公开(公告)号：US06955849B2

公开(公告)日：2005-10-18

申请号：US10854598

申请日：2004-05-26

申请人： Brian E. Curcio ,  Frank D. Egitto ,  Robert M. Japp ,  Thomas R. Miller ,  Manh-Quan T. Nguyen ,  Douglas O. Powell

发明人： Brian E. Curcio ,  Frank D. Egitto ,  Robert M. Japp ,  Thomas R. Miller ,  Manh-Quan T. Nguyen ,  Douglas O. Powell

IPC分类号： H01L21/48 ,  H05K3/40 ,  H05K3/46 ,  B32B3/00 ,  B32B7/12

CPC分类号： H01L21/486 ,  H05K3/4069 ,  H05K3/4614 ,  H05K3/462 ,  H05K2201/09536 ,  H05K2201/096 ,  H05K2203/0191 ,  H05K2203/0264 ,  H05K2203/061 ,  H05K2203/1152 ,  Y10S438/976 ,  Y10T29/49165 ,  Y10T428/24917 ,  Y10T428/28 ,  Y10T428/2804 ,  Y10T428/2839 ,  Y10T428/2848

摘要： A method for producing small pitch z-axis electrical interconnections in layers of dielectric materials which are applied to printed wiring boards and diverse electronic packages. A method for parallel fabrication of intermediate structures which are subsequently jointed to form a final structure. In addition there is provided a z-interconnected electrical structure, employing dielectric materials such as resin coated copper, employable in the manufacture of diverse type of electronic packages, including printed wiring boards (PWBs), substrates, multi-chip modules and the like.

摘要翻译： 一种用于在印刷电路板和各种电子封装上施加介电材料层的小间距z轴电互连的方法。 一种用于平行制造中间结构的方法，其随后连接以形成最终结构。 此外，提供了一种采用诸如树脂涂覆铜之类的介电材料的z互连电结构，可用于制造包括印刷线路板（PWB），基板，多芯片模块等的各种类型的电子封装。

公开(公告)号：US06790305B2

公开(公告)日：2004-09-14

申请号：US10266652

申请日：2002-10-08

申请人： Brian E. Curcio ,  Frank D. Egitto ,  Robert M. Japp ,  Thomas R. Miller ,  Manh-Quan T. Nguyen ,  Douglas O. Powell

发明人： Brian E. Curcio ,  Frank D. Egitto ,  Robert M. Japp ,  Thomas R. Miller ,  Manh-Quan T. Nguyen ,  Douglas O. Powell

IPC分类号： B32B3114

CPC分类号： H01L21/486 ,  H05K3/4069 ,  H05K3/4614 ,  H05K3/462 ,  H05K2201/09536 ,  H05K2201/096 ,  H05K2203/0191 ,  H05K2203/0264 ,  H05K2203/061 ,  H05K2203/1152 ,  Y10S438/976 ,  Y10T29/49165 ,  Y10T428/24917 ,  Y10T428/28 ,  Y10T428/2804 ,  Y10T428/2839 ,  Y10T428/2848

摘要： A method for producing small pitch z-axis electrical interconnections in layers of dielectric materials which are applied to printed wiring boards and diverse electronic packages. A method for parallel fabrication of intermediate structures which are subsequently jointed to form a final structure. In addition there is provided a z-interconnected electrical structure, employing dielectric materials such as resin coated copper, employable in the manufacture of diverse type of electronic packages, including printed wiring boards (PWBs), substrates, multi-chip modules and the like.

摘要翻译： 一种用于在印刷电路板和各种电子封装上施加介电材料层的小间距z轴电互连的方法。 一种用于平行制造中间结构的方法，其随后连接以形成最终结构。 此外，提供了一种采用诸如树脂涂覆铜之类的介电材料的z互连电结构，可用于制造包括印刷线路板（PWB），基板，多芯片模块等的各种类型的电子封装。

公开(公告)号：US06518516B2

公开(公告)日：2003-02-11

申请号：US10121821

申请日：2002-04-11

申请人： Kim J. Blackwell ,  Frank D. Egitto ,  Voya R. Markovich ,  Manh-Quan T. Nguyen ,  Douglas O. Powell ,  David L. Thomas

发明人： Kim J. Blackwell ,  Frank D. Egitto ,  Voya R. Markovich ,  Manh-Quan T. Nguyen ,  Douglas O. Powell ,  David L. Thomas

IPC分类号： H01K909

CPC分类号： H01L23/50 ,  H01L23/5383 ,  H01L23/5385 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/3025 ,  H05K3/429 ,  H05K3/4602 ,  H05K3/4623 ,  H05K3/4641 ,  H05K2201/09309 ,  H05K2201/09536 ,  Y10T29/49165 ,  H01L2224/0401

摘要： A multilayered laminate, substructures and associated methods of fabrication are presented. The multilayered laminate includes in sequential order: (a) a first intermediate layer having microvias and conductive lands; (b) a plurality of signal/power plane substructures, wherein a dielectric material of an intervening dielectric layer insulatively separates each pair of successive signal/power plane substructures and (c) a second intermediate layer having microvias and conductive lands.

公开(公告)号：US07083901B2

公开(公告)日：2006-08-01

申请号：US10262724

申请日：2002-10-01

申请人： Frank D. Egitto ,  Voya Markovich ,  Thomas R. Miller ,  Douglas O. Powell ,  James R. Wilcox

发明人： Frank D. Egitto ,  Voya Markovich ,  Thomas R. Miller ,  Douglas O. Powell ,  James R. Wilcox

IPC分类号： G03C5/00 ,  H01K3/00

CPC分类号： H05K3/4069 ,  H05K3/062 ,  H05K3/108 ,  H05K3/423 ,  H05K3/44 ,  H05K3/445 ,  H05K3/4614 ,  H05K2201/0347 ,  H05K2201/0355 ,  H05K2201/0394 ,  H05K2201/09554 ,  H05K2203/025 ,  H05K2203/0384 ,  H05K2203/0733 ,  H05K2203/1152 ,  H05K2203/1461 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T29/49179

摘要： A layer for use in a modular assemblage for supporting ICES is formed with metal contacts for assembly by making a sandwich of metal interconnect members between two layers of dielectric; drilling holes through the dielectric, stopping on a metal layer bonded to the bottom surface of the module; forming blind holes stopping on the interconnect members; and plating metal through the volume of the via, both full and blind holes, thereby forming vertical and horizontal connections in a layer that be stacked to form complex interconnect assemblies.

摘要翻译： 用于支撑ICES的模块化组件中的层由用于组装的金属触点形成，通过在两层电介质之间制造金属互连构件的夹层; 通过电介质钻孔，停止在与模块底面接合的金属层上; 形成在所述互连构件上停止的盲孔; 并通过通孔的体积电镀金属孔，这两个孔都是盲孔，从而在堆叠形成复杂互连组件的层中形成垂直和水平连接。

公开(公告)号：US06881072B2

公开(公告)日：2005-04-19

申请号：US10263510

申请日：2002-10-01

申请人： Frank D. Egitto ,  Keith J. Miller ,  Manh-Quan T. Nguyen

发明人： Frank D. Egitto ,  Keith J. Miller ,  Manh-Quan T. Nguyen

IPC分类号： G01R1/067 ,  G01R1/073 ,  H05K3/20 ,  H05K3/40 ,  H05K3/42 ,  H01R12/00

CPC分类号： G01R1/06733 ,  G01R1/0735 ,  H01R12/52 ,  H01R12/7082 ,  H01R12/714 ,  H01R2201/20 ,  H05K3/205 ,  H05K3/4007 ,  H05K3/423 ,  H05K2201/0367 ,  H05K2201/09745 ,  H05K2201/09845 ,  H05K2201/10378 ,  H05K2203/0369 ,  H05K2203/0733 ,  Y10T29/4922

摘要： A structure and method to establish an electrical connection between a tester and an electrical component. A flexible dielectric layer has a first side and a second side. A through via extends through the first side and the second side of the dielectric layer. A blind via is placed in a position that is offset from the through via and extends laterally in a first direction from a section of the first through via to a section of the flexible dielectric layer. The blind via extends in a second direction from the first side of the flexible dielectric layer to a section of the flexible dielectric layer that is between the first side and the second side of the dielectric layer. An electrically conductive member extends through the through via and extends into the blind via, thereby filling the through via and the blind via. The electrically conductive member has a first surface and a second surface. Any distance between the first surface and the second surface is greater than a distance between the first side of the dielectric layer and the second side of the dielectric layer.

公开(公告)号：US07011531B2

公开(公告)日：2006-03-14

申请号：US11031859

申请日：2005-01-07

申请人： Frank D. Egitto ,  Keith J. Miller ,  Manh-Quan T. Nguyen

发明人： Frank D. Egitto ,  Keith J. Miller ,  Manh-Quan T. Nguyen

IPC分类号： H01R12/00

CPC分类号： G01R1/06733 ,  G01R1/0735 ,  H01R12/52 ,  H01R12/7082 ,  H01R12/714 ,  H01R2201/20 ,  H05K3/205 ,  H05K3/4007 ,  H05K3/423 ,  H05K2201/0367 ,  H05K2201/09745 ,  H05K2201/09845 ,  H05K2201/10378 ,  H05K2203/0369 ,  H05K2203/0733 ,  Y10T29/4922

摘要： A structure and method to establish an electrical connection between a tester and an electrical component. A flexible dielectric layer has a first side and a second side. A through via extends through the first side and the second side of the dielectric layer. A blind via is placed in a position that is offset from the through via and extends laterally in a first direction from a section of the first through via to a section of the flexible dielectric layer. The blind via extends in a second direction from the first side of the flexible dielectric layer to a section of the flexible dielectric layer that is between the first side and the second side of the dielectric layer. An electrically conductive member extends through the through via and extends into the blind via, thereby filling the through via and the blind via. The electrically conductive member has a first surface and a second surface. Any distance between the first surface and the second surface is greater than a distance between the first side of the dielectric layer and the second side of the dielectric layer.

摘要翻译： 一种在测试仪和电气部件之间建立电气连接的结构和方法。 柔性介电层具有第一面和第二面。 通孔延伸穿过电介质层的第一侧和第二侧。 盲通孔放置在从通孔偏移的位置，并且在从第一通孔的一部分到柔性介电层的一部分的第一方向上横向延伸。 盲孔从柔性介电层的第一侧沿第二方向延伸到介电层的第一侧和第二侧之间的柔性介电层的一部分。 导电构件延伸穿过通孔并延伸到盲孔中，从而填充通孔和盲孔。 导电构件具有第一表面和第二表面。 第一表面和第二表面之间的任何距离都大于电介质层的第一面和电介质层的第二面之间的距离。

公开(公告)号：US20080217050A1

公开(公告)日：2008-09-11

申请号：US11873435

申请日：2007-10-17

申请人： Frank D. Egitto ,  Donald S. Farquhar ,  Voya R. Markovich ,  Mark D. Poliks ,  Douglas O. Powell

发明人： Frank D. Egitto ,  Donald S. Farquhar ,  Voya R. Markovich ,  Mark D. Poliks ,  Douglas O. Powell

IPC分类号： H01R12/04 ,  B29C65/48

CPC分类号： H01L21/4853 ,  H01L23/3735 ,  H01L23/49822 ,  H01L2224/16225 ,  H01L2924/01004 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01322 ,  H01L2924/15311 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/114 ,  H05K3/429 ,  H05K3/4602 ,  H05K3/4608 ,  H05K3/462 ,  H05K3/4623 ,  H05K3/4626 ,  H05K3/4632 ,  H05K3/4641 ,  H05K3/4688 ,  H05K2201/0141 ,  H05K2201/0191 ,  H05K2201/068 ,  H05K2201/09509 ,  H05K2201/09536 ,  H05K2201/09554 ,  H05K2201/0959 ,  H05K2201/096 ,  H05K2201/10378 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T156/1092

摘要： A multi-layered interconnect structure and method of formation. In a first embodiment, first and second liquid crystal polymer (LCP) dielectric layers are directly bonded, respectively, to first and second opposing surface of a thermally conductive layer, with no extrinsic adhesive material bonding the thermally conductive layer with either the first or second LCP dielectric layer. In a second embodiment, first and second 2S1P substructures are directly bonded, respectively, to first and second opposing surfaces of a LCP dielectric joining layer, with no extrinsic adhesive material bonding the LCP dielectric joining layer with either the first or second 2S1P substructures.

摘要翻译： 多层互连结构和形成方法。 在第一实施例中，第一和第二液晶聚合物（LCP）电介质层分别直接接合到导热层的第一和第二相对表面，没有外在粘合材料将导热层与第一或第二液晶聚合物 LCP电介质层。 在第二实施例中，第一和第二2S1P子结构分别直接接合到LCP电介质接合层的第一和第二相对表面，没有外部粘合材料将LCP电介质接合层与第一或第二2S1P子结构结合。

公开(公告)号：US07301108B2

公开(公告)日：2007-11-27

申请号：US10959711

申请日：2004-10-05

申请人： Frank D. Egitto ,  Donald S. Farquhar ,  Voya R. Markovich ,  Mark D. Poliks ,  Douglas O. Powell

发明人： Frank D. Egitto ,  Donald S. Farquhar ,  Voya R. Markovich ,  Mark D. Poliks ,  Douglas O. Powell

IPC分类号： H05K1/11 ,  H01R12/04

CPC分类号： H01L21/4853 ,  H01L23/3735 ,  H01L23/49822 ,  H01L2224/16225 ,  H01L2924/01004 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01322 ,  H01L2924/15311 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/114 ,  H05K3/429 ,  H05K3/4602 ,  H05K3/4608 ,  H05K3/462 ,  H05K3/4623 ,  H05K3/4626 ,  H05K3/4632 ,  H05K3/4641 ,  H05K3/4688 ,  H05K2201/0141 ,  H05K2201/0191 ,  H05K2201/068 ,  H05K2201/09509 ,  H05K2201/09536 ,  H05K2201/09554 ,  H05K2201/0959 ,  H05K2201/096 ,  H05K2201/10378 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T156/1092

摘要： A multi-layered interconnect structure and method of formation. In a first embodiment, first and second liquid crystal polymer (LCP) dielectric layers are directly bonded, respectively, to first and second opposing surface of a thermally conductive layer, with no extrinsic adhesive material bonding the thermally conductive layer with either the first or second LCP dielectric layer. In a second embodiment, first and second 2S1P substructures are directly bonded, respectively, to first and second opposing surfaces of a LCP dielectric joining layer, with no extrinsic adhesive material bonding the LCP dielectric joining layer with either the first or second 2S1P substructures.

摘要翻译： 多层互连结构和形成方法。 在第一实施例中，第一和第二液晶聚合物（LCP）电介质层分别直接接合到导热层的第一和第二相对表面，没有外在粘合材料将导热层与第一或第二液晶聚合物 LCP电介质层。 在第二实施例中，第一和第二2S1P子结构分别直接接合到LCP电介质接合层的第一和第二相对表面，没有外部粘合材料将LCP电介质接合层与第一或第二2S1P子结构结合。

公开(公告)号：US20100218891A1

公开(公告)日：2010-09-02

申请号：US12776771

申请日：2010-05-10

申请人： Frank D. Egitto ,  Donald S. Farquhar ,  Voya R. Markovich ,  Mark D. Poliks ,  Douglas O. Powell

发明人： Frank D. Egitto ,  Donald S. Farquhar ,  Voya R. Markovich ,  Mark D. Poliks ,  Douglas O. Powell

IPC分类号： C09J5/06

CPC分类号： H01L21/4853 ,  H01L23/3735 ,  H01L23/49822 ,  H01L2224/16225 ,  H01L2924/01004 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01322 ,  H01L2924/15311 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/114 ,  H05K3/429 ,  H05K3/4602 ,  H05K3/4608 ,  H05K3/462 ,  H05K3/4623 ,  H05K3/4626 ,  H05K3/4632 ,  H05K3/4641 ,  H05K3/4688 ,  H05K2201/0141 ,  H05K2201/0191 ,  H05K2201/068 ,  H05K2201/09509 ,  H05K2201/09536 ,  H05K2201/09554 ,  H05K2201/0959 ,  H05K2201/096 ,  H05K2201/10378 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T156/1092

摘要： A multi-layered interconnect structure and method of formation. In a first embodiment, first and second liquid crystal polymer (LCP) dielectric layers are directly bonded, respectively, to first and second opposing surface of a thermally conductive layer, with no extrinsic adhesive material bonding the thermally conductive layer with either the first or second LCP dielectric layer. In a second embodiment, first and second 2S1P substructures are directly bonded, respectively, to first and second opposing surfaces of a LCP dielectric joining layer, with no extrinsic adhesive material bonding the LCP dielectric joining layer with either the first or second 2S1P substructures.

摘要翻译： 多层互连结构和形成方法。 在第一实施例中，第一和第二液晶聚合物（LCP）电介质层分别直接接合到导热层的第一和第二相对表面，没有外在粘合材料将导热层与第一或第二液晶聚合物 LCP电介质层。 在第二实施例中，第一和第二2S1P子结构分别直接接合到LCP电介质接合层的第一和第二相对表面，没有外部粘合材料将LCP电介质接合层与第一或第二2S1P子结构结合。

公开(公告)号：US07981245B2

公开(公告)日：2011-07-19

申请号：US11872942

申请日：2007-10-16

申请人： Frank D. Egitto ,  Donald S. Farquhar ,  Voya R. Markovich ,  Mark D. Poliks ,  Douglas O. Powell

发明人： Frank D. Egitto ,  Donald S. Farquhar ,  Voya R. Markovich ,  Mark D. Poliks ,  Douglas O. Powell

IPC分类号： C08J5/00

CPC分类号： H01L21/4853 ,  H01L23/3735 ,  H01L23/49822 ,  H01L2224/16225 ,  H01L2924/01004 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01322 ,  H01L2924/15311 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/114 ,  H05K3/429 ,  H05K3/4602 ,  H05K3/4608 ,  H05K3/462 ,  H05K3/4623 ,  H05K3/4626 ,  H05K3/4632 ,  H05K3/4641 ,  H05K3/4688 ,  H05K2201/0141 ,  H05K2201/0191 ,  H05K2201/068 ,  H05K2201/09509 ,  H05K2201/09536 ,  H05K2201/09554 ,  H05K2201/0959 ,  H05K2201/096 ,  H05K2201/10378 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T156/1092

摘要： A multi-layered interconnect structure and method of formation. In a first embodiment, first and second liquid crystal polymer (LCP) dielectric layers are directly bonded, respectively, to first and second opposing surface of a thermally conductive layer, with no extrinsic adhesive material bonding the thermally conductive layer with either the first or second LCP dielectric layer. In a second embodiment, first and second 2S1P substructures are directly bonded, respectively, to first and second opposing surfaces of a LCP dielectric joining layer, with no extrinsic adhesive material bonding the LCP dielectric joining layer with either the first or second 2S1P substructures.

摘要翻译： 多层互连结构和形成方法。 在第一实施例中，第一和第二液晶聚合物（LCP）电介质层分别直接接合到导热层的第一和第二相对表面，没有外在粘合材料将导热层与第一或第二液晶聚合物 LCP电介质层。 在第二实施例中，第一和第二2S1P子结构分别直接接合到LCP电介质接合层的第一和第二相对表面，没有外部粘合材料将LCP电介质接合层与第一或第二2S1P子结构结合。