公开(公告)号：US20150145747A1

公开(公告)日：2015-05-28

申请号：US14146163

申请日：2014-01-02

Applicant: Siliconware Precision Industries Co., Ltd

Inventor： Hsin-Lung Chung ,  Hao-Ju Fang ,  Chih-Hsien Chiu ,  Yude Chu ,  Tsung-Hsien Tsai

IPC: H01Q1/40 ,  H05K13/00

CPC classification number: H01Q1/40 ,  H01L23/66 ,  H01L2223/6677 ,  H01L2224/16227 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01Q9/42 ,  H01Q23/00 ,  H01L2924/00014

Abstract: An electronic package is disclosed, which includes: a substrate; at least an electronic element disposed on the substrate; an encapsulant formed on the substrate and encapsulating the electronic element; and an antenna body embedded in the encapsulant without contacting with the substrate and exposed from a surface of the encapsulant. Since the antenna body is not disposed on the substrate, the surface area of the substrate can be reduced to meet the miniaturization requirement of the electronic package.

Abstract translation: 公开了一种电子封装，其包括：基板; 至少设置在所述基板上的电子元件; 形成在所述基板上并封装所述电子元件的密封剂; 以及嵌入所述密封剂中而不与所述基板接触并从所述密封剂的表面露出的天线体。 由于天线体不设置在基板上，所以可以减小基板的表面积，以满足电子封装的小型化要求。

公开(公告)号：US08962396B2

公开(公告)日：2015-02-24

申请号：US14086135

申请日：2013-11-21

Applicant: Siliconware Precision Industries Co., Ltd

Inventor： Ching-Hua Chen ,  Heng-Cheng Chu ,  Hsin-Lung Chung ,  Chih-Hsien Chiu ,  Chia-Yang Chen

IPC: H01L21/00 ,  H01L21/56 ,  H01L23/31 ,  H01L21/683 ,  H01L23/00

CPC classification number: H01L21/56 ,  H01L21/6835 ,  H01L23/3128 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2221/68345 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/48237 ,  H01L2224/49174 ,  H01L2224/73265 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/3011 ,  H01L2924/00 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A carrier-free semiconductor package includes a circuit structure having an insulating layer and a circuit layer embedded in the insulating layer and having a plurality of conductive traces and RF (radio frequency) traces, a chip disposed on a first surface of the insulating layer and electrically connected to the conductive traces, an encapsulant covering the chip and the circuit layer, a ground layer formed on a second surface of the insulating layer opposite to the first surface, and a plurality of solder balls disposed on the conductive traces or terminals on the conductive traces, wherein portions of the solder balls electrically connect the ground layer so as to allow the RF traces and the ground layer to form a microstrip line having an RF function, thus obtaining a single-layer carrier-free semiconductor package having low cost and simplified RF design.

Abstract translation: 一种无载体半导体封装，包括具有绝缘层和嵌入绝缘层中的电路层并具有多个导电迹线和RF（射频）迹线的电路结构，设置在该绝缘层的第一表面上的芯片，以及 电连接到导电迹线，覆盖芯片和电路层的密封剂，形成在与第一表面相对的绝缘层的第二表面上的接地层和设置在导电迹线上的多个焊球 导电迹线，其中焊球的部分电连接接地层，以便允许RF迹线和接地层形成具有RF功能的微带线，从而获得具有低成本的单层无载流子半导体封装， 简化射频设计。

公开(公告)号：US20140353850A1

公开(公告)日：2014-12-04

申请号：US13971189

申请日：2013-08-20

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Chih-Hsien Chiu ,  Tsung-Hsien Tsai ,  Chao-Ya Yang ,  Chia-Yang Chen ,  Chih-Ming Cheng ,  Yude Chu

IPC: H01L23/52 ,  H01L21/56 ,  H01L23/28 ,  H01L23/12 ,  H01L23/00

CPC classification number: H01L24/85 ,  H01L23/3121 ,  H01L23/4334 ,  H01L23/552 ,  H01L23/66 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0657 ,  H01L2224/04042 ,  H01L2224/2919 ,  H01L2224/32014 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2224/8592 ,  H01L2224/92247 ,  H01L2225/0651 ,  H01L2225/06575 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19103 ,  H01L2924/19104 ,  H01L2924/19105 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2224/85399 ,  H01L2224/05599

Abstract: A semiconductor package is disclosed, which includes: a circuit board; a carrier disposed on the circuit board; an RF chip disposed on the carrier; a plurality of high level bonding wires electrically connecting electrode pads of the RF chip and the circuit board; and an encapsulant formed on the circuit board for encapsulating the carrier, the high level bonding wires and the RF chip. The present invention positions the RF chip at a high level so as to facilitate element arrangement and high frequency wiring on the circuit board, thereby achieving a highly integrated wireless SiP (System in Package) module.

Abstract translation: 公开了一种半导体封装，其包括：电路板; 布置在电路板上的载体; 布置在载体上的RF芯片; 电连接RF芯片的电极焊盘和电路板的多个高级焊接线; 以及形成在电路板上用于封装载体，高电平接合线和RF芯片的密封剂。 本发明将RF芯片定位在高水平，以便于电路板上的元件布置和高频布线，从而实现高度集成的无线SiP（系统级封装）模块。

公开(公告)号：US20140210672A1

公开(公告)日：2014-07-31

申请号：US14107446

申请日：2013-12-16

Applicant: Siliconware Precision Industries Co., Ltd

Inventor： Chih-Hsien Chiu ,  Heng-Cheng Chu ,  Chien-Cheng Lin ,  Tsung-Hsien Tsai ,  Chao-Ya Yang ,  Yude Chu

IPC: H01Q1/38

Abstract: An electronic package structure is provided, including a substrate, a package encapsulant disposed on the substrate, and an antenna structure corresponding to a disposing area of the package encapsulant and having a first extension layer, a second extension layer disposed on the substrate, and a connection portion disposed between and electrically connected to the first extension layer and the second extension layer. Through the formation of the antenna structure on the disposing area of the package encapsulant, the substrate is not required to be widen, and, as such, the electronic package structure meets the miniaturization requirement.

Abstract translation: 提供一种电子封装结构，包括基板，设置在基板上的封装密封剂，以及对应于封装密封剂的布置区域的天线结构，并具有第一延伸层，设置在基板上的第二延伸层和 连接部分设置在第一延伸层和第二延伸层之间并且电连接到第一延伸层和第二延伸层。 通过在封装密封剂的配置区域上形成天线结构，不需要扩大基板，因此电子封装结构满足小型化要求。

公开(公告)号：US12068535B2

公开(公告)日：2024-08-20

申请号：US17748957

申请日：2022-05-19

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Shao-Tzu Tang ,  Chih-Hsien Chiu ,  Wen-Jung Tsai ,  Ko-Wei Chang ,  Chia-Chu Lai

IPC: H01Q1/48 ,  H01Q1/38 ,  H01Q1/50

CPC classification number: H01Q1/48 ,  H01Q1/38 ,  H01Q1/50

Abstract: An antenna module is provided with a plurality of antenna structures and a shielding structure arranged on a plate body, and the shielding structure is located between two adjacent antenna structures, where the shielding structure includes a concave portion formed on the plate body and a dielectric material formed between the concave portion and the antenna structure to generate different impedance characteristics, thereby improving the antenna isolation.

公开(公告)号：US20240047440A1

公开(公告)日：2024-02-08

申请号：US17956653

申请日：2022-09-29

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Wen-Jung Tsai ,  Chih-Hsien Chiu ,  Chin-Chiang He ,  Ko-Wei Chang ,  Chien-Cheng Lin

IPC: H01L25/16 ,  H01L23/552 ,  H01L23/31 ,  H01L23/498 ,  H01L23/58 ,  H01L21/56

CPC classification number: H01L25/165 ,  H01L23/552 ,  H01L23/3121 ,  H01L23/49811 ,  H01L23/585 ,  H01L21/56

Abstract: An electronic package is provided and includes at least one electronic element, at least one first conductive structure and a second conductive structure disposed on one side of a carrier structure with at least one circuit layer, and an encapsulation layer covering the electronic element, the first conductive structure and the second conductive structure, where the first conductive structure is exposed from the encapsulation layer to externally connect required elements according to functional requirements.

公开(公告)号：US20240047374A1

公开(公告)日：2024-02-08

申请号：US17968349

申请日：2022-10-18

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Chih-Hsien Chiu ,  Chih-Chiang He ,  Chun-Chong Chien ,  Wen-Jung Tsai

IPC: H01L23/552 ,  H01L23/31 ,  H01L21/56 ,  H01L23/00

CPC classification number: H01L23/552 ,  H01L23/3157 ,  H01L21/56 ,  H01L24/05 ,  H01L24/13 ,  H01L2924/3025 ,  H01L2224/0401 ,  H01L2224/13023 ,  H01L2924/1811

Abstract: An electronic package is provided with a plurality of electronic elements disposed on a carrier structure and a shielding structure located between two adjacent electronic elements, where the shielding structure is formed with at least one cavity and shielding members located on opposite sides of the cavity, such that the shielding members are arranged between the two electronic elements. Therefore, the electromagnetic signal will be reflected via the shielding members to prevent the two electronic elements from electromagnetically interfering with each other.

公开(公告)号：US11749583B2

公开(公告)日：2023-09-05

申请号：US17379289

申请日：2021-07-19

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Chih-Hsien Chiu ,  Siang-Yu Lin ,  Wen-Jung Tsai ,  Chia-Yang Chen ,  Chien-Cheng Lin

IPC: H01L23/42 ,  H01L23/367 ,  H01L23/16 ,  H01L21/56 ,  H01L23/31

CPC classification number: H01L23/42 ,  H01L21/561 ,  H01L23/16 ,  H01L23/3128 ,  H01L23/367

Abstract: An electronic package is provided, which includes a plurality of electronic components encapsulated by an encapsulation layer. A spacer is defined in the encapsulation layer and located between at least two adjacent electronic components of the plurality of electronic components, and a recess is formed in the spacer and used as a thermal insulation area. With the design of the thermal insulation area, the plurality of electronic components can be effectively thermally insulated from one another to prevent heat generated by one electronic component of high power from being conducted to another electronic component of low power that would thermally affect the operation of the low-power electronic component. A method for manufacturing the electronic package is also provided.

公开(公告)号：US20230082767A1

公开(公告)日：2023-03-16

申请号：US17989554

申请日：2022-11-17

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Chih-Hsien Chiu ,  Wen-Jung Tsai ,  Yu-Wei Yeh ,  Tsung-Hsien Tsai ,  Chi-Liang Shih ,  Sheng-Ming Yang ,  Ping-Hung Liao

IPC: H01L23/552 ,  H01L23/00 ,  H01L23/31 ,  H01L23/498

Abstract: An electronic package is provided and uses a plurality of bonding wires as a shielding structure. The bonding wires are stitch bonded onto a carrier carrying electronic components, such that the problem of the shielding structure peeling off or falling off from the carrier can be avoided due to the fact that the bonding wires are not affected by temperature, humidity and other environmental factors.

公开(公告)号：US11594501B2

公开(公告)日：2023-02-28

申请号：US17518146

申请日：2021-11-03

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Chih-Hsien Chiu ,  Wen-Jung Tsai

IPC: H01L21/56 ,  H01L23/49 ,  H01L23/552 ,  H01L23/66 ,  H01L23/498 ,  H01L23/31 ,  H01L23/00

Abstract: An electronic package is formed by disposing an electronic element and a lead frame having a plurality of conductive posts on a carrier structure having an antenna function, and encapsulating the electronic element and the lead frame with an encapsulant. The encapsulant is defined with a first encapsulating portion and a second encapsulating portion lower than the first encapsulating portion. The electronic element is positioned in the first encapsulating portion, and the plurality of conductive posts are positioned in the second encapsulating portion. End surfaces of the plurality of conductive posts are exposed from a surface of the second encapsulating portion so as to be electrically connected to a connector.