公开(公告)号：US08134839B2

公开(公告)日：2012-03-13

申请号：US12506598

申请日：2009-07-21

Applicant: Masahiro Yamazaki ,  Yasumasa Shibata ,  Yasuo Ueda

Inventor： Masahiro Yamazaki ,  Yasumasa Shibata ,  Yasuo Ueda

IPC: H05K1/00

CPC classification number: H05K3/363 ,  H05K3/3494 ,  H05K2201/056 ,  H05K2201/058 ,  H05K2201/10484 ,  H05K2201/10606 ,  H05K2203/0195 ,  Y10T428/1241

Abstract: A junction structure and a joining method of substrates are provided that stably can join the substrates and achieve high workability during joining. A second substrate 2 to be joined with solder to a first substrate 1 is bent with elasticity generated by a bending portion 9, and first joints 5 on the first substrate 1 and second joints 6 on the second substrate 2 are joined with solder in a state in which the first substrate 1 is brought into contact with, in a direction that increases the bending angle of the bending portion 9, a part where the joints 6 are formed on the second substrate 2.

Abstract translation: 提供了一种基板的接合结构和接合方法，其可以稳定地连接基板，并且在接合期间实现高的可加工性。 将与焊料接合到第一基板1的第二基板2由弯曲部9产生的弹性弯曲，并且第一基板1上的第一接头5和第二基板2上的第二接头6在焊料中以一种状态接合 其中第一基板1沿着增加弯曲部9的弯曲角度的方向与在第二基板2上形成接头6的部分接触。

公开(公告)号：US07870678B2

公开(公告)日：2011-01-18

申请号：US11896908

申请日：2007-09-06

Applicant: Oh Jo Kwon ,  Won Tae Choi ,  Kyoung Soo Kwon

Inventor： Oh Jo Kwon ,  Won Tae Choi ,  Kyoung Soo Kwon

IPC: G01C17/00

CPC classification number: G01C17/28 ,  G01P1/023 ,  G01P15/18 ,  H05K1/18 ,  H05K2201/10151 ,  H05K2201/10484

Abstract: Provided is a hybrid sensor module including first and second sensors that are attached on one surface of a printed circuit board (PCB) so as to detect two-axis signal components parallel to the PCB; a third sensor that is attached on one surface of the PCB such that the axial direction of the third sensor is tilted at a predetermined angle from a vertical direction of the PCB, the third sensor detecting a signal component sensed in the axial direction; and a signal correction unit that is connected to the first to third sensor and corrects signal components, detected from the respective sensors, into signal components of an orthogonal coordinate system.

Abstract translation: 提供了一种混合传感器模块，其包括附接在印刷电路板（PCB）的一个表面上的第一和第二传感器，以便检测平行于PCB的两轴信号分量; 第三传感器，其附接在PCB的一个表面上，使得第三传感器的轴向方向从PCB的垂直方向倾斜预定角度，第三传感器检测沿轴向感测的信号分量; 以及信号校正单元，其连接到第一至第三传感器，并且将从各个传感器检测的信号分量校正为正交坐标系的信号分量。

公开(公告)号：US07773389B2

公开(公告)日：2010-08-10

申请号：US11080672

申请日：2005-03-16

Applicant: Hiroki Katayama ,  Yoshiaki Ishigami

Inventor： Hiroki Katayama ,  Yoshiaki Ishigami

IPC: H05K7/00

CPC classification number: H05K3/3442 ,  H05K1/0239 ,  H05K1/025 ,  H05K1/0253 ,  H05K1/181 ,  H05K2201/0792 ,  H05K2201/09072 ,  H05K2201/093 ,  H05K2201/0969 ,  H05K2201/10022 ,  H05K2201/1003 ,  H05K2201/10121 ,  H05K2201/10484 ,  H05K2201/10515 ,  H05K2201/1053 ,  H05K2201/10636 ,  H05K2201/10984 ,  H05K2201/2036 ,  Y02P70/611 ,  Y02P70/613

Abstract: An electronic component mounted structure has: a circuit board; two semiconductor elements that are mounted on the circuit board; and an AC coupling capacitor that is operable to cut off signals with a predetermined frequency or less and is provided between the two semiconductor elements. The AC coupling capacitor is mounted on the circuit board such that a part or a whole of the AC coupling capacitor is away from the surface of the circuit board.

Abstract translation: 电子部件安装结构具有：电路板; 安装在电路板上的两个半导体元件; 以及AC耦合电容器，其可操作以以预定频率或更小的频率切断信号，并且设置在两个半导体元件之间。 AC耦合电容器安装在电路板上，使得AC耦合电容器的一部分或全部远离电路板的表面。

公开(公告)号：US07732919B2

公开(公告)日：2010-06-08

申请号：US12362354

申请日：2009-01-29

Applicant: Ichio Shimizu ,  Kenya Kawano ,  Kisho Ashida ,  Yuichi Machida

Inventor： Ichio Shimizu ,  Kenya Kawano ,  Kisho Ashida ,  Yuichi Machida

IPC: H01L23/34

CPC classification number: H05K7/04 ,  H01L23/49537 ,  H01L23/49541 ,  H01L23/49548 ,  H01L23/49575 ,  H01L23/49589 ,  H01L24/28 ,  H01L24/29 ,  H01L24/36 ,  H01L24/39 ,  H01L24/40 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L2224/05554 ,  H01L2224/0603 ,  H01L2224/40245 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/73221 ,  H01L2224/83801 ,  H01L2224/83855 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0781 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/351 ,  H05K3/202 ,  H05K3/321 ,  H05K3/3442 ,  H05K2201/0397 ,  H05K2201/09663 ,  H05K2201/0969 ,  H05K2201/09745 ,  H05K2201/1003 ,  H05K2201/10484 ,  H05K2201/10636 ,  H05K2201/10924 ,  Y02P70/611 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: Coupling reliability of a passive component is improved to increase the reliability of a semiconductor device. A first through hole is formed in a first electrode part of a first plate-like lead, and a second through hole is formed in a second electrode part of a second plate-like lead. As a result, at the first electrode part of the first plate-like lead, one external terminal of the passive component can be coupled to the first electrode parts on both sides of the first through hole while being laid across the first through hole. Also, at the second electrode part of the second plate-like lead, the other external terminal of the passive component can be coupled to the second electrode parts on both sides of the second through hole while being laid across the second through hole. Accordingly, at central portions both in the longitudinal and width directions of the passive component, the passive component is surrounded by sealing members. As a result, thermal stress applied to jointing materials such as solder can be reduced, improving the reliability of the semiconductor device (semiconductor package).

Abstract translation: 改善了无源部件的耦合可靠性，以提高半导体器件的可靠性。 第一通孔形成在第一板状引线的第一电极部分中，第二通孔形成在第二板状引线的第二电极部分中。 结果，在第一板状引线的第一电极部分，无源部件的一个外部端子可以被连接到第一通孔的两侧的第一电极部分，同时跨过第一通孔。 此外，在第二板状引线的第二电极部分，无源部件的另一个外部端子可以在跨过第二通孔而被布置在第二通孔的两侧上的第二电极部件上。 因此，在无源部件的纵向和宽度方向的中心部分处，被动部件被密封部件包围。 结果，可以减少施加到诸如焊料的接合材料的热应力，从而提高半导体器件（半导体封装）的可靠性。

公开(公告)号：US07655936B2

公开(公告)日：2010-02-02

申请号：US12044565

申请日：2008-03-07

Applicant: Noboru Sawayama ,  Kayoko Ikegami ,  Katsuo Hatase

Inventor： Noboru Sawayama ,  Kayoko Ikegami ,  Katsuo Hatase

IPC: G01N21/86 ,  G03G15/00

CPC classification number: H05K3/301 ,  G01N21/55 ,  G01N2201/062 ,  G03G2215/00042 ,  H05K1/18 ,  H05K2201/10106 ,  H05K2201/10484 ,  H05K2201/10606

Abstract: An optical sensor includes at least one light emitting unit that emits a light, a first light receiving unit that receives specular reflection light from an illumination object when the light is incident on the illumination object with an incidence angle and specularly reflected with a reflection angle, and a second light receiving unit that receives diffuse reflection light from the illumination object when the incident light is diffusely reflected at the illumination object. The sum of the incident angle and the reflection angle is 25 degrees or less.

Abstract translation: 光学传感器包括至少一个发光的发光单元，第一光接收单元，当光以入射角入射到照明物​​体上并以反射角镜面反射时，该第一光接收单元从照明物体接收镜面反射光， 以及第二光接收单元，当所述入射光在所述照明对象处漫反射时，所述第二光接收单元接收来自所述照明物体的漫反射光。 入射角和反射角的和为25度以下。

公开(公告)号：US20090283312A1

公开(公告)日：2009-11-19

申请号：US12453632

申请日：2009-05-18

Applicant: Michimasa Takahashi

Inventor： Michimasa Takahashi

IPC: H05K1/16 ,  H05K3/36 ,  G01N21/88

CPC classification number: H05K1/0298 ,  H01L24/24 ,  H01L2224/24227 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/12042 ,  H05K1/141 ,  H05K1/142 ,  H05K1/185 ,  H05K3/4602 ,  H05K3/4694 ,  H05K2201/0187 ,  H05K2201/09536 ,  H05K2201/10484 ,  Y10T29/49126 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A printed wiring board including a rigid multilayer board, a first substrate having multiple conductors, and a second substrate having multiple conductors electrically connected to the conductors of the first substrate. The conductors of the second substrate have an existing density which is set higher than an existing density of the conductors of the first substrate, and the first substrate and/or the second substrate is embedded in the rigid multilayer board.

Abstract translation: 一种印刷电路板，包括刚性多层板，具有多个导体的第一基板和具有与第一基板的导体电连接的多个导体的第二基板。 第二基板的导体具有设定为高于第一基板的导体的现有密度的现有密度，并且第一基板和/或第二基板嵌入刚性多层板中。

公开(公告)号：US20090213189A1

公开(公告)日：2009-08-27

申请号：US12392270

申请日：2009-02-25

Applicant: Katsuhiro OKUBO

Inventor： Katsuhiro OKUBO

IPC: B41J2/045

CPC classification number: B41J2/14233 ,  B41J2002/14491 ,  H05K3/323 ,  H05K3/361 ,  H05K2201/09063 ,  H05K2201/09781 ,  H05K2201/10484

Abstract: There is provided a liquid ejecting head including a channel forming member in which a pressure generating chamber is provided, a piezoelectric element that is provided at one surface side of the channel forming member, a terminal portion electrically connected to the piezoelectric element; the terminal portion being provided at the one surface side of the channel forming member, a wiring substrate which has a wiring layer, and an adhesive layer for electrically connecting the wiring layer and the terminal portion and for combing the wiring substrate and the channel forming member, the adhesive layer being formed by an anisotropic conductive material. A gap layer that is electrically discontinuous with the terminal portion and the wiring layer is provided on at least one surface of the channel forming member and the wiring substrate in an area in which the adhesive layer is provided.

Abstract translation: 提供了一种液体喷射头，其包括设置有压力发生室的通道形成构件，设置在通道形成构件的一个表面侧的压电元件，电连接到压电元件的端子部分; 所述端子部设置在所述沟道形成构件的一个表面侧，具有布线层的布线基板和用于电连接所述布线层和所述端子部分并用于梳理所述布线基板和所述沟道形成构件的粘合剂层 ，粘合剂层由各向异性导电材料形成。 在设置有粘合剂层的区域中，在沟道形成构件和布线基板的至少一个表面上设置与端子部和布线层不连续的间隙层。

公开(公告)号：US07566866B2

公开(公告)日：2009-07-28

申请号：US11852506

申请日：2007-09-10

Applicant: Mark Vandermeulen ,  Robert E. Hawke ,  David Roy ,  William F. Hill

Inventor： Mark Vandermeulen ,  Robert E. Hawke ,  David Roy ,  William F. Hill

IPC: H01J40/14

CPC classification number: G01J1/02 ,  G01J1/0271 ,  G01J1/04 ,  G01J1/0403 ,  H05K3/3436 ,  H05K2201/094 ,  H05K2201/10121 ,  H05K2201/10484 ,  Y02P70/613

Abstract: Systems and methods are provided for depositing solder in a first pattern over a first bonding pad on the substrate; depositing solder in a second pattern over a second bonding pad on the substrate, wherein the second pattern defines a larger area than the first pattern; placing the electronic device on the substrate such that pads on the electronic device are aligned with the first and second bonding pads; and reflowing the solder between the pads on the electronic device and the first and second bonding pads, causing the solder deposited on the first bonding pad to form a first solder joint and the solder deposited on the second bonding pad to form a second solder joint. The second solder joint is larger than the first solder joint causing the electronic device to be attached at an angle relative to the substrate.

Abstract translation: 提供了用于在衬底上的第一焊盘上以第一图案沉积焊料的系统和方法; 在衬底上的第二接合焊盘上以第二图案沉积焊料，其中所述第二图案限定比所述第一图案更大的面积; 将所述电子设备放置在所述基板上，使得所述电子设备上的焊盘与所述第一和第二焊盘对准; 以及在所述电子设备上的所述焊盘与所述第一和第二接合焊盘之间回流焊料，使得沉积在所述第一接合焊盘上的所述焊料形成第一焊接接头，并且所述焊料沉积在所述第二接合焊盘上以形成第二焊接接头。 第二焊点比第一焊点大，导致电子器件相对于衬底以一定角度附着。

公开(公告)号：US20090122503A1

公开(公告)日：2009-05-14

申请号：US12269481

申请日：2008-11-12

Applicant: Michael HORTIG ,  Peter KUNERT

Inventor： Michael HORTIG ,  Peter KUNERT

IPC: H05K7/00

CPC classification number: G01P1/023 ,  G01C25/00 ,  H05K3/301 ,  H05K2201/10151 ,  H05K2201/10325 ,  H05K2201/10484 ,  Y10T29/49117 ,  Y10T29/49826 ,  Y10T29/4998

Abstract: A base element having a first and a second surface, the first surface being designed to receive a module housing and the second surface being designed to be mounted on a carrier element, and in addition an angle between 0 and 90 degrees being provided between a first face normal of the first surface and a second face normal of the second surface.

Abstract translation: 具有第一表面和第二表面的基体元件，所述第一表面被设计成容纳模块壳体，并且所述第二表面设计成安装在载体元件上，此外，在第一和第二表面之间设置有0度到90度之间的角度， 第一表面的法线和第二表面的第二面法线。

公开(公告)号：US20080170220A1

公开(公告)日：2008-07-17

申请号：US12044565

申请日：2008-03-07

Applicant: Noboru Sawayama ,  Kayoko Ikegami ,  Katsuo Hatase

Inventor： Noboru Sawayama ,  Kayoko Ikegami ,  Katsuo Hatase

IPC: G01N21/00

CPC classification number: H05K3/301 ,  G01N21/55 ,  G01N2201/062 ,  G03G2215/00042 ,  H05K1/18 ,  H05K2201/10106 ,  H05K2201/10484 ,  H05K2201/10606

Abstract: An optical sensor includes at least one light emitting unit that emits a light, a first light receiving unit that receives specular reflection light from an illumination object when the light is incident on the illumination object with an incidence angle and specularly reflected with a reflection angle, and a second light receiving unit that receives diffuse reflection light from the illumination object when the incident light is diffusely reflected at the illumination object. The sum of the incident angle and the reflection angle is 25 degrees or less.

Abstract translation: 光学传感器包括至少一个发光的发光单元，第一光接收单元，当光以入射角入射到照明物​​体上并以反射角镜面反射时，该第一光接收单元从照明物体接收镜面反射光， 以及第二光接收单元，当所述入射光在所述照明对象处漫反射时，所述第二光接收单元接收来自所述照明物体的漫反射光。 入射角和反射角的和为25度以下。