公开(公告)号：US5075965A

公开(公告)日：1991-12-31

申请号：US608766

申请日：1990-11-05

申请人： Charles F. Carey ,  Kenneth M. Fallon ,  Rochelle Ginsburg ,  Charles G. Woychik

发明人： Charles F. Carey ,  Kenneth M. Fallon ,  Rochelle Ginsburg ,  Charles G. Woychik

IPC分类号： B23K1/00 ,  H01L21/60 ,  H05K3/34

CPC分类号： H01L24/81 ,  B23K1/0016 ,  H05K3/3436 ,  H01L2224/13111 ,  H01L2224/16237 ,  H01L2224/81801 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H05K2201/10992 ,  H05K2203/0415 ,  H05K3/3431 ,  H05K3/3457 ,  Y02P70/613 ,  Y10T29/49144

摘要： A controlled collapse chip connect method of joining an IC chip to a microelectronic circuit card. According to the method an inhomogeneous, anisotropic column of solder is deposited from a Pb/Sn alloy onto solder wettable I/O terminals of the I/C chip, without subsequent homogenizing reflow. The solder core has a Pb rich core and an Sn rich cap. The matching footprint of the solder wettable I/O terminals on the microelectronic circuit card is substantially free of deposited solder and presents a protected Cu surface to the solder columns, or, at most a surface of Cu and anti-oxidant. The chip is aligned with the corresponding footprints on the microelectronic circuit card, and the solder is reflowed to bond the chip to the microelectronic circuit card.

公开(公告)号：US5597469A

公开(公告)日：1997-01-28

申请号：US387686

申请日：1995-02-13

申请人： Charles F. Carey ,  Kenneth M. Fallon ,  Voya R. Markovich ,  Douglas O. Powell ,  Gary P. Vlasak ,  Richard S. Zarr

发明人： Charles F. Carey ,  Kenneth M. Fallon ,  Voya R. Markovich ,  Douglas O. Powell ,  Gary P. Vlasak ,  Richard S. Zarr

IPC分类号： C25D5/02 ,  C25D5/08 ,  H01L21/48 ,  H01L21/60 ,  H05K3/24 ,  H05K3/34

CPC分类号： H01L24/81 ,  C25D5/022 ,  C25D5/08 ,  H01L21/4825 ,  H01L21/4853 ,  H05K3/241 ,  H05K3/3473 ,  H01L2224/11849 ,  H01L2224/119 ,  H01L2224/81193 ,  H01L2224/81801 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/30105 ,  H05K2203/043 ,  H05K2203/054

摘要： Small, closely spaced deposits of solder materials may be formed with high volumetric accuracy and uniformity of shape by depositing a layer of conductive material over surfaces of a dielectric layer having apertures or recesses (e.g. blind apertures) and conductors and/or pads exposed by those apertures or recesses, masking regions of the conductive material with a further patterned dielectric layer, electroplating solder materials onto regions of the conductive material exposed by the mask, removing the mask and portions of the conductive material by selective etching and reflowing solder away from at least a portion of the surfaces of the apertured dielectric layer. Uniformity of electroplating within blind apertures is enhanced by a combination of fluid jet sparging and cathode agitation. Excess conductor material in the resulting solder deposit can be avoided by replacing conductor material with a constituent component of a solder material in an immersion bath prior to electroplating.

摘要翻译： 可以通过在具有孔或凹槽（例如盲孔）的电介质层的表面上沉积导电材料层并且暴露于其中的导体和/或焊盘而形成具有高体积精度和形状均匀性的小的，紧密间隔的焊料材料沉积物 孔或凹槽，导电材料的掩模区域和另外的图案化介电层，将电镀焊料材料电镀到由掩模曝光的导电材料的区域上，通过选择性蚀刻和至少从至少 有孔电介质层的一部分表面。 盲孔内电镀的均匀性通过流体喷射和阴极搅拌的组合增强。 在电镀之前，可以通过在浸没池中用焊料材料的构成成分代替导体材料来避免所得到的焊料沉积物中的过多的导体材料。

公开(公告)号：US06924866B2

公开(公告)日：2005-08-02

申请号：US10012276

申请日：2001-11-29

申请人： Kenneth M. Fallon ,  Charles F. Scaglione

发明人： Kenneth M. Fallon ,  Charles F. Scaglione

IPC分类号： G02F1/1345 ,  G02F1/1339

CPC分类号： G02F1/1345 ,  G02F2201/42

摘要： A method of constructing a liquid crystal display element or similar article of manufacture includes providing a first transparent substrate bondable to a second transparent substrate. The second transparent substrate has a plurality of vias passing through opposing active faces. A dispensing technique is used to fill the vias void-free with an optical grade adhesive material to form the LCD element.

摘要翻译： 构成液晶显示元件或类似制品的方法包括提供可粘合到第二透明基板上的第一透明基板。 第二透明基板具有通过相对的有效面的多个通路。 使用分配技术用光学级粘合剂材料填充无孔的通孔以形成LCD元件。

公开(公告)号：US5729896A

公开(公告)日：1998-03-24

申请号：US740571

申请日：1996-10-31

申请人： Hormazdyar M. Dalal ,  Kenneth M. Fallon ,  Gene J. Gaudenzi ,  Cynthia S. Milkovich

发明人： Hormazdyar M. Dalal ,  Kenneth M. Fallon ,  Gene J. Gaudenzi ,  Cynthia S. Milkovich

IPC分类号： H01L21/56 ,  H01L21/60 ,  H01L23/498 ,  H01L23/538 ,  H05K1/18 ,  H05K3/00 ,  H05K3/34 ,  H05K13/04

CPC分类号： H01L24/11 ,  H01L21/563 ,  H01L23/49816 ,  H01L23/5387 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H05K3/341 ,  H05K3/3436 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/136 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/81801 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/30107 ,  H05K1/189 ,  H05K2201/035 ,  H05K2201/10015 ,  H05K2201/10674 ,  H05K2201/10734 ,  H05K2201/10992 ,  H05K2203/0165 ,  H05K3/0061 ,  H05K3/3484 ,  Y02P70/613 ,  Y10T29/49137 ,  Y10T29/49144 ,  Y10T29/49146

摘要： A structure and method is disclosed for directly attaching a device or package on flexible organic circuit carriers having low cost and high reliability. IC chips with a new solder interconnect structure, comprised of a layer of pure tin, deposited on the top of high melting Pb--Sn solder balls are employed for joining. These methods, techniques and metallurgical structures enables direct attachment of electronic devices of any complexity to any substrate and to any level of packaging hierarchy. Also, devices or packages having other joining technologies, eg. SMT, BGA, TBGA, etc. could be joined onto the flexible circuit carrier.

摘要翻译： 公开了用于将设备或封装直接附接在具有低成本和高可靠性的柔性有机电路载体上的结构和方法。 使用沉积在高熔点Pb-Sn焊球顶部的由纯锡层构成的新的焊料互连结构的IC芯片进行接合。 这些方法，技术和冶金结构使得能够将任何复杂性的电子设备直接附接到任何基底和任何级别的包装层级。 此外，具有其他连接技术的设备或包装，例如 SMT，BGA，TBGA等可以连接到柔性电路载体上。

公开(公告)号：US5542601A

公开(公告)日：1996-08-06

申请号：US394684

申请日：1995-02-24

申请人： Kenneth M. Fallon ,  Miguel A. Jimarez ,  Joseph E. Zdimal

发明人： Kenneth M. Fallon ,  Miguel A. Jimarez ,  Joseph E. Zdimal

IPC分类号： H01L21/60 ,  H01L23/13 ,  H05K3/34

CPC分类号： H01L24/81 ,  H01L23/13 ,  H01L2224/16 ,  H01L2224/75 ,  H01L2224/75252 ,  H01L2224/75743 ,  H01L2224/81801 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15159 ,  H01L2924/15311 ,  H01L2924/15787

摘要： A new rework process for semiconductor chips mounted in a flip chip configuration, via solder balls, on an organic substrate is disclosed.

摘要翻译： 公开了一种通过焊球在有机衬底上以倒装芯片配置安装的半导体芯片的新的返工工艺。

公开(公告)号：US06619334B2

公开(公告)日：2003-09-16

申请号：US10007029

申请日：2001-11-29

申请人： Kenneth M. Fallon ,  Charles F. Scaglione

发明人： Kenneth M. Fallon ,  Charles F. Scaglione

IPC分类号： B65B120

CPC分类号： G02F1/1345 ,  G02F2201/42

摘要： A method of delivering fluid into constricted openings arranged in a workpiece substantially eliminates the occurrence of voids or air bubbles in the fluid filling the constricted orifices. Coextensive recesses are formed in a support base for securing the workpiece from movement during fluid flow. The constricted openings are exposed to the recesses so that fluid introduced into the openings do not overflow.

摘要翻译： 将流体输送到布置在工件中的收缩开口的方法基本上消除了填充收缩孔的流体中空隙或气泡的发生。 在支撑基座中形成共同延伸的凹部，用于在流体流动期间固定工件不移动。 收缩的开口暴露于凹部，使得引入开口的流体不会溢出。

公开(公告)号：US5634268A

公开(公告)日：1997-06-03

申请号：US476466

申请日：1995-06-07

申请人： Hormazdyar M. Dalal ,  Kenneth M. Fallon ,  Gene J. Gaudenzi

发明人： Hormazdyar M. Dalal ,  Kenneth M. Fallon ,  Gene J. Gaudenzi

IPC分类号： H01L21/60 ,  H01L23/12 ,  H01L23/538 ,  H05K1/11 ,  H05K3/00 ,  H05K3/34 ,  H05K3/42

CPC分类号： H01L24/16 ,  H01L23/5384 ,  H01L24/12 ,  H01L24/81 ,  H05K3/0094 ,  H05K3/3436 ,  H01L2224/13099 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/136 ,  H01L2224/13609 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/81193 ,  H01L2224/81801 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/3651 ,  H05K1/114 ,  H05K2201/0959 ,  H05K2201/10992 ,  H05K3/3452 ,  H05K3/3463 ,  H05K3/426 ,  Y02P70/613 ,  Y10T29/49144 ,  Y10T29/49165

摘要： A structure and a method is disclosed for making a laminated circuit carrier card for the purpose of making a Direct Chip Attached Module (DCAM) with low cost and high reliability. The carrier is made using an organic or an inorganic laminated carrier having at least one surface available for direct chip mount. The chip has at least one solder ball with a cap of low melting point metal. The surface of the carrier has electrical features that are directly connected to the low melting point metal on the solder ball of the chip to form the eutectic and this way the chip is directly attached to the carrier.

摘要翻译： 公开了用于制造具有低成本和高可靠性的直接芯片连接模块（DCAM）的层叠电路载体卡的结构和方法。 载体使用具有至少一个可用于直接芯片安装的表面的有机或无机层压载体制成。 该芯片具有至少一个具有低熔点金属帽的焊球。 载体的表面具有与芯片的焊球上的低熔点金属直接相连以形成共晶体的电特征，并且这种芯片直接连接到载体上。

公开(公告)号：US06674506B2

公开(公告)日：2004-01-06

申请号：US10012077

申请日：2001-11-29

申请人： Kenneth M. Fallon ,  Charles F. Scaglione

发明人： Kenneth M. Fallon ,  Charles F. Scaglione

IPC分类号： G02F113

CPC分类号： G02F1/1345 ,  G02F2201/42

摘要： An apparatus introduces fluid in vias formed in an LCD element free of voids or air bubbles in the fluid material. A support base secures the LCD element in place during fluid flow from a fluid dispenser positioned proximate to the LCD element. Fluid flow is facilitated by thermal energy from a heating element arranged in thermal contact with the support base.

摘要翻译： 一种装置将液体引入形成在液体材料中没有空隙或气泡的LCD元件中的通孔中。 支撑基座在流体从位于LCD元件附近的流体分配器流体流动时将LCD元件固定就位。 流体流动由来自与支撑基座热接触地布置的加热元件的热​​能促进。

公开(公告)号：US06476902B1

公开(公告)日：2002-11-05

申请号：US10006918

申请日：2001-11-29

申请人： Kenneth M. Fallon ,  Charles F. Scaglione

发明人： Kenneth M. Fallon ,  Charles F. Scaglione

IPC分类号： G02F11335

CPC分类号： G02F1/133308 ,  G02F1/1345 ,  G02F2201/42

摘要： A liquid crystal display and method of making same has a first transparent substrate bondable to a second transparent substrate. The second transparent substrate has a plurality of vias passing through opposing active surfaces of the second transparent substrate. Vias are filled void-free with an optical grade adhesive material when the first and second transparent substrates are bonded together.

摘要翻译： 液晶显示器及其制造方法具有可与第二透明基板结合的第一透明基板。 第二透明基板具有通过第二透明基板的相对的有效表面的多个通孔。 当第一和第二透明基板结合在一起时，通孔与光学级粘合剂材料填充无空隙。