公开(公告)号：US20050230843A1

公开(公告)日：2005-10-20

申请号：US11141529

申请日：2005-05-31

申请人： Vernon Williams

发明人： Vernon Williams

IPC分类号： H01L21/60 ,  H01L23/495 ,  H01L25/065 ,  H05K3/02 ,  H01L23/48

CPC分类号： H01L24/12 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y70/00 ,  B33Y80/00 ,  H01L21/4857 ,  H01L23/4952 ,  H01L24/05 ,  H01L24/11 ,  H01L24/24 ,  H01L24/25 ,  H01L24/76 ,  H01L24/82 ,  H01L25/0655 ,  H01L2224/0401 ,  H01L2224/05599 ,  H01L2224/13099 ,  H01L2224/24051 ,  H01L2224/24101 ,  H01L2224/24137 ,  H01L2224/24226 ,  H01L2224/24227 ,  H01L2224/76155 ,  H01L2224/82102 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/15173 ,  H01L2924/351 ,  H05K3/0023 ,  H05K3/02 ,  H05K3/32 ,  H05K3/321 ,  H05K3/4664 ,  H05K2203/0514 ,  H05K2203/107 ,  H05K2203/1469 ,  Y02P80/30 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155 ,  H01L2224/45099 ,  H01L2924/00

摘要： A flip-chip type semiconductor device includes at least one conductive element with a plurality of adjacent, mutually adhered regions. The at least one conductive element may include a laterally extending conductive element of the type that reroutes the connection pattern of a semiconductor die or a conductive element that protrudes from a contact pad of the flip-chip type semiconductor device. The at least one conductive element may be formed by programmed material consolidation; e.g., stereolithography. A flip-chip type semiconductor device with one or more conductive elements that are at least partially laterally extending may also include a carrier or other dielectric layer that isolates the conductive elements and their corresponding contact pads from the active surface of a semiconductor die. A protective layer may also cover at least laterally extending portions of such conductive elements. The dielectric layers or protective layers may be formed by programmed material consolidation.

摘要翻译： 倒装芯片型半导体器件包括至少一个具有多个相邻的相互粘合区域的导电元件。 所述至少一个导电元件可以包括横向延伸的导电元件，该导电元件重新路由半导体管芯的连接图案或从倒装芯片型半导体器件的接触焊盘突出的导电元件。 所述至少一个导电元件可以通过编程材料固结形成; 例如立体光刻。 具有至少部分横向延伸的一个或多个导电元件的倒装芯片型半导体器件还可以包括将导电元件及其对应的接触焊盘与半导体管芯的有源表面隔离的载体或其它电介质层。 保护层还可以覆盖这种导电元件的至少横向延伸的部分。 电介质层或保护层可以通过编程材料固结形成。

公开(公告)号：US20070062033A1

公开(公告)日：2007-03-22

申请号：US11602549

申请日：2006-11-21

申请人： Vernon Williams

发明人： Vernon Williams

IPC分类号： H05K3/10

CPC分类号： H01L24/12 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y70/00 ,  B33Y80/00 ,  H01L21/4857 ,  H01L23/4952 ,  H01L24/05 ,  H01L24/11 ,  H01L24/24 ,  H01L24/25 ,  H01L24/76 ,  H01L24/82 ,  H01L25/0655 ,  H01L2224/0401 ,  H01L2224/05599 ,  H01L2224/13099 ,  H01L2224/24051 ,  H01L2224/24101 ,  H01L2224/24137 ,  H01L2224/24226 ,  H01L2224/24227 ,  H01L2224/76155 ,  H01L2224/82102 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/15173 ,  H01L2924/351 ,  H05K3/0023 ,  H05K3/02 ,  H05K3/32 ,  H05K3/321 ,  H05K3/4664 ,  H05K2203/0514 ,  H05K2203/107 ,  H05K2203/1469 ,  Y02P80/30 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155 ,  H01L2224/45099 ,  H01L2924/00

摘要： Methods for forming conductive elements of substrates of components that are configured for use in electronic devices includes providing unconsolidated material over at least a portion of such a substrate and at least partially consolidating the material selectively or in accordance with a program. Such consolidation may be effected by directing consolidating energy, in the form of focused (e.g., laser) radiation or otherwise, toward the unconsolidated material. Additionally, all or part of a substrate may be formed by programmed material consolidation processes.

摘要翻译： 用于形成构造用于电子设备的部件的基底的导电元件的方法包括在这种基底的至少一部分上提供未固结的材料，并且至少部分地根据程序固化材料。 可以通过以聚焦（例如，激光）辐射或其他方式将能量固结到未松散的材料来实现这种整合。 此外，可以通过程序化材料固结方法形成衬底的全部或部分。

公开(公告)号：US20060237832A1

公开(公告)日：2006-10-26

申请号：US11473469

申请日：2006-06-23

申请人： Stephen James ,  Vernon Williams

发明人： Stephen James ,  Vernon Williams

IPC分类号： H01L23/02

CPC分类号： H01L24/97 ,  H01L21/561 ,  H01L21/565 ,  H01L23/16 ,  H01L23/3114 ,  H01L23/3128 ,  H01L23/4334 ,  H01L23/49575 ,  H01L24/06 ,  H01L24/48 ,  H01L24/81 ,  H01L25/0657 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05599 ,  H01L2224/06136 ,  H01L2224/1319 ,  H01L2224/16 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/85399 ,  H01L2224/97 ,  H01L2225/0651 ,  H01L2225/06586 ,  H01L2225/06589 ,  H01L2225/06593 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor device, semiconductor die package, mold tooling, and methods of fabricating the device and packages are provided. In one embodiment, the semiconductor device comprises a pair of semiconductor dies mounted on opposing sides of a flexible tape substrate, the outer surfaces of the dies having one or more standoffs disposed thereon. The standoffs can be brought into contact with an inner surface of the mold plates of a mold tooling when the device is positioned between the mold plates to maintain the flexible tape substrate in a centralized position within a mold chamber and inhibit the tape from bending as a molding compound flows into the chamber during encapsulation.

公开(公告)号：US20050026414A1

公开(公告)日：2005-02-03

申请号：US10925572

申请日：2004-08-24

申请人： Vernon Williams

发明人： Vernon Williams

IPC分类号： H01L21/60 ,  H01L23/495 ,  H01L25/065 ,  H05K3/02 ,  H01L21/4763

CPC分类号： H01L24/12 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y70/00 ,  B33Y80/00 ,  H01L21/4857 ,  H01L23/4952 ,  H01L24/05 ,  H01L24/11 ,  H01L24/24 ,  H01L24/25 ,  H01L24/76 ,  H01L24/82 ,  H01L25/0655 ,  H01L2224/0401 ,  H01L2224/05599 ,  H01L2224/13099 ,  H01L2224/24051 ,  H01L2224/24101 ,  H01L2224/24137 ,  H01L2224/24226 ,  H01L2224/24227 ,  H01L2224/76155 ,  H01L2224/82102 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/15173 ,  H01L2924/351 ,  H05K3/0023 ,  H05K3/02 ,  H05K3/32 ,  H05K3/321 ,  H05K3/4664 ,  H05K2203/0514 ,  H05K2203/107 ,  H05K2203/1469 ,  Y02P80/30 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155 ,  H01L2224/45099 ,  H01L2924/00

摘要： Methods for fabricating conductive structures on contact pads of semiconductor device components or other electronic components and for securing conductive structures to contact pads include directing consolidating energy toward unconsolidated conductive material. Alternatively, an unconsolidated material that will consolidate without additional consolidating energy may be used to form such conductive structures, in which case layers of the unconsolidated material are merely defined. Consolidating energy may be directed or layers of unconsolidated conductive material defined by recognizing the locations or orientations of one or more features, such as a contact, of the semiconductor device component or other electronic component. The conductive elements may include, but are not limited to, discrete conductive structures that protrude from the contacts, conductive traces that extend laterally from the contacts, or vias of circuit boards, interposers, or semiconductor devices.

摘要翻译： 用于在半导体器件部件或其他电子部件的接触焊盘上制造导电结构并用于将导电结构固定到接触焊盘的方法包括将固化能量引向未固结的导电材料。 或者，可以使用将在没有额外的固结能量的情况下固结的未固结的材料来形成这种导电结构，在这种情况下仅限定未固结材料的层。 通过识别半导体器件部件或其他电子部件的一个或多个特征（例如接触）的位置或取向来限定固化能量或未固结的导电材料层。 导电元件可以包括但不限于从触点突出的离散的导电结构，从触点横向延伸的导电迹线或电路板，插入件或半导体器件的通孔。

公开(公告)号：US08769846B1

公开(公告)日：2014-07-08

申请号：US13093929

申请日：2011-04-26

申请人： Vernon Williams

发明人： Vernon Williams

IPC分类号： A43B3/12

CPC分类号： A43B7/26 ,  A43B7/1455 ,  A43B7/146

摘要： The boot having skin-exfoliating means therein is a normal boot that when worn targets different regions of a foot and exfoliates dead skin from said regions of the foot, but in different exfoliating manners. The exfoliating means are designed to massage and exfoliate dead skin from the foot of an end user. The exfoliating means comprise massaging nodes aligned along a front, interior of the boot, which target skin between toes. Another exfoliating means is included along a middle region of the sole and includes an array of nodes that exfoliate skin along a bottom surface of the foot. Exfoliating ridges are located on two regions of the sole and are adapted to exfoliate skin at the rear of the foot and between the array of nodes and massaging nodes. Edge ridges adorn a periphery of the sole and provide additional exfoliating means.

摘要翻译： 在其中具有皮肤去角质装置的靴子是正常的靴子，当穿着时，针对脚的不同区域并且从脚的所述区域剥离死皮，但以不同的去角质方式。 去角质装置被设计成从最终用户的脚部按摩和去除死皮。 去角质装置包括按照沿着靴子前部，内部对准的节段，其在脚趾之间定向皮肤。 沿着鞋底的中间区域包括另外的去角质装置，并且包括沿脚底部表面剥离皮肤的节点阵列。 去角质脊位于鞋底的两个区域上，并且适于在脚后部以及节点阵列和按摩节点之间剥离皮肤。 边缘脊装饰鞋底的周边，并提供额外的去角质装置。

公开(公告)号：US20070148817A1

公开(公告)日：2007-06-28

申请号：US11708917

申请日：2007-02-20

申请人： Vernon Williams ,  Ford Grigg ,  Bret Street

发明人： Vernon Williams ,  Ford Grigg ,  Bret Street

IPC分类号： H01L21/00

CPC分类号： H01L21/00 ,  B33Y30/00 ,  B33Y80/00 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/12 ,  H01L24/13 ,  H01L24/16 ,  H01L24/742 ,  H01L24/81 ,  H01L2224/05572 ,  H01L2224/05573 ,  H01L2224/10126 ,  H01L2224/11554 ,  H01L2224/13099 ,  H01L2224/16237 ,  H01L2224/81136 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/30105 ,  H01L2924/351 ,  H05K3/12 ,  H05K3/321 ,  H05K3/3436 ,  H05K3/4007 ,  H05K2201/0367 ,  H05K2201/10977 ,  H05K2203/0594 ,  H05K2203/167 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2224/05599

摘要： A method for fabricating an electrical interconnection element, or conductive structure, includes disposing a jacket of a first member of the electrical interconnection element laterally around a contact of a semiconductor device structure and introducing conductive material into the jacket. The jacket, which may be electrically insulative, may include a plurality of adjacent, mutually adhered regions. Such regions may be formed by programmed material consolidation processes, such as stereolithography, in which material is selectively consolidated in a manner controlled by a program. The first member is configured to interconnect with a second member of the electrical interconnection element, which may be secured to and electrically communicate with a contact of another semiconductor device component.

摘要翻译： 一种用于制造电互连元件或导电结构的方法包括将电互连元件的第一构件的护套横向放置在半导体器件结构的接触件周围并将导电材料引入护套中。 可以是电绝缘的护套可以包括多个相邻的相互粘合的区域。 这样的区域可以通过程序化材料固结方法形成，例如立体光刻，其中材料以程序控制的方式选择性地固结。 第一构件被配置为与电互连元件的第二构件互连，电连接元件的第二构件可固定到另一个半导体器件部件的触点并与之电连通。

公开(公告)号：US20050221531A1

公开(公告)日：2005-10-06

申请号：US11141300

申请日：2005-05-31

申请人： Vernon Williams

发明人： Vernon Williams

IPC分类号： H01L21/60 ,  H01L23/495 ,  H01L25/065 ,  H05K3/02 ,  H01L21/00

CPC分类号： H01L24/12 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y70/00 ,  B33Y80/00 ,  H01L21/4857 ,  H01L23/4952 ,  H01L24/05 ,  H01L24/11 ,  H01L24/24 ,  H01L24/25 ,  H01L24/76 ,  H01L24/82 ,  H01L25/0655 ,  H01L2224/0401 ,  H01L2224/05599 ,  H01L2224/13099 ,  H01L2224/24051 ,  H01L2224/24101 ,  H01L2224/24137 ,  H01L2224/24226 ,  H01L2224/24227 ,  H01L2224/76155 ,  H01L2224/82102 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/15173 ,  H01L2924/351 ,  H05K3/0023 ,  H05K3/02 ,  H05K3/32 ,  H05K3/321 ,  H05K3/4664 ,  H05K2203/0514 ,  H05K2203/107 ,  H05K2203/1469 ,  Y02P80/30 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155 ,  H01L2224/45099 ,  H01L2924/00

摘要： A carrier substrate includes a substrate and at least one conductive element. The at least one conductive element may include a plurality of adjacent, mutually adhered regions, which may include the same type of material. A portion of the at least one conductive element may be disposed within a recess formed in a surface of the substrate. The at least one conductive element may include a portion that extends through the substrate.

摘要翻译： 载体基板包括基板和至少一个导电元件。 至少一个导电元件可以包括多个相邻的，相互粘合的区域，其可以包括相同类型的材料。 所述至少一个导电元件的一部分可以设置在形成在所述基板的表面中的凹部内。 所述至少一个导电元件可以包括延伸穿过衬底的部分。

公开(公告)号：US20060292750A1

公开(公告)日：2006-12-28

申请号：US11511955

申请日：2006-08-29

申请人： Stephen James ,  Vernon Williams

发明人： Stephen James ,  Vernon Williams

IPC分类号： H01L21/50

CPC分类号： H01L24/97 ,  H01L21/561 ,  H01L21/565 ,  H01L23/16 ,  H01L23/3114 ,  H01L23/3128 ,  H01L23/4334 ,  H01L23/49575 ,  H01L24/06 ,  H01L24/48 ,  H01L24/81 ,  H01L25/0657 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05599 ,  H01L2224/06136 ,  H01L2224/1319 ,  H01L2224/16 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/85399 ,  H01L2224/97 ,  H01L2225/0651 ,  H01L2225/06586 ,  H01L2225/06589 ,  H01L2225/06593 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor device, semiconductor die package, mold tooling, and methods of fabricating the device and packages are provided. In one embodiment, the semiconductor device comprises a pair of semiconductor dies mounted on opposing sides of a flexible tape substrate, the outer surfaces of the dies having one or more standoffs disposed thereon. The standoffs can be brought into contact with an inner surface of the mold plates of a mold tooling when the device is positioned between the mold plates to maintain the flexible tape substrate in a centralized position within a mold chamber and inhibit the tape from bending as a molding compound flows into the chamber during encapsulation.

公开(公告)号：US20060082021A1

公开(公告)日：2006-04-20

申请号：US11291695

申请日：2005-11-30

申请人： Vernon Williams ,  Michael Gifford

发明人： Vernon Williams ,  Michael Gifford

IPC分类号： H01L21/56

CPC分类号： H01L21/4842 ,  H01L21/565 ,  H01L23/49565 ,  H01L23/49582 ,  H01L23/49586 ,  H01L2924/0002 ,  Y02P70/605 ,  Y10T29/49121 ,  Y10T29/49146 ,  H01L2924/00

摘要： An integrated circuit leadframe has a pair of leadframe rails that are specially treated to adhere to injection mold compounds to a lesser or greater degree than portions of the leadframe rails outside of the treated areas. By adhering to mold compounds to a greater degree, mold compound not removed during a deflashing procedure does not flake off to form mold compound debris during a trimming and forming procedure. By adhering to mold compounds to a lesser degree, substantially all of the mold compound is removed during the deflashing procedure so there is no mold compound to flake off to form mold compound debris during the trimming and forming procedure. The leadframe rails may be treated by forming apertures in the rails, by increasing or decreasing the roughness of the leadframe rails, or by coating the leadframe rails with an adhesion promoting or reducing material.

公开(公告)号：US20050148115A1

公开(公告)日：2005-07-07

申请号：US11053724

申请日：2005-02-07

申请人： Vernon Williams ,  Bret Street

发明人： Vernon Williams ,  Bret Street

IPC分类号： H01L21/48 ,  H01L23/367 ,  H01L21/50

CPC分类号： H01L21/4871 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y40/00 ,  B33Y80/00 ,  H01L23/367 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/00

摘要： Programmed material consolidation processes for fabricating heat sinks include the selective consolidation of previously unconsolidated material. The heat dissipation element of the heat sink that has been fabricated by such processes can have non-linear or convoluted passageways therethrough to enhance air flow. An optical recognition may be used in conjunction with programmed material consolidation processes to ensure that a heat sink is fabricated or positioned on the appropriate location of an electronic component, such as a semiconductor device.

摘要翻译： 用于制造散热片的程序化材料固结工艺包括先前未固结的材料的选择性固结。 通过这种处理制造的散热器的散热元件可以具有非线性或卷积的通道，以增强空气流动。 光学识别可以与编程材料固结过程结合使用，以确保将散热器制造或定位在诸如半导体器件的电子部件的适当位置上。