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    Patterning a layered chrome-copper structure disposed on a dielectric substrate
    1.
    发明授权
    Patterning a layered chrome-copper structure disposed on a dielectric substrate 失效
    对设置在电介质基板上的分层铬铜结构进行成形

    公开(公告)号：US06335495B1

    公开(公告)日：2002-01-01

    申请号：US09343073

    申请日：1999-06-29

    申请人： Donald S. Farquhar ,  Edmond O. Fey ,  Elizabeth F. Foster ,  Michael J. Klodowski

    发明人： Donald S. Farquhar ,  Edmond O. Fey ,  Elizabeth F. Foster ,  Michael J. Klodowski

    IPC分类号： H01K111

    CPC分类号： H05K3/4641 ,  H05K1/0224 ,  H05K3/064 ,  H05K3/388 ,  H05K2201/015 ,  H05K2201/0338

    摘要： An electrical structure, comprising a first dielectric layer, a patterned layer on the first dielectric layer, and a second dielectric layer on the patterned layer. The patterned layer includes a metal pattern on the first dielectric layer, a metallic pattern on the metal pattern, and a plugged pattern within a remaining space of the patterned layer. The plugged pattern includes a dielectric material. The second dielectric layer is adhesively bonded to a top surface of the patterned layer. The second dielectric layer includes the dielectric material.

    摘要翻译： 电结构，包括第一电介质层，第一电介质层上的图案化层和图案化层上的第二电介质层。 图案化层包括在第一介电层上的金属图案，金属图案上的金属图案，以及图案化层的剩余空间内的堵塞图案。 堵塞图案包括电介质材料。 第二电介质层粘合到图案化层的顶表面上。 第二电介质层包括电介质材料。

    Accelerated etching of chromium
    2.
    发明授权
    Accelerated etching of chromium 失效
    加速蚀刻铬

    公开(公告)号：US06843929B1

    公开(公告)日：2005-01-18

    申请号：US09514526

    申请日：2000-02-28

    申请人： Donald S. Farquhar ,  Edmond O. Fey ,  Elizabeth Foster ,  Michael J. Klodowski ,  Paul G. Rickerl

    发明人： Donald S. Farquhar ,  Edmond O. Fey ,  Elizabeth Foster ,  Michael J. Klodowski ,  Paul G. Rickerl

    IPC分类号： C23F1/26 ,  H01L21/3213 ,  B44C1/22

    CPC分类号： H01L21/32134 ,  C23F1/26

    摘要： A method and associated structure for increasing the rate at which a chromium volume is etched when the chromium body is contacted by an acid solution such as hydrochloric acid. The etch rate is increased by a metallic or steel body in continuous electrical contact with the chromium volume, both of which are in continuous contact with the acid solution. At a temperature between about 21° C. and about 52° C., and a hydrochloric acid concentration (molarity) between about 1.2 M and about 2.4 M, the etch rate is at least a factor of about two greater than an etch rate that would occur in an absence of the steel body. In one embodiment, the chromium volume is a chromium layer that rests upon a conductive layer that includes a metal such as copper, wherein the acid solution is not in contact with the conductive layer. In another embodiment, the chromium volume is a chromium layer located under a conductive layer that includes a metal such as copper, wherein the steel body and the acid solution both contact the chromium layer through an opening in the conductive layer such that the opening exposes the chromium layer.

    摘要翻译： 一种用于提高当铬体与诸如盐酸的酸溶液接触时铬体积被蚀刻的速率的方法和相关结构。 蚀刻速率由与铬体积连续电接触的金属或钢体增加，两者都与酸溶液连续接触。 在约21℃至约52℃的温度和约1.2M至约2.4M之间的盐酸浓度（摩尔浓度）之间，蚀刻速率至少比蚀刻速率大约两倍， 将在没有钢体的情况下发生。 在一个实施方案中，铬体积是沉积在包括诸如铜的金属的导电层上的铬层，其中酸溶液不与导电层接触。 在另一个实施方案中，铬体积是位于导电层下方的铬层，该层包括诸如铜的金属，其中钢体和酸溶液都通过导电层中的开口接触铬层，使得开口暴露于 铬层。

    Security cloth design and assembly
    8.
    发明授权
    Security cloth design and assembly 失效
    安全布设计装配

    公开(公告)号：US07679921B2

    公开(公告)日：2010-03-16

    申请号：US11267770

    申请日：2005-11-04

    申请人： Mario L. Cesana ,  Donald S. Farquhar ,  Martino Taddei

    发明人： Mario L. Cesana ,  Donald S. Farquhar ,  Martino Taddei

    IPC分类号： H05K1/00

    CPC分类号： G06F21/87 ,  G06F1/1628 ,  Y10T428/23

    摘要： A security enclosure and method of forming the security enclosure. The security enclosure includes an electronic assembly, an extension, and a tamper respondent wrap. The extension has a first end inserted in the assembly and a second end having at least one bonding pad thereon. The tamper respondent wrap at least partially surrounds the assembly. The wrap has a bonding pad. The bonding pad of the extension is secured to the bonding pad of the wrap. The tamper respondent wrap includes a plurality of layers. A plurality of electrically conductive lines or a plurality of electrically conductive ink traces exist within each layer of the wrap.

    摘要翻译： 形成安全机柜的安全机箱和方法。 安全机柜包括一个电子组件，一个扩展和一个篡改的回应包。 延伸部具有插入组件中的第一端和在其上具有至少一个接合垫的第二端。 篡改答卷者至少部分地围绕组件。 包装有一个接合垫。 延伸部的接合垫固定在包装的接合垫上。 篡改答复包裹包括多个层。 多个导电线或多个导电墨迹存在于包层的每层内。

    Solid via layer to layer interconnect
    9.
    发明授权
    Solid via layer to layer interconnect 失效
    实体通过层间互连

    公开(公告)号：US07076869B2

    公开(公告)日：2006-07-18

    申请号：US10260153

    申请日：2002-09-27

    申请人： Brian E. Curcio ,  Donald S. Farquhar ,  Voya R. Markovich ,  Konstantinos I. Papathomas

    发明人： Brian E. Curcio ,  Donald S. Farquhar ,  Voya R. Markovich ,  Konstantinos I. Papathomas

    IPC分类号： H01K3/10

    CPC分类号： H05K3/462 ,  H05K3/321 ,  H05K3/423 ,  H05K3/4623 ,  H05K2201/09536 ,  H05K2201/09563 ,  H05K2201/096 ,  H05K2203/0733 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49165

    摘要： The present invention relates to a method for providing an interconnect between layers of a multilayer circuit board. A first via extending through a total thickness of a first layer is formed. The first via is totally filled with a first solid conductive plug and an end of the first solid conductive plug includes a first contact pad that is in contact with a surface of the first layer. A second via extending through a total thickness of a second layer is formed. The second via totally filling with a second solid conductive plug and an end of the second solid conductive plug includes a second contact pad that is in contact with a surface of the second layer. The second layer is electrically and mechanically coupled to the first layer by an electrically conductive adhesive that is in electrical and mechanical contact with both the end of the first plug and the end of the second plug.

    摘要翻译： 本发明涉及一种在多层电路板的层之间提供互连的方法。 形成延伸通过第一层的总厚度的第一通孔。 第一通孔完全填充有第一固体导电插塞，并且第一固体导电插塞的端部包括与第一层的表面接触的第一接触垫。 形成延伸穿过第二层的总厚度的第二通孔。 通过完全填充第二固体导电插塞和第二固体导电插塞的端部的第二通孔包括与第二层的表面接触的第二接触垫。 第二层通过与第一插头的端部和第二插头的端部电接触和机械接触的导电粘合剂电和机械地耦合到第一层。