公开(公告)号：US11927886B2

公开(公告)日：2024-03-12

申请号：US17194174

申请日：2021-03-05

Applicant: SEMES CO., LTD.

Inventor： Doo Young Oh ,  Joon Jae Lee

IPC: H01L21/02 ,  B05C9/12 ,  B05C11/10 ,  G03F7/00 ,  G03F7/004 ,  G03F7/16 ,  G03F7/20 ,  H01L21/67 ,  H01L21/677

CPC classification number: G03F7/2041 ,  B05C9/12 ,  B05C11/1044 ,  G03F7/0035 ,  G03F7/0048 ,  G03F7/162 ,  H01L21/02052 ,  H01L21/67051 ,  H01L21/67109 ,  H01L21/6715 ,  H01L21/67178 ,  H01L21/67745

Abstract: Disclosed are a substrate treating apparatus and a substrate treating method. According to an embodiment of the inventive concept, the purge operation of the purge nozzle is performed while the nozzle arm is moved from the first substrate support member to the second substrate support member, it hardly influences the operation of treating the substrate while the nozzle arm is moved from the first substrate support member to the second substrate support member. According to an embodiment of the inventive concept, the substrate treating apparatus may perform an operation of purging the photosensitive liquid nozzle while the treatment liquid supply unit performs a process of supplying the photosensitive liquid to the substrate. Accordingly, because the operation of purging the photosensitive liquid nozzle is performed at the same time when the substrate treating apparatus performs a process, productivity may be improved.

公开(公告)号：US11923219B2

公开(公告)日：2024-03-05

申请号：US16912762

申请日：2020-06-26

Applicant: SEMES CO., LTD.

Inventor： Youngseop Choi ,  Young Hun Lee ,  Yong-Jun Seo ,  Bok Kyu Lee ,  Miso Park

IPC: H01L21/67 ,  B08B3/08 ,  B08B7/04 ,  B08B13/00

CPC classification number: H01L21/67248 ,  B08B3/08 ,  B08B7/04 ,  B08B13/00 ,  H01L21/67051 ,  H01L21/67103 ,  H01L21/6719

Abstract: The inventive concept relates to an apparatus for treating a substrate. In an embodiment, the apparatus includes a process chamber having a process space in which the substrate is treated with a fluid in a supercritical state, a support unit that supports the substrate in the process space, a fluid supply unit that supplies the fluid into the process space, a filler member disposed to face the substrate placed on the support unit in the process space, and a measurement unit that measures a state in the process space, the measurement unit being provided in the filler member.

公开(公告)号：US11923213B2

公开(公告)日：2024-03-05

申请号：US17128159

申请日：2020-12-20

Applicant: SEMES CO., LTD.

Inventor： Tae Shin Kim ,  Young Dae Chung ,  Ji Hoon Jeong ,  Jee Young Lee ,  Won Geun Kim

IPC: H01L23/00 ,  B08B3/10 ,  B23K26/00 ,  B23K26/06 ,  B23K26/064 ,  B23K26/352 ,  G02B7/02 ,  G02B27/09 ,  H01L21/02 ,  H01L21/268 ,  H01L21/66 ,  H01L21/67 ,  H01L21/687 ,  B23K101/40 ,  B23K103/00

CPC classification number: H01L21/67115 ,  B08B3/10 ,  B23K26/0006 ,  B23K26/0604 ,  B23K26/0626 ,  B23K26/064 ,  B23K26/352 ,  G02B7/028 ,  G02B27/0916 ,  G02B27/0955 ,  H01L21/02057 ,  H01L21/268 ,  H01L21/67051 ,  H01L21/67248 ,  H01L21/68764 ,  H01L22/20 ,  B23K2101/40 ,  B23K2103/56

Abstract: Proposed is a substrate heating unit including: a laser generator providing a laser beam for heating a substrate; and a beam shaper processing the laser beam from the laser generator and selectively providing one of a first beam having a uniform energy distribution and a second beam having an edge-enhanced energy distribution to the substrate.

公开(公告)号：US20240072142A1

公开(公告)日：2024-02-29

申请号：US18218751

申请日：2023-07-06

Applicant: SEMES CO., LTD.

Inventor： Thomas Jongwan KWON ,  Hae-won CHOI ,  Yunsang KIM

IPC: H01L29/423 ,  H01L21/3213

CPC classification number: H01L29/4236 ,  H01L21/32137

Abstract: Provided is a method of manufacturing a semiconductor device, the method including steps of providing a semiconductor substrate having one or more trenches, forming a gate insulating layer on the semiconductor substrate inside the trenches, and forming a buried gate electrode layer on the gate insulating layer to at least partially fill the trenches, wherein the step of forming the buried gate electrode layer includes a step of repeating a unit cycle a plurality of times, the unit cycle including an atomic layer deposition (ALD) process for forming a conductive layer on the gate insulating layer to serve as the buried gate electrode layer, and an atomic layer etching (ALE) process for preferentially etching portions of the conductive layer formed near the trenches and portions of the conductive layer formed on upper ends of the trenches over other portions of the conductive layer inside the trenches.

公开(公告)号：US11915905B2

公开(公告)日：2024-02-27

申请号：US16918299

申请日：2020-07-01

Applicant: SEMES CO., LTD.

Inventor： Hyoungkyu Son ,  Yu Dong Han ,  Hyeon Gyu Kim ,  Seon Ok Kim

IPC: H01J37/32 ,  H01L21/683 ,  H01J37/20

CPC classification number: H01J37/20 ,  H01J37/32082 ,  H01J37/32532 ,  H01J37/32715 ,  H01L21/683 ,  H01J2237/334

Abstract: A support unit provided in an apparatus for treating a substrate using plasma includes a dielectric plate on which the substrate is placed, an electrode plate disposed under the dielectric plate, a power supply rod that applies power to the electrode plate, and a flange that has a shape surrounding the power supply rod and that is spaced apart from the power supply rod.

公开(公告)号：US20240064967A1

公开(公告)日：2024-02-22

申请号：US18206490

申请日：2023-06-06

Applicant: SEMES CO., LTD.

Inventor： Chengyeh Hsu ,  Thomas Jongwan Kwon ,  Yunsang Kim ,  Haewon Choi

IPC: H10B12/00

CPC classification number: H10B12/482 ,  H10B12/488 ,  H10B12/315

Abstract: A semiconductor device includes bit lines each extending in a first direction on a substrate and spaced apart from each other in a second direction, semiconductor patterns disposed on each of the bit lines and including a first semiconductor pattern disposed on a first bit line, and a second semiconductor pattern arranged to be offset in the second direction from the first semiconductor pattern on the first bit line, word lines each extending in the second direction and surrounding a sidewall of each of the semiconductor patterns, the word lines including a first word line extending in the second direction and surrounding the first semiconductor pattern, and a second word line spaced apart in the first direction from the first word line and extending in the second direction while surrounding the second semiconductor pattern, and storage nodes respectively disposed on the semiconductor patterns.

公开(公告)号：US20240059497A1

公开(公告)日：2024-02-22

申请号：US18340569

申请日：2023-06-23

Applicant: SEMES CO., LTD.

Inventor： In Su JO ,  Tae Uk PARK

IPC: B65G43/02 ,  H01L21/677 ,  H01L21/67

CPC classification number: B65G43/02 ,  H01L21/67715 ,  H01L21/67259 ,  H01L21/67733 ,  H01L21/67736 ,  B65G2812/99 ,  B65G2811/0678 ,  B65G2201/0297

Abstract: A transfer system according to the present invention comprises a first travel rail including a first merging section; a second travel rail merging the first travel rail at a merging point and including a second merging section corresponding to the first merging section; a transfer/loading area defined in the second merging section and located upstream of the merging point; and a controller (OCS) for controlling an operation of at least one transfer vehicle moving along the first travel rail and the second travel rail, wherein a second transfer vehicle moves along the second travel rail and enters the transfer/loading area, the second transfer vehicle starts a transfer/loading operation in the transfer/loading area, the first transfer vehicle moves along the first travel rail and enters the first merging section, and the first transfer vehicle passes through the merging point before the second transfer vehicle.

公开(公告)号：US11892500B2

公开(公告)日：2024-02-06

申请号：US17857978

申请日：2022-07-05

Applicant: SEMES CO., LTD.

Inventor： Jin Ho Kang ,  Joo Hyun Seo

IPC: G01P3/48 ,  G01R31/28 ,  H01L21/677 ,  B66B9/00

CPC classification number: G01R31/2867 ,  B66B9/00 ,  G01R31/2862 ,  H01L21/677

Abstract: An elevator unit for transferring a tray includes a tray guide block on which a tray is seated, a wrapping connector driving member configured to elevate and lower the tray guide block, a fixed fastener connected to the tray guide block, and a corrective fastener connected to the wrapping connector driving member and configured to rotatably coupled to the fixed fastening member.

公开(公告)号：US11890864B2

公开(公告)日：2024-02-06

申请号：US17366322

申请日：2021-07-02

Applicant: SEMES CO., LTD

Inventor： Inseok Ha ,  Jinhyuck Yang ,  Jaeyoung Jang

IPC: B41J11/00 ,  B05B7/06 ,  B05B13/02 ,  H01L21/683

CPC classification number: B41J11/0085 ,  B05B7/061 ,  B05B13/02 ,  H01L21/6838

Abstract: An apparatus for supplying a chemical liquid may include a stage on which a substrate is placed, a chemical liquid discharging member and a direction changing member. The chemical liquid discharging member may supply the chemical liquid onto at least two first regions of the substrate for first pixels along a first direction. Additionally, the chemical liquid discharging member may supply the chemical liquid onto at least two second regions of the substrate for second pixels along a second direction. The direction changing member may change a direction of the substrate from the second direction to the first direction.

公开(公告)号：US20240034055A1

公开(公告)日：2024-02-01

申请号：US18347241

申请日：2023-07-05

Applicant: SEMES CO., LTD.

Inventor： Won Yong JIN ,  Suk Won JANG

IPC: B41J2/045 ,  B41J29/17

CPC classification number: B41J2/04535 ,  B41J2/0456 ,  B41J29/17 ,  B41J2202/15

Abstract: A droplet analysis unit capable of measuring and digitizing the meniscus shape, motion, and position of ink droplets and a substrate treatment apparatus including the droplet analysis unit are provided. The substrate treatment apparatus includes: a process treatment unit supporting a substrate while the substrate is being treated; an inkjet head unit treating the substrate by ejecting a substrate treatment liquid onto the substrate using a plurality of nozzles; a gantry unit moving the inkjet head unit over the substrate; and a droplet analysis unit measuring a meniscus in each of the nozzles that is associated with the substrate treatment liquid, wherein the droplet analysis unit measures and quantifies three-dimensional (3D) information regarding the meniscus.