审中-公开

    公开(公告)号：US20200251627A1

    公开(公告)日：2020-08-06

    申请号：US16065371

    申请日：2016-12-20

    Applicant: OSRAM Opto Semiconductors GmbH

    Inventor： Siegfried Herrmann

    IPC: H01L33/52 ,  H01L23/00 ,  G02B6/42

    Abstract: A method of producing an optoelectronic component includes providing an opto-electronic semiconductor chip including a layer sequence arranged on a substrate, wherein the layer sequence includes a contact side including two electrical contact locations, the contact side facing away from the substrate; arranging the optoelectronic semiconductor chip on an auxiliary carrier such that the contact side faces away from the auxiliary carrier; arranging a molding material above the auxiliary carrier such that a housing is formed that at least partly encloses the optoelectronic semiconductor chip, wherein the contact side is covered by the molding material; and detaching the housing from the auxiliary carrier.

    Method for Producing an Electronic Device and Electronic Device
    52.
    发明申请
    Method for Producing an Electronic Device and Electronic Device 审中-公开

    公开(公告)号：US20200152822A1

    公开(公告)日：2020-05-14

    申请号：US16087646

    申请日：2017-03-22

    Applicant: OSRAM Opto Semiconductors GmbH

    Inventor： Georg Dirscherl ,  Siegfried Herrmann

    IPC: H01L33/00 ,  H01L33/56 ,  H01L23/00

    Abstract: A method for producing an electronic device and an electronic device are disclosed. In an embodiment a method for producing an electronic device includes attaching semiconductor chips on a carrier, applying a fluoropolymer to main surfaces of the semiconductor chips facing away from the carrier and a main surface of the carrier facing the semiconductor chip thereby forming an encapsulation layer including a fluoropolymer, structuring the encapsulation layer thereby forming cavities in the encapsulation layer and applying a metal layer in the cavities.

    Optoelectronic Semiconductor Component
    53.
    发明申请
    Optoelectronic Semiconductor Component 审中-公开

    公开(公告)号：US20190214375A1

    公开(公告)日：2019-07-11

    申请号：US16071253

    申请日：2017-03-02

    Applicant: OSRAM Opto Semiconductors GmbH

    Inventor： Siegfried Herrmann

    IPC: H01L25/075 ,  H01L33/62 ,  H01L33/46 ,  H01L33/48 ,  H01L33/60

    CPC classification number: H01L25/0756 ,  H01L25/0753 ,  H01L33/46 ,  H01L33/486 ,  H01L33/60 ,  H01L33/62 ,  H01L2933/0091

    Abstract: An optoelectronic semiconductor component is disclosed. In an embodiment a component includes a housing having a recess, a first semiconductor chip for generating light of a first color and a second semiconductor chip for generating light of a second color which is different from the first color, wherein, during operation, a mixed radiation including at least the light of the first color is emitted along a main emission direction, wherein the first semiconductor chip is arranged in a first plane and the second semiconductor chip is arranged in a second plane in the recess, the planes following one another along the main emission direction, wherein active zones of the first and second semiconductor chips are arranged side by side to one another, and wherein at least one electrical connection surface of the first semiconductor chip forms a part of a mounting surface of the semiconductor component.

    Method for producing optoelectronic devices and surface-mountable optoelectronic device
    54.
    发明授权
    Method for producing optoelectronic devices and surface-mountable optoelectronic device 有权

    公开(公告)号：US10243117B2

    公开(公告)日：2019-03-26

    申请号：US15573820

    申请日：2016-05-11

    Applicant: OSRAM Opto Semiconductors GmbH

    Inventor： Siegfried Herrmann ,  Ion Stoll ,  Georg Roßbach

    IPC: H01L33/50 ,  C25D13/02 ,  C25D13/12 ,  H01L33/00 ,  H01L33/32 ,  H01L33/54 ,  H01L33/56 ,  H01L33/58 ,  H01L33/62 ,  H01L33/48

    Abstract: A method for producing optoelectronic devices and a surface-mountable optoelectronic device are disclosed. In an embodiment the method includes applying semiconductor chips laterally adjacent one another on a carrier, wherein contact sides of the chips face the carrier, and wherein each semiconductor chip comprises contact elements for external electrical contacting which are arranged on the contact side of the semiconductor chip and applying an electrically conductive layer on at least sub-regions of the sides of the semiconductor chips not covered by the carrier, wherein the electrically conductive layer is formed contiguously, and wherein protective elements prevent direct contact of the contact elements with the electrically conductive layer. The method further includes electrophoretically depositing a converter layer on the electrically conductive layer and removing the electrically conductive layer from regions between the converter layer and the semiconductor chips.

    Method for producing optoelectronic semiconductor components and optoelectronic semiconductor component
    55.
    发明授权
    Method for producing optoelectronic semiconductor components and optoelectronic semiconductor component 有权

    公开(公告)号：US10128424B2

    公开(公告)日：2018-11-13

    申请号：US15553565

    申请日：2016-02-12

    Applicant: OSRAM Opto Semiconductors GmbH

    Inventor： Siegfried Herrmann

    IPC: H01L33/00 ,  H01L33/62 ,  H01L33/48 ,  H01L33/54 ,  H01L21/56

    Abstract: The invention relates in at least one embodiment to the production of optoelectronic semiconductor components and comprises the steps: A) providing an intermediate carrier (2) having a plurality of fixing points (23), B) providing optoelectronic semiconductor chips (3) each having a chip upper side (30) and a mounting side (32) located opposite thereto, wherein electric contact points (34) of the semiconductor chips (3) are each located on the mounting sides (32), C) attaching connecting means (4), D) fixing the contact points (34) to the fixing points (23) by means of the connecting means (4), E) producing a potting layer (5), such that the semiconductor chips (3) and the contact points (34) and the connecting means (4) are directly surrounded all round by the potting layer (5), F) detaching the semiconductor chips (3), such that the connecting means (4) are removed from the semiconductor chips (3) and recesses (44) are each provided at the contact points (34) as a negative form in relation to the connecting regions (4), and G) producing electric contact structures (6).

    Optoelectronic component and method for producing optoelectronic semiconductor components
    57.
    发明授权
    Optoelectronic component and method for producing optoelectronic semiconductor components 有权

    公开(公告)号：US10109780B2

    公开(公告)日：2018-10-23

    申请号：US15127401

    申请日：2015-03-17

    Applicant: OSRAM Opto Semiconductors GmbH

    Inventor： Siegfried Herrmann

    IPC: H01L33/62 ,  H01L33/38 ,  H01L33/48 ,  H01L23/12 ,  H01L23/498 ,  H01L25/16 ,  H01L31/02 ,  H01L31/0224 ,  H01L23/043 ,  H01L23/36 ,  H01L33/64

    Abstract: What is specified is: an optoelectronic semiconductor component (1) comprising a carrier (5) and a semiconductor body (2), wherein the semiconductor body is fastened on the carrier and has a semiconductor layer sequence having an active region (20) provided for generating and/or receiving radiation, a first semiconductor layer (21) and a second semiconductor layer (22). The active region is arranged between the first semiconductor layer and the second semiconductor layer. The carrier is electrically conductive and is divided into a first carrier body (51) and a second carrier body (52), wherein the first carrier body and the second carrier body are electrically insulated from one another. The first carrier body has a first external contact (61) of the semiconductor component on the side remote from the semiconductor body, wherein the first contact is electrically conductively connected to the first semiconductor layer via the first carrier body. The second carrier body has a second external contact (62) of the semiconductor component on the side remote from the semiconductor body, wherein the second contact is electrically conductively connected to the second semiconductor layer via the second carrier body. The invention furthermore relates to a method for producing semiconductor components.

    Unknown
    59.
    发明申请
    Unknown 审中-公开

    公开(公告)号：US20180040787A1

    公开(公告)日：2018-02-08

    申请号：US15663984

    申请日：2017-07-31

    Applicant: OSRAM Opto Semiconductors GmbH

    Inventor： Siegfried Herrmann

    IPC: H01L33/60 ,  H01L25/075 ,  H01L33/62

    CPC classification number: H01L33/60 ,  F21Y2115/10 ,  H01L25/0753 ,  H01L33/38 ,  H01L33/62 ,  H01L2224/48091

    Abstract: A light-emitting component includes at least two radiation-emitting semiconductor chips of a first type configured to emit electromagnetic radiation during operation, and a light exit surface at a light exit side of the light-emitting component, wherein each of the radiation-emitting semiconductor chips of the first type includes a semiconductor layer sequence with a stacking direction, the stacking direction of each radiation-emitting semiconductor chip of the first type is parallel to the light exit surface of the component, and all the semiconductor chips of the first type are arranged directly below the light exit surface.

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