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    Process for producing an anisotropic conductive film
    5.
    发明授权
    Process for producing an anisotropic conductive film 失效
    各向异性导电膜的制造方法

    公开(公告)号：US5188702A

    公开(公告)日：1993-02-23

    申请号：US872504

    申请日：1992-04-23

    申请人： Yoshinari Takayama ,  Amane Mochizuki ,  Atsushi Hino ,  Kazuo Ouchi ,  Masakazu Sugimoto

    发明人： Yoshinari Takayama ,  Amane Mochizuki ,  Atsushi Hino ,  Kazuo Ouchi ,  Masakazu Sugimoto

    IPC分类号： B29C37/00 ,  B44C1/22 ,  C23F1/00 ,  C23F4/02

    CPC分类号： H01R12/714

    摘要： An anisotropic conductive film is disclosed, comprising an insulating film having fine through-holes independently piercing the film in the thickness direction, each of the through-holes being filled with a metallic substance in such a manner that at least one end of each through-hole has a bump-like projection of said metallic substance having a bottom area larger than the opening of the through-hole. The metallic substance serving as a conducting path is prevented from falling off, and sufficient conductivity can be thus assured.

    摘要翻译： 公开了一种各向异性导电膜，其包括具有在厚度方向上独立地穿透膜的细孔的绝缘膜，每个通孔以金属物质填充，使得每个通孔的至少一端， 所述金属物质具有比通孔开口大的底面积的凸起状突起。 作为导电路径的金属物质被防止脱落，从而可以确保足够的导电性。

    Heat-resistant photoresist composition and negative-type pattern formation method
    6.
    发明授权
    Heat-resistant photoresist composition and negative-type pattern formation method 失效
    耐热光刻胶组合物和负型图案形成方法

    公开(公告)号：US5595856A

    公开(公告)日：1997-01-21

    申请号：US594720

    申请日：1996-01-31

    申请人： Amane Mochizuki ,  Michie Ishii ,  Masako Maeda ,  Kazumi Higashi

    发明人： Amane Mochizuki ,  Michie Ishii ,  Masako Maeda ,  Kazumi Higashi

    IPC分类号： C08L79/00 ,  G03F7/004 ,  G03F7/038

    CPC分类号： G03F7/0045 ,  G03F7/038

    摘要： A heat-resistant negative-working photoresist composition comprising a resin component having a carbodiimide unit in the molecule, and a compound capable of inducing a basic compound by irradiation with actinic rays. The photosensitive layer formed by the photoresist composition shows a sufficient sensitivity even by a lower irradiation energy and can give a sharp negative-type pattern by irradiation with actinic rays such as ultraviolet rays.

    摘要翻译： 一种耐热负性光致抗蚀剂组合物，其包含在分子中具有碳二亚胺单元的树脂组分和能够通过用光化射线照射而诱导碱性化合物的化合物。 由光致抗蚀剂组合物形成的感光层即使通过较低的照射能量显示出足够的灵敏度，并且可以通过用诸如紫外线的光化射线照射而产生尖锐的负型图案。

    Anisotropic electrically conductive adhesive film and connection structure using the same
    8.
    发明授权
    Anisotropic electrically conductive adhesive film and connection structure using the same 失效
    各向异性导电胶膜及其连接结构使用

    公开(公告)号：US5438223A

    公开(公告)日：1995-08-01

    申请号：US030865

    申请日：1993-03-12

    申请人： Kazumi Higashi ,  Amane Mochizuki ,  Masako Maeda

    发明人： Kazumi Higashi ,  Amane Mochizuki ,  Masako Maeda

    IPC分类号： H01L23/498 ,  H05K3/32 ,  H01L23/48 ,  H01L29/40 ,  H01L29/41

    CPC分类号： H05K3/321 ,  H01L23/49827 ,  H01L2224/83101 ,  H01L2924/01019 ,  H01L2924/01079 ,  H05K2201/0154 ,  H05K2201/09945 ,  H05K2201/10378

    摘要： An anisotropic electrically conductive adhesive film having fine through holes independently electroconductively passing through an insulating film in the thickness direction, at least one end portion of both the end portions of the each through hole on the front and back surfaces of said film being blocked with a bump-form metal projection having a larger base area than the area of the opening portion of the through hole, wherein the insulating film comprises a thermoplastic polyimide resin having a melt viscosity at 400.degree. C. of not higher than 1.times.10.sup.8 poise is disclosed. The film is interposed between materials to be connected to provide a connection structure.

    摘要翻译： 一种各向异性导电粘合剂膜，其具有在厚度方向独立地通过绝缘膜的细通孔，所述膜的前表面和后表面上的每个通孔的两个端部的至少一个端部被阻挡 公开了具有比通孔的开口部的面积大的基底面积的凸起状金属突起，其中，绝缘膜包括在400℃下的熔融粘度为1×10 8泊以下的热塑性聚酰亚胺树脂。 该膜介于待连接的材料之间以提供连接结构。

    Heat resistant adhesive film, an adhesion structure, and method of adhesion
    9.
    发明授权
    Heat resistant adhesive film, an adhesion structure, and method of adhesion 失效
    耐热粘合膜，粘合结构和粘合方法

    公开(公告)号：US5578696A

    公开(公告)日：1996-11-26

    申请号：US223661

    申请日：1994-04-06

    申请人： Amane Mochizuki ,  Kazumi Higashi ,  Masako Maeda

    发明人： Amane Mochizuki ,  Kazumi Higashi ,  Masako Maeda

    IPC分类号： C08G73/10 ,  C09J179/08 ,  H05K3/38 ,  C08G69/26

    CPC分类号： C08G73/1089 ,  C09J179/08 ,  H05K3/386 ,  Y10T428/31681 ,  Y10T428/31721

    摘要： A heat-resistant adhesive film, an adhesion structure obtained using the same, and an adhesion method using the same are disclosed, the film comprising a polyisoimide resin containing at least 40 mol % of an isoimide unit represented by formula (I): ##STR1## wherein R.sub.1 represents a tetravalent aromatic or aliphatic residue; R.sub.2 represents a divalent aromatic or aliphatic residue; and the arrow represents a bond replaceable on isomerization, in the molecule thereof. The isoimide unit of the polyisoimide resin is easily converted to an imide unit on heating, e.g., hot pressing with an adherend, to provide a cover-lay film or a single-sided or double-sided base for printed circuit boards having excellent adhesion, heat resistance, dimensional precision, and workability.

    摘要翻译： 公开了一种耐热粘合剂膜，使用其的粘合结构和使用其的粘合方法，所述膜包含含有至少40mol％由式（I）表示的异酰亚胺单元的聚异酰亚胺树脂：nt芳族 或脂族残基; R2表示二价芳族或脂族残基; 并且箭头表示在其分子中可异构化替代的键。 聚异酰亚胺树脂的异酰亚胺单元在加热时容易地转化为酰亚胺单元，例如用被粘物热压，以提供具有优异粘合性的印刷电路板的覆盖层或单面或双面基材， 耐热性，尺寸精度和可加工性。