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公开(公告)号：US20120314384A1
公开(公告)日：2012-12-13
申请号：US13156609
申请日：2011-06-09
CPC分类号： H05K3/0094 , B23K1/0016 , B23K35/24 , B23K35/36 , H01L21/76898 , H01L23/481 , H01L23/49827 , H01L23/49883 , H01L2224/0401 , H01L2224/0557 , H01L2224/06181 , H01L2224/13023 , H01L2224/131 , H01L2924/00014 , H01L2924/07811 , H01L2924/09701 , Y10T29/49165 , H01L2924/014 , H01L2924/00 , H01L2224/05552
摘要： A component can include a substrate having a first surface and a second surface remote therefrom, an opening extending in a direction between the first and second surfaces, and a conductive via extending within the opening. The substrate can have a CTE less than 10 ppm/° C. The conductive via can include a plurality of base particles each including a first region of a first metal substantially covered by a layer of a second metal different from the first metal. The base particles can be metallurgically joined together and the second metal layers of the particles can be at least partially diffused into the first regions. The conductive via can include voids interspersed between the joined base particles. The voids can occupy 10% or more of a volume of the conductive via.
摘要翻译： 部件可以包括具有第一表面和远离其的第二表面的基板，沿着第一和第二表面之间的方向延伸的开口以及在开口内延伸的导电通孔。 基底可以具有小于10ppm /℃的CTE。导电通孔可以包括多个基础颗粒，每个基底颗粒包括基本上被不同于第一金属的第二金属层覆盖的第一金属的第一区域。 基础颗粒可以冶金学连接在一起，并且颗粒的第二金属层可以至少部分地扩散到第一区域中。 导电通孔可以包括散布在接合的基础颗粒之间的空隙。 空隙可以占据导电通孔体积的10％或更多。
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公开(公告)号：US08723049B2
公开(公告)日：2014-05-13
申请号：US13156609
申请日：2011-06-09
IPC分类号： H05K1/11
CPC分类号： H05K3/0094 , B23K1/0016 , B23K35/24 , B23K35/36 , H01L21/76898 , H01L23/481 , H01L23/49827 , H01L23/49883 , H01L2224/0401 , H01L2224/0557 , H01L2224/06181 , H01L2224/13023 , H01L2224/131 , H01L2924/00014 , H01L2924/07811 , H01L2924/09701 , Y10T29/49165 , H01L2924/014 , H01L2924/00 , H01L2224/05552
摘要： A component can include a substrate having a first surface and a second surface remote therefrom, an opening extending in a direction between the first and second surfaces, and a conductive via extending within the opening. The substrate can have a CTE less than 10 ppm/° C. The conductive via can include a plurality of base particles each including a first region of a first metal substantially covered by a layer of a second metal different from the first metal. The base particles can be metallurgically joined together and the second metal layers of the particles can be at least partially diffused into the first regions. The conductive via can include voids interspersed between the joined base particles. The voids can occupy 10% or more of a volume of the conductive via.
摘要翻译： 部件可以包括具有第一表面和远离其的第二表面的基板，沿着第一和第二表面之间的方向延伸的开口以及在开口内延伸的导电通孔。 基底可以具有小于10ppm /℃的CTE。导电通孔可以包括多个基础颗粒，每个基底颗粒包括基本上被不同于第一金属的第二金属层覆盖的第一金属的第一区域。 基础颗粒可以冶金学连接在一起，并且颗粒的第二金属层可以至少部分地扩散到第一区域中。 导电通孔可以包括散布在接合的基础颗粒之间的空隙。 空隙可以占据导电通孔体积的10％或更多。
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公开(公告)号：US08785790B2
公开(公告)日：2014-07-22
申请号：US13293698
申请日：2011-11-10
申请人： Cyprian Emeka Uzoh , Charles G. Woychik , Terrence Caskey , Belgacem Haba , Hiroaki Sato , Philip Damberg
发明人： Cyprian Emeka Uzoh , Charles G. Woychik , Terrence Caskey , Belgacem Haba , Hiroaki Sato , Philip Damberg
CPC分类号： H05K1/115 , H01L23/14 , H01L23/49827 , H01L23/49866 , H01L2924/0002 , H05K1/03 , H05K1/09 , H05K3/42 , H05K2201/0141 , H05K2201/0175 , H05K2201/09509 , H05K2201/10378 , H05K2203/025 , H05K2203/1105 , Y10T29/49165 , H01L2924/00
摘要： A component includes a support structure having first and second spaced-apart and parallel surfaces and a plurality of conductive elements extending in a direction between the first and second surfaces. Each conductive element contains an alloy of a wiring metal selected from the group consisting of copper, aluminum, nickel and chromium, and an additive selected from the group consisting of Gallium, Germanium, Indium, Selenium, Tin, Sulfur, Silver, Phosphorus, and Bismuth. The alloy has a composition that varies with distance in at least one direction across the conductive element. A concentration of the additive is less than or equal to 5% of the total atomic mass of the conductive element, and a resistivity of the conductive element is between 2.5 and 30 micro-ohm-centimeter.
摘要翻译： 组件包括具有第一和第二间隔开并平行表面的支撑结构以及沿第一和第二表面之间的方向延伸的多个导电元件。 每个导电元件包含选自铜，铝，镍和铬的布线金属的合金和选自由镓，锗，铟，硒，锡，硫，银，磷和 铋。 该合金具有随导电元件的至少一个方向上的距离而变化的组成。 添加剂的浓度小于或等于导电元件的总原子质量的5％，并且导电元件的电阻率在2.5至30微欧姆厘米之间。
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公开(公告)号：US08846447B2
公开(公告)日：2014-09-30
申请号：US13593118
申请日：2012-08-23
IPC分类号： H01L23/00 , H01L23/498 , H01L21/683 , G01R31/28 , H01L25/04 , H01L21/66
CPC分类号： H01L22/32 , G01R31/2886 , H01L21/6835 , H01L22/14 , H01L23/49811 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/17 , H01L24/81 , H01L25/04 , H01L25/0652 , H01L25/50 , H01L2221/68327 , H01L2221/68331 , H01L2221/6834 , H01L2221/68381 , H01L2224/11015 , H01L2224/11849 , H01L2224/13014 , H01L2224/13082 , H01L2224/14131 , H01L2224/14135 , H01L2224/16111 , H01L2224/16112 , H01L2224/16146 , H01L2224/16147 , H01L2224/16237 , H01L2224/16257 , H01L2224/16267 , H01L2224/16503 , H01L2224/17051 , H01L2224/8109 , H01L2224/81138 , H01L2224/8114 , H01L2224/81191 , H01L2224/81385 , H01L2224/81815 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2225/06565 , H01L2924/00011 , H01L2924/01322 , H01L2924/014 , H01L2924/07811 , H01L2924/12 , H01L2924/14 , H01L2924/15788 , H01L2924/181 , H01L2924/00 , H01L2224/81805
摘要： A method of attaching a microelectronic element to a substrate can include aligning the substrate with a microelectronic element, the microelectronic element having a plurality of spaced-apart electrically conductive bumps each including a bond metal, and reflowing the bumps. The bumps can be exposed at a front surface of the microelectronic element. The substrate can have a plurality of spaced-apart recesses extending from a first surface thereof. The recesses can each have at least a portion of one or more inner surfaces that are non-wettable by the bond metal of which the bumps are formed. The reflowing of the bumps can be performed so that at least some of the bond metal of each bump liquefies and flows at least partially into one of the recesses and solidifies therein such that the reflowed bond material in at least some of the recesses mechanically engages the substrate.
摘要翻译： 将微电子元件附接到衬底的方法可以包括将衬底与微电子元件对准，微电子元件具有多个间隔开的导电凸块，每个包括接合金属，并且回流凸块。 凸起可以暴露在微电子元件的前表面处。 衬底可以具有从其第一表面延伸的多个间隔开的凹部。 这些凹部各自可以具有一个或多个内表面的至少一部分，该内表面不被其形成凸起的粘结金属润湿。 可以进行凸块的回流，使得每个凸块的至少一些粘结金属液化并且至少部分地流入其中一个凹部并在其中固化，使得至少一些凹部中的回流焊接材料机械地接合 基质。
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公开(公告)号：US08772946B2
公开(公告)日：2014-07-08
申请号：US13492064
申请日：2012-06-08
申请人： Cyprian Emeka Uzoh , Charles G. Woychik , Terrence Caskey , Kishor V. Desai , Huailiang Wei , Craig Mitchell , Belgacem Haba
发明人： Cyprian Emeka Uzoh , Charles G. Woychik , Terrence Caskey , Kishor V. Desai , Huailiang Wei , Craig Mitchell , Belgacem Haba
CPC分类号： H01L23/34 , H01L21/76841 , H01L21/76883 , H01L21/76885 , H01L21/76898 , H01L23/147 , H01L23/481 , H01L23/49811 , H01L23/49827 , H01L24/05 , H01L24/10 , H01L24/13 , H01L2224/0401 , H01L2224/05558 , H01L2224/05567 , H01L2224/0557 , H01L2224/05571 , H01L2224/1134 , H01L2224/1147 , H01L2224/13082 , H01L2224/13083 , H01L2224/13124 , H01L2224/13147 , H01L2224/13155 , H01L2224/13184 , H01L2224/13565 , H01L2224/32105 , H01L2924/00011 , H01L2924/01322 , H01L2924/07811 , H01L2924/12042 , H01L2924/00 , H01L2924/00012 , H01L2924/00014 , H01L2924/014 , H01L2224/81805
摘要： A component can include a substrate and a conductive via extending within an opening in the substrate. The substrate can have first and second opposing surfaces. The opening can extend from the first surface towards the second surface and can have an inner wall extending away from the first surface. A dielectric material can be exposed at the inner wall. The conductive via can define a relief channel within the opening adjacent the first surface. The relief channel can have an edge within a first distance from the inner wall in a direction of a plane parallel to and within five microns below the first surface, the first distance being the lesser of one micron and five percent of a maximum width of the opening in the plane. The edge can extend along the inner wall to span at least five percent of a circumference of the inner wall.
摘要翻译： 部件可以包括在基板的开口内延伸的基板和导电通孔。 基底可以具有第一和第二相对表面。 开口可以从第一表面延伸到第二表面，并且可以具有远离第一表面延伸的内壁。 电介质材料可以在内壁暴露。 导电通孔可以在邻近第一表面的开口内限定释放通道。 释放通道可以具有在与第一表面平行且在五微米以内的平面的方向上离内壁的第一距离内的边缘，第一距离是最小宽度的一微米和百分之五的最小宽度 在飞机上开了 边缘可以沿着内壁延伸以跨越内壁的圆周的至少百分之五。
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公开(公告)号：US20140054763A1
公开(公告)日：2014-02-27
申请号：US13593118
申请日：2012-08-23
IPC分类号： H01L23/00 , H01L23/498
CPC分类号： H01L22/32 , G01R31/2886 , H01L21/6835 , H01L22/14 , H01L23/49811 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/17 , H01L24/81 , H01L25/04 , H01L25/0652 , H01L25/50 , H01L2221/68327 , H01L2221/68331 , H01L2221/6834 , H01L2221/68381 , H01L2224/11015 , H01L2224/11849 , H01L2224/13014 , H01L2224/13082 , H01L2224/14131 , H01L2224/14135 , H01L2224/16111 , H01L2224/16112 , H01L2224/16146 , H01L2224/16147 , H01L2224/16237 , H01L2224/16257 , H01L2224/16267 , H01L2224/16503 , H01L2224/17051 , H01L2224/8109 , H01L2224/81138 , H01L2224/8114 , H01L2224/81191 , H01L2224/81385 , H01L2224/81815 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2225/06565 , H01L2924/00011 , H01L2924/01322 , H01L2924/014 , H01L2924/07811 , H01L2924/12 , H01L2924/14 , H01L2924/15788 , H01L2924/181 , H01L2924/00 , H01L2224/81805
摘要： A method of attaching a microelectronic element to a substrate can include aligning the substrate with a microelectronic element, the microelectronic element having a plurality of spaced-apart electrically conductive bumps each including a bond metal, and reflowing the bumps. The bumps can be exposed at a front surface of the microelectronic element. The substrate can have a plurality of spaced-apart recesses extending from a first surface thereof. The recesses can each have at least a portion of one or more inner surfaces that are non-wettable by the bond metal of which the bumps are formed. The reflowing of the bumps can be performed so that at least some of the bond metal of each bump liquefies and flows at least partially into one of the recesses and solidifies therein such that the reflowed bond material in at least some of the recesses mechanically engages the substrate.
摘要翻译： 将微电子元件附接到衬底的方法可以包括将衬底与微电子元件对准，微电子元件具有多个间隔开的导电凸块，每个包括接合金属，并且回流凸块。 凸起可以暴露在微电子元件的前表面处。 衬底可以具有从其第一表面延伸的多个间隔开的凹部。 这些凹部各自可以具有一个或多个内表面的至少一部分，该内表面不被其形成凸起的粘结金属润湿。 可以进行凸块的回流，使得每个凸块的至少一些粘结金属液化并且至少部分地流入其中一个凹部并在其中固化，使得至少一些凹部中的回流焊接材料机械地接合 基质。
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公开(公告)号：US20130328186A1
公开(公告)日：2013-12-12
申请号：US13492064
申请日：2012-06-08
申请人： Cyprian Emeka Uzoh , Charles G. Woychik , Terrence Caskey , Kishor V. Desai , Huailiang Wei , Craig Mitchell , Belgacem Haba
发明人： Cyprian Emeka Uzoh , Charles G. Woychik , Terrence Caskey , Kishor V. Desai , Huailiang Wei , Craig Mitchell , Belgacem Haba
IPC分类号： H01L23/48 , H01L21/28 , H01L23/498
CPC分类号： H01L23/34 , H01L21/76841 , H01L21/76883 , H01L21/76885 , H01L21/76898 , H01L23/147 , H01L23/481 , H01L23/49811 , H01L23/49827 , H01L24/05 , H01L24/10 , H01L24/13 , H01L2224/0401 , H01L2224/05558 , H01L2224/05567 , H01L2224/0557 , H01L2224/05571 , H01L2224/1134 , H01L2224/1147 , H01L2224/13082 , H01L2224/13083 , H01L2224/13124 , H01L2224/13147 , H01L2224/13155 , H01L2224/13184 , H01L2224/13565 , H01L2224/32105 , H01L2924/00011 , H01L2924/01322 , H01L2924/07811 , H01L2924/12042 , H01L2924/00 , H01L2924/00012 , H01L2924/00014 , H01L2924/014 , H01L2224/81805
摘要： A component can include a substrate and a conductive via extending within an opening in the substrate. The substrate can have first and second opposing surfaces. The opening can extend from the first surface towards the second surface and can have an inner wall extending away from the first surface. A dielectric material can be exposed at the inner wall. The conductive via can define a relief channel within the opening adjacent the first surface. The relief channel can have an edge within a first distance from the inner wall in a direction of a plane parallel to and within five microns below the first surface, the first distance being the lesser of one micron and five percent of a maximum width of the opening in the plane. The edge can extend along the inner wall to span at least five percent of a circumference of the inner wall.
摘要翻译： 部件可以包括在基板的开口内延伸的基板和导电通孔。 基底可以具有第一和第二相对表面。 开口可以从第一表面延伸到第二表面，并且可以具有远离第一表面延伸的内壁。 电介质材料可以在内壁暴露。 导电通孔可以在邻近第一表面的开口内限定释放通道。 释放通道可以具有在与第一表面平行且在五微米以内的平面的方向上离内壁的第一距离内的边缘，第一距离是最小宽度的一微米和百分之五的最小宽度 在飞机上开了 边缘可以沿着内壁延伸以跨越内壁的圆周的至少百分之五。
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公开(公告)号：US20130118784A1
公开(公告)日：2013-05-16
申请号：US13293698
申请日：2011-11-10
CPC分类号： H05K1/115 , H01L23/14 , H01L23/49827 , H01L23/49866 , H01L2924/0002 , H05K1/03 , H05K1/09 , H05K3/42 , H05K2201/0141 , H05K2201/0175 , H05K2201/09509 , H05K2201/10378 , H05K2203/025 , H05K2203/1105 , Y10T29/49165 , H01L2924/00
摘要： A component includes a support structure having first and second spaced-apart and parallel surfaces and a plurality of conductive elements extending in a direction between the first and second surfaces. Each conductive element contains an alloy of a wiring metal selected from the group consisting of copper, aluminum, nickel and chromium, and an additive selected from the group consisting of Gallium, Germanium, Indium, Selenium, Tin, Sulfur, Silver, Phosphorus, and Bismuth. The alloy has a composition that varies with distance in at least one direction across the conductive element. A concentration of the additive is less than or equal to 5% of the total atomic mass of the conductive element, and a resistivity of the conductive element is between 2.5 and 30 micro-ohm-centimeter.
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公开(公告)号：US20130001757A1
公开(公告)日：2013-01-03
申请号：US13173883
申请日：2011-06-30
申请人： Chok Chia , Qwai Low , Kishor Desai , Charles G. Woychik
发明人： Chok Chia , Qwai Low , Kishor Desai , Charles G. Woychik
IPC分类号： H01L23/495 , H01R43/16 , H01L21/50 , H01L23/34 , H01L21/60
CPC分类号： H01L23/49575 , H01L23/3107 , H01L23/4334 , H01L23/49541 , H01L23/49548 , H01L24/13 , H01L24/16 , H01L24/32 , H01L25/105 , H01L2224/11332 , H01L2224/13111 , H01L2224/13113 , H01L2224/13139 , H01L2224/13147 , H01L2224/1329 , H01L2224/13311 , H01L2224/13313 , H01L2224/13339 , H01L2224/13347 , H01L2224/1339 , H01L2224/13401 , H01L2224/16245 , H01L2224/291 , H01L2224/32245 , H01L2224/73253 , H01L2224/81192 , H01L2224/8184 , H01L2225/1029 , H01L2225/1058 , H01L2225/1094 , H01L2924/01322 , H01L2924/01327 , H01L2924/07811 , Y10T29/49204 , H01L2924/00014 , H01L2924/01083 , H01L2924/014 , H01L2924/00
摘要： A microelectronic unit can include a lead frame and a device chip. The lead frame can have a plurality of monolithic lead fingers extending in a plane of the lead frame. Each lead finger can have a fan-out portion and a chip connection portion extending in the lead frame plane. The fan-out portions can have first and second opposed surfaces and a first thickness in a first direction between the opposed surfaces. The chip connection portions can have a second thickness smaller than the first thickness. The chip connection portions can define a recess below the first surface. The device chip can have a plurality of at least one of passive devices or active devices. The device chip can have contacts thereon facing the chip connection portions and electrically coupled thereto. At least a portion of a thickness of the device chip can extend within the recess.
摘要翻译： 微电子单元可以包括引线框架和器件芯片。 引线框架可以具有在引线框架的平面中延伸的多个单片引线指。 每个引线指可以具有在引线框架平面中延伸的扇出部分和芯片连接部分。 扇出部分可以在相对的表面之间具有第一和第二相对表面以及在第一方向上的第一厚度。 芯片连接部分可以具有小于第一厚度的第二厚度。 芯片连接部分可以限定第一表面下方的凹陷。 器件芯片可以具有多个无源器件或有源器件中的至少一个。 器件芯片可以具有面向芯片连接部分并且与其电耦合的触点。 装置芯片的厚度的至少一部分可以在凹部内延伸。
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公开(公告)号：US08525309B2
公开(公告)日：2013-09-03
申请号：US13173883
申请日：2011-06-30
申请人： Chok Chia , Qwai Low , Kishor Desai , Charles G. Woychik
发明人： Chok Chia , Qwai Low , Kishor Desai , Charles G. Woychik
IPC分类号： H01L23/495 , H01L21/50 , H01L23/34 , H01L21/60 , H01R43/16
CPC分类号： H01L23/49575 , H01L23/3107 , H01L23/4334 , H01L23/49541 , H01L23/49548 , H01L24/13 , H01L24/16 , H01L24/32 , H01L25/105 , H01L2224/11332 , H01L2224/13111 , H01L2224/13113 , H01L2224/13139 , H01L2224/13147 , H01L2224/1329 , H01L2224/13311 , H01L2224/13313 , H01L2224/13339 , H01L2224/13347 , H01L2224/1339 , H01L2224/13401 , H01L2224/16245 , H01L2224/291 , H01L2224/32245 , H01L2224/73253 , H01L2224/81192 , H01L2224/8184 , H01L2225/1029 , H01L2225/1058 , H01L2225/1094 , H01L2924/01322 , H01L2924/01327 , H01L2924/07811 , Y10T29/49204 , H01L2924/00014 , H01L2924/01083 , H01L2924/014 , H01L2924/00
摘要： A microelectronic unit can include a lead frame and a device chip. The lead frame can have a plurality of monolithic lead fingers extending in a plane of the lead frame. Each lead finger can have a fan-out portion and a chip connection portion extending in the lead frame plane. The fan-out portions can have first and second opposed surfaces and a first thickness in a first direction between the opposed surfaces. The chip connection portions can have a second thickness smaller than the first thickness. The chip connection portions can define a recess below the first surface. The device chip can have a plurality of at least one of passive devices or active devices. The device chip can have contacts thereon facing the chip connection portions and electrically coupled thereto. At least a portion of a thickness of the device chip can extend within the recess.
摘要翻译： 微电子单元可以包括引线框架和器件芯片。 引线框架可以具有在引线框架的平面中延伸的多个单片引线指。 每个引线指可以具有在引线框架平面中延伸的扇出部分和芯片连接部分。 扇出部分可以在相对的表面之间具有第一和第二相对表面以及在第一方向上的第一厚度。 芯片连接部分可以具有小于第一厚度的第二厚度。 芯片连接部分可以限定第一表面下方的凹陷。 器件芯片可以具有多个无源器件或有源器件中的至少一个。 器件芯片可以具有面向芯片连接部分并且与其电耦合的触点。 装置芯片的厚度的至少一部分可以在凹部内延伸。
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