公开(公告)号：US4104222A

公开(公告)日：1978-08-01

申请号：US441990

申请日：1974-02-13

申请人： Masakazu Date ,  Masahiro Wada

发明人： Masakazu Date ,  Masahiro Wada

IPC分类号： C08J3/03 ,  C08L67/02 ,  C09D167/02 ,  D06M15/507 ,  C08J3/06 ,  C08G63/50 ,  D06M15/10 ,  D06M15/68

CPC分类号： C08J3/03 ,  C08L67/02 ,  C09D167/02 ,  D06M15/507 ,  C08J2367/00 ,  C08J2367/02 ,  Y10T428/31786 ,  Y10T428/31797 ,  Y10T428/31942 ,  Y10T442/2279 ,  Y10T442/2344 ,  Y10T442/2352 ,  Y10T442/2393 ,  Y10T442/2402 ,  Y10T442/2434 ,  Y10T442/2525 ,  Y10T442/2607 ,  Y10T442/2721 ,  Y10T442/2738

摘要： The present invention relates to a dispersion of a linear polyester resin for use in the property-improvement of shaped high polymer articles, said dispersion being obtained by mixing a linear polyester resin with a higher alcohol/ethylene oxide addition type surface-active agent, melting the mixture and dispersing the resulting melt by pouring it into an aqueous solution of an alkali under stirring. The dispersion may be used as coating or impregnating agents for shaped high molecular weight polymers.

摘要翻译： 本发明涉及一种用于成型高分子制品性能改进的线性聚酯树脂的分散体，所述分散体是通过将线性聚酯树脂与高级醇/环氧乙烷加成型表面活性剂混合而获得的，熔融 混合并将所得熔体在搅拌下倒入碱水溶液中分散。 分散体可以用作成形高分子量聚合物的包衣或浸渍剂。

公开(公告)号：US08883883B2

公开(公告)日：2014-11-11

申请号：US13322037

申请日：2010-05-28

申请人： Masahiro Wada

发明人： Masahiro Wada

IPC分类号： C08G59/62 ,  C08L63/00 ,  C08L61/04 ,  C08K3/00 ,  H01L23/29 ,  C08G59/68 ,  H01L23/00

CPC分类号： H01L23/293 ,  C08G59/621 ,  C08G59/688 ,  C08L63/00 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48011 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/10253 ,  H01L2924/1301 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/20752 ,  H01L2924/20656

摘要： Disclosed is a resin composition for encapsulating a semiconductor including a phenol resin (A) having one or more components containing a component (A1) composed of a polymer having a first structural unit and a second structural unit, an epoxy resin (B), and an inorganic filler (C). Also disclosed is a semiconductor device obtained by encapsulating a semiconductor element with a cured product of the resin composition for encapsulating a semiconductor.

摘要翻译： 公开了一种包含具有一种或多种成分的酚醛树脂（A）的半导体的树脂组合物，该组分含有由具有第一结构单元和第二结构单元的聚合物组成的组分（A1），环氧树脂（B）和 无机填料（C）。 还公开了通过将半导体元件与用于封装半导体的树脂组合物的固化物封装而获得的半导体器件。

公开(公告)号：US08809478B2

公开(公告)日：2014-08-19

申请号：US13700370

申请日：2011-06-06

申请人： Masako Saito ,  Ichiro Hiratsuka ,  Masahiro Wada ,  Ryota Chiba ,  Takuya Kanazawa ,  Osamu Yoshioka ,  Takehito Tsukamoto ,  Junko Toda

发明人： Masako Saito ,  Ichiro Hiratsuka ,  Masahiro Wada ,  Ryota Chiba ,  Takuya Kanazawa ,  Osamu Yoshioka ,  Takehito Tsukamoto ,  Junko Toda

IPC分类号： C08G77/08 ,  C08L83/04 ,  H01L23/057 ,  H01L23/498 ,  C08L83/06 ,  C08K5/14 ,  C08K5/549 ,  H01L33/56 ,  C08K5/5425 ,  C08K5/00 ,  C08G77/20 ,  C08G77/12

CPC分类号： C08L83/06 ,  C08G77/12 ,  C08G77/20 ,  C08K5/0025 ,  C08K5/14 ,  C08K5/5425 ,  C08K5/549 ,  C08L83/04 ,  H01L23/057 ,  H01L23/49861 ,  H01L33/56 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/00

摘要： A curable composition includes: 100 parts by mass of a silicon-containing polymer having a Mw of 3,000 to 100,000 obtainable by hydrolysis-condensation of an organosilane mixture including R1SiX3, R2SiX3, R3R4SiX2 and R5SiX3, the total of R2SiX3 and R3R4SiX2 being 5 to 60 mol %, optionally a prepolymer, optionally a cyclic siloxane compound, 0.0001 to 10 parts by mass of an organic peroxide and optionally a metal catalyst, and 10 to 1,500 parts by mass of a filler, wherein R1 is a C2-6 alkenyl group, R2 is a C1-6 alkyl group, R3 and R4 are each a C1-6 alkyl group, R5 is a phenyl group optionally substituted with a C1-6 alkyl group, and X is a C1-6 alkoxy group, one or more of R2 to R4 is a methyl group, f represents a number of 2 to 10, g represents a number of 0 to 8, and n represents 1 or 2.

摘要翻译： 可固化组合物包括：通过包括R1SiX3，R2SiX3，R3R4SiX2和R5SiX3的有机硅烷混合物的水解缩合得到的Mw为3,000〜100,000的含硅聚合物100质量份，R2SiX3和R3R4SiX2的合计为5〜60 mol％，任选的预聚物，任选的环状硅氧烷化合物，0.0001-10质量份有机过氧化物和任选的金属催化剂，以及10-1500质量份填料，其中R1是C2-6链烯基， R2是C1-6烷基，R3和R4各自是C1-6烷基，R5是任选被C 1-6烷基取代的苯基，X是C 1-6烷氧基，一个或多个 R 2〜R 4为甲基，f表示2〜10的数，g表示0〜8的数，n表示1或2。

公开(公告)号：US08592994B2

公开(公告)日：2013-11-26

申请号：US12517551

申请日：2007-12-05

申请人： Kenya Tachibana ,  Masahiro Wada ,  Hitoshi Kawaguchi ,  Kensuke Nakamura

发明人： Kenya Tachibana ,  Masahiro Wada ,  Hitoshi Kawaguchi ,  Kensuke Nakamura

IPC分类号： H01L23/48

CPC分类号： H01L21/563 ,  C08L63/00 ,  H01L23/293 ,  H01L23/3735 ,  H01L23/3737 ,  H01L23/49822 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/10253 ,  H05K1/0271 ,  H05K3/305 ,  H05K3/4602 ,  H05K2201/068 ,  H05K2201/10674 ,  H05K2201/10977 ,  H01L2924/00 ,  H01L2224/0401

摘要： A flip-chip semiconductor package includes a circuit board having a core layer and at least one buildup layer, a semiconductor device connected to the circuit board through a metal bump, and a cured member that is made of a sealing resin composition and enclosed between the semiconductor device and the circuit board. The coefficient of linear expansion at 25 to 75° C. of the cured member is 15 to 35 ppm/° C., the glass transition temperature of at least one buildup layer is 170° C. or more, and the coefficient of linear expansion of at 25 to 75° C. of the at least one buildup layer in the planar direction is 25 ppm or less. A highly reliable flip-chip semiconductor package, buildup layer material, core layer material, and sealing resin composition can be provided by preventing cracks and inhibiting delamination.

摘要翻译： 倒装芯片半导体封装包括具有芯层和至少一个堆积层的电路板，通过金属凸块连接到电路板的半导体器件，以及由密封树脂组合物制成的封装在其间的固化构件 半导体器件和电路板。 固化部件的25〜75℃的线膨胀系数为15〜35ppm /℃，至少一层积层的玻璃化转变温度为170℃以上，线膨胀系数 在平面方向上的至少一个堆积层的25〜75℃为25ppm以下。 可以通过防止裂纹和抑制分层而提供高度可靠的倒装芯片半导体封装，堆积层材料，芯层材料和密封树脂组合物。

公开(公告)号：US08552572B2

公开(公告)日：2013-10-08

申请号：US13055706

申请日：2009-07-22

申请人： Masahiro Wada

发明人： Masahiro Wada

IPC分类号： H01L23/29 ,  C08L63/00 ,  C08G59/62

CPC分类号： H01L23/293 ,  C08G59/06 ,  C08G59/68 ,  H01L24/45 ,  H01L24/73 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48011 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/10253 ,  H01L2924/12044 ,  H01L2924/1301 ,  H01L2924/13034 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/20753 ,  H01L2924/20656 ,  H01L2924/00014

摘要： Provided is a resin composition for encapsulating a semiconductor which has excellent flame resistance and solder resistance, and can be manufactured at a low cost. The composition includes a phenol resin (A), an epoxy resin (B), and an inorganic filler (C). The phenol resin (A) includes at least one polymer component (A0) composed of a polymer having structural units represented by general formulae (1) and (2), and at least one polymer component (A0) is composed of a polymer having structural units represented by general formulae (1) and (2) and terminated on at least one end with an aromatic group free of polar groups and containing at least one alkyl group having 1 to 3 carbon atoms: wherein R1 and R2 are each independently a hydrogen atom or a hydrocarbon group having 1 to 6 carbon atoms; each R3 is independently a hydrocarbon group having 1 to 6 carbon atoms; and a is an integer of 0 to 3 , wherein R5, R6, R8 and R9 are each independently a hydrogen atom or a hydrocarbon group having 1 to 6 carbon atoms; each R4 and R7 is independently a hydrocarbon group having 1 to 6 carbon atoms; b is an integer of 0 to 3; and c is an integer of 0 to 4.

摘要翻译： 提供一种用于封装半导体的树脂组合物，其具有优异的阻燃性和阻焊性，并且可以以低成本制造。 该组合物包括酚醛树脂（A），环氧树脂（B）和无机填料（C）。 酚醛树脂（A）包括至少一种由具有由通式（1）和（2）表示的结构单元的聚合物组成的聚合物组分（A0），并且至少一种聚合物组分（A0）由具有结构 由通式（1）和（2）表示的单元并且在至少一个末端具有不含极性基团并且含有至少一个具有1至3个碳原子的烷基的芳族基团终止：其中R1和R2各自独立地为氢 原子或碳原子数为1〜6的烃基; 每个R 3独立地是具有1至6个碳原子的烃基; a为0〜3的整数，其中，R 5，R 6，R 8和R 9各自独立地为氢原子或碳原子数1〜6的烃基。 每个R 4和R 7独立地是具有1至6个碳原子的烃基; b为0〜3的整数; c为0〜4的整数。

公开(公告)号：US20120001350A1

公开(公告)日：2012-01-05

申请号：US13255571

申请日：2010-03-02

申请人： Masahiro Wada

发明人： Masahiro Wada

IPC分类号： H01L23/28 ,  C08L63/02

CPC分类号： H01L23/3128 ,  C08G59/621 ,  C08L63/00 ,  H01L21/565 ,  H01L23/295 ,  H01L23/3107 ,  H01L23/49513 ,  H01L23/49816 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/451 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/1301 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/20753

摘要： Disclosed is a resin composition for encapsulating a semiconductor containing an epoxy resin (A), a curing agent (B), and an inorganic filler (C), wherein the epoxy resin (A) includes an epoxy resin (A1) having a predetermined structure, and the curing agent (B) includes a phenol resin (B1) having a predetermined structure, wherein the content of a c=1 component included in the total amount of the phenol resin (B1) is not less than 40% in terms of area percentage and the content of a C≧4 component is not more than 20% in terms of area percentage, as measured by the area method of gel permeation chromatography. Also disclosed is a semiconductor device obtained by encapsulating a semiconductor element with a cured product of the resin composition for encapsulating a semiconductor.

摘要翻译： 公开了一种用于封装含有环氧树脂（A），固化剂（B）和无机填料（C）的半导体的树脂组合物，其中环氧树脂（A）包括具有预定结构的环氧树脂（A1） ，固化剂（B）含有具有规定结构的酚醛树脂（B1），其中包含在酚醛树脂（B1）总量中的ac = 1成分的含量以面积计不小于40％ 百分比，通过凝胶渗透色谱法的面积法测定，C≥4成分的含量以面积百分比计不超过20％。 还公开了通过将半导体元件与用于封装半导体的树脂组合物的固化物封装而获得的半导体器件。

公开(公告)号：US20100308261A1

公开(公告)日：2010-12-09

申请号：US12864915

申请日：2009-01-29

申请人： Satoshi Kanbe ,  Kazumi Hosono ,  Masahiro Wada

发明人： Satoshi Kanbe ,  Kazumi Hosono ,  Masahiro Wada

IPC分类号： C01B7/13 ,  B01J8/02 ,  C09K3/00

CPC分类号： C01B7/135 ,  B01J23/42 ,  C01B9/06 ,  C01D3/12

摘要： A system (100) of the present invention for producing an iodine compound includes: a raw material adjusting unit (1) for supplying hydrogen-containing gas to at least one of liquid iodine in an iodine melting pot (4) and gaseous iodine obtained by evaporating liquid iodine so as to obtain a mixture gas; a hydrogen iodide producing unit (10) including a hydrogen iodide producing tower (12) having a catalyst layer (12a) for converting the introduced mixture gas into crude hydrogen iodide gas; a hydrogen iodide refining unit for removing unreacted iodine from the introduced crude hydrogen iodide gas so as to obtain hydrogen iodide gas; and an iodine compound producing unit (30) for producing a target iodine compound from the obtained hydrogen iodide gas and a reaction material. This allows producing an iodine compound with high purity easily, efficiently, and with low cost.

摘要翻译： 用于制备碘化合物的本发明的系统（100）包括：用于向碘熔池（4）中的液碘中的至少一种供给含氢气体的原料调节单元（1）和由 蒸发液体碘以得到混合气体; 含有碘化氢生成塔（12）的碘化氢生成装置（10），具有催化剂层（12a），用于将引入的混合气体转化为粗的碘化氢气体; 一种碘化氢精制装置，用于从引入的碘化氢气体中除去未反应的碘，以获得碘化氢气体; 和由所得碘化氢气体和反应物质制造目标碘化合物的碘化合物生成装置（30）。 这样可以容易地，有效地且低成本地制备高纯度的碘化合物。

公开(公告)号：US07794853B2

公开(公告)日：2010-09-14

申请号：US12518509

申请日：2007-12-13

申请人： Kenji Orito ,  Toshiharu Hayashi ,  Masahiro Wada ,  Reiko Izumi ,  Koji Hoshino

发明人： Kenji Orito ,  Toshiharu Hayashi ,  Masahiro Wada ,  Reiko Izumi ,  Koji Hoshino

IPC分类号： B32B15/01 ,  B32B15/02 ,  B32B15/04 ,  B32B18/00

CPC分类号： H01M4/8807 ,  C23C24/087 ,  C23C28/042 ,  C23C28/048 ,  H01M4/8817 ,  H01M4/90 ,  H01M8/0232 ,  H01M8/0241 ,  H01M8/0245 ,  H01M2008/1095 ,  Y10S977/762 ,  Y10S977/81 ,  Y10S977/811 ,  Y10T428/12479 ,  Y10T428/12806 ,  Y10T428/12889

摘要： Porous titanium having a low contact resistance includes porous titanium body, Au, and Ti oxide layer (3). Porous titanium includes continuous holes (1) opening on a surface and being connected to inner holes and a skeleton (2). Au adheres to at least an outer skeletal surface (4) of the porous titanium via diffusion bonding to form a network structure. The Ti oxide layer (3) is formed in a clearance between adjacent Au cords (5) of the Au network sticking. The width of an Au cord (5) of the Au network is 0.3 to 10 μm at least at one position; and the thickness of the Ti oxide layer (3), which is formed in the clearance between adjacent Au cords (5) of the Au network is 30 to 150 nm.

摘要翻译： 具有低接触电阻的多孔钛包括多孔钛体，Au和Ti氧化物层（3）。 多孔钛包括在表面上开口并连接到内孔的连续孔（1）和骨架（2）。 Au通过扩散接合附着于多孔钛的至少外骨骼表面（4）以形成网络结构。 Ti氧化物层（3）形成在Au网络粘附的相邻Au电线（5）之间的间隙中。 Au网络的Au线（5）的宽度至少在一个位置为0.3至10μm; 并且在Au网络的相邻Au线（5）之间的间隙中形成的Ti氧化物层（3）的厚度为30〜150nm。

公开(公告)号：US07757092B2

公开(公告)日：2010-07-13

申请号：US10985300

申请日：2004-11-09

申请人： Masahiro Wada

发明人： Masahiro Wada

IPC分类号： G06F21/00

CPC分类号： G06F21/35 ,  G06F21/608 ,  G06F2221/2137

摘要： A request signal requesting a response signal from an ID card is transmitted, and, when a response signal is received, it is compared with the data identifying the manager, which is stored in advance, and a determination is made as to whether or not the data identifying the manager is received. If the data is determined to be received, a timer is set, and, if there is a job being held up, the output processing of the job is executed. When it is determined that a predetermined time has elapsed, outputting is notified to be restricted, thereafter outputting is prohibited.

摘要翻译： 发送从ID卡请求响应信号的请求信号，并且当接收到响应信号时，将其与预先存储的识别管理者的数据进行比较，并且确定是否 收到标识管理员的数据。 如果确定要接收数据，则设置定时器，并且如果存在作业被保持，则执行作业的输出处理。 当确定已经经过了预定时间时，通知限制输出，之后禁止输出。

公开(公告)号：US07661511B2

公开(公告)日：2010-02-16

申请号：US11587999

申请日：2005-04-27

申请人： Tomoya Hasegawa ,  Yasuyuki Amagai ,  Shoichi Okazaki ,  Masahiro Wada

发明人： Tomoya Hasegawa ,  Yasuyuki Amagai ,  Shoichi Okazaki ,  Masahiro Wada

IPC分类号： E04B1/38 ,  E04B1/82 ,  E04B1/343 ,  E04B2/00

CPC分类号： E04F13/0871 ,  E04B9/001 ,  E04B9/045 ,  E04B2001/8245 ,  E04C2/043

摘要： Perforations of a board for building material are formed by a number of recesses (13), or a number of recesses (13) and through-holes (12). A bottom face (16) of the recess forms a face for screwing or driving the fixing element (70) thereto. A color of the bottom face is set to have a brightness of color decreased in comparison with a color of a surface (18) of the board. A substrate of the board is a gypsum board and the bottom face of the recess is formed by a liner paper for gypsum board. According to such a board, a region for screwing or driving the fixing element thereto can be ensured without impairing regularity, uniformity or architectural design of the perforations, and putty finishing or the like for an exposed part of the fixing element can be omitted.

摘要翻译： 用于建筑材料的板的穿孔由多个凹部（13）或多个凹部（13）和通孔（12）形成。 凹部的底面（16）形成用于将固定元件（70）旋拧或驱动的面。 将底面的颜色设定为与基板的表面（18）的颜色相比，颜色的亮度降低。 板的基板是石膏板，凹部的底面由用于石膏板的衬纸形成。 根据这种板，可以确保用于将固定元件拧紧或驱动的区域，而不损害穿孔的规则性，均匀性或建筑设计，并且可以省略用于固定元件的暴露部分的油灰整理等。