公开(公告)号：US20180226385A1

公开(公告)日：2018-08-09

申请号：US15889677

申请日：2018-02-06

Applicant: NICHIA CORPORATION

Inventor： Takuya NAKABAYASHI ,  Tadaaki IKEDA

IPC: H01L25/075 ,  H01L33/62 ,  H01L33/60 ,  H01L33/54 ,  H01L33/50

CPC classification number: H01L25/0753 ,  H01L33/505 ,  H01L33/54 ,  H01L33/56 ,  H01L33/60 ,  H01L33/62 ,  H01L2933/005 ,  H01L2933/0058 ,  H01L2933/0066

Abstract: A light-emitting device includes a mounting board, a first light-emitting element, a second light-emitting element and a light-reflective covering member. The mounting board includes first lands and second lands on an upper surface of the mounting board. The first light-emitting element is flip-chip mounted on the first lands. The second light-emitting element is flip-chip mounted on the second lands. The light-reflective covering member covers a lateral surface of the first light-emitting element, a lateral surface of the second light-emitting element, and the upper surface of the mounting board. The mounting board and the light-reflective covering member define a depressed portion between the first light-emitting element and the second light-emitting element with a bottom surface of the depressed portion being located inside the mounting board.

公开(公告)号：US20170244015A1

公开(公告)日：2017-08-24

申请号：US15591112

申请日：2017-05-10

Applicant: NICHIA CORPORATION

Inventor： Takuya NAKABAYASHI ,  Hiroto TAMAKI

IPC: H01L33/62 ,  H01L33/60 ,  H01L33/28 ,  H01L33/32 ,  H01L33/30 ,  H05K1/18 ,  H01L33/50 ,  H05K1/03 ,  H05K1/11 ,  H05K1/09 ,  H05K1/02 ,  H01L33/64 ,  H01L33/56

CPC classification number: H01L33/62 ,  H01L25/167 ,  H01L33/28 ,  H01L33/30 ,  H01L33/32 ,  H01L33/486 ,  H01L33/502 ,  H01L33/56 ,  H01L33/60 ,  H01L33/647 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2924/0002 ,  H01L2924/181 ,  H05K1/0274 ,  H05K1/0298 ,  H05K1/0306 ,  H05K1/09 ,  H05K1/115 ,  H05K1/181 ,  H05K1/185 ,  H05K3/282 ,  H05K2201/0209 ,  H05K2201/0326 ,  H05K2201/10106 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A wiring substrate includes ceramic layers and a conductive member. The ceramic layers have an uppermost ceramic layer and a lowermost ceramic layer. The conductive member includes an upper conductive layer, an internal conductive layer, a lower conductive layer, vias, and a covering layer. The upper conductive layer is disposed on an upper surface of the uppermost ceramic layer. The internal conductive layer is interposed between the ceramic layers. The lower conductive layer is disposed on a lower surface of the lowermost ceramic layer. The vias connect the upper conductive layer, the internal conductive layer, and the lower connective layer. The covering layer covers a portion of the upper conductive layer. The upper conductive layer includes a covered region covered with the covering layer and an element mount region. An upper surface of the element mount region is higher than an upper surface of the covered portion.

公开(公告)号：US20170236981A1

公开(公告)日：2017-08-17

申请号：US15584150

申请日：2017-05-02

Applicant: NICHIA CORPORATION

Inventor： Takuya NAKABAYASHI

IPC: H01L33/48 ,  H01L33/36 ,  H01L33/62 ,  H01L33/60 ,  H01L33/50

CPC classification number: H01L33/60 ,  H01L24/97 ,  H01L25/0753 ,  H01L33/36 ,  H01L33/486 ,  H01L33/50 ,  H01L33/62 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2924/01322 ,  H01L2924/12035 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2933/0033 ,  H01L2933/0058 ,  H01L2933/0066 ,  H01L2924/00

Abstract: A light emitting device of side-view type includes a substrate, a light emitting element, an insulating member and a light reflecting or sealing member. The substrate includes a pair of connection terminals at least on a first main surface. The light emitting element is disposed on a first main surface side of the substrate and connected to the connection terminals. The insulating member is disposed to cover at least a portion of the connection terminals. The light reflecting or sealing member covers the light emitting element. The connection terminals each includes an element connection portion and an outer connection portion disposed on the first main surface of the substrate. The outer connection portion is configured to connect with an external unit. The insulating member is placed in contact with the light reflecting or sealing member, and disposed between the element connection portion and the outer connection portion.

公开(公告)号：US20170207377A1

公开(公告)日：2017-07-20

申请号：US15477119

申请日：2017-04-03

Applicant: NICHIA CORPORATION

Inventor： Shimpei SASAOKA ,  Takuya NAKABAYASHI

IPC: H01L33/62 ,  H01L27/15 ,  H01L33/48

CPC classification number: H01L33/62 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L25/0753 ,  H01L25/13 ,  H01L27/156 ,  H01L33/486 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45169 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4909 ,  H01L2224/49107 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00012

Abstract: A light emitting apparatus includes a package and at least one light emitting device. The package has a package bottom surface and defining a recessed portion having a recessed portion bottom surface. The package includes a first leadframe, a second leadframe, and a resin portion. The first leadframe has a first leadframe upper surface and a first leadframe bottom surface. The second leadframe has a second leadframe upper surface and a second leadframe bottom surface. The first leadframe has a first leadframe main portion and a first leadframe extension portion. A first recessed part is formed at the first leadframe bottom surface and embedded with the resin portion. The first leadframe forms a second recessed part at an upper surface thereof other than an area approximately above the first recessed part, while the second recessed part is not provided on the area approximately above the first recessed part.

公开(公告)号：US20170200873A1

公开(公告)日：2017-07-13

申请号：US15399897

申请日：2017-01-06

Applicant: NICHIA CORPORATION

Inventor： Takuya NAKABAYASHI

IPC: H01L33/60 ,  H01L33/56 ,  H01L33/50

CPC classification number: H01L33/005 ,  H01L33/0095 ,  H01L33/46 ,  H01L33/486 ,  H01L33/502 ,  H01L33/508 ,  H01L33/56 ,  H01L33/60 ,  H01L2933/0033 ,  H01L2933/0041 ,  H01L2933/005

Abstract: A method for manufacturing a light-emitting device includes providing a soluble member to cover at least one lateral surface of a light-emitting element. The soluble member includes a material soluble in a first solvent. A light-shielding member is provided to cover at least one lateral surface of the soluble member. The light-shielding member includes a light-shielding resin less soluble in the first solvent than the soluble member. The soluble member is removed with the first solvent. A first light-transmissive member is provided in a space formed by removing the soluble member.

公开(公告)号：US20170062684A1

公开(公告)日：2017-03-02

申请号：US15246730

申请日：2016-08-25

Applicant: NICHIA CORPORATION

Inventor： Tadaaki IKEDA ,  Takuya NAKABAYASHI

IPC: H01L33/62 ,  H01L25/075 ,  H01L33/60 ,  H01L27/15

CPC classification number: H01L33/62 ,  H01L25/0753

Abstract: A light-emitting device includes a substrate having a first surface extended in a first direction, a second surface opposite to the first surface, a third surface between the first and second surfaces and extended in the first direction, and a fourth surface opposite to the third surface, a conductive member including at least four element mounting portions arranged in the first direction on the first surface, a first wiring portion on the second surface, a second wiring portion on the third surface, and a third wiring portion on the fourth surface, and first, second, third, and fourth light-emitting elements respectively mounted on the four element mounting portions. With the first, second, and third wiring portions, the first and second light-emitting elements are connected in series, the third and fourth light-emitting elements are connected in series, and the first and third light-emitting elements are connected in parallel.

Abstract translation: 发光装置包括具有沿第一方向延伸的第一表面的基板，与第一表面相对的第二表面，在第一和第二表面之间并在第一方向上延伸的第三表面和与第一表面相对的第四表面 第三表面，包括在第一表面上沿第一方向布置的至少四个元件安装部分的第二表面上的第一布线部分，第三表面上的第二布线部分和第四表面上的第三布线部分的导电部件 以及分别安装在四个元件安装部上的第一，第二，第三和第四发光元件。 利用第一，第二和第三布线部分，第一和第二发光元件串联连接，第三和第四发光元件串联连接，并且第一和第三发光元件并联连接 。

公开(公告)号：US20170040498A1

公开(公告)日：2017-02-09

申请号：US15296519

申请日：2016-10-18

Applicant: NICHIA CORPORATION

Inventor： Hiroto TAMAKI ,  Takuya NAKABAYASHI

IPC: H01L33/48 ,  H01L33/62 ,  H01L33/50 ,  H01L33/60

CPC classification number: H01L33/486 ,  H01L24/97 ,  H01L33/50 ,  H01L33/507 ,  H01L33/56 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/16225

Abstract: A light emitting device has a base body equipped with a base material and a pair of connection terminals disposed from a first main face to a second main face that is on the opposite side from the first main face; a plurality of light emitting elements connected to the connection terminals on the first main face; and a light reflecting member that covers the side faces of the light emitting elements, the base material having a protruding component on the second main face, the protruding component being one of a heat releasing terminal, a reinforcement terminal, and an insulating film, and the connection terminals being disposed on the first main face from the second main face on both sides of the protruding component, and being partly exposed from the light reflecting member on both sides of the first main face.

Abstract translation: 发光装置具有配置有基材的基体和从第一主面到与第一主面相反的一侧的第二主面配置的一对连接端子， 连接到第一主面上的连接端子的多个发光元件; 以及覆盖发光元件的侧面的光反射部件，所述基材在所述第二主面上具有突出部件，所述突出部件是放热端子，加强端子和绝缘膜之一，以及 所述连接端子从所述突出部件的两侧的所述第二主面设置在所述第一主面上，并且在所述第一主面的两侧部分地从所述光反射部件露出。

公开(公告)号：US20160247991A1

公开(公告)日：2016-08-25

申请号：US15143677

申请日：2016-05-02

Applicant: NICHIA CORPORATION

Inventor： Shimpei SASAOKA ,  Takuya NAKABAYASHI

IPC: H01L33/62 ,  H01L33/56 ,  H01L33/48

CPC classification number: H01L33/62 ,  H01L33/38 ,  H01L33/486 ,  H01L33/54 ,  H01L33/56 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/18301 ,  H05K1/0313 ,  H01L2924/00014

Abstract: A light emitting device includes a molded package and one or more light emitting components. The molded package includes a recess, two leads, and a molded resin part. A part of the recess is defined by a side wall formed from the molded resin part. At least one of the two leads includes an upper-surface portion exposed from a bottom surface of the recess. The at least one of the two leads includes a groove at an upper surface threreof. The groove is filled with a part of the molded resin part. The part of the molded resin part includes a first portion and a second portion. The first portion is exposed from the bottom surface of the recess. The second portion connects with a bottom surface of the side wall.

Abstract translation: 发光器件包括模制封装和一个或多个发光元件。 模制包装包括凹部，两个引线和模制树脂部件。 凹部的一部分由由模制树脂部分形成的侧壁限定。 两个引线中的至少一个包括从凹部的底表面露出的上表面部分。 两个引线中的至少一个引线在上表面包括凹槽。 凹槽被模制树脂部分的一部分填充。 模制树脂部分的一部分包括第一部分和第二部分。 第一部分从凹部的底表面露出。 第二部分与侧壁的底面连接。

公开(公告)号：US20160093781A1

公开(公告)日：2016-03-31

申请号：US14867222

申请日：2015-09-28

Applicant: NICHIA CORPORATION

Inventor： Hiroto TAMAKI ,  Takuya NAKABAYASHI

IPC: H01L33/60 ,  H01L33/08 ,  H01L33/44 ,  H01L33/62

CPC classification number: H01L24/97 ,  H01L33/486 ,  H01L33/505 ,  H01L33/56 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2933/0041 ,  H01L2924/00014

Abstract: A method of manufacturing a light emitting device includes: preparing a light-transmissive member including a light reflective sheet that has a through-hole, and a color conversion material layer that is composed of a light-transmissive resin containing a color conversion material and disposed in the through-hole, preparing a light emitting element, fixing the color conversion material layer to the light emitting element, covering a side surface of the light emitting element with a light-reflective member, and cutting the light-reflective member and light-reflective sheet.

Abstract translation: 一种制造发光器件的方法包括：制备包括具有通孔的光反射片的透光构件和由包含颜色转换材料的透光树脂构成的颜色转换材料层， 在通孔中准备发光元件，将颜色转换材料层固定到发光元件，用光反射构件覆盖发光元件的侧表面，并且切割光反射元件和发光元件， 反光片。

公开(公告)号：US20150342045A1

公开(公告)日：2015-11-26

申请号：US14718094

申请日：2015-05-21

Applicant: NICHIA CORPORATION

Inventor： Takuya NAKABAYASHI ,  Akira HORI

IPC: H05K1/11 ,  H05K1/18 ,  F21V8/00

CPC classification number: H05K1/111 ,  G02B6/0066 ,  G02B6/0073 ,  H05K1/181 ,  H05K3/3442 ,  H05K2201/09381 ,  H05K2201/09427 ,  H05K2201/09472 ,  H05K2201/09745 ,  H05K2201/10106 ,  H05K2201/10454 ,  H05K2203/048 ,  Y02P70/611

Abstract: A semiconductor device mounting structure includes a semiconductor device and a mounting substrate. The semiconductor device includes a first external connection terminal and a device-side mounting insulating region. The first external connection terminal is provided at a first end and has a metal region on a semiconductor mounting surface of the semiconductor device. The device-side mounting insulating region is defined by the metal region on the semiconductor mounting surface. The semiconductor mounting surface faces a substrate mounting surface. The mounting substrate has on the substrate mounting surface a land pattern made of an electrically conductive material to be electrically connected to the first external connection terminal. The land pattern is provided in a first shape to surround the device-side mounting insulating region and includes a land-side insulating region which has a second shape to correspond to a periphery of the device-side mounting insulating region.

Abstract translation: 半导体器件安装结构包括半导体器件和安装基板。 半导体器件包括第一外部连接端子和器件侧安装绝缘区域。 第一外部连接端子设置在第一端，并且在半导体器件的半导体安装表面上具有金属区域。 器件侧安装绝缘区域由半导体安装表面上的金属区域限定。 半导体安装表面面向基板安装表面。 安装基板在基板安装表面上具有由导电材料制成的焊盘图案，以电连接到第一外部连接端子。 所述焊盘图案设置成围绕所述器件侧安装绝缘区域的第一形状，并且包括具有与所述器件侧安装绝缘区域的周边相对应的第二形状的焊盘侧绝缘区域。