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81.发明申请公开(公告)号：US20160300820A1
公开(公告)日：2016-10-13
申请号：US15100559
申请日：2015-01-13
Applicant: OSRAM OPTO SEMICONDUCTORS GMBH
Inventor： Matthias Sabathil , Frank Singer , Roland Hüttinger
IPC: H01L25/075 , H01L33/50 , H01L33/00 , H01L33/56
CPC classification number: H01L25/0753 , F21K9/90 , F21Y2103/10 , F21Y2115/10 , H01L24/29 , H01L24/32 , H01L24/83 , H01L24/97 , H01L33/0095 , H01L33/502 , H01L33/56 , H01L33/58 , H01L2224/291 , H01L2224/2919 , H01L2224/32227 , H01L2224/83801 , H01L2224/83851 , H01L2224/97 , H01L2924/15159 , H01L2933/0041 , H01L2933/005 , H01L2933/0091 , H01L2924/014 , H01L2924/00014 , H01L2924/0781 , H01L2224/83
Abstract: A method for producing optoelectronic semiconductor components and an optoelectronic semiconductor component are disclosed. In an embodiment the method includes: A) creating a blank by pultrusion from a glass melt, B) shaping the blank into a billet-shaped optical element with a longitudinal axis, the optical element having a mounting side and a light outlet side, C) producing conductor tracks on the mounting side, D) mounting a plurality of optoelectronic semiconductor chips on the mounting side of the optical element and connecting them to the conductor tracks and E) separating the optical element into the optoelectronic semiconductor components, wherein each optoelectronic semiconductor component comprises at least two of the semiconductor chips, and wherein at least steps A) to D) are performed in the stated sequence.
Abstract translation: 公开了一种用于制造光电子半导体部件和光电半导体部件的方法。 在一个实施方案中，该方法包括：A）通过拉挤成型从玻璃熔体产生坯料，B）将坯料成型为具有纵向轴线的坯形光学元件，所述光学元件具有安装侧和光出口侧，C ）在安装侧产生导体轨道，D）将多个光电子半导体芯片安装在光学元件的安装侧并将它们连接到导体轨道，以及E）将光学元件分离成光电子半导体部件，其中每个光电子半导体 组件包括至少两个半导体芯片，并且其中至少步骤A）至D）以所述顺序执行。
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82.发明申请公开(公告)号：US20160225964A1
公开(公告)日：2016-08-04
申请号：US15022535
申请日：2014-08-25
Applicant: OSRAM OPTO SEMICONDUCTORS GMBH
Inventor： Thomas Schwarz , Frank Singer , Jürgen Moosburger
CPC classification number: H01L33/54 , H01L21/568 , H01L33/0095 , H01L33/486 , H01L33/52 , H01L33/62 , H01L2224/04105 , H01L2224/19 , H01L2224/2518 , H01L2224/82 , H01L2224/96 , H01L2924/1815 , H01L2933/0033 , H01L2933/005 , H01L2933/0066
Abstract: An optoelectronic semiconductor component includes an optoelectronic semiconductor that is partly embedded into a shaped body, which is formed from a molding compound that at least partly covers at least two lateral faces and the rear surface of the optoelectronic semiconductor chip. A first contact layer and a second contact layer are arranged on the shaped body and are electrically connected to the optoelectronic semiconductor chip. A mounting face is arranged transversely in relation to the radiation passage face and is provided for mounting the optoelectronic semiconductor component.
Abstract translation: 光电子半导体部件包括部分地嵌入到成形体中的光电子半导体，其由至少部分地覆盖光电子半导体芯片的至少两个侧面和后表面的模制化合物形成。 第一接触层和第二接触层布置在成形体上并与光电子半导体芯片电连接。 安装面相对于辐射通道面横向布置，并且用于安装光电子半导体部件。
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83.发明申请公开(公告)号：US20160087177A1
公开(公告)日：2016-03-24
申请号：US14888770
申请日：2014-05-05
Applicant: OSRAM OPTO SEMICONDUCTORS GMBH
Inventor： Thomas Schwarz , Frank Singer , Alexander Linkov , Stefan Illek , Wolfgang Mönch
CPC classification number: H01L33/62 , H01L24/24 , H01L25/0753 , H01L33/0095 , H01L33/46 , H01L33/486 , H01L33/54 , H01L33/58 , H01L33/60 , H01L2224/32245 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2224/48471 , H01L2224/48479 , H01L2224/49107 , H01L2224/73265 , H01L2924/00014 , H01L2924/12035 , H01L2924/12041 , H01L2933/0058 , H01L2933/0066 , H01L2924/00 , H01L2224/4554
Abstract: A radiation-emitting semiconductor device includes at least one semiconductor chip having a semiconductor layer sequence having an active region that produces radiation; a mounting surface on which at least one electrical contact for external contacting of the semiconductor chip is formed, wherein the mounting surface runs parallel to a main extension plane of the semiconductor layer sequence; a radiation exit surface running at an angle to or perpendicularly to the mounting surface; a radiation-guiding layer arranged in a beam path between the semiconductor chip and the radiation exit surface; and a reflector body adjacent to the radiation-guiding layer in regions and in a top view of the semiconductor device covers the semiconductor chip.
Abstract translation: 辐射发射半导体器件包括至少一个具有半导体层序列的半导体芯片，该半导体层序列具有产生辐射的有源区; 其上形成有用于半导体芯片外部接触的至少一个电触点的安装表面，其中所述安装表面平行于所述半导体层序列的主延伸平面延伸; 辐射出口表面以与安装表面成角度或垂直于该安装表面延伸; 布置在半导体芯片和辐射出射表面之间的光束路径中的辐射引导层; 并且在半导体器件的区域和顶视图中与辐射引导层相邻的反射器体覆盖半导体芯片。
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公开(公告)号：US20150167938A1
公开(公告)日：2015-06-18
申请号：US14418924
申请日：2013-07-03
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Stefan Groetsch , Frank Singer
CPC classification number: F21V19/0015 , F21S41/147 , F21S41/19 , F21S43/14 , F21S43/19 , F21S45/47 , F21V29/70 , H01L25/0753 , H01L33/486 , H01L2224/48 , H01L2924/0002 , Y10T29/41 , H01L2924/00
Abstract: A method for producing an illuminant is specified, in which a positioning device (3) holds an optoelectronic semiconductor component (1) inside a tolerance range (4) on the upper side of a connection carrier (2) during the mechanical fixation and electrical connecting of the optoelectronic semiconductor component (1) to the connection carrier (2).
Abstract translation: 规定了用于制造发光体的方法，其中定位装置（3）在机械固定和电连接期间将光电子半导体部件（1）保持在连接载体（2）的上侧的公差范围（4）内 的光电子半导体部件（1）连接到连接载体（2）。
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85.发明申请公开(公告)号：US20150070914A1
公开(公告)日：2015-03-12
申请号：US14484069
申请日：2014-09-11
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Walter Wegleiter , Andreas Plößl , Frank Singer
CPC classification number: F21V17/105 , F21K9/90 , F21V19/003 , F21V21/096 , F21V29/89 , F21Y2101/00 , F21Y2115/10 , Y10T29/4913
Abstract: An optoelectronic lighting device includes a lighting module with an optoelectronic semiconductor chip. A connection carrier has a first main surface and a second main surface facing away from the first main surface. The lighting module is arranged on the first main surface of the connection carrier, and the connection carrier adheres to a heat sink on account of a magnetic attraction.
Abstract translation: 光电照明装置包括具有光电半导体芯片的照明模块。 连接托架具有第一主表面和远离第一主表面的第二主表面。 照明模块布置在连接托架的第一主表面上，并且连接托架由于吸引力而附着在散热器上。
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Patent Agency Ranking
公开(公告)号：US20140231837A1
公开(公告)日：2014-08-21
申请号：US14346687
申请日：2012-09-21
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Frank Singer , Michael Zitzlsperger , Stefan Groetsch
IPC: H01L25/075 , H01L33/62 , F21S8/10 , H01L33/64
CPC classification number: H01L25/0753 , F21S41/141 , H01L24/73 , H01L33/62 , H01L33/64 , H01L33/642 , H01L2224/32245 , H01L2224/48247 , H01L2224/48471 , H01L2224/48479 , H01L2224/73265 , H01L2924/00014 , H01L2924/19107 , H01L2224/48227 , H01L2924/00 , H01L2924/00012 , H01L2224/4554
Abstract: An LED module has an electrically insulating main body, a base surface and a mounting surface located opposite the base surface. A number of electrical connection contacts are arranged at the mounting surface. The connection contacts do not adjoin the base surface. A heat sink is arranged in the main body. The heat sink extends from the mounting surface as far as the base surface. Furthermore, the LED module has a number of LED chips, each having an electrically insulating carrier substrate at a chip underside and two chip contacts at a chip top side. The LED chips are arranged with the electrically insulating carrier substrate on the heat sink.
Abstract translation: LED模块具有电绝缘主体，基面和与基面相对的安装面。 多个电连接触点设置在安装表面。 连接触点不与基面相邻。 散热器布置在主体中。 散热片从安装表面延伸到基面最远处。 此外，LED模块具有多个LED芯片，每个LED芯片在芯片下侧具有电绝缘载体基板，在芯片顶侧具有两个芯片触点。 LED芯片布置有散热器上的电绝缘载体衬底。
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公开(公告)号：US11984435B2
公开(公告)日：2024-05-14
申请号：US17289114
申请日：2019-11-08
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Thomas Schwarz , Frank Singer
IPC: H01L25/075 , H01L33/10 , H01L33/58 , H01L33/62
CPC classification number: H01L25/0753 , H01L33/10 , H01L33/58 , H01L33/62
Abstract: A multi-pixel display device with an integrated circuit, a plurality of light-emitting semiconductor chips disposed on the integrated circuit, a display area having a plurality of pixels, each of the light-emitting semiconductor chips being associated with one of the pixels, a light-directing element disposed between the plurality of light-emitting semiconductor chips and the display area and adapted to direct the light of each light-emitting semiconductor chip from the plurality of light-emitting semiconductor chips to its associated pixel.
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公开(公告)号：US11480723B2
公开(公告)日：2022-10-25
申请号：US17475030
申请日：2021-09-14
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Peter Brick , Jean-Jacques Drolet , Hubert Halbritter , Laura Kreiner , Thomas Schwarz , Tilman Ruegheimer , Frank Singer
IPC: F21V8/00 , G02B27/01 , H01L25/075
Abstract: The invention relates to various aspects of a μ-LED or a μ-LED array for augmented reality or lighting applications, in particular in the automotive field. The μ-LED is characterized by particularly small dimensions in the range of a few μm.
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公开(公告)号：US11156759B2
公开(公告)日：2021-10-26
申请号：US17039422
申请日：2020-09-30
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Peter Brick , Jean-Jacques Drolet , Hubert Halbritter , Laura Kreiner , Thomas Schwarz , Tilman Ruegheimer , Frank Singer
IPC: F21V8/00 , G02B27/01 , H01L25/075
Abstract: The invention relates to various aspects of a μ-LED or a μ-LED array for augmented reality or lighting applications, in particular in the automotive field. The μ-LED is characterized by particularly small dimensions in the range of a few μm.
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90.发明授权公开(公告)号：US11152423B2
公开(公告)日：2021-10-19
申请号：US16098283
申请日：2017-05-11
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Peter Brick , Matthias Sabathil , Frank Singer , Thomas Schwarz
IPC: H01L27/15 , H01L25/075 , H01L33/58 , H01L33/08 , H01L33/62
Abstract: An optical assembly and a display device are disclosed. In an embodiment an optical assembly includes a common carrier, a plurality of first chip groups, each first chip group comprising at least two similar luminescence diode chips, a plurality of second chip groups, each second chip group comprising at least two similar luminescence diode chips, wherein the first and second chip groups are arranged planar along a regular grid of first unit cells on a main surface of the common carrier and an optical element arranged downstream of the first and second chip groups with respect to a main radiation direction, wherein the luminescence diode chips of the different chip groups are configured to emit electromagnetic radiation of different wavelength characteristics.
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