公开(公告)号：US08546188B2

公开(公告)日：2013-10-01

申请号：US12757511

申请日：2010-04-09

申请人： Fei Liu ,  Albert M. Young ,  Roy R. Yu

发明人： Fei Liu ,  Albert M. Young ,  Roy R. Yu

IPC分类号： H01L21/00 ,  H01L23/02

CPC分类号： H01L25/0657 ,  H01L24/05 ,  H01L25/50 ,  H01L2221/68359 ,  H01L2221/68363 ,  H01L2221/68377 ,  H01L2224/0401 ,  H01L2224/0557 ,  H01L2224/16145 ,  H01L2225/06541 ,  H01L2924/0002 ,  H01L2924/01327 ,  H01L2924/10252 ,  H01L2924/10253 ,  H01L2924/10271 ,  H01L2924/10272 ,  H01L2924/10329 ,  H01L2924/1301 ,  H01L2924/1305 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/3511 ,  H01L2924/00 ,  H01L2224/05552

摘要： A first set of semiconductor substrates includes semiconductor chips having bonding pads arranged in a primary pattern. A second set of semiconductor substrates includes semiconductor chips having bonding pads arranged in a mirror-image pattern. A first semiconductor substrate from the first set is bonded to a second semiconductor substrate from the second set such that each bonding pads is bonded to a mirror-image bonding pad. Additional substrates are bonded sequentially such that the bonded structure includes an even number of semiconductor substrates of which one half have bonding pads of the primary pattern and are bonded to the side of the first semiconductor substrate, while the other half have bonding pads of the mirror-image pattern and are bonded to the side of the second semiconductor substrate. The mirror-image patterns of the bonding pads enable maximal cancellation of wafer bow.

摘要翻译： 第一组半导体衬底包括具有以初级图案布置的焊盘的半导体芯片。 第二组半导体衬底包括具有以镜像图案布置的接合焊盘的半导体芯片。 来自第一组的第一半导体衬底从第二组焊接到第二半导体衬底，使得每个焊盘接合到镜像接合焊盘。 附加的基板顺序地接合，使得接合结构包括偶数个半导体衬底，其中半个半导体衬底具有初级图案的焊盘并且结合到第一半导体衬底的侧面，而另一半具有镜的接合焊盘 - 图案图案并且结合到第二半导体衬底的侧面。 接合焊盘的镜像图案能够最大限度地消除晶片弓。

公开(公告)号：US20130183553A1

公开(公告)日：2013-07-18

申请号：US13349255

申请日：2012-01-12

申请人： Hariklia Deligianni ,  Harold J. Hovel ,  Fei Liu

发明人： Hariklia Deligianni ,  Harold J. Hovel ,  Fei Liu

IPC分类号： H01M10/42 ,  H01M4/04 ,  H01M2/20

CPC分类号： H01M2/204 ,  H01G11/16 ,  H01M2/348 ,  H01M10/0436 ,  H01M10/052 ,  H01M10/0562 ,  H01M10/058 ,  H01M2200/103 ,  Y10T29/49108 ,  Y10T29/49115

摘要： A useful lifetime of an energy storage device can be extended by providing a series connection of a battery cell and an self-programming fuse. A plurality of series connections of a battery cell and an self-programming fuse can then be connected in a parallel connection to expand the energy storage capacity of the energy storage device. Each self-programming fuse can be a strip of a metal semiconductor alloy material, which electromigrates when a battery cell is electrically shorted and causes increases in the amount of electrical current therethrough. Thus, each self-programming fuse is a self-programming circuit that opens once the battery cell within the same series connection is shorted.

摘要翻译： 可以通过提供电池单元和自编程保险丝的串联连接来扩展能量存储装置的有用寿命。 然后可以并联连接电池单元和自编程保险丝的多个串联连接以扩大能量存储装置的能量存储容量。 每个自编程保险丝可以是金属半导体合金材料的条带，当电池单元电气短路并导致电流量增加时，电极会电流化。 因此，每个自编程保险丝是一个自编程电路，一旦同一串联连接中的电池单元短路，该自编程电路就会断开。

公开(公告)号：US20120286377A1

公开(公告)日：2012-11-15

申请号：US13103193

申请日：2011-05-09

申请人： Josephine B. Chang ,  Sebastian U. Engelmann ,  Michael A. Guillorn ,  Fei Liu ,  Conal E. Murray

发明人： Josephine B. Chang ,  Sebastian U. Engelmann ,  Michael A. Guillorn ,  Fei Liu ,  Conal E. Murray

IPC分类号： H01L29/84 ,  H01L21/3105 ,  H01L29/06

CPC分类号： H01L29/84 ,  B81B3/0072 ,  B81B2203/0109 ,  B81B2203/0307 ,  H01L29/0673

摘要： Improved nano-electromechanical system devices and structures and systems and techniques for their fabrication. In one embodiment, a structure comprises an underlying substrate separated from first and second anchor points by first and second insulating support points, respectively. The first and second anchor points are joined by a beam. First and second deposition regions overlie the first and second anchor points, respectively, and the first and second deposition regions exert compression on the first and second anchor points, respectively. The compression on the first and second anchor points causes opposing forces on the beam, subjecting the beam to a tensile stress. The first and second deposition regions suitably exhibit an internal tensile stress having an achievable maximum varying with their thickness, so that the tensile stress exerted on the beam depends at least on part on the thickness of the first and second deposition regions.

摘要翻译： 改进的纳米机电系统设备及其制造的结构及系统和技术。 在一个实施例中，结构包括分别通过第一和第二绝缘支撑点从第一和第二锚定点分离的下面的基底。 第一和第二锚定点通过梁连接。 第一和第二沉积区域分别覆盖在第一和第二锚定点上，并且第一和第二沉积区域分别在第一和第二锚定点上施加压缩。 第一和第二锚固点上的压缩在梁上产生相反的力，使梁受到拉伸应力。 第一和第二沉积区域适当地呈现具有随其厚度变化的可实现最大值的内部拉伸应力，使得施加在梁上的拉伸应力至少部分地取决于第一和第二沉积区域的厚度。

公开(公告)号：US08239786B2

公开(公告)日：2012-08-07

申请号：US12644790

申请日：2009-12-22

申请人： William S. Wong ,  Fei Liu ,  Been-Der Chen ,  Yen-Wen Lu

发明人： William S. Wong ,  Fei Liu ,  Been-Der Chen ,  Yen-Wen Lu

IPC分类号： G06F17/50

CPC分类号： G03F1/36

摘要： A multivariable solver for proximity correction uses a Jacobian matrix to approximate effects of perturbations of segment locations in successive iterations of a design loop. The problem is formulated as a constrained minimization problem with box, linear equality, and linear inequality constraints. To improve computational efficiency, non-local interactions are ignored, which results in a sparse Jacobian matrix.

摘要翻译： 用于近程校正的多变量求解器使用雅可比矩阵近似设计循环的连续迭代中的段位置的扰动效应。 该问题被形成为具有框，线性等式和线性不等式约束的约束最小化问题。 为了提高计算效率，忽略非局部相互作用，这导致了稀疏的雅可比矩阵。

公开(公告)号：US08232704B2

公开(公告)日：2012-07-31

申请号：US12623043

申请日：2009-11-20

申请人： Rui Feng Qin ,  Fei Liu

发明人： Rui Feng Qin ,  Fei Liu

IPC分类号： H02K1/26

CPC分类号： H02K1/265 ,  H02K23/405

摘要： An electric motor comprises a stator and a rotor rotatably mounted confronting the stator. The rotor has a rotor core which comprises at least a first tooth, a second tooth and a third tooth which are adjacent. Each of the teeth comprises a rib section radially and outwardly extending from a core and a tooth section located at an outer end of the rib section. The angle between the first tooth and the second tooth is n degrees, wherein when the rotor core is rotated n degrees to move the first tooth towards the second tooth, the rotated second tooth does not coincide with the pre-rotated third tooth.

摘要翻译： 电动机包括定子和与该定子相对转动地安装的转子。 转子具有至少包括相邻的第一齿，第二齿和第三齿的转子芯。 每个齿包括从芯部径向向外延伸的肋部分和位于肋部分的外端处的齿部分。 第一齿和第二齿之间的角度为n度，其中当转子芯旋转n度以使第一齿朝向第二齿移动时，旋转的第二齿不与预旋转的第三齿重合。

公开(公告)号：US20120187089A1

公开(公告)日：2012-07-26

申请号：US13393225

申请日：2009-10-27

申请人： Xuanshu Chen ,  Yuan Pan ,  Fei Liu ,  Junjia He ,  Zhao Yuan ,  Ting Yin ,  Yan Du ,  Yan He

发明人： Xuanshu Chen ,  Yuan Pan ,  Fei Liu ,  Junjia He ,  Zhao Yuan ,  Ting Yin ,  Yan Du ,  Yan He

IPC分类号： H01H33/14

CPC分类号： H01H33/14 ,  H01H9/167 ,  H01H9/563 ,  H01H33/16 ,  H01H33/59 ,  H01H33/6662 ,  H01H2009/543

摘要： A high-voltage, super-voltage and heavy current breaker is formed by combining intelligent optical vacuum breaker modules (21) with phase selection function in series and/or parallel connection. Each vacuum breaker module (21) is connected each other in series after being connected in parallel with a resistance capacitance device or with a resistance capacitance device and a zinc oxide arrester valve plate (22). Tight coupling reactors are connected with several serial branches of the vacuum breaker module (21) simultaneously to achieve parallel connection of several serial branches of the vacuum breaker module (21). The breaker distributes the high-voltage and heavy current into the low voltage and low current serial and parallel vacuum breaker modules (21) to share.

摘要翻译： 通过将智能光学真空断路器模块（21）与串联和/或并联的相位选择功能相结合，形成高压，超电压和大电流断路器。 每个真空断路器模块（21）在与电阻电容器件或电阻电容器件和氧化锌避雷器阀板（22）并联连接之后彼此串联连接。 紧耦合电抗器同时与真空断路器模块（21）的几个串联连接，以实现真空断路器模块（21）的几个串联分支的并联连接。 断路器将高压和大电流分配到低压和低电流串联和并联真空断路器模块（21）中以共享。

公开(公告)号：US20120043814A1

公开(公告)日：2012-02-23

申请号：US12858535

申请日：2010-08-18

申请人： Hariklia Deligianni ,  Fei Liu

发明人： Hariklia Deligianni ,  Fei Liu

IPC分类号： H02J1/10 ,  G06F17/50 ,  H01L33/18 ,  H01M10/00 ,  H01M10/46 ,  B32B37/16

CPC分类号： H01M10/39 ,  G06F17/5045 ,  G06F17/5068 ,  G06F17/5081 ,  H01L31/022458 ,  H01L31/053 ,  H01L31/068 ,  H01M10/465 ,  H01M14/005 ,  H01M16/00 ,  H01M16/006 ,  H02J7/35 ,  H02S40/38 ,  Y02E10/547 ,  Y10T156/10 ,  Y10T307/50

摘要： An integrated photovoltaic cell and battery device, a method of manufacturing the same and a photovoltaic power system incorporating the integrated photovoltaic cell and battery device. The integrated photovoltaic cell and battery device includes a photovoltaic cell, a battery, and interconnects providing three-dimensional integration of the photovoltaic cell and the battery into an integrated device for capturing and storing solar energy. Also provided is a design structure readable by a machine to simulate, design, or manufacture the above integrated photovoltaic cell and battery device.

摘要翻译： 集成光伏电池和电池装置，其制造方法以及并入有集成光伏电池和电池装置的光伏发电系统。 集成光伏电池和电池装置包括光伏电池，电池和将光伏电池和电池三维集成在一起的用于捕获和存储太阳能的集成装置的互连。 还提供了用于模拟，设计或制造上述集成光伏电池和电池装置的机器可读的设计结构。

公开(公告)号：US08076177B2

公开(公告)日：2011-12-13

申请号：US12780100

申请日：2010-05-14

申请人： Kuan-Neng Chen ,  Fei Liu

发明人： Kuan-Neng Chen ,  Fei Liu

IPC分类号： H01L21/44

CPC分类号： H01L25/0657 ,  H01L24/81 ,  H01L25/50 ,  H01L2224/0345 ,  H01L2224/0346 ,  H01L2224/0401 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/05578 ,  H01L2224/05609 ,  H01L2224/05611 ,  H01L2224/05616 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/13147 ,  H01L2224/16112 ,  H01L2224/16147 ,  H01L2224/16237 ,  H01L2224/32145 ,  H01L2224/73104 ,  H01L2224/81138 ,  H01L2224/81191 ,  H01L2224/81203 ,  H01L2224/81385 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2225/06513 ,  H01L2225/06565 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2224/81 ,  H01L2224/05552

摘要： Scalable transfer-join bonding techniques are provided. In one aspect, a transfer-join bonding method is provided. The method includes the following steps. A first bonding structure is provided having at least one metal pad embedded in an insulator and at least one via in the insulator over the metal pad. The via has tapered sidewalls. A second bonding structure is provided having at least one copper stud adapted to have a taper that complements the tapered sidewalls of the via, such that the via and the copper stud fit together like a lock-and-key. The first bonding structure is bonded to the second bonding structure by way of a metal-to-metal bonding between the metal pad and the copper stud that deforms the copper stud. A transfer-join bonded structure is also provided.

摘要翻译： 提供了可扩展的传输连接粘合技术。 一方面，提供了转移 - 接合接合方法。 该方法包括以下步骤。 提供了第一接合结构，其具有嵌入在绝缘体中的至少一个金属焊盘和位于金属焊盘上的绝缘体中的至少一个通孔。 通孔具有锥形侧壁。 提供了第二接合结构，其具有至少一个铜螺柱，其适于具有与通孔的锥形侧壁相互补充的锥形，使得通孔和铜螺柱像锁键一样安装在一起。 第一接合结构通过在金属焊盘和铜螺柱之间的金属 - 金属接合而结合到第二接合结构，其使铜螺柱变形。 还提供了转移接合结合结构。

公开(公告)号：US20110278063A1

公开(公告)日：2011-11-17

申请号：US12780086

申请日：2010-05-14

申请人： Kuan-Neng Chen ,  Fei Liu

发明人： Kuan-Neng Chen ,  Fei Liu

IPC分类号： H01R4/02 ,  B23K31/02

CPC分类号： H01L24/81 ,  B23K20/02 ,  B23K2101/38 ,  B23K2103/12 ,  H01L24/03 ,  H01L24/14 ,  H01L2224/0401 ,  H01L2224/8114

摘要： Copper (Cu)-to-Cu bonding techniques are provided. In one aspect, a bonding method is provided. The method includes the following steps. A first bonding structure is provided having at least one copper pad embedded in a first insulator and at least one via in the first insulator over the copper pad, wherein the via has tapered sidewalls. A second bonding structure is provided having at least one copper stud embedded in a second insulator, wherein a portion of the copper stud is exposed for bonding and has a domed shape. The first bonding structure is bonded to the second bonding structure by way of a copper-to-copper bonding between the copper pad and the copper stud, wherein the via and the copper stud fit together like a lock-and-key. A bonded structure is also provided.

摘要翻译： 提供了铜（Cu）与Cu的结合技术。 一方面，提供了接合方法。 该方法包括以下步骤。 提供了第一接合结构，其具有嵌入在第一绝缘体中的至少一个铜焊盘和位于铜焊盘上的第一绝缘体中的至少一个通孔，其中该通孔具有锥形侧壁。 提供了第二接合结构，其具有嵌入在第二绝缘体中的至少一个铜螺柱，其中铜螺柱的一部分露出用于接合并且具有圆顶形状。 第一接合结构通过在铜焊盘和铜螺柱之间的铜 - 铜接合而结合到第二接合结构，其中通孔和铜螺柱像锁和键一样安装在一起。 还提供了粘合结构。

公开(公告)号：US20110103516A1

公开(公告)日：2011-05-05

申请号：US13000829

申请日：2009-06-26

申请人： Dongshan Bao ,  Fei Liu ,  Bin Wang ,  Yang Yao

发明人： Dongshan Bao ,  Fei Liu ,  Bin Wang ,  Yang Yao

IPC分类号： H04L27/20 ,  H04L27/00

CPC分类号： H04L27/2627 ,  H04L1/0041 ,  H04L1/0071 ,  H04L1/0072

摘要： A device for transmitting digital broadcast signal comprises: at least a first encoding unit, each of which encodes data of a sub-channel with forward error correction encoding; at least a time-domain interleaving unit, each of which receives data output from a first encoding unit and performs interleaving in time-domain on the encoded data; a first multiplexing unit, which multiplexes the interleaved data output from each of the time-domain interleaving unit into Main Service Channel (MSC) data; a second encoding unit, which performs forward error correction encoding on a second set of data to obtain Fast Information Channel (FIC) data; a differential modulating unit, which performs differential modulation on the FIC data by using a first modulation mode and on the MSC data by using a second modulation mode, wherein the modulation level of the first modulation mode is lower than that of the second modulation mode; and a frame generating and transmitting unit, which generates signal unit transmission frames by using differential-modulation symbol sequences generated by the differential modulating unit and transmitting said signal unit transmission frames.

摘要翻译： 用于发送数字广播信号的装置包括：至少第一编码单元，每个编码单元用前向纠错编码对子信道的数据进行编码; 至少一个时域交织单元，每个时域接收单元接收从第一编码单元输出的数据，并在编码数据上对时域执行交织; 第一复用单元，将从每个时域交织单元输出的交织数据复用到主服务信道（MSC）数据中; 第二编码单元，对第二组数据执行前向纠错编码以获得快速信息信道（FIC）数据; 差分调制单元，其通过使用第一调制模式对所述FIC数据进行差分调制，并且通过使用第二调制模式对所述MSC数据执行差分调制，其中所述第一调制模式的调制电平低于所述第二调制模式的调制电平; 以及帧生成和发送单元，其通过使用由差分调制单元生成的差分调制符号序列生成信号单元发送帧，并发送所述信号单元发送帧。