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    Flexible printed circuit board
    3.
    发明授权
    Flexible printed circuit board 有权
    柔性印刷电路板

    公开(公告)号：US07119285B2

    公开(公告)日：2006-10-10

    申请号：US10790310

    申请日：2004-03-01

    申请人： Deok-heung Kim ,  Bong-hui Lee

    发明人： Deok-heung Kim ,  Bong-hui Lee

    IPC分类号： H05K1/00 ,  H05K1/03

    CPC分类号： H05K1/028 ,  H05K3/28 ,  H05K3/323 ,  H05K3/361 ,  H05K2201/09627 ,  H05K2201/0979 ,  H05K2201/10666

    摘要： A flexible printed circuit board (FPCB) which prevents a short circuit due to a crack in a bending portion is provided. The FPCB includes an end portion, a bending portion extended from the end portion, and a circuit portion extended from the bending portion. The improved FPCB includes a base film which is flexible and comprises a first via-hole formed adjacent to the end portion and the bending portion and a second via-hole formed adjacent to the bending portion and the circuit portion, a first conductive layer formed on an outer surface of at least the end portion and the bending portion, a cover layer formed on the first conductive layer, a second conductive layer which is formed on an inner surface of the end portion and is electrically connected to the first conductive layer through the first via-hole, and a third conductive layer which is formed on an inner surface of the extension circuit portion and is electrically connected to the first conductive layer through the second via-hole.

    摘要翻译： 提供一种柔性印刷电路板（FPCB），其防止由于弯曲部分的裂纹引起的短路。 FPCB包括端部，从端部延伸的弯曲部和从弯曲部延伸的电路部。 改进的FPCB包括柔性的基膜，包括邻近端部和弯曲部分形成的第一通孔和邻近弯曲部分和电路部分形成的第二通孔，形成在第一导电层上的第一导电层 至少所述端部和所述弯曲部的外表面，形成在所述第一导电层上的覆盖层，形成在所述端部的内表面上并通过所述第一导电层电连接到所述第一导电层的第二导电层 第一导电孔和第三导电层，其形成在延伸电路部分的内表面上，并通过第二通孔与第一导电层电连接。

    Circuit board and method of manufacturing the same
    4.
    发明授权
    Circuit board and method of manufacturing the same 有权
    电路板及其制造方法

    公开(公告)号：US08431029B2

    公开(公告)日：2013-04-30

    申请号：US12492382

    申请日：2009-06-26

    申请人： Young-duck Kwon ,  Deok-heung Kim

    发明人： Young-duck Kwon ,  Deok-heung Kim

    IPC分类号： H01B13/00

    CPC分类号： H05K3/067 ,  H05K3/06 ,  H05K3/242 ,  H05K2201/0338 ,  H05K2203/025 ,  H05K2203/1184

    摘要： Provided are a circuit board and a method of manufacturing the same. The method includes: forming a pad portion and a lead line portion of a metal on an insulating substrate, wherein the lead line portion is connected to the pad portion; forming a conductive layer on the pad portion and the lead line portion, wherein the conductive layer has an upper surface comprising gold; forming an etching mask on the conductive layer so as to expose a portion corresponding to the lead line portion in the conductive layer; etching a portion of the lead line portion exposed by the etching mask and a portion of the conductive layer corresponding to the lead line portion using an etching solution containing an acid; and removing the etching mask.

    摘要翻译： 提供一种电路板及其制造方法。 该方法包括：在绝缘基板上形成金属的焊盘部分和引线部分，其中引线部分连接到焊盘部分; 在所述焊盘部分和所述引线部分上形成导电层，其中所述导电层具有包含金的上表面; 在所述导电层上形成蚀刻掩模，以暴露与所述导电层中的所述引线部分相对应的部分; 使用含有酸的蚀刻溶液蚀刻由蚀刻掩模暴露的引线部分的一部分和与引线部分相对应的导电层的一部分; 并去除蚀刻掩模。

    Flexible printed circuit board
    5.
    发明申请
    Flexible printed circuit board 有权
    柔性印刷电路板

    公开(公告)号：US20050122700A1

    公开(公告)日：2005-06-09

    申请号：US10790310

    申请日：2004-03-01

    申请人： Deok-heung Kim ,  Bong-hui Lee

    发明人： Deok-heung Kim ,  Bong-hui Lee

    IPC分类号： H05K1/02 ,  H05K1/00 ,  H05K3/28 ,  H05K3/32 ,  H05K3/36 ,  H01R11/09 ,  H05K1/11 ,  H05K1/14

    CPC分类号： H05K1/028 ,  H05K3/28 ,  H05K3/323 ,  H05K3/361 ,  H05K2201/09627 ,  H05K2201/0979 ,  H05K2201/10666

    摘要： A flexible printed circuit board (FPCB) which prevents a short circuit due to a crack in a bending portion is provided. The FPCB includes an end portion, a bending portion extended from the end portion, and a circuit portion extended from the bending portion. The improved FPCB includes a base film which is flexible and comprises a first via-hole formed adjacent to the end portion and the bending portion and a second via-hole formed adjacent to the bending portion and the circuit portion, a first conductive layer formed on an outer surface of at least the end portion and the bending portion, a cover layer formed on the first conductive layer, a second conductive layer which is formed on an inner surface of the end portion and is electrically connected to the first conductive layer through the first via-hole, and a third conductive layer which is formed on an inner surface of the extension circuit portion and is electrically connected to the first conductive layer through the second via-hole.

    摘要翻译： 提供一种柔性印刷电路板（FPCB），其防止由于弯曲部分的裂纹引起的短路。 FPCB包括端部，从端部延伸的弯曲部和从弯曲部延伸的电路部。 改进的FPCB包括柔性的基膜，包括邻近端部和弯曲部分形成的第一通孔和邻近弯曲部分和电路部分形成的第二通孔，形成在第一导电层上的第一导电层 至少所述端部和所述弯曲部的外表面，形成在所述第一导电层上的覆盖层，形成在所述端部的内表面上并通过所述第一导电层电连接到所述第一导电层的第二导电层 第一导电孔和第三导电层，其形成在延伸电路部分的内表面上，并通过第二通孔与第一导电层电连接。

    Apparatus for roll-to-roll manufacturing semiconductor parts and feeding method thereof
    6.
    发明授权
    Apparatus for roll-to-roll manufacturing semiconductor parts and feeding method thereof 有权
    用于卷对卷制造半导体部件的装置及其馈送方法

    公开(公告)号：US08601680B2

    公开(公告)日：2013-12-10

    申请号：US12545371

    申请日：2009-08-21

    申请人： Woo-suk Choi ,  Deok-heung Kim

    发明人： Woo-suk Choi ,  Deok-heung Kim

    IPC分类号： H05K3/00 ,  H05K3/20

    CPC分类号： H05K3/0085 ,  B65H18/103 ,  B65H23/188 ,  B65H2301/522 ,  B65H2701/1752 ,  H05K1/0393 ,  H05K3/0097 ,  H05K2201/10204 ,  H05K2203/1545

    摘要： Provided is a method of roll-to-roll processing of semiconductor parts, the method including: supplying to a processing unit a first material uncoiled from a first roll for processing at the processing unit; connecting a leading board to a leading portion of the first material before the processing so that the first material led by the leading board is processed during transfer in the processing unit along a path; cutting the leading board from the leading portion of the first material after the processing; and if a terminal edge of the first material begins to be processed at the processing unit, connecting another leading board to a leading portion of a second material uncoiled from a second roll and supplying the second material to the processing unit for processing.

    摘要翻译： 提供一种半导体部件的卷对卷处理的方法，该方法包括：向处理单元提供从第一辊展开的第一材料，以在处理单元处进行处理; 在处理之前将前导板连接到第一材料的引导部分，使得由前导板引导的第一材料沿着路径在处理单元中传送期间被处理; 在处理后从第一材料的引导部分切割引导板; 并且如果所述第一材料的端边缘在所述处理单元处开始被处理，则将另一前导板连接到从第二辊展开的第二材料的引导部分，并将所述第二材料供应到所述处理单元用于处理。

    Roll-to-roll substrate transfer apparatus, wet etching apparatus comprising the same and apparatus for manufacturing printed circuit board
    7.
    发明授权
    Roll-to-roll substrate transfer apparatus, wet etching apparatus comprising the same and apparatus for manufacturing printed circuit board 有权
    卷对卷基板输送装置，包含该蚀刻装置的湿式蚀刻装置以及印刷电路板的制造装置

    公开(公告)号：US08128752B2

    公开(公告)日：2012-03-06

    申请号：US12317562

    申请日：2008-12-23

    申请人： Deok-heung Kim

    发明人： Deok-heung Kim

    IPC分类号： C23F1/00 ,  B65G13/02

    CPC分类号： C23F1/08 ,  C25D17/00 ,  C25D17/28 ,  H05K1/0393 ,  H05K3/068 ,  H05K3/241 ,  H05K2203/075 ,  H05K2203/1545 ,  H05K2203/1572

    摘要： In one aspect, a roll-to-roll substrate transfer apparatus is provided that includes: a feed roll and a take-up roll between which a printed circuit board substrate extends; and a plurality of drive roller rows transmitting motive power to the substrate for moving the substrate in a transferring direction, each drive roller row of the plurality includes a roller axis arranged in a direction perpendicular to the transferring direction of the substrate, and a plurality of spaced-apart drive rollers on the roller axis, wherein drive rollers of one drive roller row are arranged in spaces between drive rollers of adjacent drive roller rows. In other aspects, a wet etching apparatus and an apparatus for manufacturing a printed circuit board that include the roll-to-roll substrate transfer apparatus are provided.

    摘要翻译： 一方面，提供了一种卷对卷基板输送装置，其包括：进给辊和卷取辊，印刷电路板基板延伸在该卷取辊之间; 以及将传递动力的多个驱动辊列传送到所述基板，用于沿传送方向移动所述基板，所述多个驱动辊排包括沿与所述基板的传送方向垂直的方向布置的滚子轴， 辊轴上的间隔开的驱动辊，其中一个驱动辊排的驱动辊布置在相邻驱动辊排的驱动辊之间的空间中。 在其它方面，提供了一种湿蚀刻装置和用于制造包括该卷对卷基板转印装置的印刷电路板的装置。

    CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
    8.
    发明申请
    CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME 有权
    电路板及其制造方法

    公开(公告)号：US20100000776A1

    公开(公告)日：2010-01-07

    申请号：US12492382

    申请日：2009-06-26

    申请人： Deok-heung Kim ,  Young-duck Kwon

    发明人： Deok-heung Kim ,  Young-duck Kwon

    IPC分类号： H05K1/11 ,  H01B13/00

    CPC分类号： H05K3/067 ,  H05K3/06 ,  H05K3/242 ,  H05K2201/0338 ,  H05K2203/025 ,  H05K2203/1184

    摘要： Provided are a circuit board and a method of manufacturing the same. The method includes: forming a pad portion and a lead line portion of a metal on an insulating substrate, wherein the lead line portion is connected to the pad portion; forming a conductive layer on the pad portion and the lead line portion, wherein the conductive layer has an upper surface comprising gold; forming an etching mask on the conductive layer so as to expose a portion corresponding to the lead line portion in the conductive layer; etching a portion of the lead line portion exposed by the etching mask and a portion of the conductive layer corresponding to the lead line portion using an etching solution containing an acid; and removing the etching mask.

    摘要翻译： 提供一种电路板及其制造方法。 该方法包括：在绝缘基板上形成金属的焊盘部分和引线部分，其中引线部分连接到焊盘部分; 在所述焊盘部分和所述引线部分上形成导电层，其中所述导电层具有包含金的上表面; 在所述导电层上形成蚀刻掩模，以暴露与所述导电层中的所述引线部分相对应的部分; 使用含有酸的蚀刻溶液蚀刻由蚀刻掩模暴露的引线部分的一部分和与引线部分相对应的导电层的一部分; 并去除蚀刻掩模。

    Roll-to-roll substrate transfer apparatus, wet etching apparatus comprising the same and apparatus for manufacturing printed circuit board
    9.
    发明申请
    Roll-to-roll substrate transfer apparatus, wet etching apparatus comprising the same and apparatus for manufacturing printed circuit board 有权
    卷对卷基板输送装置，包含该蚀刻装置的湿式蚀刻装置以及印刷电路板的制造装置

    公开(公告)号：US20090159210A1

    公开(公告)日：2009-06-25

    申请号：US12317562

    申请日：2008-12-23

    申请人： Deok-heung Kim

    发明人： Deok-heung Kim

    IPC分类号： C23F1/00 ,  B65G13/02

    CPC分类号： C23F1/08 ,  C25D17/00 ,  C25D17/28 ,  H05K1/0393 ,  H05K3/068 ,  H05K3/241 ,  H05K2203/075 ,  H05K2203/1545 ,  H05K2203/1572

    摘要： In one aspect, a roll-to-roll substrate transfer apparatus is provided that includes: a feed roll and a take-up roll between which a printed circuit board substrate extends; and a plurality of drive roller rows transmitting motive power to the substrate for moving the substrate in a transferring direction, each drive roller row of the plurality includes a roller axis arranged in a direction perpendicular to the transferring direction of the substrate, and a plurality of spaced-apart drive rollers on the roller axis, wherein drive rollers of one drive roller row are arranged in spaces between drive rollers of adjacent drive roller rows. In other aspects, a wet etching apparatus and an apparatus for manufacturing a printed circuit board that include the roll-to-roll substrate transfer apparatus are provided.

    摘要翻译： 一方面，提供了一种卷对卷基板输送装置，其包括：进给辊和卷取辊，印刷电路板基板延伸在该卷取辊之间; 以及将传递动力的多个驱动辊列传送到所述基板，用于沿传送方向移动所述基板，所述多个驱动辊排包括沿与所述基板的传送方向垂直的方向布置的滚子轴， 辊轴上的间隔开的驱动辊，其中一个驱动辊排的驱动辊布置在相邻驱动辊排的驱动辊之间的空间中。 在其它方面，提供了一种湿蚀刻装置和用于制造包括该卷对卷基板转印装置的印刷电路板的装置。