摘要:
In one embodiment, a wafer level package includes a rerouting pattern formed on a semiconductor substrate and a first encapsulant pattern overlying the rerouting pattern. The first encapsulant pattern has a via hole to expose a portion of the rerouting pattern. The package additionally includes an external connection terminal formed on the exposed portion of the rerouting pattern. An upper section of the sidewall and a sidewall of the external connection terminal may be separated by a gap distance. The gap distance may increase toward an upper surface of the encapsulant pattern.
摘要:
A circuit for detecting a voltage change is described. The circuit includes a supply insensitive pulse generator that generates a pulse signal. The circuit also includes a time-to-digital converter coupled to the supply insensitive pulse generator. The time-to-digital converter generates a digital signal based on the pulse signal and a voltage. The circuit also includes a controller coupled to the time-to-digital converter that detects a voltage change based on the digital signal.
摘要:
In one embodiment, a semiconductor package may include a semiconductor chip having a chip pad formed on a first surface thereof, a sealing member for sealing the semiconductor chip and exposing the first surface of the semiconductor chip, a conductive wiring overlying a part of the first surface of the semiconductor chip and directly contacting a part of an upper surface of the sealing member. The conductive wiring further contacts the pad. The semiconductor package may also include an encapsulant covering the conductive wiring and having openings for exposing parts of the conductive wiring.
摘要:
Provided are a multimedia play apparatus and method. The multimedia play apparatus and method enable synchronization between an audio and a video through existing multimedia play time information, and even in a multimedia service that simultaneously provides multimedia and a message, the multimedia play apparatus and method enable synchronization between multimedia and a message that occurs by terminal characteristics between different environments and different users on the basis of existing multimedia play time information and multimedia meaning information. Moreover, by performing synchronization between multimedia and a message on the basis of the multimedia meaning information, the multimedia play apparatus and method can prevent the damage of a multimedia service that provides multimedia and a message together because of a spoiler corresponding to a malicious message.
摘要:
The present invention relates to a composition for inducing embryonic stem cell differentiation comprising a MEK/ERK (mitogen-activated protein kinase kinase/extracellular regulated kinase) signal transduction inhibitor and BMP (bone morphogenetic protein), and a method for inducing differentiation of embryonic stem cells into mesodermal cells using the same. Further, the mesodermal cells obtained by the above method are able to differentiate into various mesenchymal tissue cells. In particular, the present invention relates to a method for inducing differentiation into hemangioblast by culturing the mesodermal cells obtained by the above method in the presence of VEGF (vascular endothelial cell growth factor) and bFGF (basic fibroblast growth factor). The differentiated hemangioblasts can be further differentiated into vascular endothelial cells, vascular smooth muscle cells, and hematopoietic stem cells under various culture conditions.
摘要:
A fabricating method of a semiconductor device may include forming a semiconductor die on a supporting wafer, and picking up the die from the wafer by attaching to the die a transfer unit, the transfer unit including a head unit configured to enable twisting movement, and performing the twisting movement. A fabricating method of a semiconductor device may include forming a first semiconductor device on a supporting wafer; and picking up the first semiconductor device from the wafer, moving the first semiconductor device onto a second semiconductor device, and bonding the first semiconductor device to the second semiconductor device while maintaining the first semiconductor device oriented so that a surface faces upwardly. A fabricating method of a semiconductor device may include forming a first semiconductor device on a supporting wafer, attaching to the first semiconductor device a transfer unit configured to enable twisting movement, and performing the twisting movement.
摘要:
A fixing apparatus for fixing a cargo insulation panel to a hull is provided. The fixing apparatus includes a fixing plate adhered to one face of the insulation panel, a plurality of fixing brackets protruded to the outside of the fixing plate, protruded portions of the fixing brackets being fixed by stud bolts arranged on the hull, and coupling means being configured to couple the fixing brackets to the fixing plate. The fixing apparatus can improve the continuity of the insulation panel, enhance the adhesiveness and airtightness with a member such as supple triplex, easily adjust adjacent insulation panels vertically or laterally. The fixing apparatus also solves the problem of damage caused by interference or the inconvenience of transportation by allowing the fixing bracket to be inserted during the transportation of the insulation panel.
摘要:
A semiconductor package includes a first semiconductor chip, a second semiconductor chip disposed on the first semiconductor chip, and a connection member to electrically connect the first semiconductor chip and the second semiconductor chip. The connection member may include a connection pad disposed on the first semiconductor chip, a connection pillar disposed on the second semiconductor chip, and a bonding member to connect the connection pad and the connection pillar. An anti-contact layer may be formed on at least one surface of the connection pad.
摘要:
There are provided a power combiner implemented by a printed circuit board, a power amplifying module having the same, and a signal transceiving module. The power combiner includes: a primary wiring unit formed on one surface of a printed circuit board, receiving a plurality of balance signals having positive balance signals and negative balance signals, and including a plurality of positive primary wirings and a plurality of negative primary wirings, wherein the plurality of positive primary wirings are spaced apart from each other by a predetermined interval, the plurality of negative primary wirings are spaced apart from each other by a predetermined interval, one ends of the plurality of positive primary wirings are connected in common to thereby receive the plurality of positive balance signals, one ends of the plurality of negative primary wirings are connected in common to thereby receive the plurality of negative balance signals, and the other ends of the plurality of positive primary wirings and the other ends of the plurality of negative primary wirings are connected to each other to thereby form a loop; and a secondary wiring unit formed on the other surface of the printed circuit board, and including a secondary wiring combining powers of the plurality of balance signals from the primary wirings forming the loop to thereby output a single end signal.
摘要:
An apparatus for a cargo insulation panel and an insulation panel using the fixing apparatus are provided. By providing a fixing apparatus of a cargo insulation panel and an insulation panel using the fixing apparatus, which include a fixing plate adhered to one face of the insulation panel, a plurality of fixing brackets protruded to the outside of the fixing plate, protruded portions of the fixing brackets being fixed by stud bolts arranged on the hull, and coupling means being configured to couple the fixing brackets to the fixing plate, the present invention can improve the continuity of the insulation panel, enhance the adhesiveness and airtightness with a member such as supple triplex, easily adjust adjacent insulation panels vertically or laterally, and solve the problem of damage by interference or the inconvenience of transportation by allowing the fixing bracket to be inserted during the transportation of the insulation panel.