公开(公告)号：US20060273443A1

公开(公告)日：2006-12-07

申请号：US11444530

申请日：2006-06-01

申请人： Michael Bauer ,  Jens Pohl

发明人： Michael Bauer ,  Jens Pohl

IPC分类号： H01L23/24

CPC分类号： H01L23/5389 ,  H01L21/563 ,  H01L23/295 ,  H01L23/3121 ,  H01L23/49805 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/73203 ,  H01L2924/0102 ,  H01L2924/01046 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/3011

摘要： A package for an electronic component includes a synthetic package compound. This synthetic package compound includes an upper outer contact on its upper side and a lower outer contact on its lower side, where the upper outer contact is electrically connected to the lower outer contact via a conduction path. The synthetic package compound includes a mixture of a plastic with filler particles. The conduction path is formed from free conducting metallic inclusions. The filler particles are provided with metallorganic compounds or inorganic complex compounds. The inclusions are formed by photolytic decomposition of the metallorganic compounds or inorganic complex compounds.

摘要翻译： 用于电子部件的包装包括合成包装化合物。 这种合成包装化合物包括其上侧的上外接触件和其下侧上的下外接触件，其中上外接触件通过传导路径电连接到下外触头。 合成包装化合物包括塑料与填料颗粒的混合物。 导电路径由自由导电金属夹杂物形成。 填料颗粒中含有金属有机化合物或无机络合物。 夹杂物是由金属有机化合物或无机络合物的光分解形成的。

公开(公告)号：US07656018B2

公开(公告)日：2010-02-02

申请号：US11444530

申请日：2006-06-01

申请人： Michael Bauer ,  Jens Pohl

发明人： Michael Bauer ,  Jens Pohl

IPC分类号： H01L23/24

CPC分类号： H01L23/5389 ,  H01L21/563 ,  H01L23/295 ,  H01L23/3121 ,  H01L23/49805 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/73203 ,  H01L2924/0102 ,  H01L2924/01046 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/3011

摘要： A package for an electronic component includes a synthetic package compound. This synthetic package compound includes an upper outer contact on its upper side and a lower outer contact on its lower side, where the upper outer contact is electrically connected to the lower outer contact via a conduction path. The synthetic package compound includes a mixture of a plastic with filler particles. The conduction path is formed from free conducting metallic inclusions. The filler particles are provided with metallorganic compounds or inorganic complex compounds. The inclusions are formed by photolytic decomposition of the metallorganic compounds or inorganic complex compounds.

摘要翻译： 用于电子部件的包装包括合成包装化合物。 这种合成包装化合物包括其上侧的上外接触件和其下侧上的下外接触件，其中上外接触件通过传导路径电连接到下外触头。 合成包装化合物包括塑料与填料颗粒的混合物。 导电路径由自由导电金属夹杂物形成。 填料颗粒中含有金属有机化合物或无机络合物。 夹杂物是由金属有机化合物或无机络合物的光分解形成的。

公开(公告)号：US20070117424A1

公开(公告)日：2007-05-24

申请号：US11601540

申请日：2006-11-17

申请人： Michael Bauer ,  Markus Brunnbauer ,  Irmgard Escher-Poeppel ,  Jens Pohl ,  Christian Stuempfl

发明人： Michael Bauer ,  Markus Brunnbauer ,  Irmgard Escher-Poeppel ,  Jens Pohl ,  Christian Stuempfl

IPC分类号： H05K1/00

CPC分类号： H05K3/4015 ,  H01L21/4853 ,  H01L23/49805 ,  H01L23/49816 ,  H01L25/105 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/15331 ,  H05K3/3436 ,  H05K2201/0379 ,  H05K2201/10242 ,  H05K2201/10515 ,  H05K2203/0597 ,  Y02P70/613

摘要： For the vertical electrical connection of a number of components, an electronic structure with at least two components has solderable connecting elements, which include at least one socket element and a solder ball stacked on the socket element. The socket element has a cylindrical core of an electrically conducting first material with a lateral surface, a bottom surface and a top surface. The core is surrounded with a cladding of an electrically insulating second material in such a way that the lateral surface of the core is covered by the cladding and the top surface and the bottom surface are kept free of the cladding.

摘要翻译： 对于多个部件的垂直电连接，具有至少两个部件的电子结构具有可焊接的连接元件，其包括堆叠在插座元件上的至少一个插座元件和焊球。 插座元件具有导电的第一材料的圆柱形芯，其具有侧表面，底表面和顶表面。 芯被电绝缘的第二材料的包层围绕，使得芯的侧表面被包层覆盖，并且顶表面和底表面保持没有包层。

公开(公告)号：US07602614B2

公开(公告)日：2009-10-13

申请号：US10562252

申请日：2004-06-04

申请人： Michael Bauer ,  Wolfram Eurskens ,  Rudolf Kerler ,  Heinz Pape ,  Peter Strobel ,  Stephan Stoeckl

发明人： Michael Bauer ,  Wolfram Eurskens ,  Rudolf Kerler ,  Heinz Pape ,  Peter Strobel ,  Stephan Stoeckl

IPC分类号： H05K7/00

CPC分类号： H05K1/184 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/48227 ,  H01L2224/73207 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06572 ,  H01L2924/15192 ,  H01L2924/15311 ,  H05K1/0284 ,  H05K3/105 ,  H05K3/46 ,  H05K2201/0215 ,  H05K2201/0257 ,  H05K2201/0919 ,  H05K2201/10446 ,  H05K2203/102 ,  H05K2203/108 ,  H05K2203/1131 ,  H05K2203/1136

摘要： An electronic module and a method for the production thereof is disclosed. In one embodiment, the electronic module has a plurality of components arranged on a wiring block. The wiring block has a plurality of outer sides and has in its volume lines interconnecting contact pads on the outer sides. The contact pads are electrically connected to component connections of the components.

摘要翻译： 公开了电子模块及其制造方法。 在一个实施例中，电子模块具有布置在接线块上的多个部件。 布线块具有多个外侧，并且其体积线将外侧的接触焊盘互连。 接触垫电连接到部件的部件连接。

公开(公告)号：US07470601B2

公开(公告)日：2008-12-30

申请号：US11543983

申请日：2006-10-06

申请人： Michael Bauer ,  Ludwig Heitzer ,  Eric Kuerzel ,  Peter Strobel

发明人： Michael Bauer ,  Ludwig Heitzer ,  Eric Kuerzel ,  Peter Strobel

IPC分类号： H01L21/00

CPC分类号： H01L23/3128 ,  H01L21/6835 ,  H01L21/6836 ,  H01L21/78 ,  H01L23/49816 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L2221/68322 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68354 ,  H01L2221/68368 ,  H01L2224/05599 ,  H01L2224/274 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48471 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2224/8385 ,  H01L2224/85399 ,  H01L2224/92247 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/3512 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299

摘要： A semiconductor device includes a semiconductor chip and an adhesive film between the back side of the semiconductor chip and a chip pad of a leadframe. The adhesive film includes a film core and adhesive layers that cover both sides of the film core. The film core includes a brittle, fragile hard material.

摘要翻译： 半导体器件包括半导体芯片和半导体芯片的背面与引线框的芯片焊盘之间的粘合膜。 粘合膜包括膜芯和覆盖膜芯的两侧的粘合剂层。 薄膜芯包括脆性脆弱的硬质材料。

公开(公告)号：US07276785B2

公开(公告)日：2007-10-02

申请号：US10934549

申请日：2004-09-07

申请人： Michael Bauer ,  Wolfram Eurskens ,  Gerold Gruendler ,  Rudolf Kerler ,  Heinz Pape ,  Peter Strobel

发明人： Michael Bauer ,  Wolfram Eurskens ,  Gerold Gruendler ,  Rudolf Kerler ,  Heinz Pape ,  Peter Strobel

IPC分类号： H01L23/02

CPC分类号： H01L24/97 ,  H01L25/0652 ,  H01L25/16 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01052 ,  H01L2924/01057 ,  H01L2924/01068 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00012

摘要： The invention relates to an electronic module having electronic components, which are arranged in vertically staggered component layers, which are electrically conductively connected to one another via regions, which are uncovered within the respective component layers, of contact bumps or of bonding connections and via interconnects, which are arranged between the component layers and are connected to the uncovered regions. Moreover, the invention relates to a process for producing the electronic module, either in a panel or as individual components.

摘要翻译： 本发明涉及一种具有电子部件的电子模块，它们以垂直交错的部件层布置，它们通过接触凸块或接合连接件和通孔互连件在各个部件层内未被覆盖的区域彼此导电连接 ，其布置在组件层之间并连接到未覆盖区域。 此外，本发明涉及一种用于制造电子模块的方法，无论是在面板中还是作为单独的部件。

公开(公告)号：US20070082463A1

公开(公告)日：2007-04-12

申请号：US11543983

申请日：2006-10-06

申请人： Michael Bauer ,  Ludwig Heitzer ,  Eric Kuerzel ,  Peter Strobel

发明人： Michael Bauer ,  Ludwig Heitzer ,  Eric Kuerzel ,  Peter Strobel

IPC分类号： H01L21/30 ,  H01L21/44 ,  H01L21/46

CPC分类号： H01L23/3128 ,  H01L21/6835 ,  H01L21/6836 ,  H01L21/78 ,  H01L23/49816 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L2221/68322 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68354 ,  H01L2221/68368 ,  H01L2224/05599 ,  H01L2224/274 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48471 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2224/8385 ,  H01L2224/85399 ,  H01L2224/92247 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/3512 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299

摘要： A semiconductor device includes a semiconductor chip and an adhesive film between the back side of the semiconductor chip and a chip pad of a leadframe. The adhesive film includes a film core and adhesive layers that cover both sides of the film core. The film core includes a brittle, fragile hard material.

摘要翻译： 半导体器件包括半导体芯片和半导体芯片的背面与引线框的芯片焊盘之间的粘合膜。 粘合膜包括膜芯和覆盖膜芯的两侧的粘合剂层。 薄膜芯包括脆性脆弱的硬质材料。

公开(公告)号：US20050052830A1

公开(公告)日：2005-03-10

申请号：US10934549

申请日：2004-09-07

申请人： Michael Bauer ,  Wolfram Eurskens ,  Gerold Gruendler ,  Rudolf Kerler ,  Heinz Pape ,  Peter Strobel

发明人： Michael Bauer ,  Wolfram Eurskens ,  Gerold Gruendler ,  Rudolf Kerler ,  Heinz Pape ,  Peter Strobel

IPC分类号： H01L25/065 ,  H01L25/16 ,  H05K5/00

CPC分类号： H01L24/97 ,  H01L25/0652 ,  H01L25/16 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01052 ,  H01L2924/01057 ,  H01L2924/01068 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00012

摘要： The invention relates to an electronic module having electronic components, which are arranged in vertically staggered component layers, which are electrically conductively connected to one another via regions, which are uncovered within the respective component layers, of contact bumps or of bonding connections and via interconnects, which are arranged between the component layers and are connected to the uncovered regions. Moreover, the invention relates to a process for producing the electronic module, either in a panel or as individual components.

摘要翻译： 本发明涉及一种具有电子部件的电子模块，它们以垂直交错的部件层布置，它们通过接触凸块或接合连接件和通孔互连件在各个部件层内未被覆盖的区域彼此导电连接 ，其布置在组件层之间并连接到未覆盖区域。 此外，本发明涉及一种用于制造电子模块的方法，无论是在面板中还是作为单独的部件。

公开(公告)号：US08877328B2

公开(公告)日：2014-11-04

申请号：US10531389

申请日：2003-10-16

申请人： Michael Bauer ,  Werner Bochmann

发明人： Michael Bauer ,  Werner Bochmann

IPC分类号： B32B3/00 ,  B42D25/00

CPC分类号： B42D25/465 ,  B42D15/00 ,  B42D25/00 ,  B42D25/21 ,  B42D25/23 ,  B42D25/24 ,  B42D25/29 ,  B42D25/324 ,  B42D25/328 ,  Y10T428/24876

摘要： The invention relates to a data carrier having at least one printed area produced by intaglio printing and partly covered with a film, and to a method for producing said data carrier.

摘要翻译： 本发明涉及一种具有至少一个印刷区域的数据载体，该打印区域由凹版印刷产生并且部分地被膜覆盖，并且涉及一种用于生成所述数据载体的方法。

公开(公告)号：US20130187482A1

公开(公告)日：2013-07-25

申请号：US13512552

申请日：2010-11-26

申请人： Michael Bauer ,  Marc Brodbeck

发明人： Michael Bauer ,  Marc Brodbeck

IPC分类号： H03K17/00

CPC分类号： H03K17/005 ,  G08C17/02 ,  G08C2201/40 ,  H03K17/18 ,  Y10T307/773

摘要： The invention relates to an electronic relay with an input plug-in contact (30) and at least one output plug-in contact (87, 87a) for a current to be switched, an electronic component (104) for processing data and for actuating a semiconductor switch (116) for switching the current, a wireless communications interface (106, 108) for connection to a wireless communications network (150), wherein the wireless communications interface is embodied for receiving a first data signal (118, 126) and for receiving a first switching signal (120), a control plug-in contact (15) for receiving a second switching signal (122), wherein the electronic component is embodied such that the semiconductor switch is actuated for switching the current based upon the reception of the first or second switching signal, and such that the first data signal received via the wireless communications interface is processed and, based upon a result of the data processing of the first data signal, the semiconductor switch is actuated for switching the current.

摘要翻译： 本发明涉及一种具有输入插入式触点（30）和用于切换电流的至少一个输出插入式触头（87,87a）的电子继电器，用于处理数据并致动的电子部件（104） 用于切换电流的半导体开关（116），用于连接到无线通信网络（150）的无线通信接口（106,108），其中所述无线通信接口被实现为用于接收第一数据信号（118,126）和 用于接收第一切换信号（120），用于接收第二切换信号（122）的控制插入式触点（15），其中所述电子部件被实施为使得所述半导体开关被致动以基于所述接收来切换所述电流 并且使得经由无线通信接口接收的第一数据信号被处理，并且基于第一数据信号的数据处理的结果，半导体swi 手柄用于切换电流。