公开(公告)号：US20130281559A1

公开(公告)日：2013-10-24

申请号：US13924877

申请日：2013-06-24

申请人： Baek Soung Park ,  Ki Tae SONG ,  Dong Seon UH ,  In Hwan KIM

发明人： Baek Soung Park ,  Ki Tae SONG ,  Dong Seon UH ,  In Hwan KIM

IPC分类号： C09J163/00

CPC分类号： C09J163/00 ,  C08L63/00 ,  C09J7/00 ,  C09J7/10 ,  H01L24/27 ,  H01L24/29 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L24/94 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/27436 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29386 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48145 ,  H01L2224/73215 ,  H01L2224/83191 ,  H01L2224/83862 ,  H01L2224/92165 ,  H01L2224/94 ,  H01L2225/06506 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2224/27 ,  H01L2924/05442 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012

摘要： An adhesive composition for a semiconductor has two exothermic peaks between 65° C. and 350° C. and has an area ratio of voids of less than 10%, measured after curing at 150° C. for 10 minutes and then at 150° C. for 30 minutes, and then molding at 175° C. for 60 seconds. A first exothermic peak appears between 65° C. and 185° C. and a second exothermic peak appears between 155° C. and 350° C.

摘要翻译： 用于半导体的粘合剂组合物在65℃和350℃之间具有两个放热峰，并且在150℃下固化10分钟然后在150℃下测量的空隙面积比小于10％ 30分钟，然后在175℃下成型60秒。 第一个放热峰出现在65°C和185°C之间，第二个放热峰出现在155°C和350°C之间。

公开(公告)号：US20130041088A1

公开(公告)日：2013-02-14

申请号：US13571574

申请日：2012-08-10

申请人： Baek Soung PARK ,  Ki Tae SONG ,  In Hwan KIM

发明人： Baek Soung PARK ,  Ki Tae SONG ,  In Hwan KIM

IPC分类号： C09J163/00

CPC分类号： C09J9/00 ,  C08G59/50 ,  C08G59/621 ,  C08G59/688 ,  C08L33/00 ,  C09J163/00 ,  H01L23/293 ,  H01L24/29 ,  H01L24/32 ,  H01L25/0657 ,  H01L2224/2929 ,  H01L2224/29298 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29386 ,  H01L2224/29387 ,  H01L2224/29388 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/83191 ,  H01L2224/92247 ,  H01L2924/01012 ,  H01L2924/01029 ,  H01L2924/181 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2924/0665 ,  H01L2924/00014 ,  H01L2924/05432 ,  H01L2924/0532 ,  H01L2924/05032 ,  H01L2924/05042 ,  H01L2924/0503

摘要： An adhesive composition for semiconductors, an adhesive film prepared using the adhesive composition, and a semiconductor device including the adhesive film, the adhesive composition exhibiting two exothermic peaks at temperatures ranging from 65° C. to 350° C., wherein a first exothermic peak appears at a lower temperature than a second exothermic peak, and the adhesive composition has a curing rate of about 70% to 100% in a first exothermic peak zone, as calculated by Equation 1: Curing rate=[(Heating value upon 0 cycle−Heating value after 1 cycle)/Heating value upon 0 cycle]×100.

摘要翻译： 一种用于半导体的粘合剂组合物，使用该粘合剂组合物制备的粘合剂膜和包含该粘合剂膜的半导体器件，该粘合剂组合物在65℃至350℃的温度范围内显示两个放热峰，其中第一放热峰 出现在比第二放热峰低的温度下，并且粘合剂组合物在第一放热峰区域中具有约70％至100％的固化速率，如由等式1计算的：固化速率= [（[0循环时的加热值] 1循环后的加热值）/ 0循环的加热值×100。

公开(公告)号：US20140306357A1

公开(公告)日：2014-10-16

申请号：US14315495

申请日：2014-06-26

申请人： Baek Soung PARK ,  Jae Won CHOI ,  Sung Min KIM ,  In Hwan KIM ,  Jun Woo LEE ,  Su MI IM

发明人： Baek Soung PARK ,  Jae Won CHOI ,  Sung Min KIM ,  In Hwan KIM ,  Jun Woo LEE ,  Su MI IM

IPC分类号： H01L23/544 ,  H01L21/70

CPC分类号： H01L23/544 ,  C09J7/20 ,  C09J2201/28 ,  C09J2201/36 ,  C09J2203/326 ,  H01L21/6836 ,  H01L21/70 ,  H01L24/27 ,  H01L2221/68327 ,  H01L2224/83191

摘要： A dicing die-bonding film and a method of forming a groove in a dicing die-bonding film, the film including a base film; a pressure-sensitive adhesive layer stacked on the base film; and a bonding layer stacked on the pressure-sensitive adhesive layer, wherein the pressure-sensitive adhesive layer includes a first region overlapping with the bonding layer, and a second region not overlapping with the bonding layer, the second region including a third region adjacent to the first region, and a fourth region adjacent to the third region and having a groove formed therein.

摘要翻译： 一种切割芯片接合薄膜和一种在切割芯片接合薄膜中形成凹槽的方法，该薄膜包括一个基膜; 叠层在基膜上的压敏粘合剂层; 以及层叠在所述粘合剂层上的接合层，其中，所述压敏粘合剂层包括与所述接合层重叠的第一区域和与所述接合层不重叠的第二区域，所述第二区域包括与所述接合层相邻的第三区域 所述第一区域和与所述第三区域相邻并且在其中形成有凹槽的第四区域。

公开(公告)号：US20140194555A1

公开(公告)日：2014-07-10

申请号：US14204128

申请日：2014-03-11

申请人： Jun Woo LEE ,  Sung Min KIM ,  In Hwan KIM ,  Baek Soung PARK ,  Su Mi LIM ,  Jae Won CHOI

发明人： Jun Woo LEE ,  Sung Min KIM ,  In Hwan KIM ,  Baek Soung PARK ,  Su Mi LIM ,  Jae Won CHOI

IPC分类号： C09J163/00

CPC分类号： C09J163/00 ,  C08K5/0025 ,  C08K5/3445 ,  C08L63/00 ,  C09J7/00 ,  C09J7/10 ,  C09J2201/622 ,  C09J2203/326 ,  C09J2205/102 ,  C09J2463/00 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L24/85 ,  H01L2224/27003 ,  H01L2224/27436 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/29387 ,  H01L2224/32145 ,  H01L2224/83191 ,  H01L2224/83885 ,  H01L2224/85 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2224/48 ,  H01L2924/05442 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

摘要： An adhesive composition for semiconductors, an adhesive film, and a semiconductor device, wherein, in a curing process including a first stage at a temperature ranging from 120° C. to 130° C. for 1 to 20 minutes, a second stage at a temperature ranging from 140° C. to 150° C. for 1 to 10 minutes, a third stage at a temperature ranging from 160° C. to 180° C. for 30 seconds to 10 minutes, and a fourth stage at a temperature ranging from 160° C. to 180° C. for 10 minutes to 2 hours, the adhesive film has a DSC curing rate in the first stage that is 40% or less of a total curing rate, a DSC curing rate in the fourth stage that is 30% to 60% higher than a DSC curing rate in the third stage, and DSC curing rates in each of the second and third stages that are 5% or more higher than a DSC curing rate of a preceding stage thereof.

摘要翻译： 一种用于半导体的粘合剂组合物，粘合剂膜和半导体器件，其中在包括在120℃至130℃的温度下进行1至20分钟的第一阶段的固化过程中，第二阶段在 温度范围为140℃至150℃，持续1至10分钟，第三阶段在160℃至180℃的温度下进行30秒至10分钟，第四阶段在温度范围 从160℃至180℃进行10分钟〜2小时，粘合膜的第一阶段的DSC固化速度为总固化速度的40％以下，第四阶段的DSC固化速度为 比第三阶段的DSC固化速度高30〜60％，第二阶段和第三阶段的DSC固化速度比前一阶段的DSC固化速度高5％以上。

公开(公告)号：US20140353848A1

公开(公告)日：2014-12-04

申请号：US14202006

申请日：2014-03-10

申请人： Baek Soung PARK ,  Jae Won CHOI ,  In Hwan KIM ,  Gyu Seok SONG ,  Su Mi LIM

发明人： Baek Soung PARK ,  Jae Won CHOI ,  In Hwan KIM ,  Gyu Seok SONG ,  Su Mi LIM

IPC分类号： H01L23/373 ,  H01L21/48

CPC分类号： H01L23/3737 ,  H01L21/4882 ,  H01L23/3121 ,  H01L23/36 ,  H01L25/0657 ,  H01L2224/16145 ,  H01L2224/45139 ,  H01L2224/48091 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/12044 ,  H01L2924/181 ,  Y10T428/2848 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2924/01049 ,  H01L2924/01004 ,  H01L2924/00012

摘要： A heat dissipation adhesive film, a semiconductor device including the same, and a method of fabricating the semiconductor device, the heat dissipation adhesive film being placeable between a protective layer encasing a semiconductor element therein and a heat dissipation metal layer on the protective layer to bond the protective layer to the heat dissipation metal layer, wherein an adhesive strength between the heat dissipation adhesive film and the protective layer and an adhesive strength between the heat dissipation adhesive film and the heat dissipation metal layer are each about 3 kgf/25 mm2 or greater.

摘要翻译： 散热粘合膜，包含该半导体装置的半导体装置以及制造该半导体装置的方法，散热粘合剂膜可放置在其中包围半导体元件的保护层与保护层上的散热金属层之间 散热金属层的保护层，其中散热粘合剂膜和保护层之间的粘合强度以及散热粘合剂膜和散热金属层之间的粘合强度分别为约3kgf / 25mm 2或更大 。

公开(公告)号：US20100031356A1

公开(公告)日：2010-02-04

申请号：US12391374

申请日：2009-02-24

申请人： Hyoung Kee CHOI ,  Se Hwa SONG ,  Eun Young LEE ,  Yi Jin IM ,  In Hwan KIM ,  Yae Hoe KIM

发明人： Hyoung Kee CHOI ,  Se Hwa SONG ,  Eun Young LEE ,  Yi Jin IM ,  In Hwan KIM ,  Yae Hoe KIM

IPC分类号： G06F21/00

CPC分类号： H04W12/12 ,  H04L63/1466 ,  H04W8/04 ,  H04W12/10 ,  H04W80/04

摘要： A binding update method in MIPv6 is provided which includes: a first step of allowing a mobile node to generate a HoTI (Home Test Init) message including a HoA (Home Address) encoded with a product of a first prime number and a second prime number and to transmit the HoTI message to a corresponding node through a home agent along with a first index; a second step of allowing the mobile node to generate a CoTI (Care of Test Init) message including a CoA (Care-of Address) encoded with a product of the first prime number and a third prime number and to transmit the CoTI message directly to the corresponding node along with a second index; a third step of allowing the corresponding node to generate a HoT (Home of Test) message including a first nonce and to transmit the HoT message to the mobile node through the home agent; a fourth step of allowing the corresponding node to generate a CoT (Care-of Test) message including a second nonce and to transmit the CoT message to the mobile node; a fifth step of allowing the mobile node to generate a BU (Binding Update) message by adding the first prime number to the first nonce and the second nonce included in the HoT message and the CoT message and to transmit the BU message to the corresponding node; and a sixth step of allowing the corresponding node to verify the BU message using an exclusive OR operation and a factorization operation in prime numbers with the first prime number and to transmit a BA (Binding Ack) message to the mobile node.

摘要翻译： 提供了一种MIPv6中的绑定更新方法，其包括：允许移动节点生成包含用第一素数和第二素数的乘积编码的HoA（归属地址）的HoTI（家庭测试初始化​​）消息的第一步骤 并且通过归属代理与第一索引一起将HoTI消息发送到对应的节点; 允许移动节点生成包含用第一素数和第三素数的乘积编码的CoA（转交地址）的CoTI（关怀测试初始）消息的第二步骤，并且将CoTI消息直接发送到 相应的节点连同第二个索引; 允许对应节点生成包括第一随机数的HoT（测试归属）消息并通过归属代理向移动节点发送HoT消息的第三步骤; 允许对应节点生成包括第二随机数的CoT（转交测试）消息并将CoT消息发送到移动节点的第四步骤; 第五步骤，通过将包括在HoT消息和CoT消息中的第一随机数和第二随机数添加第一素数并允许移动节点向相应节点发送BU消息来产生BU（绑定更新）消息 ; 以及允许相应节点使用异或运算和具有第一素数的质数的分解操作来验证该BU消息并向移动节点发送BA（绑定确认）消息的第六步骤。

公开(公告)号：US20090155412A1

公开(公告)日：2009-06-18

申请号：US12332472

申请日：2008-12-11

申请人： In Hwan KIM ,  Sun Mi Lee ,  Bo Mi Lee ,  Ji Eun Oh ,  Myung Chul Kim ,  Hye Kyung Park ,  Jong Wook Kim ,  Kwang II Kwon ,  Jee Young Kim ,  Jee Sun Lee

发明人： In Hwan KIM ,  Sun Mi Lee ,  Bo Mi Lee ,  Ji Eun Oh ,  Myung Chul Kim ,  Hye Kyung Park ,  Jong Wook Kim ,  Kwang II Kwon ,  Jee Young Kim ,  Jee Sun Lee

IPC分类号： A23D7/02 ,  A23D7/00

CPC分类号： A23D9/02 ,  C11C3/10 ,  C12Y301/01003

摘要： Disclosed herein is a method of preparing trans fat-free oils and fats by an enzymatic interesterification (EI), and trans fat-free oils and fats prepared by the method. Specifically, the method comprises the steps of: 1) mixing fully hydrogenated fat derived from vegetable oil with RBD olive oil; 2) adding lipase to the mixed oil and reacting the mixed oil with lipase at 65 to 80° C. for 1 to 4 hours (1st reaction step); and 3) reacting the mixed oil from step 2) with the lipase at 40 to 60° C. for 44 to 47 hours (2nd reaction step).

摘要翻译： 本文公开了通过酶促酯交换（EI）和通过该方法制备的反式无脂肪油和脂肪制备反式无脂肪油和脂肪的方法。 具体地说，该方法包括以下步骤：1）将来自植物油的完全氢化脂肪与RBD橄榄油混合; 2）向混合油中加入脂肪酶，并在65〜80℃下使混合油与脂肪酶反应1〜4小时（第1反应步骤）。 和3）将来自步骤2）的混合油与脂肪酶在40至60℃下反应44至47小时（第2反应步骤）。

公开(公告)号：US20120162052A1

公开(公告)日：2012-06-28

申请号：US13415462

申请日：2012-03-08

申请人： In Hwan KIM ,  Seung Chan BYUN ,  Jin Chul CHOI ,  Jin Hyoung KIM ,  Sang Keun LEE

发明人： In Hwan KIM ,  Seung Chan BYUN ,  Jin Chul CHOI ,  Jin Hyoung KIM ,  Sang Keun LEE

IPC分类号： G09G3/32

CPC分类号： G09G3/3233 ,  G09G3/3266 ,  G09G2300/0819 ,  G09G2300/0852 ,  G09G2310/0256 ,  G09G2310/0262

摘要： An electro-luminescence display having a plurality of pixels is disclosed. One of the pixels of the electro-luminescence display includes an electro-luminescence diode electrically connected between first and second voltage sources; first and second thin film transistors adjusting an amount of current flowing to the electro-luminescence diode; and a control circuit complementarily operating the first and second thin film transistors in an active mode and a refresh mode.

摘要翻译： 公开了具有多个像素的电致发光显示器。 电致发光显示器的像素之一包括电连接在第一和第二电压源之间的电致发光二极管; 第一和第二薄膜晶体管调节流向电致发光二极管的电流量; 以及以活动模式和刷新模式互补地操作第一和第二薄膜晶体管的控制电路。

公开(公告)号：US20080300023A1

公开(公告)日：2008-12-04

申请号：US12130743

申请日：2008-05-30

申请人： In Hwan KIM ,  Chang Soo KIM ,  Kwang Hyo SON

发明人： In Hwan KIM ,  Chang Soo KIM ,  Kwang Hyo SON

IPC分类号： H04M1/00

CPC分类号： H04M1/72522 ,  H04M1/7253

摘要： A mobile communication terminal including an input unit, a display unit, a receiving unit configured to receive a signal including at least one interactive function, a memory configured to store at least one symbol indicating a type of the at least one interactive function, and a control unit configured to detect the type of the interactive function included in the signal received by the receiving unit, to search the memory for the symbol indicating the at least one interactive function, to control the display unit to display the searched symbol, and to control an operation of the interactive function according to a signal provided via the input unit.

摘要翻译： 一种移动通信终端，包括输入单元，显示单元，被配置为接收包括至少一个交互功能的信号的接收单元，被配置为存储指示所述至少一个交互功能的类型的至少一个符号的存储器，以及 控制单元，被配置为检测由接收单元接收的信号中包括的交互功能的类型，以搜索存储器中指示至少一个交互功能的符号，以控制显示单元显示所搜索的符号，并且控制 根据经由输入单元提供的信号进行交互功能的操作。