公开(公告)号：US07756168B2

公开(公告)日：2010-07-13

申请号：US10900015

申请日：2004-07-26

申请人： Phil Floyd ,  Peter Kner ,  Decai Sun

发明人： Phil Floyd ,  Peter Kner ,  Decai Sun

IPC分类号： H01S3/10

CPC分类号： H01S5/18366 ,  H01S5/0425 ,  H01S5/0607

摘要： A vertical cavity laser apparatus is provided. In one embodiment, the apparatus includes an electrically responsive substrate; a support block positioned on the electrically responsive substrate; a bridge arm structure coupled to the support block, the structure having a base; a laser active area on the bridge arm structure, a tuning pad on the bridge arm structure, a laser bond pad on the bridge arm structure with traces connecting the laser bond pad to the laser active area and base. The traces are positioned and shaped to be symmetric to avoid problems due to the asymmetry of the injection current. Additionally, in this embodiment, the laser bond pad is kept at a height of the base in order to minimize device capacitance and the traces are also kept at the height of the base. Methods are also provided whereby impedance matching and high speed performance can be accomplished irregardless of the mechanical configuration of the bridge arm structure.

摘要翻译： 提供了一种垂直腔激光装置。 在一个实施例中，该装置包括电响应基板; 位于所述电响应基板上的支撑块; 耦合到所述支撑块的桥臂结构，所述结构具有基部; 桥臂结构上的激光有源区域，桥臂结构上的调谐板，桥臂结构上的激光键合焊盘，其具有将激光键合焊盘连接到激光器有源区域和基底的迹线。 迹线被定位和成形为对称以避免由于注入电流的不对称性引起的问题。 此外，在本实施例中，激光焊盘保持在基座的高度，以便最小化器件电容，并且迹线也保持在基座的高度。 还提供了可以实现阻抗匹配和高速性能的方法，无论桥臂结构的机械结构如何。

公开(公告)号：US07284324B2

公开(公告)日：2007-10-23

申请号：US11197675

申请日：2005-08-04

申请人： Christopher L. Chua ,  Francesco Lemmi ,  Koenraad F. Van Schuylenbergh ,  Jeng Ping Lu ,  David K. Fork ,  Eric Peeters ,  Decai Sun ,  Donald L. Smith ,  Linda T. Romano

发明人： Christopher L. Chua ,  Francesco Lemmi ,  Koenraad F. Van Schuylenbergh ,  Jeng Ping Lu ,  David K. Fork ,  Eric Peeters ,  Decai Sun ,  Donald L. Smith ,  Linda T. Romano

IPC分类号： H01R43/16

CPC分类号： H01L24/13 ,  G01R1/06727 ,  G01R3/00 ,  H01F17/0033 ,  H01F17/02 ,  H01F41/041 ,  H01L21/76838 ,  H01L21/7688 ,  H01L23/498 ,  H01L23/49811 ,  H01L23/5227 ,  H01L24/11 ,  H01L24/16 ,  H01L24/48 ,  H01L28/10 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/13099 ,  H01L2224/4847 ,  H01L2224/8592 ,  H01L2924/0001 ,  H01L2924/00014 ,  H01L2924/00015 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/0104 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01061 ,  H01L2924/01068 ,  H01L2924/01072 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01084 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12034 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  Y10T29/4902 ,  Y10T29/49071 ,  Y10T29/49147 ,  Y10T29/49204 ,  Y10T29/49208 ,  Y10T29/4921 ,  Y10T29/49218 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/85399 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An out-of-plane micro-structure which can be used for on-chip integration of high-Q inductors and transformers places the magnetic field direction parallel to the substrate plane without requiring high aspect ratio processing. The photolithographically patterned coil structure includes an elastic member having an intrinsic stress profile. The intrinsic stress profile biases a free portion away from the substrate forming a loop winding. An anchor portion remains fixed to the substrate. The free portion end becomes a second anchor portion which may be connected to the substrate via soldering or plating. A series of individual coil structures can be joined via their anchor portions to form inductors and transformers.

摘要翻译： 可以用于高Q电感和变压器的片上集成的平面外微结构使得磁场方向平行于衬底平面而不需要高纵横比处理。 光刻图案的线圈结构包括具有固有应力分布的弹性构件。 固有的应力分布使形成环绕的基板远离基板偏移。 锚固部分​​保持固定到基底上。 自由部分端部成为可以通过焊接或电镀而连接到基板的第二锚固部分。 一系列单独的线圈结构可以通过它们的锚定部分接合以形成电感器和变压器。

公开(公告)号：US07120182B2

公开(公告)日：2006-10-10

申请号：US10739181

申请日：2003-12-19

申请人： Christopher L. Chua ,  Decai Sun

发明人： Christopher L. Chua ,  Decai Sun

IPC分类号： H01S5/20 ,  H01S5/00

CPC分类号： B82Y20/00 ,  H01S5/2063 ,  H01S5/22 ,  H01S5/2275 ,  H01S5/34313 ,  H01S5/4031

摘要： An array of light emitters includes a plurality of light emitting structures formed over a layered structure with at least one quantum well layer. At least one cladding layer is formed on over the at least one quantum well layer. At least one waveguide layer is formed on or over the at least one cladding layer. At least one isolation region is formed at least in between at least two of the plurality of light emitting structures. The at least one isolation region isolates the at least two light emitting structures from each other.

摘要翻译： 光发射器阵列包括在具有至少一个量子阱层的分层结构上形成的多个发光结构。 在所述至少一个量子阱层上形成至少一个覆层。 至少一个波导层形成在至少一个包层上或上面。 至少在多个发光结构中的至少两个之间形成至少一个隔离区域。 所述至少一个隔离区将所述至少两个发光结构彼此隔离。

公开(公告)号：US06647036B1

公开(公告)日：2003-11-11

申请号：US09731154

申请日：2000-12-06

申请人： Decai Sun ,  Michel A. Rosa

发明人： Decai Sun ,  Michel A. Rosa

IPC分类号： H01S304

CPC分类号： B81C3/002 ,  B81B2201/047 ,  B81C2203/058 ,  H01S5/02252 ,  H01S5/02272 ,  H01S5/183 ,  H01S5/423 ,  H05K1/183 ,  H05K3/3442

摘要： A micro-electromechanical system assembly is designed to integrate a laser. More particularly, laser is a vertical cavity surface-emitting laser. The MEMS assembly includes a micro-electromechanical substrate having an upper surface and a lower surface, the upper surface defined as having a first area and a second area. A first substrate bonding pad is positioned on the upper surface at a location within the first area, and a second substrate bonding pad is positioned on the upper surface at a location within the second area. Deposited upon the first and second substrate bonding areas are respective first and second solder material. A laser to be integrated in the MEMS assembly has a first laser bonding pad located on a first side, and a second laser bonding pad located on a second side. The laser is placed between the first substrate bonding pad and second substrate bonding pad such that they align with the respective first and second laser bonding pads. Upon a reflow of the solder material, a precise alignment of the laser is obtained while the reflow process occurs, and at the same time providing a mechanical and electrical connection between the bonding pads. In a further embodiment, the MEMS substrate is configured with a trench portion into which is placed the laser having the first and second laser bonding pads. Placement in the trench, is at least one of a 45° and 54.74° angle. Upon reflow of solder material on the substrate, the laser is finely positioned and held mechanically stable. In a further embodiment, the trench previously described includes a spring mechanism which carries a substrate bonding pad. The spring mechanism causing the laser within the trench to be maintained in a preferred position during and after the solder reflow process. Still yet another embodiment employs bimetallic cantilevers for positioning the laser and electrical interconnect.

摘要翻译： 微机电系统组件被设计为集成激光器。 更具体地，激光是垂直腔表面发射激光器。 MEMS组件包括具有上表面和下表面的微机电衬底，所述上表面限定为具有第一区域和第二区域。 第一衬底接合焊盘位于第一区域内的位置的上表面上，第二衬底接合焊盘位于第二区域内的位置的上表面上。 沉积在第一和第二衬底接合区域上的是相应的第一和第二焊料材料。 集成在MEMS组件中的激光器具有位于第一侧的第一激光焊盘和位于第二侧的第二激光焊盘。 激光器被放置在第一衬底焊盘和第二衬底焊盘之间，使得它们与相应的第一和第二激光焊盘对准。 当焊料回流时，在回流过程发生时获得激光的精确对准，并且同时在接合焊盘之间提供机械和电连接。 在另一实施例中，MEMS衬底被配置有沟槽部分，放置有具有第一和第二激光焊盘的激光器。 放置在沟槽中，是45°和54.74°角中的至少一个。 在衬底上焊料材料回流时，激光器被精细地定位并保持机械稳定。 在另一实施例中，先前描述的沟槽包括一个承载衬底接合焊盘的弹簧机构。 在焊料回流过程中和之后使引起沟槽内的激光的弹簧机构保持在优选的位置。 又一实施例采用双金属悬臂来定位激光和电互连。

公开(公告)号：US06580858B2

公开(公告)日：2003-06-17

申请号：US09844574

申请日：2001-04-30

申请人： Jingkuang Chen ,  Joel A. Kubby ,  Decai Sun

发明人： Jingkuang Chen ,  Joel A. Kubby ,  Decai Sun

IPC分类号： G02B642

CPC分类号： G02B6/35 ,  G02B6/3512 ,  G02B6/3582 ,  G02B6/3584 ,  G02B6/3598 ,  G02B6/4214

摘要： A MEMS-based adjustable mirror module allows faster, lower cost, and easier alignment of optical fibers in substrates. Movable mirrors formed on the substrate allow adjustment of the light path after the optical fiber is attached, after which the mirrors are affixed in place to prevent misalignment.

公开(公告)号：US6058124A

公开(公告)日：2000-05-02

申请号：US976845

申请日：1997-11-25

申请人： Decai Sun ,  Ross D. Bringans

发明人： Decai Sun ,  Ross D. Bringans

IPC分类号： H01S5/02 ,  H01S5/22 ,  H01S5/323 ,  H01S5/40 ,  H01S3/085

CPC分类号： H01S5/4031 ,  H01S5/02 ,  H01S5/2214 ,  H01S5/32316 ,  H01S5/32341 ,  H01S5/4087

摘要： A monolithic laser structure has an infrared laser structure side by side with a red laser structure. The infrared and red laser structures share the same substrate and have the same material for the cladding layers and for the cap and barrier reduction layers. The red and infrared laser structures can have native oxide confined or metal confined ridge waveguides.

摘要翻译： 单片激光器结构具有红外激光结构并排的红外激光结构。 红外和红色激光结构共享相同的基板，并且具有用于包覆层和盖和阻挡层还原层的相同材料。 红色和红外激光结构可以具有自然氧化物限制或金属限制脊状波导。

公开(公告)号：US6054335A

公开(公告)日：2000-04-25

申请号：US209866

申请日：1998-12-11

申请人： Decai Sun ,  Ross D. Bringans ,  Christopher L. Chua ,  Philip D. Floyd ,  Eric Peeters ,  Joel A. Kubby ,  Alex T. Tran

发明人： Decai Sun ,  Ross D. Bringans ,  Christopher L. Chua ,  Philip D. Floyd ,  Eric Peeters ,  Joel A. Kubby ,  Alex T. Tran

IPC分类号： B81B3/00 ,  B81B7/02 ,  H01L27/15 ,  H01S5/00 ,  H01S5/02 ,  H01S5/022 ,  H01S5/026 ,  H01S5/042 ,  H01S5/183 ,  H01S5/42 ,  H01L21/00

CPC分类号： H01S5/18308 ,  H01S5/02288 ,  H01L27/15 ,  H01S5/021 ,  H01S5/02252 ,  H01S5/4087 ,  H01S5/423 ,  H01S5/426

摘要： A III-V compound light emitter is integrated with Si-based actuators. The Proposed devices take advantage of the superior optical properties of III-V compounds and the superior mechanical properties of Si, as well as mature fabrication technologies of Si-Micro-Electro-Mechanical Systems (MEMS). The emitter can be a light emitting diode (LED), a vertical cavity surface emitting laser (VCSEL) or an edge emitting laser. Electro or magnetic based actuation from Si-based actuators provides linear or angular movement of the light emitter.

摘要翻译： III-V复合光发射器与Si基致动器集成。 提出的器件利用了III-V化合物的优异光学性能和Si的优异机械性能，以及Si-Micro-Electro-Mechanical Systems（MEMS）的成熟制造技术。 发射极可以是发光二极管（LED），垂直腔表面发射激光器（VCSEL）或边缘发射激光器。 基于Si的致动器的基于电或磁的致动器提供光发射器的线性或角度运动。

公开(公告)号：US5784399A

公开(公告)日：1998-07-21

申请号：US774937

申请日：1996-12-19

申请人： Decai Sun

发明人： Decai Sun

IPC分类号： H01S5/12 ,  H01S5/125 ,  H01S5/343 ,  H01S5/40 ,  H01S3/19 ,  H01L29/06

CPC分类号： B82Y20/00 ,  H01S5/12 ,  H01S5/4031 ,  H01S2301/14 ,  H01S5/125 ,  H01S5/34326 ,  H01S5/4056 ,  H01S5/4087

摘要： In a quantum well semiconductor laser structure, a distributed Bragg reflector is used to select the polarization mode of the emitted light beam. The period of the distributed Bragg reflector matches the peak gain of one polarization mode providing optical feedback for that mode to be the light emitted. The distributed Bragg reflector can extend along the length of the active layer within the semiconductor structure or extend at one end of the active layer external to the semiconductor structure.

摘要翻译： 在量子阱半导体激光器结构中，使用分布式布拉格反射器来选择发射光束的偏振模式。 分布式布拉格反射器的周期与一种偏振模式的峰值增益匹配，为该模式提供光反馈，作为发出的光。 分布式布拉格反射器可以沿着半导体结构内的有源层的长度延伸，或者在半导体结构外部的有源层的一端延伸。

公开(公告)号：US09385285B2

公开(公告)日：2016-07-05

申请号：US12561617

申请日：2009-09-17

申请人： Serge J. Bierhuizen ,  Nanze Patrick Wang ,  Gregory W. Eng ,  Decai Sun ,  Yajun Wei

发明人： Serge J. Bierhuizen ,  Nanze Patrick Wang ,  Gregory W. Eng ,  Decai Sun ,  Yajun Wei

IPC分类号： H01L33/56 ,  H01L33/58 ,  H01L33/48

CPC分类号： H01L33/58 ,  H01L25/13 ,  H01L25/50 ,  H01L33/486 ,  H01L33/507 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2933/0033 ,  H01L2933/0041 ,  H01L2933/0058 ,  H01L2933/0066 ,  H01L2933/0091 ,  H01L2924/00

摘要： An array of housings with housing bodies and lenses is molded, or an array of housing bodies is molded and bonded with lenses to form an array of housings with housing bodies and lenses. Light-emitting diodes (LEDs) are attached to the housings in the array. An array of metal pads may be bonded to the back of the array or insert molded with the housing array to form bond pads on the back of the housings. The array is singulated to form individual LED modules.

摘要翻译： 模制具有壳体和透镜的壳体阵列，或者将壳体主体的阵列模制并与透镜结合以形成具有壳体和透镜的壳体阵列。 发光二极管（LED）连接到阵列中的外壳。 金属焊盘的阵列可以结合到阵列的背面或用壳体阵列模制的嵌件以在壳体的背面形成接合焊盘。 将阵列分割成单独的LED模块。

公开(公告)号：US20080259971A1

公开(公告)日：2008-10-23

申请号：US10900015

申请日：2004-07-26

申请人： Phil Floyd ,  Peter Kner ,  Decai Sun

发明人： Phil Floyd ,  Peter Kner ,  Decai Sun

IPC分类号： H01S3/10 ,  H01S5/00

CPC分类号： H01S5/18366 ,  H01S5/0425 ,  H01S5/0607

摘要： A vertical cavity laser apparatus is provided. In one embodiment, the apparatus includes an electrically responsive substrate; a support block positioned on the electrically responsive substrate; a bridge arm structure coupled to the support block, the structure having a base; a laser active area on the bridge arm structure, a tuning pad on the bridge arm structure, a laser bond pad on the bridge arm structure with traces connecting the laser bond pad to the laser active area and base. The traces are positioned and shaped to be symmetric to avoid problems due to the asymmetry of the injection current. Additionally, in this embodiment, the laser bond pad is kept at a height of the base in order to minimize device capacitance and the traces are also kept at the height of the base. Methods are also provided whereby impedance matching and high speed performance can be accomplished irregardless of the mechanical configuration of the bridge arm structure.

摘要翻译： 提供了一种垂直腔激光装置。 在一个实施例中，该装置包括电响应基板; 位于所述电响应基板上的支撑块; 耦合到所述支撑块的桥臂结构，所述结构具有基部; 桥臂结构上的激光有源区域，桥臂结构上的调谐板，桥臂结构上的激光键合焊盘，其具有将激光键合焊盘连接到激光器有源区域和底座的迹线。 迹线被定位和成形为对称以避免由于注入电流的不对称性引起的问题。 此外，在本实施例中，激光焊盘保持在基座的高度，以便最小化器件电容，并且迹线也保持在基座的高度。 还提供了可以实现阻抗匹配和高速性能的方法，无论桥臂结构的机械结构如何。