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公开(公告)号:US20040150101A1
公开(公告)日:2004-08-05
申请号:US10394135
申请日:2003-03-24
IPC分类号: H01L027/12
CPC分类号: H01L23/5383 , H01L23/3128 , H01L25/0652 , H01L25/0655 , H01L25/18 , H01L2224/16 , H01L2224/16225 , H01L2224/32245 , H01L2224/73253 , H01L2924/00014 , H01L2924/01019 , H01L2924/01046 , H01L2924/01057 , H01L2924/01078 , H01L2924/01079 , H01L2924/12044 , H01L2924/14 , H01L2924/1433 , H01L2924/15311 , H01L2924/16195 , H01L2924/3011 , H01L2924/3025 , H05K1/024 , H05K1/113 , H05K3/4623 , H05K3/4688 , H05K2201/09536 , H05K2201/096 , H05K2203/061 , H01L2224/0401
摘要: An information handling system, e.g., computer, server or mainframe, which includes a multi-chip electronic package utilizing an organic, laminate chip carrier and a plurality of semiconductor chips positioned on an upper surface of the carrier. The organic, laminate chip carrier is comprised of a plurality of conductive planes and dielectric layers and couples the chips to underlying conductors on the bottom surface thereof. The carrier may include a high-speed portion to assure high-frequency connection between the semiconductor chips and may also include an internal capacitor and/or thermally conductive member for enhanced operational capabilities of the final system product.
摘要翻译: 信息处理系统,例如计算机,服务器或主机,其包括利用有机层压芯片载体的多芯片电子封装以及位于载体的上表面上的多个半导体芯片。 有机层压芯片载体由多个导电平面和电介质层组成,并将芯片连接到其底表面上的底层导体。 载体可以包括高速部分以确保半导体芯片之间的高频连接,并且还可以包括用于增强最终系统产品的操作能力的内部电容器和/或导热构件。
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公开(公告)号:US20040242270A1
公开(公告)日:2004-12-02
申请号:US10449019
申请日:2003-06-02
IPC分类号: H04M001/00
CPC分类号: G06K19/0723 , G06K19/044 , G06K19/0704 , G06K19/0718 , G06K19/0728 , G06K19/07749 , G06K19/07769 , G06K19/14 , G06K19/145
摘要: An electronic card which includes a thin body portion, a storage device (e.g., semiconductor chip) and an antenna. In another embodiment, the card includes the body portion, the antenna, and a recording device (e.g., magnetic stripe).
摘要翻译: 一种包括薄体部分的电子卡,存储装置(例如,半导体芯片)和天线。 在另一个实施例中,卡包括主体部分,天线和记录装置(例如磁条)。
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公开(公告)号:US20040201136A1
公开(公告)日:2004-10-14
申请号:US10409066
申请日:2003-04-09
IPC分类号: B29C035/08
CPC分类号: B31D1/026 , H01L21/4882 , H01L2224/73253 , H01L2924/01057 , H01L2924/01078 , H05K3/0058 , H05K3/386 , Y10T156/1064
摘要: A method of removing selected portions of material from a base material using a plurality of different depth cuts (e.g., using laser cutting) such that apertured sections (or segments) are expeditiously removed for eventual use with another component or otherwise. In one example, the segmented section so removed can be used to bond various elements of an electronic package which in turn can then be positioned and used within an information handling system such as a computer, server, mainframe, etc.
摘要翻译: 使用多个不同深度切割(例如,使用激光切割)从基材除去所选部分材料的方法,使得快速去除多孔部分(或段)以最终用于另一部件或其它部件。 在一个示例中,如此去除的分段部分可以用于粘合电子包装的各种元件,电子包装件然后可以在诸如计算机,服务器,主机等的信息处理系统内定位和使用。
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公开(公告)号:US20040231888A1
公开(公告)日:2004-11-25
申请号:US10811817
申请日:2004-03-30
发明人: Benson Chan , John M. Lauffer , How T. Lin , Voya R. Markovich , David L. Thomas
IPC分类号: H05K001/00
CPC分类号: H05K3/4688 , H01L23/3128 , H01L23/5383 , H01L25/0652 , H01L25/0655 , H01L25/18 , H01L2224/16 , H01L2224/73253 , H01L2924/00014 , H01L2924/01019 , H01L2924/01046 , H01L2924/01057 , H01L2924/01078 , H01L2924/01079 , H01L2924/12044 , H01L2924/14 , H01L2924/1433 , H01L2924/15311 , H01L2924/16195 , H01L2924/3011 , H01L2924/3025 , H05K1/024 , H05K1/113 , H05K3/4623 , H05K2201/09536 , H05K2201/096 , H05K2203/061 , Y10T29/49126 , Y10T29/49165 , H01L2224/0401
摘要: A multilayered PCB including two multilayered portions, one of these able to electrically connect electronic components mounted on the PCB to assure high frequency connections therebetween. The PCB further includes a conventional PCB portion to reduce costs while assuring a structure having a satisfactory overall thickness for use in the PCB field. Coupling is also possible to the internal portion from these components. Methods of making these structures have also been provided.
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公开(公告)号:US20040183212A1
公开(公告)日:2004-09-23
申请号:US10423877
申请日:2003-04-28
发明人: David Alcoe
IPC分类号: H01L023/48 , H01L029/40
CPC分类号: H01L23/49838 , H01L23/49811 , H01L23/49822 , H01L2224/16225 , H01L2224/73253 , H01L2924/00014 , H01L2924/01019 , H01L2924/01078 , H01L2924/15312 , H01L2924/16195 , H05K1/113 , H05K1/114 , H05K1/115 , H05K1/116 , H05K3/3426 , H05K3/4602 , H05K2201/09454 , H05K2201/09472 , H05K2201/09509 , H05K2201/0979 , H05K2201/10318 , Y10T29/49149 , H01L2224/0401
摘要: An electronic package and information handling system utilizing same wherein the package substrate includes an internally conductive layer coupled to an external pad and of a size sufficiently large enough to substantially prevent cracking, separation, etc. of the pad when the pad is subjected to a tensile pressure of about 1.4 grams per square mil or greater.
摘要翻译: 一种利用其的电子封装和信息处理系统,其中封装衬底包括耦合到外部焊盘的内部导电层,并且具有足够大的尺寸以足以基本上防止衬垫经受拉伸时的焊盘的开裂,分离等 约1.4克/平方密度或更大的压力。
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公开(公告)号:US20040177998A1
公开(公告)日:2004-09-16
申请号:US10811915
申请日:2004-03-30
IPC分类号: H05K001/11 , H01R012/04 , H05K003/30
CPC分类号: H05K3/462 , H05K3/321 , H05K3/4069 , H05K3/429 , H05K3/4623 , H05K2201/0347 , H05K2201/09536 , H05K2201/0959 , H05K2201/096 , Y10T29/49117 , Y10T29/49126 , Y10T29/49128 , Y10T29/49151 , Y10T29/49155 , Y10T29/49165 , Y10T29/49167
摘要: A circuitized substrate assembly and method for making same wherein the assembly includes individual circuitized substrates bonded together. The substrates each include at least one opening, only one of which is substantially filled with a conductive paste prior to bonding. Once bonded, the paste is also partially located within the other opening to provide an effective electrical connection therewith.
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公开(公告)号:US20040163964A1
公开(公告)日:2004-08-26
申请号:US10370529
申请日:2003-02-24
IPC分类号: C25D005/02
CPC分类号: H05K3/4644 , H05K1/112 , H05K3/423 , H05K3/4614 , H05K2201/0355 , H05K2201/0394 , H05K2201/096 , H05K2201/10378 , H05K2203/061 , H05K2203/0733
摘要: A method of making a circuitized substrate in which a commoning layer is used to form multiple, substantially vertically aligned conductive openings in a multilayered component such as a laminate interposer for coupling a chip to a printed circuit board or the like. The structure, including such a chip and circuit board is ideally suited for use within an information handling system.
摘要翻译: 一种制造电路化基板的方法,其中共用层在诸如用于将芯片耦合到印刷电路板等的层叠插入件的多层部件中形成多个基本上垂直排列的导电开口。 包括这种芯片和电路板的结构非常适合在信息处理系统中使用。
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公开(公告)号:US20040118596A1
公开(公告)日:2004-06-24
申请号:US10322527
申请日:2002-12-19
IPC分类号: H05K001/11
CPC分类号: H05K3/462 , H05K3/321 , H05K3/4069 , H05K3/429 , H05K3/4623 , H05K2201/0347 , H05K2201/09536 , H05K2201/0959 , H05K2201/096 , Y10T29/49117 , Y10T29/49126 , Y10T29/49128 , Y10T29/49151 , Y10T29/49155 , Y10T29/49165 , Y10T29/49167
摘要: A circuitized substrate assembly and method for making same wherein the assembly includes individual circuitized substrates bonded together. The substrates each include at least one opening, only one of which is substantially filled with a conductive paste prior to bonding. Once bonded, the paste is also partially located within the other opening to provide an effective electrical connection therewith.
摘要翻译: 电路化基板组件及其制造方法,其中所述组件包括结合在一起的各个电路化基板。 基板各自包括至少一个开口,其中仅一个开口在接合之前基本上填充有导电浆料。 一旦粘合,糊料也部分地位于另一个开口内,以提供与其的有效电连接。
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公开(公告)号:US09007202B1
公开(公告)日:2015-04-14
申请号:US13778499
申请日:2013-02-27
发明人: Benson Chan , Jianzhuang Huang , Subahu Desai
CPC分类号: G08B21/0269 , G08B21/0202 , G08B21/0238 , G08B21/0247 , G08B21/025 , G08B21/0258 , G08B21/0291
摘要: A human being tracking and monitoring system comprising parent and child units, each of which include a microcontroller, a transceiver, a crystal, a battery, a voltage regulator and a switch with all of these elements except the battery being strategically positioned on one side of a circuit board, manual activation of the two switches in a first predetermined manner establishing a communication link between the parent and child units wherein a plurality of random identification signals are generated, this communication link between said parent and child units being broken by activation of the switches in a second predetermined manner.
摘要翻译: 一种包括母子单元的人类跟踪和监测系统,每个单元包括微控制器,收发器,晶体,电池,电压调节器和具有除了电池之外的所有这些元件的开关,其策略性地位于 电路板,以第一预定方式手动激活两个交换机,以在母机和子单元之间建立通信链路,其中生成多个随机识别信号,所述父与子单元之间的通信链路被激活 以第二预定方式切换。
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公开(公告)号:US20040118598A1
公开(公告)日:2004-06-24
申请号:US10379575
申请日:2003-03-06
IPC分类号: H05K001/11
CPC分类号: H05K3/462 , H05K3/321 , H05K3/4069 , H05K3/429 , H05K3/4623 , H05K2201/0347 , H05K2201/09536 , H05K2201/0959 , H05K2201/096 , Y10T29/49117 , Y10T29/49126 , Y10T29/49128 , Y10T29/49151 , Y10T29/49155 , Y10T29/49165 , Y10T29/49167
摘要: An information handling system (e.g., computer, server, etc.) Utilizing at least one circuitized substrate assembly of robust construction and possessing enhanced operational capabilities. The substrate assemblies include a substrate having at least one opening which is substantially filled with a conductive paste prior to bonding. Once bonded, the paste is also partially located within the other opening to provide an effective electrical connection therewith.
摘要翻译: 信息处理系统(例如,计算机,服务器等)利用至少一个具有坚固结构并具有增强的操作能力的电路化基板组件。 衬底组件包括具有至少一个开口的衬底,其在接合之前基本上填充有导电膏。 一旦粘合,糊料也部分地位于另一个开口内,以提供与其的有效电连接。
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