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公开(公告)号：US10133186B2
公开(公告)日：2018-11-20
申请号：US15299285
申请日：2016-10-20
发明人： Bart Schipper
摘要： An alignment apparatus for aligning a substrate, and a substrate processing system including such alignment apparatus. The alignment apparatus includes an alignment base for supporting the substrate and/or a substrate support member. A force generating device applies a contact force on the substrate. The force generating device includes an arm including a rigid proximal end and a rigid distal end. The distal end is provided with a contact section for contacting an edge of the substrate and an elastically deformable arm section extending between the proximal and distal ends. The connection part connects the proximal end to the alignment base. The arm is movable with respect to the alignment base via the connection part. The alignment apparatus also includes an actuator for causing a displacement of the proximal end, whereby the contact force, defined by the elastically deformable arm section, is applied to the substrate by the contact section.
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公开(公告)号：US10079206B2
公开(公告)日：2018-09-18
申请号：US15389581
申请日：2016-12-23
IPC分类号： H01L21/44 , H01L23/528 , G06F17/50 , G03F7/20
CPC分类号： H01L23/528 , G03F7/2059 , G03F7/2061 , G06F17/5068 , G06F17/5077 , H01L21/263 , H01L21/76816 , H01L25/0655 , H01L27/0207 , H01L27/0617 , H01L29/0684 , H01L29/0692
摘要： Method of manufacturing electronic devices using a maskless lithographic exposure system using a maskless pattern writer, wherein beamlet control data is generated for controlling the maskless pattern writer to expose a wafer for creation of the electronic devices. The beamlet control data is generated based on design layout data defining a plurality of structures, such as vias, for the electronic devices to be manufactured from the wafer, and selection data defining which of the structures of the design layout data are applicable for each electronic device to be manufactured from the wafer, the selection data defining a different set of the structures for different subsets of the electronic devices. Exposure of the wafer according to the beamlet control data results in exposing a pattern having a different set of the structures for different subsets of the electronic devices.
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公开(公告)号：US10037864B2
公开(公告)日：2018-07-31
申请号：US15594712
申请日：2017-05-15
IPC分类号： G03B27/52 , H01J37/09 , H01J37/30 , H01J37/317 , B82Y10/00 , B82Y40/00 , H01J37/147 , H01J37/302
CPC分类号： H01J37/09 , B82Y10/00 , B82Y40/00 , H01J37/147 , H01J37/3007 , H01J37/302 , H01J37/3174 , H01J37/3177 , H01J2237/002 , H01J2237/026 , H01J2237/0262 , H01J2237/0264 , H01J2237/16 , H01J2237/182 , H01J2237/188
摘要： The invention relates to a charged particle beam generator. The generator may comprise a high voltage shielding arrangement (201) for shielding components outside the shielding arrangement from high voltages within the shielding arrangement, and a vacuum pump (220) located outside the shielding arrangement for regulating a pressure of a space within the shielding arrangement. The generator may comprise a collimator system with a cooling arrangement (405a/407a-407b/405b) comprising cooling channels inside electrodes of the collimator system.
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公开(公告)号：US10008362B1
公开(公告)日：2018-06-26
申请号：US15390777
申请日：2016-12-27
IPC分类号： H01J37/18 , G02B6/42 , H01J37/302 , H01J37/317
摘要： Fiber feedthrough device (50), for forming a hermetic seal around optical fibers in a flat fiber group (60) with a group width. The device comprises a slotted member and a base (62). The base defines a hole (65) that extends entirely through the base along a feedthrough direction (X), and is adapted to accommodate the slotted member. The slotted member (52) defines first and second surfaces (53) on opposite sides associated with the feedthrough direction, and a side surface (55, 56) facing transverse to the feedthrough direction. The slotted member comprises a slot (58), which extends along the feedthrough direction through the slotted member, and opens into the first and second surfaces and into a longitudinal opening (59) along the side surface. The slot extends transversely into the slotted member up to a slot depth at least equal to the fiber group width.
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公开(公告)号：US09934943B2
公开(公告)日：2018-04-03
申请号：US14787775
申请日：2014-05-05
IPC分类号： H01J37/317 , H01J37/09 , H01J37/30
CPC分类号： H01J37/3177 , H01J37/09 , H01J37/3007 , H01J2237/0435 , H01J2237/0453 , H01J2237/3175 , H01J2237/31774
摘要： A sub-beam aperture array for forming a plurality of sub-beams from one or more charged particle beams. The sub-beam aperture array comprises one or more beam areas, each beam area comprising a plurality of sub-beam apertures arranged in a non-regular hexagonal pattern, the sub-beam apertures arranged so that, when projected in a first direction onto a line parallel to a second direction, the sub-beam apertures are uniformly spaced along the line, and wherein the first direction is different from the second direction. The system further comprises a beamlet aperture array with a plurality of beamlet apertures arranged in one or more groups. The beamlet aperture array is arranged to receive the sub-beams and form a plurality of beamlets at the locations of the beamlet apertures of the beamlet array.
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公开(公告)号：US09905322B2
公开(公告)日：2018-02-27
申请号：US14541233
申请日：2014-11-14
IPC分类号： G21K1/02 , G21K5/04 , H01J37/30 , H01J37/24 , H01J37/317 , H01J37/02 , H01J37/16 , H01J37/065 , H01J37/12
CPC分类号： G21K1/02 , G21K5/04 , H01J37/026 , H01J37/065 , H01J37/12 , H01J37/16 , H01J37/24 , H01J37/3002 , H01J37/3007 , H01J37/3174 , H01J37/3175 , H01J37/3177 , H01J2237/002 , H01J2237/0216 , H01J2237/024 , H01J2237/032 , H01J2237/04 , H01J2237/1215 , H01J2237/16 , H01J2237/1825 , H01J2237/303 , H01J2237/30472
摘要： The invention relates to a collimator electrode stack (70), comprising: —at least three collimator electrodes (71-80) for collimating a charged particle beam along an optical axis (A), wherein each collimator electrode comprises an electrode body with an electrode aperture for allowing passage to the charged particle beam, wherein the electrode bodies are spaced along an axial direction (Z) which is substantially parallel with the optical axis, and wherein the electrode apertures are coaxially aligned along the optical axis; and —a plurality of spacing structures (89) provided between each pair of adjacent collimator electrodes and made of an electrically insulating material, for positioning the collimator electrodes at predetermined distances along the axial direction. Each of the collimator electrodes (71-80) is electrically connected to a separate voltage output (151-160).The invention further relates to a method of operating a charged particle beam generator.
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公开(公告)号：US09703213B2
公开(公告)日：2017-07-11
申请号：US14342542
申请日：2012-09-12
CPC分类号： G03F7/70891 , B82Y10/00 , B82Y40/00 , G03F7/709 , H01J37/02 , H01J37/3177 , H01J2237/002 , H01J2237/0216 , H01J2237/28
摘要： The invention relates to a substrate processing apparatus (10) comprising a support frame (60), a radiation projection system (20) for projecting radiation onto a substrate to be processed, a substrate support structure (30) for supporting the substrate, and a fluid transfer system (150). The radiation projection system comprises a cooling arrangement (130) and is supported by and vibrationally decoupled from the support frame such that vibrations of the support frame above a predetermined maximum frequency are substantially decoupled from the radiation projection system. The fluid transfer system comprises at least one tube (140) fixed at two points (151,152), and comprises a flexible portion. A substantial part of the flexible portion extends over a plane substantially parallel to the substrate support structure surface. The stiffness of the flexible portion is adapted to substantially decouple vibrations at the second fixed point which are above the predetermined maximum frequency from the first fixed point.
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公开(公告)号：US09691589B2
公开(公告)日：2017-06-27
申请号：US13293393
申请日：2011-11-10
IPC分类号： H01J37/302 , H01J37/04 , H01J37/317 , H01J37/30 , B82Y10/00 , B82Y40/00 , G03F7/20
CPC分类号： H01J37/3026 , B82Y10/00 , B82Y40/00 , G03F7/70475 , G06T1/20 , G06T1/60 , H01J37/045 , H01J37/3002 , H01J37/3174 , H01J37/3175 , H01J37/3177 , H01J2237/3175 , H01J2237/31761 , H01J2237/31764 , H04N1/405
摘要： A method for exposing a wafer using a plurality of charged particle beamlets. The method comprises identifying non-functional beamlets among the beamlets, allocating a first subset of the beamlets for exposing a first portion of the wafer, the first subset excluding the identified non-functional beamlets, performing a first scan for exposing the first portion of the wafer using the first subset of the beamlets, allocating a second subset of the beamlets for exposing a second portion of the wafer, the second subset also excluding the identified non-functional beamlets, and performing a second scan for exposing the second portion of the wafer using the second subset of the beamlets, wherein the first and second portions of the wafer do not overlap and together comprise the complete area of the wafer to be exposed.
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公开(公告)号：US09644995B2
公开(公告)日：2017-05-09
申请号：US13539585
申请日：2012-07-02
CPC分类号： G01D5/24 , G03F9/7053
摘要： A measurement system for measuring an input electrical current (Ics) from a current source (CS) and generating a current measurement signal, comprising a current measuring circuit (70) having a first input terminal (72) connected to the current source and an output terminal (74) for providing the current measurement signal. The current measuring circuit further comprises one or more power supply terminals (75, 76) arranged to receive one or more voltages from a power supply (77a, 77b) for powering the current measuring circuit. The current measuring circuit also comprises a first voltage source (VD) coupled to the one or more power supply terminals, the first voltage source providing a disturbance voltage to the one or more power supply terminals, the disturbance voltage representing a voltage at the first input terminal.
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公开(公告)号：US09607806B2
公开(公告)日：2017-03-28
申请号：US13484231
申请日：2012-05-30
IPC分类号： G21K1/08 , H01J37/30 , H01J37/317 , B82Y10/00 , B82Y40/00
CPC分类号： H01J37/3007 , B82Y10/00 , B82Y40/00 , H01J37/3174 , H01J37/3177 , H01J2237/0435 , H01J2237/04924 , H01J2237/1205 , H01J2237/15 , H01J2237/1532
摘要： The invention relates to a method and a device for manipulation of one or more charged particle beams of a plurality of charged particle beamlets in a charged particle multi-beamlet apparatus. The manipulator device comprises a planar substrate comprising an array of through openings in the plane of the substrate, each of these through openings is arranged for passing the at least one charged particle beamlet there through, wherein each of the through openings is provided with one or more electrodes arranged around the through opening, and a electronic control circuit for providing control signals to the one or more electrodes of each through opening, wherein the electronic control circuit is arranged for providing the one or more electrodes of each individual through opening with an at least substantially analog adjustable voltage.
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