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    Electrical connector for connecting electrical units, electrical device, and production method for producing electrical device
    81.
    发明申请
    Electrical connector for connecting electrical units, electrical device, and production method for producing electrical device 失效
    用于连接电气设备的电气连接器，电气设备和用于生产电气设备的生产方法

    公开(公告)号：US20050033125A1

    公开(公告)日：2005-02-10

    申请号：US10897465

    申请日：2004-07-23

    Applicant: Nagao Miyazaki ,  Yoshihiko Suzuki

    Inventor： Nagao Miyazaki ,  Yoshihiko Suzuki

    IPC: H01R4/04 ,  H01R13/66 ,  H05K1/00 ,  H05K1/14 ,  H05K3/32 ,  A61B5/05

    CPC classification number: H05K1/14 ,  H01R4/04 ,  H01R12/52 ,  H01R13/6683 ,  H05K1/0284 ,  H05K1/142 ,  H05K1/144 ,  H05K3/321 ,  H05K2201/0224 ,  H05K2201/09963 ,  H05K2203/0278

    Abstract: In a construction for electrically connecting electrical unit with joint surfaces thereof opposed to each other, wiring patterns electrically connected with distortion gauges are formed on function-element forming surfaces of each electrical three-dimensional unit and are extended to edge portions formed between the function-element forming surfaces and adjacent wiring surfaces as the joint surfaces to form first lands; second lands extending from the edge portions by a specified distance are formed at positions of the wiring surfaces corresponding to the first lands; and electrical connectors displaying a joining performance upon being pressed together are formed to bridge the first and second lands while being held in close contact with the first and second lands. A plurality of three-dimensional electrical unit can be securely and easily electrically connected with each other with high precision.

    Abstract translation: 在将电气单元与其相对的接合面电连接的结构中，在每个电三维单元的功能元件形成表面上形成与变形量规电连接的布线图案，并延伸到形成在功能元件之间的边缘部分， 元件形成表面和相邻布线表面作为接合表面以形成第一焊盘; 在与第一焊盘对应的布线面的位置处形成从边缘部延伸规定距离的第二焊盘; 并且形成在被压在一起时显示接合性能的电连接器，以在与第一和第二焊盘保持紧密接触的同时桥接第一和第二焊盘。 多个三维电气单元可以以高精度牢固且容易地彼此电连接。

    Fine conductive particles for making anisotropic conductive adhesive composition
    82.
    发明授权
    Fine conductive particles for making anisotropic conductive adhesive composition 有权
    用于制造各向异性导电粘合剂组合物的细小导电颗粒

    公开(公告)号：US06841094B2

    公开(公告)日：2005-01-11

    申请号：US10246460

    申请日：2002-09-19

    Applicant: Hsun-Tien Li ,  Shu-Chen Huang ,  Kai-Chi Chen

    Inventor： Hsun-Tien Li ,  Shu-Chen Huang ,  Kai-Chi Chen

    IPC: H01B1/22 ,  H05K3/32

    CPC classification number: H01B1/22 ,  H05K3/323 ,  H05K2201/0224 ,  Y10T428/2995

    Abstract: Fine conductive particles are composed of metallic conductive powder, and an insulating organic capping layer on the grains of the powder. The metallic conductive powder have grains with a diameter ranging from 1 to 20 microns, and the capping layer has a thickness of 50-400 nm, which is able to flow by thermo-pressing. The insulating organic capping layer is prepared from a silane having a reactive functionality, a fluorine-containing silane and a compound or a resin having a functionality able to reactive with the reactive functionality.

    Abstract translation: 细导电颗粒由金属导电粉末和粉末颗粒上的绝缘有机覆盖层组成。 金属导电粉末具有直径范围为1至20微米的晶粒，并且覆盖层具有50-400nm的厚度，其能够通过热压而流动。 绝缘有机覆盖层由具有反应性官能团的硅烷，含氟硅烷和具有能够与反应性官能团反应的官能团的化合物或树脂制备。

    Direct application voltage variable material, components thereof and devices employing same
    84.
    发明申请
    Direct application voltage variable material, components thereof and devices employing same 有权
    直接施加电压可变材料，其组件和使用其的装置

    公开(公告)号：US20040201941A1

    公开(公告)日：2004-10-14

    申请号：US10746020

    申请日：2003-12-23

    Inventor： Edwin James Harris ,  Tushar Vyas ,  Stephen J. Whitney

    IPC: H02H001/00

    CPC classification number: H01L23/62 ,  H01C17/06513 ,  H01C17/06553 ,  H01C17/0656 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/12044 ,  H01L2924/3011 ,  H02H9/044 ,  H05K1/0257 ,  H05K1/0298 ,  H05K1/167 ,  H05K2201/0224 ,  H05K2201/0272 ,  H05K2201/0738 ,  H01L2924/00

    Abstract: A voltage variable material (nullVVMnull) including an insulative binder that is formulated to intrinsically adhere to conductive and non-conductive surfaces is provided. The binder and thus the VVM is self-curable and applicable in a spreadable form that dries before use. The binder eliminates the need to place the VVM in a separate device or to provide separate printed circuit board pads on which to electrically connect the VVM. The binder and thus the VVM can be directly applied to many different types of substrates, such as a rigid (FR-4) laminate, a polyimide or a polymer. The VVM can also be directly applied to different types of substrates that are placed inside a device. In one embodiment, the VVM includes doped semiconductive particles having a core, such which can be silicon, and an inert coating, which can be an oxide. The particles are mixed in the binder with conductive particles.

    Abstract translation: 提供了包括被配制为固有地粘附到导电和非导电表面的绝缘粘合剂的电压可变材料（“VVM”）。 粘合剂，因此VVM是可自我修复的，并且可以在使用前干燥的可涂抹形式使用。 粘合剂消除了将VVM放置在单独的装置中的需要，或者提供用于电连接VVM的单独的印刷电路板焊盘。 粘合剂，因此VVM可以直接应用于许多不同类型的基材，例如刚性（FR-4）层压材料，聚酰亚胺或聚合物。 VVM也可以直接应用于放置在设备内部的不同类型的基板。 在一个实施例中，VVM包括具有芯的掺杂的半导体颗粒，其可以是硅，以及可以是氧化物的惰性涂层。 颗粒在粘合剂中与导电颗粒混合。

    Electrically connecting structure
    85.
    发明授权
    Electrically connecting structure 失效
    电连接结构

    公开(公告)号：US5586892A

    公开(公告)日：1996-12-24

    申请号：US397919

    申请日：1995-03-03

    Applicant: Minoru Sato

    Inventor： Minoru Sato

    IPC: C09J9/02 ,  C09J11/04 ,  H01B1/00 ,  H01B1/20 ,  H01B5/16 ,  H01R4/04 ,  H01R11/01 ,  H05K3/32

    CPC classification number: H01R4/04 ,  H05K3/323 ,  H01L2224/2929 ,  H01L2224/29324 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/2936 ,  H01L2224/29399 ,  H01L2224/2949 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/07811 ,  H05K2201/0129 ,  H05K2201/0224 ,  H05K2201/0272 ,  H05K2201/10674

    Abstract: An electrically connecting structure including a first electronic part having a first connecting terminal, a second electronic part having a second connecting terminal which is arranged to face the first connecting terminal of the first electronic part, and an anisotropic conductive adhesive arranged between the first connecting terminal and the second connecting terminal. The anisotropic conductive adhesive includes an insulating adhesive, a plurality of first conductive particles which are covered with an insulating layer, and a plurality of second conductive particles which are not covered with any material. The first conductive particles and the second conductive particles have substantially the same size. Portions of the insulating layer covering the first conductive particles are brought into contact with the first connecting terminal and the second connecting terminal, and are broken away, under a force which is applied to the first connecting terminal and the second connecting terminal, so that the first conductive particles are brought into contact with the first connecting terminal and the second connecting terminal. The second conductive particles are brought into contact with the first connecting terminal and the second connecting terminal under the force which is applied to the first connecting terminal and the second connecting terminal, and the first connecting terminal and the second connecting terminal are electrically connected to each other through the first conductive particles and the second conductive particles.

    Abstract translation: 一种电连接结构，包括具有第一连接端子的第一电子部件，具有与第一电子部件的第一连接端子相对的第二连接端子的第二电子部件和布置在第一连接端子之间的各向异性导电粘合剂 和第二连接端子。 各向异性导电粘合剂包括绝缘粘合剂，被绝缘层覆盖的多个第一导电颗粒以及未被任何材料覆盖的多个第二导电颗粒。 第一导电颗粒和第二导电颗粒具有基本上相同的尺寸。 覆盖第一导电颗粒的绝缘层的部分与第一连接端子和第二连接端子接触，并且在施加到第一连接端子和第二连接端子的力的作用下被分离，使得 第一导电粒子与第一连接端子和第二连接端子接触。 在施加到第一连接端子和第二连接端子的力下，第二导电粒子与第一连接端子和第二连接端子接触，第一连接端子和第二连接端子电连接到每个 另一个通过第一导电颗粒和第二导电颗粒。

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