公开(公告)号：US20210159457A1

公开(公告)日：2021-05-27

申请号：US16698805

申请日：2019-11-27

Applicant: Applied Materials, Inc.

Inventor： Kyuil Cho ,  Byung Sung Kwak ,  Robert Jan Visser

IPC: H01L51/52 ,  H01L51/56

Abstract: A display device includes a display layer having a plurality of organic light-emitting diodes (OLEDs) and an encapsulation layer covering a light-emitting side of the display layer. The encapsulation layer includes a plurality of first polymer projections on display layer, the plurality of first polymer projections having spaces therebetween, and a first dielectric layer conformally covering the plurality of first polymer projections and any exposed underlying surface in the spaces between the first polymer projections, the dielectric layer forming side walls along sides of the first polymer projections and defining wells in spaces between the side walls.

公开(公告)号：US20200219819A1

公开(公告)日：2020-07-09

申请号：US16241427

申请日：2019-01-07

Applicant: Applied Materials, Inc.

Inventor： Michael Yu-tak Young ,  Ludovic Godet ,  Robert Jan Visser

IPC: H01L23/544 ,  H01L21/67 ,  G03F9/00

Abstract: Embodiments of the present disclosure generally relate to an optically transparent substrate, comprising a major surface having a peripheral edge region with an orientation feature formed therein, and a texture formed on the peripheral edge region, the texture having an opacity that is greater than an opacity of the major surface.

公开(公告)号：US20190189685A1

公开(公告)日：2019-06-20

申请号：US16270235

申请日：2019-02-07

Applicant: Applied Materials, Inc.

Inventor： Manivannan Thothadri ,  Robert Jan Visser

IPC: H01L27/15 ,  H01L33/00 ,  H05K13/00 ,  H05K3/30 ,  H05K3/00 ,  H05K13/04 ,  H01L21/67 ,  H01L25/075 ,  H01L33/60 ,  H01L21/683

Abstract: An apparatus for positioning micro-devices on a destination substrate includes a first support to hold a destination substrate, a second support to provide or hold a transfer body having a surface to receive an adhesive layer, a light source to generate a light beam, a mirror configured to adjustably position the light beam on the adhesive layer on the transfer body, and a controller. The controller is configured to cause the light source to generate the light beam and adjust the mirror to position the light beam on the adhesive layer so as to selectively expose one or more portions of the adhesive layer to create one or more neutralized portions. The transfer body and the destination substrate are moved away from each other and one or more micro-devices corresponding to the one or more neutralized portions of the adhesive layer remain on the destination substrate.

公开(公告)号：US10273577B2

公开(公告)日：2019-04-30

申请号：US15286234

申请日：2016-10-05

Applicant: APPLIED MATERIALS, INC.

Inventor： Ranga Rao Arnepalli ,  Nilesh Chimanrao Bagul ,  Prerna Sonthalia Goradia ,  Robert Jan Visser

IPC: B44C1/22 ,  C23C16/448 ,  H01L21/02 ,  H01L21/311

Abstract: Systems and methods for processing films on the surface of a substrate are described. The systems possess aerosol generators which form droplets from a condensed matter (liquid or solid) of one or more precursors. A carrier gas is flowed through the condensed matter and push the droplets toward a substrate placed in a substrate processing region. An inline pump connected with the aerosol generator can also be used to push the droplets towards the substrate. A direct current (DC) electric field is applied between two conducting plates configured to pass the droplets in-between. The size of the droplets is desirably reduced by application of the DC electric field. After passing through the DC electric field, the droplets pass into the substrate processing region and chemically react with the substrate to deposit or etch films.

公开(公告)号：US20180226278A1

公开(公告)日：2018-08-09

申请号：US15425231

申请日：2017-02-06

Applicant: Applied Materials, Inc.

Inventor： Ranga Rao Arnepalli ,  Prerna Sonthalia Goradia ,  Robert Jan Visser ,  Nitin Ingle ,  Mikhail Korolik ,  Jayeeta Biswas ,  Saurabh Lodha

IPC: H01L21/67 ,  H01L21/311 ,  H01L21/02

CPC classification number: H01L21/67069 ,  H01L21/02244 ,  H01L21/31122

Abstract: Systems and methods of etching a semiconductor substrate may include flowing an oxygen-containing precursor into a substrate processing region of a semiconductor processing chamber. The substrate processing region may house the semiconductor substrate, and the semiconductor substrate may include an exposed metal-containing material. The methods may include flowing a nitrogen-containing precursor into the substrate processing region. The methods may further include removing an amount of the metal-containing material.

公开(公告)号：US20170298252A1

公开(公告)日：2017-10-19

申请号：US15508359

申请日：2015-10-09

Applicant: Applied Materials, Inc.

Inventor： Ranga Rao Arnepalli ,  Robert Jan Visser ,  Rajeev Bajaj ,  Darshan Thakare ,  Prerna Goradia ,  Uday Mahajan ,  Abdul Wahab Mohammed

IPC: C09G1/02 ,  H01L21/3105 ,  C09K3/14

CPC classification number: C09G1/02 ,  C01B33/149 ,  C01F17/0043 ,  C01P2002/72 ,  C01P2004/04 ,  C01P2004/52 ,  C01P2004/62 ,  C01P2004/64 ,  C01P2004/84 ,  C01P2004/88 ,  C09K3/1436 ,  C09K3/1445 ,  C09K3/1463 ,  H01L21/31053

Abstract: A slurry for chemical mechanical planarization includes a surfactant, and abrasive particles having an average diameter between 20 and 30 nm and an outer surface of ceria. The abrasive particles are formed using a hydrothermal synthesis process. The abrasive particles are between 0.1 and 3 wt % of the slurry.

公开(公告)号：US09716012B2

公开(公告)日：2017-07-25

申请号：US14560525

申请日：2014-12-04

Applicant: Applied Materials, Inc.

Inventor： David Thompson ,  Huixiong Dai ,  Patrick M. Martin ,  Timothy Michaelson ,  Kadthala R. Narendrnath ,  Robert Jan Visser ,  Jingjing Xu ,  Lin Zhang

IPC: H01L21/3205 ,  C23C16/04 ,  C23C16/18 ,  C23C16/455 ,  H01L21/285 ,  H01L21/768

CPC classification number: H01L21/32051 ,  C23C16/04 ,  C23C16/18 ,  C23C16/45551 ,  C23C16/45553 ,  H01L21/28562 ,  H01L21/76849

Abstract: Provided are methods for selective deposition. Certain methods describe providing a first substrate surface; providing a second substrate surface; depositing a first layer of film over the first and second substrate surfaces, wherein the deposition has an incubation delay over the second substrate surface such that the first layer of film over the first substrate surface is thicker than the first layer of film deposited over the second substrate surface; and etching the first layer of film over the first and second substrate surfaces, wherein the first layer of film over the second substrate surface is at least substantially removed, but the first layer of film over the first substrate is only partially removed.

公开(公告)号：US20170140920A1

公开(公告)日：2017-05-18

申请号：US15045081

申请日：2016-02-16

Applicant: APPLIED MATERIALS, INC.

Inventor： Ranga Rao Arnepalli ,  Nilesh Chimanrao Bagul ,  Prerna Sonthalia Goradia ,  Robert Jan Visser

IPC: H01L21/02 ,  C23C16/448 ,  H01L21/3065

CPC classification number: H01L21/0262 ,  C23C16/045 ,  C23C16/4486 ,  C23C16/45525 ,  H01L21/02107 ,  H01L21/0228 ,  H01L21/02521 ,  H01L21/30621 ,  H01L21/32 ,  H01L21/465

Abstract: Systems and methods for processing films on the surface of a substrate are described. The systems possess aerosol generators which form droplets from a condensed matter (liquid or solid) of one or more precursors. A carrier gas is flowed through the condensed matter and push the droplets toward a substrate placed in a substrate processing region. An inline pump connected with the aerosol generator can also be used to push the droplets towards the substrate. A direct current (DC) electric field is applied between two conducting plates configured to pass the droplets in-between. The size of the droplets is desirably reduced by application of the DC electric field. After passing through the DC electric field, the droplets pass into the substrate processing region and chemically react with the substrate to deposit or etch films.

公开(公告)号：US20150275364A1

公开(公告)日：2015-10-01

申请号：US14666689

申请日：2015-03-24

Applicant: Applied Materials, Inc.

Inventor： David Thompson ,  Huixiong Dai ,  Patrick M. Martin ,  Timothy Michaelson ,  Kadthala R. Narendrnath ,  Robert Jan Visser ,  Jingjing Xu ,  Lin Zhang

IPC: C23C16/455 ,  C23C16/50 ,  C23C16/458

CPC classification number: C23C16/45544 ,  C23C16/45536 ,  C23C16/45551 ,  C23C16/4584 ,  C23C16/56 ,  H01L21/68764 ,  H01L21/68771

Abstract: Provided are apparatus and methods for the sequential deposition and annealing of a film within a single processing chamber. An energy source positioned within the processing chamber in an area isolated from process gases can be used to rapidly form and decompose a film on the substrate without damaging underlying layers due to exceeding the thermal budget of the device being formed.

Abstract translation: 提供了用于在单个处理室内顺序沉积和退火膜的装置和方法。 位于与处理气体隔离的区域内的处理室内的能量源可用于快速地形成和分解衬底上的膜，而不会由于超过正在形成的器件的热量预算而损坏下层。

公开(公告)号：US12216243B2

公开(公告)日：2025-02-04

申请号：US16905703

申请日：2020-06-18

Applicant: Applied Materials, Inc.

Inventor： Ludovic Godet ,  Tapashree Roy ,  Prerna Sonthalia Goradia ,  Srobona Sen ,  Robert Jan Visser ,  Nitin Deepak ,  Tapash Chakraborty

IPC: G02F1/1339 ,  B32B3/20 ,  G02B1/06

Abstract: Embodiments described herein relate to flat optical devices and methods of forming flat optical devices. One embodiment includes a substrate having a first arrangement of a first plurality of pillars formed thereon. The first arrangement of the first plurality of pillars includes pillars having a height h and a lateral distance d, and a gap g corresponding to a distance between adjacent pillars of the first plurality of pillars. An aspect ratio of the gap g to the height h is between about 1:1 and about 1:20. A first encapsulation layer is disposed over the first arrangement of the first plurality of pillars. The first encapsulation layer has a refractive index of about 1.0 to about 1.5. The first encapsulation layer, the substrate, and each of the pillars of the first arrangement define a first space therebetween. The first space has a refractive index of about 1.0 to about 1.5.