公开(公告)号：US20110210318A1

公开(公告)日：2011-09-01

申请号：US13060248

申请日：2009-08-21

申请人： Jae-Soon Bae ,  Ji-Eun Kim ,  Hye-Young Jang ,  Jeung-Gon Kim ,  Jun-Gi Jang ,  Sung-Kil Hong ,  Tae-Yoon Park ,  Dae-Woong Lee

发明人： Jae-Soon Bae ,  Ji-Eun Kim ,  Hye-Young Jang ,  Jeung-Gon Kim ,  Jun-Gi Jang ,  Sung-Kil Hong ,  Tae-Yoon Park ,  Dae-Woong Lee

IPC分类号： H01L51/54 ,  H01L51/30 ,  H01L51/46 ,  C07D209/82 ,  C07D413/10 ,  C07D401/10 ,  C07D409/10 ,  C07D401/14

CPC分类号： H01L51/0072 ,  C07D209/80 ,  C07D209/82 ,  C07D403/10 ,  C07D409/04 ,  C07D409/10 ,  H01L51/0067 ,  H01L51/0068 ,  H01L51/05 ,  H01L51/42 ,  H01L51/5012 ,  H01L51/5056 ,  H01L51/5072 ,  H01L51/5088 ,  Y02E10/549 ,  Y02P70/521

摘要： The present invention provides a novel compound that is capable of largely improving a life time, efficiency, electrochemical stability, and thermal stability of an organic electronic device, and an organic electronic device that comprises an organic material layer comprising the compound.

摘要翻译： 本发明提供能够大大提高有机电子器件的寿命，效率，电化学稳定性和热稳定性的新型化合物，以及包含含有该化合物的有机材料层的有机电子器件。

公开(公告)号：US08003439B2

公开(公告)日：2011-08-23

申请号：US12385316

申请日：2009-04-03

申请人： Myung-Sam Kang ,  Chang-Sup Ryu ,  Jung-Hyun Park ,  Hoe-Ku Jung ,  Ji-Eun Kim

发明人： Myung-Sam Kang ,  Chang-Sup Ryu ,  Jung-Hyun Park ,  Hoe-Ku Jung ,  Ji-Eun Kim

IPC分类号： H01L21/00

CPC分类号： H01L23/3128 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/13 ,  H01L24/16 ,  H01L24/48 ,  H01L24/81 ,  H01L2221/68345 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/73215 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12044 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/30105 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method of manufacturing a board on chip package including laminating a dry film on a carrier film, one side of which is laminated by a thin metal film; patterning the dry film in accordance with a circuit wire through light exposure and developing process, and forming a solder ball pad and a circuit wire; removing the dry film; laminating an upper photo solder resist excluding a portion where the solder ball pad is formed; etching the thin metal film formed on a portion where the upper photo solder resist is not laminated; mounting a semiconductor chip on the solder ball pad by a flip chip bonding; molding the semiconductor chip with a passivation material; removing the carrier film and the thin metal film; and laminating a lower photo solder resist under the solder ball pad. The board on chip package provides a high density circuit since a circuit pattern is formed using a seed layer.

摘要翻译： 一种制造片上封装的方法，包括在载体膜上层叠干膜，其一面由薄金属膜层压; 通过曝光和显影工艺根据电路线图案化干膜，并形成焊球焊盘和电路线; 去除干膜; 层压除了形成焊球垫的部分之外的上光阻焊剂; 蚀刻形成在上层光阻焊层未层叠的部分上的金属薄膜; 通过倒装芯片焊接将半导体芯片安装在焊球垫上; 用钝化材料成型半导体芯片; 去除载体膜和金属薄膜; 并在焊球下方层叠下光阻焊剂。 由于使用种子层形成电路图案，片上封装芯片提供了高密度电路。

公开(公告)号：US20110186342A1

公开(公告)日：2011-08-04

申请号：US13018971

申请日：2011-02-01

申请人： Young-Ji KIM ,  Kyung-Ro Yoon ,  Sang-Duck Kim ,  Jung-Hyun Park ,  Nam-Keun Oh ,  Jong-Gyu Choi ,  Ji-Eun Kim

发明人： Young-Ji KIM ,  Kyung-Ro Yoon ,  Sang-Duck Kim ,  Jung-Hyun Park ,  Nam-Keun Oh ,  Jong-Gyu Choi ,  Ji-Eun Kim

IPC分类号： H05K1/11 ,  H05K3/06

CPC分类号： H05K1/11 ,  H05K3/06 ,  Y10T29/49144 ,  Y10T29/49156

摘要： A single layered printed circuit board and a method of manufacturing the same are disclosed. In accordance with an embodiment of the present invention, the method can include forming a bonding pad, a circuit pattern and a post on a surface of an insulation film, in which one end part of the post is electrically connected to at least a portion of the circuit pattern, pressing an insulator on the surface of the insulation film, in which the circuit pattern and the post are buried in the insulator, selectively etching the insulator such that the other end part of the post is exposed, and opening a portion of the insulation film such that at least a portion of the bonding pad is exposed.

摘要翻译： 公开了一种单层印刷电路板及其制造方法。 根据本发明的实施例，该方法可以包括在绝缘膜的表面上形成焊盘，电路图案和柱，其中柱的一个端部电连接到绝缘膜的至少一部分 电路图案，将电路图案和柱埋在绝缘体中的绝缘膜表面上的绝缘体按压绝缘体，选择性地蚀刻绝缘体，使得柱的另一端暴露，并且打开一部分 所述绝缘膜使得所述焊盘的至少一部分露出。

公开(公告)号：US07972460B2

公开(公告)日：2011-07-05

申请号：US12408366

申请日：2009-03-20

申请人： Myung-Sam Kang ,  Jung-Hyun Park ,  Jeong-Woo Park ,  Ji-Eun Kim

发明人： Myung-Sam Kang ,  Jung-Hyun Park ,  Jeong-Woo Park ,  Ji-Eun Kim

IPC分类号： B32B37/02 ,  H05K1/02 ,  H01L21/70

CPC分类号： B32B38/04 ,  B32B38/10 ,  B32B2038/0092 ,  B32B2038/047 ,  B32B2309/105 ,  B32B2310/0843 ,  B32B2457/08 ,  H05K3/0035 ,  H05K3/108 ,  H05K3/421 ,  H05K3/428 ,  H05K3/4652 ,  H05K2201/0376 ,  H05K2203/0384 ,  H05K2203/0554 ,  Y10T156/1056 ,  Y10T156/1057 ,  Y10T156/1064 ,  Y10T156/1082

摘要： Disclosed is a method of manufacturing a printed circuit board. The method of manufacturing a printed circuit board having a via for connecting one layer to another layer can include forming a circuit pattern on one surface of a carrier; processing a hole corresponding to the via on one surface of the carrier; compressing the surface of the carrier into one surface of an insulation body; removing the carrier; processing a via hole on the insulation body, corresponding to a position of the hole; and forming a conductive material in the via hole, to thereby easily process a hole for forming a via and have high design freedom.

摘要翻译： 公开了印刷电路板的制造方法。 制造具有用于将一层连接到另一层的通路的印刷电路板的制造方法可以包括在载体的一个表面上形成电路图案; 在载体的一个表面上处理与通孔对应的孔; 将载体的表面压缩到绝缘体的一个表面中; 移除载体; 处理绝缘体上的通孔，对应于孔的位置; 并且在通孔中形成导电材料，从而容易地加工用于形成通孔的孔，并具有高的设计自由度。

公开(公告)号：US07937833B2

公开(公告)日：2011-05-10

申请号：US11976072

申请日：2007-10-19

申请人： Hoe-Ku Jung ,  Je-Gwang Yoo ,  Myung-Sam Kang ,  Ji-Eun Kim ,  Jeong-Woo Park ,  Jung-Hyun Park

发明人： Hoe-Ku Jung ,  Je-Gwang Yoo ,  Myung-Sam Kang ,  Ji-Eun Kim ,  Jeong-Woo Park ,  Jung-Hyun Park

IPC分类号： H03K3/02

CPC分类号： H05K3/20 ,  H05K3/0058 ,  H05K3/108 ,  H05K3/4611 ,  H05K3/4682 ,  H05K2201/0394 ,  H05K2201/09481 ,  H05K2201/09518 ,  H05K2201/09563 ,  H05K2203/0152 ,  H05K2203/0376 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49156

摘要： A method of manufacturing a circuit board is disclosed. A method of manufacturing a circuit board that includes forming a first circuit pattern on the insulation layer of a carrier, in which an insulation layer and a first seed layer are stacked in order; stacking and pressing the carrier and an insulation board with the side of the carrier having the first circuit pattern facing the insulation board; removing the carrier to transfer the first circuit pattern and the insulation layer onto the insulation board; and forming a second circuit pattern on the insulation layer transferred to the insulation board, allows fine pitch circuit patterns to enable the manufacture of fine circuit patterns of high density on the board, and allows the manufacture of a multi-layer circuit board with a simple process.

摘要翻译： 公开了一种制造电路板的方法。 一种制造电路板的方法，包括在载体的绝缘层上形成第一电路图案，其中绝缘层和第一种子层依次层叠; 堆叠并按压载体和绝缘板，其中载体侧具有面向绝缘板的第一电路图案; 移除载体以将第一电路图案和绝缘层转移到绝缘板上; 并且在转移到绝缘板的绝缘层上形成第二电路图案，允许精细的间距电路图案能够在板上制造高密度的精细电路图案，并且允许制造具有简单的多层电路板 处理。

公开(公告)号：US07858437B2

公开(公告)日：2010-12-28

申请号：US11706186

申请日：2007-02-15

申请人： Hoe-Ku Jung ,  Myung-Sam Kang ,  Ji-Eun Kim ,  Jung-Hyun Park

发明人： Hoe-Ku Jung ,  Myung-Sam Kang ,  Ji-Eun Kim ,  Jung-Hyun Park

IPC分类号： H01L21/44

CPC分类号： H01L21/481 ,  H01L23/13 ,  H01L24/73 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/16 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06568 ,  H01L2225/1058 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/15331 ,  H05K1/183 ,  H05K3/205 ,  H05K3/4658 ,  H05K3/4697 ,  H05K2203/0568 ,  H05K2203/0571 ,  H05K2203/308 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： An aspect of the present invention features a method for manufacturing a substrate having a cavity. The method can comprises: (a) forming an upper layer circuit on an upper seed layer; (b) laminating a dry film on a portion of the upper seed layer where a cavity is to be formed; (c) fabricating an upper outer layer by forming an insulation layer on top of the upper seed layer and on top and sides of the upper layer circuit; (d) stacking the upper outer layer on one side of a core layer where an internal circuit is formed; (e) removing the upper seed layer; and (f) forming the cavity by removing the dry film. The method for manufacturing a substrate with a cavity according to the present invention can reduce the total thickness of the substrate while the thickness of an insulation layer remains the same, by forming the insulation layer on sides of an external circuit.

摘要翻译： 本发明的一个方面的特征在于一种用于制造具有腔的衬底的方法。 该方法可以包括：（a）在上部种子层上形成上层电路; （b）在要形成空腔的上种子层的一部分上层压干膜; （c）通过在上部种子层的顶部和上层电路的顶部和侧面上形成绝缘层来制造上部外层; （d）在形成有内部电路的芯层的一侧堆叠上外层; （e）去除上部种子层; 和（f）通过去除干膜形成空腔。 根据本发明的用于制造具有腔的衬底的方法可以通过在外部电路的侧面上形成绝缘层来减小衬底的总厚度，同时绝缘层的厚度保持相同。

公开(公告)号：US20100289008A1

公开(公告)日：2010-11-18

申请号：US12225096

申请日：2007-03-14

申请人： Jun-Gi Jang ,  Chang-Hwan Kim ,  Dong-Seob Jeong ,  Sang-Young Jeon ,  Kong-Kyeom Kim ,  Wook-Dong Cho ,  Ji-Eun Kim ,  Byung-Sun Jeon

发明人： Jun-Gi Jang ,  Chang-Hwan Kim ,  Dong-Seob Jeong ,  Sang-Young Jeon ,  Kong-Kyeom Kim ,  Wook-Dong Cho ,  Ji-Eun Kim ,  Byung-Sun Jeon

IPC分类号： H01L51/54 ,  H01L51/50 ,  H01L51/56

CPC分类号： H01L51/5052 ,  H01L51/0053 ,  H01L51/0059 ,  H01L51/0072

摘要： The present invention provides an organic light emitting device comprising a first electrode, a second electrode, and at least two organic material layers interposed therebetween, including a light emitting layer, wherein the organic material layers comprise at least one layer of a hole injecting layer, a hole transporting layer and a hole injecting and transporting layer, and at least one of the hole injecting layer, the hole transporting layer and the hole injecting and transporting layer comprises a material with a HOMO energy level of ˜4 eV or less, and a material with a LUMO energy level of −4 eV or less, and a process for preparing the same.

摘要翻译： 本发明提供了一种有机发光器件，其包括第一电极，第二电极和介于其间的至少两个有机材料层，包括发光层，其中有机材料层包括至少一层空穴注入层， 空穴传输层和空穴注入传输层，并且空穴注入层，空穴传输层和空穴注入传输层中的至少一个包括HOMO能级为〜4eV以下的材料，以及 LUMO能级为-4eV以下的材料及其制备方法。

公开(公告)号：US20100125103A1

公开(公告)日：2010-05-20

申请号：US12484623

申请日：2009-06-15

申请人： Tae-Lin Huh ,  Hebok Song ,  Ji-Eun Kim ,  Byoung-Mog Kwon ,  Dong Cho Han ,  Hye-Nan Kim

发明人： Tae-Lin Huh ,  Hebok Song ,  Ji-Eun Kim ,  Byoung-Mog Kwon ,  Dong Cho Han ,  Hye-Nan Kim

IPC分类号： A61K31/215 ,  C07C43/20 ,  A61K31/085 ,  C07C69/66 ,  A61P3/10

CPC分类号： A61K31/085 ,  A23L2/52 ,  A23L33/10 ,  A23L33/15 ,  A23L33/16 ,  A61K9/145 ,  A61K9/1623 ,  A61K9/2018 ,  A61K9/4858 ,  A61K31/215

摘要： Disclosed is a pharmaceutical composition containing obovatol represented by Formula 1 and its derivatives. The obovatol and its derivatives effectively increase the activity of AMPK (AMP-activated protein kinase) that plays an important role in diabetes and metabolic syndrome, and thus may be variously used in treating diabetes and metabolic syndrome. (In Formula 1, R1, R2 and R3 are the same as defined above).

摘要翻译： 公开了含有由式1及其衍生物表示的咯博醇的药物组合物。 obovatol及其衍生物有效地增加了在糖尿病和代谢综合征中起重要作用的AMPK（AMP活化蛋白激酶）的活性，因此可以多种多样地用于治疗糖尿病和代谢综合征。 （在式1中，R1，R2和R3与上述定义相同）。

公开(公告)号：US07604874B2

公开(公告)日：2009-10-20

申请号：US11585909

申请日：2006-10-25

申请人： Ji-Eun Kim ,  Se-Hwan Son ,  Jae-Soon Bae ,  Youn-Gu Lee ,  Kong-Kyeum Kim ,  Jae-Chol Lee ,  Jun-Gi Jang ,  Sung-Gap Im

发明人： Ji-Eun Kim ,  Se-Hwan Son ,  Jae-Soon Bae ,  Youn-Gu Lee ,  Kong-Kyeum Kim ,  Jae-Chol Lee ,  Jun-Gi Jang ,  Sung-Gap Im

IPC分类号： C09K11/06

CPC分类号： H01L51/0058 ,  C07D333/08 ,  C07D333/20 ,  C07D333/24 ,  C07D333/36 ,  C07D409/14 ,  C07D413/14 ,  C07D417/14 ,  C09B1/00 ,  C09B23/005 ,  C09B23/0058 ,  C09B23/14 ,  C09B57/008 ,  C09B69/008 ,  H01L51/0055 ,  H01L51/006 ,  H01L51/0061 ,  H01L51/0064 ,  H01L51/0068 ,  H01L51/0069 ,  H01L51/0072 ,  H01L51/0073 ,  H01L51/0085 ,  H01L51/50 ,  Y10S428/917

摘要： Disclosed is a novel group of compounds having a general structure of anthracene body substituted with at least one thiophenyl group, which can be further substituted with various substituent groups. These new compounds are generally compatible with organic electroluminescence. Also disclosed are organic electroluminescent devices and method of making the same. The organic electroluminescent devices include at least one of the compounds in various layers thereof. Organic electroluminescent devices employing the new compounds in their light-emitting layers show outstanding stability.

公开(公告)号：US20090241171A1

公开(公告)日：2009-09-24

申请号：US12439106

申请日：2007-08-29

申请人： John Sunwoo ,  Yong-Ki Son ,  Myoung-Hwan Oh ,  Hyun-Tae Jeong ,  Ji-Young Choi ,  Ji-Eun Kim ,  Hee-Joong Ahn ,  Jin-Ho Yoo ,  Bae-Sun Kim ,  Dong-Woo Lee ,  Ga-Gue Kim ,  Il-Yeon Cho ,  Dong-Won Han

发明人： John Sunwoo ,  Yong-Ki Son ,  Myoung-Hwan Oh ,  Hyun-Tae Jeong ,  Ji-Young Choi ,  Ji-Eun Kim ,  Hee-Joong Ahn ,  Jin-Ho Yoo ,  Bae-Sun Kim ,  Dong-Woo Lee ,  Ga-Gue Kim ,  Il-Yeon Cho ,  Dong-Won Han

IPC分类号： G06F15/16 ,  G06F21/00

CPC分类号： G06F3/017 ,  G06F1/163 ,  G06F3/011 ,  G06F21/32

摘要： A wearable system and a method for transferring and controlling information/service based on biologically generated information from a user are provided. In the method, an intuitive bio signal generated by a user is sensed and a device pointed by the sensed bio signal is selected. Then, bio signal information is created using the sensed bio signal and the generated bio signal information is transmitted to the selected device. After transmitting, the information/service is transferred to the selected device after confirming that the selected device that receives the bio signal information is activated.

摘要翻译： 提供了一种可穿戴系统和用于基于来自用户的生物信息产生的信息/服务的传送和控制的方法。 在该方法中，感测由用户生成的直观的生物信号，并且选择由感测的生物信号指向的装置。 然后，使用感测到的生物信号创建生物信号信息，并将所生成的生物信号信息发送到所选择的装置。 在发送之后，在确认接收到生物信号信息的所选设备被激活之后，信息/服务被传送到所选择的设备。