公开(公告)号：US4954874A

公开(公告)日：1990-09-04

申请号：US529936

申请日：1983-09-08

申请人： Yasuaki Miura

发明人： Yasuaki Miura

IPC分类号： C03C3/062 ,  C03C3/32 ,  H01L23/057 ,  H01L23/10

CPC分类号： H01L23/10 ,  H01L23/057 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/01322 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/16195

摘要： A semiconductor device includes a package hermetically sealed with a chalcogenide-based glass sealing agent. A semiconductor element is housed within the package, and the respective electrodes of the semiconductor element are connected through bonding wires to leads extending to the outside of the package.

摘要翻译： 半导体器件包括用硫族化物基玻璃密封剂密封的封装。 半导体元件容纳在封装内，并且半导体元件的各个电极通过接合线连接到延伸到封装外部的引线。

公开(公告)号：US4939316A

公开(公告)日：1990-07-03

申请号：US253639

申请日：1988-10-05

申请人： Deepak Mahulikar ,  James M. Popplewell

发明人： Deepak Mahulikar ,  James M. Popplewell

IPC分类号： H01L23/02 ,  C25D11/04 ,  H01L23/057 ,  H01L23/06 ,  H01L23/10 ,  H01L23/14

CPC分类号： H01L23/06 ,  H01L23/057 ,  H01L23/10 ,  H01L23/142 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/01025 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/16152 ,  H01L2924/16195 ,  Y10T29/49121

摘要： The present invention relates to a package adapted to house an electronic device, such as a semiconductor integrated circuit. The package components are comprised of aluminum or an aluminum based alloy. At least a portion of the surfaces of the package components are anodized to enhance corrosion resistance and increase bond strength. The aluminum based packages are characterized by lighter weight than copper based packages and better thermal conductivity than plastic based packages.

摘要翻译： 本发明涉及一种适于容纳诸如半导体集成电路的电子设备的封装。 包装部件由铝或铝基合金构成。 包装部件的表面的至少一部分被阳极化以增强耐腐蚀性并增加粘结强度。 基于铝的包装的特征在于比基于铜的包装更轻的重量，并且比基于塑料的包装具有更好的导热性。

公开(公告)号：US4926238A

公开(公告)日：1990-05-15

申请号：US252701

申请日：1988-09-30

申请人： Kiichiro Mukai ,  Atsushi Saiki ,  Seiki Harada

发明人： Kiichiro Mukai ,  Atsushi Saiki ,  Seiki Harada

IPC分类号： H01L23/32 ,  H01L21/312 ,  H01L23/057 ,  H01L23/10 ,  H01L23/29 ,  H01L23/31 ,  H01L23/556

CPC分类号： H01L24/50 ,  H01L21/312 ,  H01L23/057 ,  H01L23/10 ,  H01L23/293 ,  H01L23/3171 ,  H01L23/556 ,  H01L24/05 ,  H01L2224/02166 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05556 ,  H01L2224/13144 ,  H01L2224/48095 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01021 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01061 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01092 ,  H01L2924/01322 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/16195

摘要： A semiconductor device wherein a coating film which is made of a polyimide resin or a polyimide isoindoloquinazolinedione resin and which is at least 10 .mu.m thick is disposed on at least an active region of a semiconductor substrate, and the resultant semiconductor substrate is encapsulated in a ceramic package. The semiconductor device has troubles relieved conspicuously, the troubles being ascribable to alpha-rays which come flying from impurities contained in the material of the package.

摘要翻译： 在半导体衬底的至少有源区上设置半导体装置，其中由聚酰亚胺树脂或聚酰亚胺异吲哚并唑并二酮树脂制成并且至少10μm厚的涂膜，并将所得半导体衬底封装在 陶瓷包装。 半导体器件明显地消除了麻烦，这些麻烦归因于包含在包装材料中的杂质所产生的α射线。

公开(公告)号：US4916522A

公开(公告)日：1990-04-10

申请号：US184214

申请日：1988-04-21

申请人： Charles Cohn

发明人： Charles Cohn

IPC分类号： H01L23/28 ,  H01L23/057 ,  H01L23/24

CPC分类号： H01L23/24 ,  H01L23/057 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/181

摘要： An integrated circuit package uses an encapsulant frame which prevents the encapsulant used to seal the integrated circuit chip from the ambient atmosphere from flowing to unwanted areas and to permit the encapsulant to be deposited with a controllable depth.

公开(公告)号：US4910584A

公开(公告)日：1990-03-20

申请号：US235815

申请日：1988-08-23

申请人： Masahiko Mizuo

发明人： Masahiko Mizuo

IPC分类号： H01L23/34 ,  H01L21/52 ,  H01L23/057 ,  H01L23/15 ,  H01L23/36 ,  H01L23/495 ,  H01L23/498 ,  H05K1/02 ,  H05K3/34

CPC分类号： H01L23/057 ,  H01L23/15 ,  H01L23/36 ,  H01L23/49555 ,  H01L23/49805 ,  H01L23/49811 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2924/01079 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/16195 ,  H05K1/0201 ,  H05K3/3421

摘要： A semiconductor device including a semiconductor chip, a leadless chip carrier to one side of which the chip is adhered, and a cap which seals the leadless chip carrier to protect the semiconductor chip. A heat sinking plate (21a or 21b) which is electrically connected to the semiconductor chip (8) is provided on the opposite side of the leadless chip carrier (1).

摘要翻译： 一种包括半导体芯片的半导体器件，其一侧粘附芯片的无引线芯片载体，以及密封无引线芯片载体以保护半导体芯片的盖。 在无引线芯片载体（1）的相对侧设置与半导体芯片（8）电连接的散热板（21a或21b）。

公开(公告)号：US4905075A

公开(公告)日：1990-02-27

申请号：US287767

申请日：1988-12-21

申请人： Victor A. K. Temple ,  Alexander J. Yerman

发明人： Victor A. K. Temple ,  Alexander J. Yerman

IPC分类号： G02B6/42 ,  H01L23/057 ,  H01L23/08 ,  H01L25/07

CPC分类号： H01L23/057 ,  G02B6/4204 ,  G02B6/4295 ,  H01L23/08 ,  H01L24/49 ,  H01L25/072 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4911 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/1301 ,  H01L2924/14 ,  H01L2924/16195 ,  H01L2924/19107 ,  H01L2924/351 ,  Y10S257/905

摘要： A semiconductor hermetic package for semiconductor device comprises base, sidewall and cover members. Signals can be coupled between the enclosed devices and external devices by coupling means including conductive regions disposed in and through the package. Light pipes or conductive tracks and paths extending through the package can be used to couple the signals. A portion of the package can function as a grading resistance.

摘要翻译： 用于半导体器件的半导体密封封装包括基底，侧壁和盖构件。 信号可以通过耦合装置连接在封闭装置和外部装置之间，该装置包括布置在包装中并通过封装的导电区域。 可以使用光管或延伸穿过封装的导电轨道和路径来耦合信号。 包装的一部分可用作耐分级性。

公开(公告)号：US4903120A

公开(公告)日：1990-02-20

申请号：US801177

申请日：1985-11-22

申请人： Gary L. Beene ,  Thomas D. Petrovich ,  Charles E. Williams

发明人： Gary L. Beene ,  Thomas D. Petrovich ,  Charles E. Williams

IPC分类号： H01L21/60 ,  H01L23/04 ,  H01L23/057 ,  H01L23/12 ,  H01L23/498 ,  H01L25/04 ,  H01L25/18

CPC分类号： H01L23/49827 ,  H01L23/04 ,  H01L23/057 ,  H01L2224/48091 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/14

摘要： A chip carrier with multiple through hole vias in its hermetic sealing lid. One or more chips is mounted on the inner surface of that lid. The lid contains multiple through vias, and the semiconductor chip on the inner surface of the lid is bonded to the vias in the lid by TAB strips or (optionally) by wire bonds. The vias in the lid connect these leads through to contacts on the outer surface of the package. These contacts can than be connected to (using interconnect structures such as TAB strips, or printed wiring boards, or discretionary wiring), to provide circuit interconnection. Preferably low-power-dissipation chips are mounted on the inner surface of the lid in this fashion, with higher-power-dissipation chips mounted on the bottom surface of the chip cavity.

摘要翻译： 在其密封盖中具有多个通孔通孔的芯片载体。 一个或多个芯片安装在该盖的内表面上。 盖子包含多个通孔，盖子的内表面上的半导体芯片通过TAB条或（可选地）通过引线键合到盖子中的通孔上。 盖子中的通孔将这些引线连接到包装外表面上的触点。 这些触点可以连接到（使用诸如TAB条或印刷电路板之间的互连结构或任意布线），以提供电路互连。 优选地，以这种方式将低功耗芯片安装在盖的内表面上，其中较高功率耗散的芯片安装在芯片腔的底表面上。

公开(公告)号：US4879588A

公开(公告)日：1989-11-07

申请号：US145068

申请日：1988-01-19

申请人： Akira Ohtsuka ,  Tomoji Goto ,  Masao Ida

发明人： Akira Ohtsuka ,  Tomoji Goto ,  Masao Ida

IPC分类号： H01L23/08 ,  H01L23/02 ,  H01L23/04 ,  H01L23/057 ,  H01L23/12 ,  H01L23/498 ,  H01L23/50 ,  H01L23/66

CPC分类号： H01L23/66 ,  H01L23/057 ,  H01L23/49822 ,  H01L2924/0002 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/13063 ,  H01L2924/3011

摘要： An improved integrated circuit package of the MLCP type suitable for use both at high operating frequencies and with chips dissipating large amounts of power. Electric power supplying wirings and signal transmitting wirings are disposed on entirely separate surfaces, the power transmitting wirings being formed on entire peripheries of respective, dedicated ceramic plates. Termination resistors for the signal wirings though are formed on the same ceramic plates which contain the power supplying wirings.

公开(公告)号：US4876588A

公开(公告)日：1989-10-24

申请号：US244940

申请日：1988-09-15

申请人： Takashi Miyamoto

发明人： Takashi Miyamoto

IPC分类号： H01L23/40 ,  H01L23/057 ,  H01L23/10 ,  H01L23/34 ,  H01L23/36

CPC分类号： H01L23/36 ,  H01L23/057 ,  H01L23/10 ,  H01L2224/32188 ,  H01L2224/48091 ,  H01L2224/49109 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15312 ,  H01L2924/1532 ,  H01L2924/16195

摘要： A semiconductor device in which a heat-radiator is bonded by a resin film to a metal plate constituting a part of a package is disclosed. Gold plating layers are employed in bonding pads, outer leads and the die bonding portion of the package. However, from the surface of the metal plate to which the resin film is adhered, the gold plating layer is removed or excluded, and the resin film is adhered to an underlying nickel plating layer.

摘要翻译： 公开了一种半导体器件，其中散热器通过树脂膜结合到构成封装的一部分的金属板。 镀金层用于封装的焊盘，外引线和裸片焊接部分。 然而，从附着有树脂膜的金属板的表面除去或排除镀金层，将树脂膜附着在下面的镀镍层上。

公开(公告)号：US4857988A

公开(公告)日：1989-08-15

申请号：US153979

申请日：1988-02-09

申请人： Stanley A. Fottler

发明人： Stanley A. Fottler

IPC分类号： H01L23/057 ,  H01L23/10 ,  H01L23/13

CPC分类号： H01L23/057 ,  H01L23/10 ,  H01L23/13 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15157 ,  H01L2924/15165 ,  H01L2924/15787

摘要： A semiconductor chip carrier having a ceramic base with a cavity for carrying a semiconductor chip and a cap for sealing the chip within the cavity. The base has a metallization pattern covering the chip contacts on the base and an outer contact castellated ring providing for the flow of excess solder away from the contact area.

摘要翻译： 一种具有陶瓷基座的半导体芯片载体，其具有用于承载半导体芯片的空腔和用于将该芯片密封在空腔内的盖。 底座具有覆盖基座上的芯片触头的金属化图案和外部接触的冕口环，其提供过量焊料远离接触区域的流动。