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公开(公告)号：US20190195469A1
公开(公告)日：2019-06-27
申请号：US16288586
申请日：2019-02-28
Applicant: NICHIA CORPORATION
Inventor： Motokazu YAMADA
IPC: F21V13/14 , F21V5/04 , F21V15/01 , F21V3/00 , F21V3/10 , F21V3/12 , F21V9/08 , F21V7/00 , F21V19/00
CPC classification number: F21V13/14 , F21V3/00 , F21V3/10 , F21V3/12 , F21V5/04 , F21V7/0083 , F21V7/22 , F21V9/08 , F21V9/30 , F21V15/01 , F21V19/005 , F21Y2113/13 , F21Y2115/10
Abstract: A light emitting device includes a base, light sources, wall portions, and a half mirror. The base has a light reflecting surface and has a first side on which the light reflecting surface is provided. The light sources are mounted on the first side of the base. Each of the wall portions surrounds each of the plurality of light sources. The half mirror is to reflect a part of incident light and to transmit another part of the incident light. The half mirror is disposed opposite to the base such that the light sources are provided between the half mirror and the base.
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公开(公告)号：US20190124733A1
公开(公告)日：2019-04-25
申请号：US16167387
申请日：2018-10-22
Applicant: NICHIA CORPORATION
Inventor： Motokazu YAMADA
Abstract: A light-emitting module includes: a base body including electrical conductor wirings; a light-emitting element disposed on the base body and electrically connected to the electrical conductor wirings; a light reflection film disposed on an upper surface of the light-emitting element; and a half mirror disposed on a light extraction surface side of the light-emitting element and spaced apart from the light-emitting element. A spectral reflectance of the half mirror under perpendicular incidence at a wavelength longer than a peak emission wavelength of a light emitted from the light-emitting element is greater than a spectral reflectance of the half mirror under perpendicular incidence at the peak emission wavelength.
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公开(公告)号：US20180040776A1
公开(公告)日：2018-02-08
申请号：US15784781
申请日：2017-10-16
Applicant: NICHIA CORPORATION
Inventor： Motokazu YAMADA , Mototaka INOBE , Kunihiro IZUNO
Abstract: A light emitting device includes a substrate, a light emitting element, a light reflecting resin member, a sealing member, an electrically conductive wiring and a lens member. The light reflecting resin member surrounds the light emitting element. The sealing member is disposed in a region surrounded by the light reflecting resin member. The electrically conductive wiring is arranged on an upper surface of the substrate such that the substrate includes an exposed region exposed from the electrically conductive wiring with at least a part of the exposed region of the substrate being embedded in the light reflecting resin member. The lens member is disposed above the light emitting element to reach an outer edge of the substrate. The lens member is in contact with an upper surface of the sealing member and an upper surface and an outer lateral surface of the light reflecting resin member.
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公开(公告)号：US20160343905A1
公开(公告)日：2016-11-24
申请号：US15175281
申请日：2016-06-07
Applicant: Nichia Corporation
Inventor： Isamu NIKI , Motokazu YAMADA , Masahiko SANO , Shuji SHIOJI
CPC classification number: H01L33/16 , H01L21/02378 , H01L21/0254 , H01L21/02647 , H01L33/007 , H01L33/20 , H01L33/22 , H01L33/24 , H01L33/26 , H01L33/32 , H01L2933/0083 , Y10T428/24355 , Y10T428/24479
Abstract: A semiconductor light emitting device including a substrate, an electrode and a light emitting region is provided. The substrate may have protruding portions formed in a repeating pattern on substantially an entire surface of the substrate while the rest of the surface may be substantially flat. The cross sections of the protruding portions taken along planes orthogonal to the surface of the substrate may be semi-circular in shape. The cross sections of the protruding portions may in alternative be convex in shape. A buffer layer and a GaN layer may be formed on the substrate.
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公开(公告)号：US20160190405A1
公开(公告)日：2016-06-30
申请号：US14968897
申请日：2015-12-15
Applicant: NICHIA CORPORATION
Inventor： Motokazu YAMADA , Yuichi YAMADA
IPC: H01L33/54 , H01L33/50 , H01L25/075 , H01L33/62 , H01L33/58
CPC classification number: H01L33/54 , H01L33/508 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/181 , H01L2924/00012 , H01L2924/00
Abstract: A light emitting device includes a base, at least one light emitting element, and a light transmissive sealing member. The base has a conductor wiring. The at least one light emitting element is mounted on the base. The at least one light emitting element is electrically connected to the conductor wiring. The light transmissive sealing member includes a light diffusion material. The light transmissive sealing member covers the at least one light emitting element. The light transmissive sealing member has a projection shape. The projection shape has a substantially circular bottom surface facing the base and a height in a light axis direction of the at least one light emitting element. The height is greater than a diameter of the substantially circular bottom surface.
Abstract translation: 发光器件包括基底，至少一个发光元件和透光密封元件。 底座有导线。 至少一个发光元件安装在基座上。 所述至少一个发光元件电连接到所述导体布线。 透光密封构件包括光漫射材料。 透光密封构件覆盖至少一个发光元件。 透光密封构件具有突出形状。 突起形状具有面向基部的大致圆形的底面和至少一个发光元件的光轴方向的高度。 高度大于基本圆形的底面的直径。
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Patent Agency Ranking
公开(公告)号：US20150179891A1
公开(公告)日：2015-06-25
申请号：US14610030
申请日：2015-01-30
Applicant: NICHIA CORPORATION
Inventor： Motokazu YAMADA , Mototaka INOBE , Kunihiro IZUNO
CPC classification number: H01L33/46 , H01L25/0753 , H01L25/167 , H01L33/486 , H01L33/56 , H01L33/60 , H01L33/62 , H01L2224/45144 , H01L2224/48137 , H01L2224/48465 , H01L2224/4945 , H01L2924/01322 , H01L2933/0025 , H01L2933/0033 , H01L2933/005 , H01L2933/0066 , H01L2924/00
Abstract: A method of manufacturing a light emitting device includes a first step of mounting a light emitting element on a substrate having a conductor wiring and electrically connecting the light emitting element with the conductor wiring, a second step of disposing a light reflecting resin which reflects light from the light emitting element to surround the light emitting element, and a third step of disposing a sealing member after hardening the light reflecting resin to cover the light emitting element.
Abstract translation: 一种制造发光器件的方法包括：将发光元件安装在具有导体布线的基板上并将发光元件与导体布线电连接的第一步骤;设置反射光的光反射树脂的第二步骤， 所述发光元件围绕所述发光元件，以及第三步骤，在硬化所述光反射树脂以覆盖所述发光元件之后设置密封构件。
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公开(公告)号：US20150034992A1
公开(公告)日：2015-02-05
申请号：US14517965
申请日：2014-10-20
Applicant: NICHIA CORPORATION
Inventor： Mototaka INOBE , Motokazu YAMADA , Kazuhiro KAMADA
CPC classification number: H01L33/60 , H01L25/0753 , H01L33/20 , H01L33/32 , H01L33/52 , H01L33/54 , H01L33/56 , H01L33/62 , H01L2224/45144 , H01L2224/48091 , H01L2224/48137 , H01L2224/48465 , H01L2224/8592 , H01L2924/01322 , H01L2924/181 , H01L2933/005 , H01L2933/0058 , H01L2933/0066 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
Abstract: A light emitting device includes a substrate, metallization, a light emitting element, conducting wire, light reflective resin, and insulating material. The metallization is provided on a surface of the substrate that is made of insulating substance. The light emitting element is mounted on the substrate. The conducting wire electrically connects the metallization and the light emitting element. The light reflective resin is provided on the substrate to reflect light from the light emitting element. The insulating material covers at least part of metallization surfaces. The insulating material is established to come in contact with a side of the light emitting element.
Abstract translation: 发光装置包括基板，金属化，发光元件，导线，光反射树脂和绝缘材料。 金属化被设置在由绝缘物质制成的基板的表面上。 发光元件安装在基板上。 导线将金属化和发光元件电连接。 光反射树脂设置在基板上以反射来自发光元件的光。 绝缘材料覆盖至少部分金属化表面。 建立绝缘材料以与发光元件的一侧接触。
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公开(公告)号：US20150001564A1
公开(公告)日：2015-01-01
申请号：US14317008
申请日：2014-06-27
Applicant: NICHIA CORPORATION
Inventor： Hiroki OGURO , Motokazu YAMADA , Yasuo FUJIKAWA
CPC classification number: H01L33/60 , H01L33/48 , H01L33/50 , H01L33/505 , H01L2224/73204
Abstract: Provided is a light emitting device in which deterioration of the substrate member can be reduced. The light emitting device includes a base member mainly made of a resin, a plurality of wiring portions and arranged on the base member via an adhesive agent, a groove portion defined between adjacent wiring portions, and at least one light emitting element which is disposed straddling at least a part of the groove portion. The adhesive agent is applied covering the base member from the groove portion, and contains a light-shielding member. The light-shielding member shields the base member from light, for example at a specific wavelength, emitted from the at least one light emitting element.
Abstract translation: 提供了能够降低基板部件的劣化的发光装置。 发光装置包括主要由树脂制成的基底构件，多个布线部分，并且经由粘合剂布置在基底构件上，限定在相邻布线部分之间的凹槽部分和至少一个跨越的布置的发光元件 凹槽部分的至少一部分。 涂敷粘合剂从凹槽部分覆盖基底构件，并且包含遮光构件。 光屏蔽构件将基体部件从例如从至少一个发光元件发射的特定波长的光屏蔽。
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公开(公告)号：US20140021506A1
公开(公告)日：2014-01-23
申请号：US13944982
申请日：2013-07-18
Applicant: NICHIA CORPORATION
Inventor： Motokazu YAMADA
IPC: H01L33/52
CPC classification number: H01L33/52 , H01L33/38 , H01L33/62 , H01L2224/13 , H01L2224/73204 , H01L2933/005 , H01L2933/0066
Abstract: A light emitting device includes a support member, a light emitting element, and an underfill material. The support member includes an insulating member and positive and negative electrically conductive wirings arranged on the insulating member. The electrically conductive wirings are insulated and separated from each other by an insulating region arranged between the positive and negative electrically conductive wirings. The insulating separation region includes a first region disposed on an outer side with respect to the light emitting element and a second region disposed directly under the light emitting element. The first region includes an underfill arranging portion in which an interval between the electrically conductive wirings is wider than in the second region. The underfill material is arranged to extend from the underfill arranging portion to the second region in a space formed between the support member and the light emitting element.
Abstract translation: 发光器件包括支撑构件，发光元件和底部填充材料。 支撑构件包括布置在绝缘构件上的绝缘构件和正和负导电布线。 导电布线通过布置在正导电布线和负导电布线之间的绝缘区域彼此绝缘和分离。 绝缘分离区域包括相对于发光元件设置在外侧的第一区域和设置在发光元件正下方的第二区域。 第一区域包括底部填充布置部分，其中导电布线之间的间隔比第二区域宽。 底部填充材料布置成在形成在支撑构件和发光元件之间的空间中从底部填充部分延伸到第二区域。
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90.发明申请公开(公告)号：US20130146892A1
公开(公告)日：2013-06-13
申请号：US13759892
申请日：2013-02-05
Applicant: Nichia Corporation
Inventor： Shunsuke MINATO , Junya NARITA , Yohei WAKAI , Yukio NARUKAWA , Motokazu YAMADA
IPC: H01L33/32
CPC classification number: H01L33/24 , H01L33/10 , H01L33/20 , H01L33/32 , H01L2224/48095 , H01L2224/48247 , H01L2224/48465 , H01L2924/01012 , H01L2924/01019 , H01L2924/0102 , H01L2924/01046 , H01L2924/01057 , H01L2924/01063 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/00
Abstract: A light emitting element having a recess-protrusion structure on a substrate is provided. A semiconductor light emitting element 100 has a light emitting structure of a semiconductor 20 on a first main surface of a substrate 10. The first main surface of the substrate 10 has substrate protrusion portion 11, the bottom surface 14 of each protrusion is wider than the top surface 13 thereof in a cross-section, or the top surface 13 is included in the bottom surface 14 in a top view of the substrate. The bottom surface 14 has an approximately polygonal shape, and the top surface 13 has an approximately circular or polygonal shape with more sides than that of the bottom surface 14.
Abstract translation: 提供了在基板上具有凹凸结构的发光元件。 半导体发光元件100在基板10的第一主表面上具有半导体20的发光结构。基板10的第一主表面具有基板突出部11，每个突起的底表面14比 顶表面13处于横截面，或者顶表面13以衬底的顶视图包括在底表面14中。 底面14具有近似多边形的形状，并且顶面13具有大致圆形或多边形形状，其侧面比底面14多。
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