公开(公告)号：US09413923B2

公开(公告)日：2016-08-09

申请号：US13354399

申请日：2012-01-20

Applicant: Takehito Yamaguchi ,  Mitsuo Abe ,  Yuhiro Kobayashi

Inventor： Takehito Yamaguchi ,  Mitsuo Abe ,  Yuhiro Kobayashi

IPC: H04N1/00 ,  H04N1/21 ,  H04N5/232 ,  H04N13/02 ,  H04N101/00

CPC classification number: H04N1/215 ,  H04N1/0044 ,  H04N5/23293 ,  H04N13/221 ,  H04N2101/00 ,  H04N2201/212

Abstract: An imaging apparatus includes a display unit, an imaging unit adapted to successively capture an image of a subject and successively generate image data, and a controller adapted to control a display of a display object displayed on the display unit to change the display object in a specific direction at a predetermined timing in a predetermined recording mode.

Abstract translation: 一种成像装置包括：显示单元，适于连续拍摄被摄体图像并连续生成图像数据的成像单元;以及控制器，用于控制显示在显示单元上的显示对象的显示，以使显示对象改变为 在预定的记录模式中的预定定时。

公开(公告)号：US06796024B2

公开(公告)日：2004-09-28

申请号：US10392179

申请日：2003-03-20

Applicant: Yoshitsugu Katoh ,  Mitsuo Abe ,  Yoshihiko Ikemoto ,  Sumikazu Hosoyamada

Inventor： Yoshitsugu Katoh ,  Mitsuo Abe ,  Yoshihiko Ikemoto ,  Sumikazu Hosoyamada

IPC: H05K330

CPC classification number: H01L24/32 ,  H01L23/3128 ,  H01L23/4334 ,  H01L23/49531 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/05599 ,  H01L2224/32057 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L2224/8547 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/15151 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/30107 ,  H01L2924/3025 ,  Y10T29/49121 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49146 ,  Y10T29/49171 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

Abstract: According to the method of producing a semiconductor device, the substrate is provided with an opening formed at a substantially central position, interconnections and joining parts. The heat spreading plate has a fixed portion fixed to the substrate, a stage portion caved with respect to the fixed potion and connecting portions connecting the fixed portion and the stage portion. The heat spreading plate is fixed by positioning the stage portion at a position opposing the opening, then the heat spreading plate is welded to the substrate and the semiconductor chip is mounted on the stage portion through the opening. Then the semiconductor chip and interconnections formed on the substrate are electrically connected and sealing resin is formed on both sides of the heat spreading plate such that at least the semiconductor chip is sealed.

Abstract translation: 根据制造半导体器件的方法，基板设置有形成在大致中心位置的开口，互连部和接合部。 散热板具有固定到基板的固定部分，相对于固定部分凹陷的台部分和连接固定部分和台部部分的连接部分。 通过将台架部分定位在与开口相对的位置来固定散热板，然后将散热板焊接到基板，并且通过开口将半导体芯片安装在台架部分上。 然后，形成在基板上的半导体芯片和互连电连接，并且在散热板的两侧形成密封树脂，使得至少半导体芯片被密封。

公开(公告)号：US5290738A

公开(公告)日：1994-03-01

申请号：US789688

申请日：1991-11-08

Applicant: Hiroshi Tomishima ,  Toshikazu Nishiyama ,  Nobuyuki Yamada ,  Noriyuki Kumasaka ,  Mitsuo Abe

Inventor： Hiroshi Tomishima ,  Toshikazu Nishiyama ,  Nobuyuki Yamada ,  Noriyuki Kumasaka ,  Mitsuo Abe

IPC: C04B35/462 ,  G11B5/10 ,  G11B5/127 ,  G11B5/235 ,  G11B5/31 ,  H01F1/34 ,  H01F10/28 ,  C04B35/46 ,  C04B35/49

CPC classification number: C04B35/462 ,  G11B5/10 ,  G11B5/3103 ,  G11B5/3106 ,  Y10T428/1157

Abstract: A nonmagnetic oxide substrate material has a composition of 15 to 60 mol % of NiO, 10 to 70 mol % of CoO, 10 to 40 mol % of TiO.sub.2, and 0.5 to 25 mol % of CaO and is formed of very minute crystal grains. Preferably MgO or ZrO.sub.2 is used as an additive to the material to present a total composition containing the additive of 0.5 to 3 wt % per 100 parts by weight of the nonmagnetic oxide substrate material. Preferably, the substrate material is formulated to have a thermal expansion coefficient falling in the range of from 100 to 140 X 10.sup.-7 /.degree.C. A magnetic head using this substrate material reduces the loss in surface smoothness due to the relative slide with the magnetic tape.

Abstract translation: 非磁性氧化物基材的组成为NiO为15〜60摩尔％，CoO为10〜70摩尔％，TiO 2为10〜40摩尔％，CaO为0.5〜25摩尔％，并且由非常微小的晶粒形成。 优选地，MgO或ZrO 2用作材料的添加剂，以提供含有每100重量份非磁性氧化物基材的0.5至3重量％的添加剂的总组合物。 优选地，将基材材料配制成具有落在100至140×10-7 /℃范围内的热膨胀系数。 使用该基板材料的磁头由于与磁带的相对滑动而降低了表面光滑度的损失。

公开(公告)号：US4631869A

公开(公告)日：1986-12-30

申请号：US638690

申请日：1984-08-08

Applicant: Satoshi Miyatake ,  Mitsuo Abe ,  Masao Kume ,  Toshihide Ogasawara ,  Hiroshi Umino

Inventor： Satoshi Miyatake ,  Mitsuo Abe ,  Masao Kume ,  Toshihide Ogasawara ,  Hiroshi Umino

IPC: B23F23/12 ,  H02P5/50 ,  B24B49/00

CPC classification number: H02P5/50 ,  B23F23/12 ,  Y10T409/102226

Abstract: An apparatus for automatically causing a workpiece to engage a rotary tool. A pulse signal generated by rotating a reference workpiece is stored, and then a pulse signal generated by rotating a mounted workpiece is counted. The counted pulse signal and the stored pulse signal are compared, and when they coincide with each other, the workpiece is brought into engagement with the rotary tool. When the rotary tool is shifted, the stored pulse signal information is updated, and then a pulse signal generated by rotating a mounted workpiece is counted. If the updated stored pulse signal information land the counted pulse signal information are equal to each other, then the workpiece is taken into engagement with the rotary tool.

Abstract translation: 一种用于自动使工件接合旋转工具的装置。 存储通过旋转参考工件产生的脉冲信号，然后计数通过旋转安装的工件产生的脉冲信号。 比较计数脉冲信号和存储的脉冲信号，当它们彼此重合时，工件与旋转工具接合。 当旋转工具移位时，存储的脉冲信号信息被更新，然后计数通过旋转安装的工件产生的脉冲信号。 如果更新的存储的脉冲信号信息着陆，则计数的脉冲信号信息彼此相等，则工件与旋转工具接合。

公开(公告)号：US4617761A

公开(公告)日：1986-10-21

申请号：US638682

申请日：1984-08-08

Applicant: Satoshi Miyatake ,  Mitsuo Abe ,  Masao Kume

Inventor： Satoshi Miyatake ,  Mitsuo Abe ,  Masao Kume

IPC: B23F5/00 ,  B23F5/04 ,  B23F23/00 ,  G05B19/18 ,  H02P5/52 ,  B24B19/00

CPC classification number: H02P5/52 ,  B23F23/00 ,  B23F23/006 ,  B23F5/04 ,  G05B19/186

Abstract: A machine for automatically grinding a helical gear. The machine comprises a first rotational drive source for rotating a grinding wheel, a second rotational drive source for rotating a helical gear in mesh with the grinding wheel, a third rotational drive source for displacing the helical gear and the second rotational drive source in unison. Pulse generators are operatively connected to the first and third rotational drive sources. An output signal from one of the pulse generator is subtracted from an output signal from the other pulse generator to produce differential pulses which serve as drive pulses for the second rotational drive source.

Abstract translation: 用于自动研磨斜齿轮的机器。 机器包括用于旋转砂轮的第一旋转驱动源，用于旋转与砂轮啮合的斜齿轮的第二旋转驱动源，用于一致地移动斜齿轮和第二旋转驱动源的第三旋转驱动源。 脉冲发生器可操作地连接到第一和第三旋转驱动源。 从来自其他脉冲发生器的输出信号中减去来自脉冲发生器之一的输出信号，以产生用作第二旋转驱动源的驱动脉冲的差分脉冲。

公开(公告)号：US4081414A

公开(公告)日：1978-03-28

申请号：US639837

申请日：1975-12-11

Applicant: Mitsuo Abe ,  Tetsuo Murata ,  Minoru Furuichi ,  Nobuhide Shiraishi ,  Shohei Wada ,  Seiji Tai ,  Tsukasa Maeda

Inventor： Mitsuo Abe ,  Tetsuo Murata ,  Minoru Furuichi ,  Nobuhide Shiraishi ,  Shohei Wada ,  Seiji Tai ,  Tsukasa Maeda

IPC: C08L7/00 ,  B29C53/00 ,  B29C65/00 ,  B29C65/02 ,  C08L21/00 ,  C08L23/00 ,  C08L47/00 ,  C08L101/00 ,  C09J5/00 ,  C09J5/06 ,  C09J109/00 ,  C09J121/00 ,  C09J147/00 ,  C08L91/00

CPC classification number: C09J109/00 ,  B29C66/45 ,  Y10S525/914

Abstract: A hot melt adhesive composition consisting essentially of 100 parts by weight of polybutadiene having a 1,2-bond structure content of not less than 70% and a crystallinity of not less than 10%, from 50 to 1000 parts by weight of at least one inorganic filler, from 10 to 300 parts by weight of at least one tackifier, and at least one plasticizer and/or at least one flow improving agent, said composition having melt viscosity of from 50 to 50000 poises within a temperature range from 100.degree. to 150.degree. C.

Abstract translation: 一种热熔粘合剂组合物，其基本上由100重量份的具有不小于70％的1,2-键结构含量和不小于10％的结晶度的聚丁二烯，50至1000重量份的至少一种 无机填料，10至300重量份的至少一种增粘剂和至少一种增塑剂和/或至少一种流动改进剂，所述组合物在100-500℃的范围内具有50至50000泊的熔体粘度， 150℃

公开(公告)号：US20120188332A1

公开(公告)日：2012-07-26

申请号：US13354399

申请日：2012-01-20

Applicant: TAKEHITO YAMAGUCHI ,  MITSUO ABE ,  YUHIRO KOBAYASHI

Inventor： TAKEHITO YAMAGUCHI ,  MITSUO ABE ,  YUHIRO KOBAYASHI

IPC: H04N13/02 ,  H04N7/00

CPC classification number: H04N1/215 ,  H04N1/0044 ,  H04N5/23293 ,  H04N13/221 ,  H04N2101/00 ,  H04N2201/212

Abstract: An imaging apparatus includes a display unit, an imaging unit adapted to successively capture an image of a subject and successively generate image data, and a controller adapted to control a display of a display object displayed on the display unit to change the display object in a specific direction at a predetermined timing in a predetermined recording mode.

Abstract translation: 一种成像装置包括：显示单元，适于连续拍摄被摄体图像并连续生成图像数据的成像单元;以及控制器，用于控制显示在显示单元上的显示对象的显示，以使显示对象改变为 在预定的记录模式中的预定定时。

公开(公告)号：US06424032B1

公开(公告)日：2002-07-23

申请号：US09643911

申请日：2000-08-23

Applicant: Yoshihiko Ikemoto ,  Mitsuo Abe ,  Yoshitsugu Katoh ,  Sumikazu Hosoyamada

Inventor： Yoshihiko Ikemoto ,  Mitsuo Abe ,  Yoshitsugu Katoh ,  Sumikazu Hosoyamada

IPC: H01L2352

CPC classification number: H01L23/50 ,  H01L23/49838 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/85 ,  H01L2224/05554 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48233 ,  H01L2224/48465 ,  H01L2224/49109 ,  H01L2224/49175 ,  H01L2224/4943 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2924/01076 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/1517 ,  H01L2924/19041 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2224/78 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2224/05599

Abstract: In a semiconductor device, an influence of the simultaneous switching noise is reduced by increasing the decoupling capacity between a ground ring and a power supply ring. A semiconductor element having a plurality of electrode pads is mounted on a redistribution substrate. The power supply ring and the ground ring are formed on the redistribution substrate in a surrounding area of the semiconductor element. One of the ground ring and the power supply ring has a plurality of convex portions protruding toward the other of the ground ring and the power supply ring. The other of the ground ring and the power supply ring has a plurality of concave portions each of which receives the corresponding one of the convex portions with a predetermined distance therebetween.

Abstract translation: 在半导体器件中，通过增加接地环和电源环之间的去耦电容来降低同时开关噪声的影响。 具有多个电极焊盘的半导体元件安装在再分布基板上。 电源环和接地环形成在半导体元件的周围区域中的再分布基板上。 接地环和供电环中的一个具有向接地环和电源环中的另一个突出的多个凸部。 接地环和电源环中的另一个具有多个凹部，每个凹部在其间以预定的距离接收相应的一个凸部。

公开(公告)号：US4476509A

公开(公告)日：1984-10-09

申请号：US349529

申请日：1982-02-17

Applicant: Katsuo Konishi ,  Kanji Kawano ,  Kohji Tamura ,  Mitsuo Abe

Inventor： Katsuo Konishi ,  Kanji Kawano ,  Kohji Tamura ,  Mitsuo Abe

IPC: C09D5/23 ,  G11B5/31 ,  G11B5/25

CPC classification number: G11B5/3116 ,  G11B5/3163

Abstract: A thin film magnetic head is composed of a first thin film of a magnetic material deposited on a non-magnetic substrate. A V-like groove is formed in the first magnetic thin film with a depth reaching the non-magnetic substrate. One wall face of the V-like groove is deposited with a non-magnetic thin film, and the V-like groove is filled with a second magnetic thin film. A magnetic gap provided by the non-magnetic thin film is used as the magnetic head gap.

Abstract translation: 薄膜磁头由沉积在非磁性基底上的磁性材料的第一薄膜组成。 在第一磁性薄膜中形成V型槽，深度达到非磁性基板。 V型槽的一个壁面用非磁性薄膜沉积，V形槽填充有第二磁性薄膜。 由非磁性薄膜提供的磁隙用作磁头间隙。

公开(公告)号：US4434544A

公开(公告)日：1984-03-06

申请号：US429636

申请日：1982-09-30

Applicant: Akihiro Dohya ,  Yasuhiko Hino ,  Mitsuo Abe

Inventor： Akihiro Dohya ,  Yasuhiko Hino ,  Mitsuo Abe

IPC: H01L27/01 ,  H05K1/03 ,  H05K1/09 ,  H05K3/10 ,  H05K3/24 ,  H05K3/46 ,  H01L29/46

CPC classification number: H01L27/016 ,  H05K3/108 ,  H05K3/4647 ,  H05K1/0306 ,  H05K1/09 ,  H05K2203/0315 ,  H05K2203/0733 ,  H05K2203/1142 ,  H05K3/243

Abstract: A multilayer circuit construction includes a conductive layer formed of an alloy of a noble metal and a small amount of a base metal disposed on a heat resistant insulating substrate. The portion of the substrate not covered with the conductive alloy is covered with an oxide of the base metal constituent of the alloy. The construction may be formed by depositing a base metal layer over the substrate, followed by depositing the noble metal over a part of the base metal layer. By oxidizing at high temperatures, the exposed base metal layer is converted to oxide, while the noble metal and the base metal thereunder diffuse into each other to form the alloy.

Abstract translation: 多层电路结构包括由贵金属和少量设置在耐热绝缘基板上的贱金属的合金形成的导电层。 没有被导电合金覆盖的基板的部分被合金的贱金属成分的氧化物覆盖。 该结构可以通过在衬底上沉积贱金属层，然后将贵金属沉积在基底金属层的一部分上而形成。 通过在高温下氧化，露出的基底金属层被转化为氧化物，而贵金属和其后的母体金属彼此扩散以形成合金。