公开(公告)号：US5645979A

公开(公告)日：1997-07-08

申请号：US708938

申请日：1996-09-06

申请人： Amane Mochizuki ,  Michie Ishii ,  Masako Maeda ,  Kazumi Higashi

发明人： Amane Mochizuki ,  Michie Ishii ,  Masako Maeda ,  Kazumi Higashi

IPC分类号： C08L79/00 ,  G03F7/004 ,  G03F7/038 ,  G03F7/32 ,  G03F7/38

CPC分类号： G03F7/0045 ,  G03F7/038

摘要： A heat-resistant negative-working photoresist composition comprising a resin component having a carbodiimide unit in the molecule, and a compound capable of inducing a basic compound by irradiation with actinic rays. The photosensitive layer formed by the photoresist composition shows a sufficient sensitivity even by a lower irradiation energy and can give a sharp negative-type pattern by irradiation with actinic rays such as ultraviolet rays.

公开(公告)号：US5595856A

公开(公告)日：1997-01-21

申请号：US594720

申请日：1996-01-31

申请人： Amane Mochizuki ,  Michie Ishii ,  Masako Maeda ,  Kazumi Higashi

发明人： Amane Mochizuki ,  Michie Ishii ,  Masako Maeda ,  Kazumi Higashi

IPC分类号： C08L79/00 ,  G03F7/004 ,  G03F7/038

CPC分类号： G03F7/0045 ,  G03F7/038

摘要： A heat-resistant negative-working photoresist composition comprising a resin component having a carbodiimide unit in the molecule, and a compound capable of inducing a basic compound by irradiation with actinic rays. The photosensitive layer formed by the photoresist composition shows a sufficient sensitivity even by a lower irradiation energy and can give a sharp negative-type pattern by irradiation with actinic rays such as ultraviolet rays.

摘要翻译： 一种耐热负性光致抗蚀剂组合物，其包含在分子中具有碳二亚胺单元的树脂组分和能够通过用光化射线照射而诱导碱性化合物的化合物。 由光致抗蚀剂组合物形成的感光层即使通过较低的照射能量显示出足够的灵敏度，并且可以通过用诸如紫外线的光化射线照射而产生尖锐的负型图案。

公开(公告)号：US5438223A

公开(公告)日：1995-08-01

申请号：US030865

申请日：1993-03-12

申请人： Kazumi Higashi ,  Amane Mochizuki ,  Masako Maeda

发明人： Kazumi Higashi ,  Amane Mochizuki ,  Masako Maeda

IPC分类号： H01L23/498 ,  H05K3/32 ,  H01L23/48 ,  H01L29/40 ,  H01L29/41

CPC分类号： H05K3/321 ,  H01L23/49827 ,  H01L2224/83101 ,  H01L2924/01019 ,  H01L2924/01079 ,  H05K2201/0154 ,  H05K2201/09945 ,  H05K2201/10378

摘要： An anisotropic electrically conductive adhesive film having fine through holes independently electroconductively passing through an insulating film in the thickness direction, at least one end portion of both the end portions of the each through hole on the front and back surfaces of said film being blocked with a bump-form metal projection having a larger base area than the area of the opening portion of the through hole, wherein the insulating film comprises a thermoplastic polyimide resin having a melt viscosity at 400.degree. C. of not higher than 1.times.10.sup.8 poise is disclosed. The film is interposed between materials to be connected to provide a connection structure.

摘要翻译： 一种各向异性导电粘合剂膜，其具有在厚度方向独立地通过绝缘膜的细通孔，所述膜的前表面和后表面上的每个通孔的两个端部的至少一个端部被阻挡 公开了具有比通孔的开口部的面积大的基底面积的凸起状金属突起，其中，绝缘膜包括在400℃下的熔融粘度为1×10 8泊以下的热塑性聚酰亚胺树脂。 该膜介于待连接的材料之间以提供连接结构。

公开(公告)号：US5578696A

公开(公告)日：1996-11-26

申请号：US223661

申请日：1994-04-06

申请人： Amane Mochizuki ,  Kazumi Higashi ,  Masako Maeda

发明人： Amane Mochizuki ,  Kazumi Higashi ,  Masako Maeda

IPC分类号： C08G73/10 ,  C09J179/08 ,  H05K3/38 ,  C08G69/26

CPC分类号： C08G73/1089 ,  C09J179/08 ,  H05K3/386 ,  Y10T428/31681 ,  Y10T428/31721

摘要： A heat-resistant adhesive film, an adhesion structure obtained using the same, and an adhesion method using the same are disclosed, the film comprising a polyisoimide resin containing at least 40 mol % of an isoimide unit represented by formula (I): ##STR1## wherein R.sub.1 represents a tetravalent aromatic or aliphatic residue; R.sub.2 represents a divalent aromatic or aliphatic residue; and the arrow represents a bond replaceable on isomerization, in the molecule thereof. The isoimide unit of the polyisoimide resin is easily converted to an imide unit on heating, e.g., hot pressing with an adherend, to provide a cover-lay film or a single-sided or double-sided base for printed circuit boards having excellent adhesion, heat resistance, dimensional precision, and workability.

摘要翻译： 公开了一种耐热粘合剂膜，使用其的粘合结构和使用其的粘合方法，所述膜包含含有至少40mol％由式（I）表示的异酰亚胺单元的聚异酰亚胺树脂：nt芳族 或脂族残基; R2表示二价芳族或脂族残基; 并且箭头表示在其分子中可异构化替代的键。 聚异酰亚胺树脂的异酰亚胺单元在加热时容易地转化为酰亚胺单元，例如用被粘物热压，以提供具有优异粘合性的印刷电路板的覆盖层或单面或双面基材， 耐热性，尺寸精度和可加工性。

公开(公告)号：US5374469A

公开(公告)日：1994-12-20

申请号：US945929

申请日：1992-09-17

申请人： Atsushi Hino ,  Amane Mochizuki ,  Kazuo Ouchi ,  Shoji Morita ,  Toshiki Naito ,  Kazumi Higashi ,  Masako Maeda ,  Masayuki Kaneto ,  Munekazu Tanaka ,  Masakazu Sugimoto

发明人： Atsushi Hino ,  Amane Mochizuki ,  Kazuo Ouchi ,  Shoji Morita ,  Toshiki Naito ,  Kazumi Higashi ,  Masako Maeda ,  Masayuki Kaneto ,  Munekazu Tanaka ,  Masakazu Sugimoto

IPC分类号： H05K1/00 ,  H05K1/03 ,  H05K3/00 ,  H05K3/20 ,  H05K3/28 ,  H05K3/40 ,  H05K3/42 ,  H05K3/46 ,  B32B9/00

CPC分类号： H05K3/4635 ,  H05K1/036 ,  H05K3/205 ,  H05K3/281 ,  H05K3/4007 ,  H05K3/421 ,  H05K3/4617 ,  H05K3/4632 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H05K1/0346 ,  H05K1/0393 ,  H05K2201/0129 ,  H05K2201/0154 ,  H05K2201/0195 ,  H05K2201/0347 ,  H05K2201/0355 ,  H05K2201/0358 ,  H05K2201/0367 ,  H05K2201/0394 ,  H05K2201/068 ,  H05K2201/09481 ,  H05K2201/10378 ,  H05K2203/0152 ,  H05K2203/0156 ,  H05K2203/0376 ,  H05K2203/063 ,  H05K2203/0726 ,  H05K2203/0733 ,  H05K2203/107 ,  H05K2203/1572 ,  H05K3/0035 ,  H05K3/28 ,  H05K3/423 ,  H05K3/427 ,  H05K3/4647 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/24942 ,  Y10T428/31721

摘要： A flexible printed substrate imparted with an adhesive property for loading on an external substrate, a double printed substrate having formed on both surfaces thereof a metal layer or a wiring circuit, and a multilayer substrate having a multilayer structure are disclosed. The flexible printed substrate comprises an insulating resin layer comprising a low-linear expansion polyimide resin layer and a thermoplastic polyimide resin layer, and a metal layer or a wiring circuit formed on the low-linear expansion polyimide resin layer of the insulating resin layer, wherein a mixed region of the polyimide resin components is formed in the interface between the low-linear expansion polyimide resin layer and the thermoplastic polyimide resin layer.

摘要翻译： 公开了一种赋予外部基板的粘合性的柔性印刷基板，在其两面形成金属层或布线电路的双面印刷基板以及具有多层结构的多层基板。 柔性印刷基板包括绝缘树脂层，其包含低线膨胀聚酰亚胺树脂层和热塑性聚酰亚胺树脂层，以及形成在绝缘树脂层的低线性膨胀聚酰亚胺树脂层上的金属层或布线电路，其中 在低线膨胀聚酰亚胺树脂层和热塑性聚酰亚胺树脂层之间的界面形成聚酰亚胺树脂成分的混合区域。

公开(公告)号：US5431863A

公开(公告)日：1995-07-11

申请号：US101817

申请日：1993-08-04

申请人： Amane Mochizuki ,  Masako Maeda ,  Masakazu Sugimoto ,  Munekazu Tanaka ,  Tetsuya Terada

发明人： Amane Mochizuki ,  Masako Maeda ,  Masakazu Sugimoto ,  Munekazu Tanaka ,  Tetsuya Terada

IPC分类号： C09J7/02 ,  C09J201/00 ,  H01L21/48 ,  H01L21/60 ,  H01L23/495 ,  H05K3/30 ,  H05K3/36 ,  B29C65/48 ,  B26F1/31

CPC分类号： H01L21/4803 ,  H01L23/49572 ,  H01L24/24 ,  H01L24/82 ,  H05K3/361 ,  H01L2224/24226 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H05K2201/09063 ,  H05K2201/10977 ,  H05K3/305

摘要： A method of mounting a semiconductor device including a film carrier having an insulating film having on one side thereof a connecting lead and a semiconductor element junctioned with the film carrier on an outer substrate, which includes forming an opening for adhesive forcing or adhesive injection in the insulating film within its bonding area to be in contact with a land part on the outer substrate and in an area near the bonding area, connecting the connecting lead to the land part on the outer substrate, and forcing or injecting an adhesive through the opening formed in the insulating film into the space between the film carrier and the outer substrate.

摘要翻译： 一种安装半导体器件的方法，所述半导体器件包括具有绝缘膜的膜载体，所述膜载体的一侧具有连接引线和与所述膜载体连接的外部基板上的半导体元件，所述半导体器件包括在所述外部基板上形成用于粘合剂强制或粘合剂注入的开口 在其接合区域内的绝缘膜与外基板上的接合部分和接合区域附近的区域接触，将连接引线连接到外基板上的接合部分，并且通过形成的开口迫使或注入粘合剂 在绝缘膜中进入薄膜载体和外基板之间的空间。

公开(公告)号：US5246834A

公开(公告)日：1993-09-21

申请号：US836859

申请日：1992-02-19

申请人： Akio Tsuji ,  Masako Maeda ,  Motoo Nakajima

发明人： Akio Tsuji ,  Masako Maeda ,  Motoo Nakajima

IPC分类号： G01N33/532 ,  C12Q1/66 ,  G01N33/535 ,  G01N33/543 ,  G01N33/58

CPC分类号： C12Q1/66 ,  G01N33/581

摘要： The present invention is intended to provide an EIA method utilizing bioluminescence using a firefly luciferase. The EIA method of the present invention is characterized by using an ATP-generating enzyme as a labeling enzyme, subjecting ATP generated to bioluminescence by the use of the firefly luciferase, and measuring the quantity of light emitted. Acetate kinase is a preferred enzyme used in the method.