Planar structure semiconductor device and method of making the same
    51.
    发明授权
    Planar structure semiconductor device and method of making the same 失效
    平面结构半导体器件及其制造方法

    公开(公告)号:US3909319A

    公开(公告)日:1975-09-30

    申请号:US38240873

    申请日:1973-07-25

    摘要: In forming a junction in an energy converting diode by diffusing an impurity such as Zn into a III - V compound crystal such as GaAs, a junction region doped with an impurity such as Zn can be formed directly beneath a thin metal film by forming a thin layer of refractory metal such as Ta on a surface of said crystal, sealing this structure in a reaction tube together with an impurity source such as ZnAs2, and heating the tube within a heating furnace to perform diffusion treatment. In such a formed device, said metal film formed on the surface of the junction region is not lost by the diffusion treatment and remains completely. Further, the remaining metal film makes a good and strong ohmic contact with the matrix crystal, therefore it can be utilized as an electrode and also as a heat dissipating medium by adhering a heat dissipator thereon to form a good heat dissipating device. When part of said refractory metal film is oxidized by anodization, this oxidized film can work as a mask for impurity diffusion and enables selective diffusion of the junction region.

    摘要翻译: 在通过将诸如Zn的杂质扩散到诸如GaAs的III-V复合晶体中来形成能量转换二极管中的结时,可以通过形成薄的金属膜直接形成掺杂有诸如Zn的杂质的结区域 在所述晶体的表面上的诸如Ta的难熔金属层,与诸如ZnAs 2的杂质源一起将反应管中的该结构密封,并且在加热炉内加热管以进行扩散处理。 在这种形成的装置中,形成在接合区域的表面上的金属膜不会被扩散处理所损失,并且完全保留。 此外,剩余的金属膜与基体晶体形成良好且强烈的欧姆接触,因此其可以用作电极,并且还可以通过将散热器粘附在其上以形成良好的散热装置作为散热介质。 当通过阳极氧化使所述难熔金属膜的一部分氧化时,该氧化膜可以用作杂质扩散的掩模,并且能够选择性地扩散接合区域。