公开(公告)号：US20060035025A1

公开(公告)日：2006-02-16

申请号：US11146295

申请日：2005-06-06

申请人： Donald Verplancken ,  Ashok Sinha

发明人： Donald Verplancken ,  Ashok Sinha

IPC分类号： C23C14/00 ,  C23C16/00

CPC分类号： C23C16/45542 ,  C23C16/452 ,  H01J37/32357

摘要： A method for providing activated species for a cyclical deposition process is provided herein. In one aspect, the method includes delivering a gas to be activated into a plasma generator, activating the gas to create a volume of reactive species, delivering a fraction of the reactive species into a processing region to react within a substrate therein, and maintaining at least a portion of the gas remaining in the plasma generator in an activated state after delivering the fraction of the gas into the process region. The plasma generator may include a high density plasma (HDP) generator, a microwave generator, a radio-frequency (RF) generator, an inductive-coupled plasma (ICP) generator, a capacitively coupled generator, or combinations thereof.

摘要翻译： 本文提供了用于提供用于循环沉积工艺的活化物质的方法。 在一个方面，所述方法包括将待激活的气体输送到等离子体发生器中，激活气体以产生一定体积的反应物质，将一部分反应性物质输送到处理区域中以在其内部的基底内反应并维持在 在将一部分气体输送到处理区域中之后，剩余在等离子体发生器中的气体的至少一部分处于活化状态。 等离子体发生器可以包括高密度等离子体（HDP）发生器，微波发生器，射频（RF）发生器，感应耦合等离子体（ICP）发生器，电容耦合发生器或其组合。

公开(公告)号：US07709385B2

公开(公告)日：2010-05-04

申请号：US12335976

申请日：2008-12-16

申请人： Ming Xi ,  Ashok Sinha ,  Moris Kori ,  Alfred W. Mak ,  Xinliang Lu ,  Ken Kaung Lai ,  Karl A. Littau

发明人： Ming Xi ,  Ashok Sinha ,  Moris Kori ,  Alfred W. Mak ,  Xinliang Lu ,  Ken Kaung Lai ,  Karl A. Littau

IPC分类号： H01L21/44

CPC分类号： C23C16/0272 ,  C23C16/34 ,  C23C16/45525 ,  C23C16/45527 ,  C23C16/45561 ,  C30B25/02 ,  C30B25/14 ,  C30B29/38 ,  H01L21/28562 ,  H01L21/76843 ,  H01L21/76876

摘要： In one embodiment, a method for forming a tungsten-containing material on a substrate is provided which includes forming a tungsten-containing layer by sequentially exposing a substrate to a processing gas and a tungsten-containing gas during an atomic layer deposition process, wherein the processing gas comprises a boron-containing gas and a nitrogen-containing gas, and forming a tungsten bulk layer over the tungsten-containing layer by exposing the substrate to a deposition gas comprising the tungsten-containing gas and a reactive precursor gas during a chemical vapor deposition process. In one example, the tungsten-containing layer and the tungsten bulk layer are deposited within the same processing chamber.

摘要翻译： 在一个实施例中，提供了一种在基板上形成含钨材料的方法，其包括通过在原子层沉积工艺期间将衬底顺序地暴露于处理气体和含钨气体来形成含钨层，其中 处理气体包括含硼气体和含氮气体，并且在化学气体中通过将衬底暴露于包含含钨气体和反应性前体气体的沉积气体而在含钨层上形成钨体层 沉积工艺。 在一个实例中，含钨层和钨体层沉积在相同的处理室内。

公开(公告)号：US20090035865A1

公开(公告)日：2009-02-05

申请号：US11832130

申请日：2007-08-01

申请人： Colette Pamela DeMoor ,  Ashok Sinha ,  Ian Gibbons

发明人： Colette Pamela DeMoor ,  Ashok Sinha ,  Ian Gibbons

IPC分类号： G01N33/18 ,  B01J19/00 ,  G01N21/78

CPC分类号： G01N31/222 ,  G01N21/81

摘要： A moisture sensor is disclosed which measures cumulative exposure to moisture. The moisture sensor comprises a matrix having a hygroscopic material, a first reagent, and a second reagent which interact only in the presence of water to produce a detectable, irreversible change in the matrix to provide a moisture indication. The moisture sensor may be incorporated with a disposable diagnostic device, whereby a method for preventing the use of such a disposable diagnostic device if exposed to excessive cumulative humidity is also disclosed.

摘要翻译： 公开了一种测量累积暴露于湿气的湿度传感器。 水分传感器包括具有吸湿材料，第一试剂和第二试剂的基质，其仅在水存在下相互作用以在基质中产生可检测的不可逆变化以提供湿气指示。 湿度传感器可以与一次性诊断装置并入，由此也公开了如果暴露于过度累积湿度时防止使用这种一次性诊断装置的方法。

公开(公告)号：US20070238305A1

公开(公告)日：2007-10-11

申请号：US11402074

申请日：2006-04-11

申请人： Gerardo Delgadino ,  Indrajit Lahiri ,  Teh-Tien Su ,  Brian Sheih ,  Ashok Sinha

发明人： Gerardo Delgadino ,  Indrajit Lahiri ,  Teh-Tien Su ,  Brian Sheih ,  Ashok Sinha

IPC分类号： H01L21/302 ,  H01L21/461

CPC分类号： H01L21/31138 ,  G03F7/427 ,  H01J37/32357 ,  H01L21/0209

摘要： A plasma etch process for etching a porous carbon-doped silicon oxide dielectric layer using a photoresist mask is carried out first in an etch reactor by performing a fluorocarbon based etch process on the workpiece to etch exposed portions of the dielectric layer while depositing protective fluorocarbon polymer on the photoresist mask. Then, in an ashing reactor, polymer and photoresist are removed by heating the workpiece to over 100 degrees C., exposing a peripheral portion of the backside of said workpiece, and providing products from a plasma of a hydrogen process gas to reduce carbon contained in polymer and photoresist on said workpiece until the polymer has been removed from a backside of said workpiece. The process gas preferably contains both hydrogen gas and water vapor, although the primary constituent is hydrogen gas. The wafer (workpiece) backside may be exposed by extending the wafer lift pins.

摘要翻译： 首先在蚀刻反应器中进行用于蚀刻使用光致抗蚀剂掩模的多孔碳掺杂氧化硅电介质层的等离子体蚀刻工艺，通过在工件上执行基于碳氟化合物的蚀刻工艺来蚀刻介电层的暴露部分，同时沉积保护性氟碳聚合物 在光刻胶掩模上。 然后，在灰化反应器中，通过将工件加热到超过100摄氏度，去除聚合物和光致抗蚀剂，暴露所述工件背面的周边部分，并提供来自氢处理气体的等离子体的产物，以减少包含在 聚合物和光致抗蚀剂，直到聚合物已从所述工件的背面去除。 处理气体优选含有氢气和水蒸汽，尽管主要成分是氢气。 晶片（工件）背面可以通过延伸晶片提升销来暴露。

公开(公告)号：US07220673B2

公开(公告)日：2007-05-22

申请号：US11461909

申请日：2006-08-02

申请人： Ming Xi ,  Ashok Sinha ,  Moris Kori ,  Alfred W. Mak ,  Xinliang Lu ,  Ken Kaung Lai ,  Karl A. Littau

发明人： Ming Xi ,  Ashok Sinha ,  Moris Kori ,  Alfred W. Mak ,  Xinliang Lu ,  Ken Kaung Lai ,  Karl A. Littau

IPC分类号： H01L21/44

CPC分类号： C23C16/0272 ,  C23C16/34 ,  C23C16/45525 ,  C23C16/45527 ,  C23C16/45561 ,  C30B25/02 ,  C30B25/14 ,  C30B29/38 ,  H01L21/28562 ,  H01L21/76843 ,  H01L21/76876

摘要： In one embodiment, a method for forming a tungsten-containing material on a substrate is provided which includes forming a tungsten nucleation layer by sequentially exposing a substrate to a boron-containing gas and a tungsten-containing gas within a processing chamber during an atomic layer deposition process, and forming a tungsten bulk layer on the tungsten nucleation layer by exposing the substrate to a processing gas that contains the tungsten-containing gas and a reactive precursor gas within another processing chamber during a chemical vapor deposition process. In one example, the tungsten nucleation layer is deposited on a dielectric material, such as silicon oxide. In another example, the tungsten nucleation layer is deposited on a barrier material, such as titanium or titanium nitride. Other examples provide that the tungsten nucleation layer and the tungsten bulk layer are deposited in the same processing chamber.

摘要翻译： 在一个实施例中，提供了一种用于在基板上形成含钨材料的方法，其包括通过在原子层中将衬底顺序地暴露于处理室内的含硼气体和含钨气体来形成钨成核层 通过在化学气相沉积工艺期间将衬底暴露于另一处理室内含有含钨气体和反应性前体气体的处理气体，在钨成核层上形成钨体层。 在一个实例中，钨成核层沉积在介电材料如氧化硅上。 在另一个实例中，钨成核层沉积在诸如钛或氮化钛的阻挡材料上。 其他实例提供了钨成核层和钨本体层沉积在相同的处理室中。

公开(公告)号：US20070066064A1

公开(公告)日：2007-03-22

申请号：US11372752

申请日：2006-03-10

申请人： Michael Kutney ,  Daniel Hoffman ,  Gerardo Delgadino ,  Ezra Gold ,  Ashok Sinha ,  Xiaoye Zhao ,  Douglas Burns ,  Shawming Ma

发明人： Michael Kutney ,  Daniel Hoffman ,  Gerardo Delgadino ,  Ezra Gold ,  Ashok Sinha ,  Xiaoye Zhao ,  Douglas Burns ,  Shawming Ma

IPC分类号： H01L21/00 ,  G01L21/30 ,  H01L21/302

CPC分类号： H01L21/67069 ,  H01L21/31116 ,  H01L21/76807

摘要： In some implementations, a method is provided in a plasma processing chamber for stabilizing etch-rate distributions during a process transition from one process step to another process step. The method includes performing a pre-transition compensation of at least one other process parameter so as to avoid unstable plasma states by inhibiting formation of a parasitic plasma during the process transition. In some implementations, a method is provided for processing a workpiece in plasma processing chamber, which includes inhibiting deviations from an expected etch-rate distribution by avoiding unstable plasma states during a process transition from one process step to another process step.

摘要翻译： 在一些实施方案中，在等离子体处理室中提供了一种方法，用于在从一个处理步骤到另一个处理步骤的过程转变期间稳定蚀刻速率分布。 该方法包括执行至少一个其它过程参数的预过渡补偿，以便通过在过程转换期间抑制寄生等离子体的形成来避免不稳定的等离子体状态。 在一些实施方案中，提供了一种用于处理等离子体处理室中的工件的方法，其包括通过在从一个工艺步骤转换到另一工艺步骤的过程转变期间避免不稳定的等离子体状态来抑制预期蚀刻速率分布的偏差。

公开(公告)号：US20060027329A1

公开(公告)日：2006-02-09

申请号：US10914947

申请日：2004-08-09

申请人： Ashok Sinha ,  Daniel Hoffman ,  John Holland

发明人： Ashok Sinha ,  Daniel Hoffman ,  John Holland

IPC分类号： C23F1/00 ,  B44C1/22

CPC分类号： H01J37/32165 ,  H01J37/321

摘要： A method and apparatus for processing a substrate includes a reactor chamber having a chamber wall and containing a substrate support. An electrode overlies the substrate and is spaced apart from the substrate support. One or more plasma sources maintains plasma in the reactor in one or more torroidal paths using a first frequency. One or more RF power generators supply power to the electrode at a second frequency that is different from the first frequency.

摘要翻译： 用于处理衬底的方法和装置包括具有室壁并包含衬底支撑件的反应室。 电极覆盖在衬底上并且与衬底支撑件间隔开。 一个或多个等离子体源使用第一频率在一个或多个环形路径中保持反应器中的等离子体。 一个或多个RF发电机以不同于第一频率的第二频率向电极供电。

公开(公告)号：US06893548B2

公开(公告)日：2005-05-17

申请号：US09882208

申请日：2001-06-13

申请人： Robin Cheung ,  Daniel A. Carl ,  Liang-Yuh Chen ,  Yezdi Dordi ,  Paul F. Smith ,  Ratson Morad ,  Peter Hey ,  Ashok Sinha

发明人： Robin Cheung ,  Daniel A. Carl ,  Liang-Yuh Chen ,  Yezdi Dordi ,  Paul F. Smith ,  Ratson Morad ,  Peter Hey ,  Ashok Sinha

IPC分类号： C23C18/16 ,  C25D7/12 ,  C25D21/12 ,  C25D21/18 ,  C25D5/00

CPC分类号： C25D21/18 ,  C23C18/1617 ,  C23C18/1683 ,  C25D21/12

摘要： An apparatus and method is provided for analyzing or conditioning an electrochemical bath. One aspect of the invention provides a method for analyzing an electrochemical bath in an electrochemical deposition process including providing a first electrochemical bath having a first bath composition, utilizing the first electrochemical bath in an electrochemical deposition process to form a second electrochemical bath having a second bath composition and analyzing the first and second compositions to identify one or more constituents generated in the electrochemical deposition process. Additive material having a composition that is substantially the same as all or at least some of the one or more constituents generated in the electrochemical deposition process may be added to another electrochemical bath to produce a desired chemical composition. The constituents may be added at the beginning of the use of the bath to initially condition the electrochemical bath or may be added, preferably either continuously or periodically, during the electrochemical deposition process.

摘要翻译： 提供了一种用于分析或调理电化学浴的装置和方法。 本发明的一个方面提供了一种用于在电化学沉积方法中分析电化学浴的方法，包括提供具有第一浴组成的第一电化学浴，利用电化学沉积工艺中的第一电化学浴形成具有第二浴的第二电化学浴 组合和分析第一和第二组合物以鉴定在电化学沉积过程中产生的一种或多种成分。 具有与在电化学沉积工艺中产生的一种或多种成分中的全部或至少一些基本上相同的组成的添加剂材料可以加入到另一电化学浴中以产生所需的化学组成。 可以在使用浴的开始时添加组分以最初调节电化学浴，或者可以在电化学沉积过程期间连续地或周期性地添加。

公开(公告)号：US06399479B1

公开(公告)日：2002-06-04

申请号：US09386077

申请日：1999-08-30

申请人： Fusen Chen ,  Zheng Xu ,  Peijun Ding ,  Barry Chin ,  Ashok Sinha

发明人： Fusen Chen ,  Zheng Xu ,  Peijun Ding ,  Barry Chin ,  Ashok Sinha

IPC分类号： H01L214763

CPC分类号： H01L21/76862 ,  H01L21/76865 ,  H01L21/76868 ,  H01L21/76873 ,  H01L21/76877

摘要： The invention provides a method for filling a structure on a substrate comprising: depositing a barrier layer on one or more surfaces of the structure, depositing a seed layer over the barrier layer, removing a portion of the seed layer, and electrochemically depositing a metal to fill the structure. Preferably, a portion or all of the seed layer formed on the sidewall portion of the structure is removed using a electrochemical de-plating process prior to the electroplating process.

摘要翻译： 本发明提供了一种用于在衬底上填充结构的方法，包括：在结构的一个或多个表面上沉积阻挡层，在阻挡层上沉积种子层，去除种子层的一部分，以及电化学沉积金属 填写结构。 优选地，在电镀工艺之前使用电化学去镀工艺去除在结构的侧壁部分上形成的种子层的一部分或全部。

公开(公告)号：US06270621B1

公开(公告)日：2001-08-07

申请号：US09593018

申请日：2000-06-13

申请人： Simon W. Tam ,  Semyon Sherstinsky ,  Mei Chang ,  Alan Morrison ,  Ashok Sinha

发明人： Simon W. Tam ,  Semyon Sherstinsky ,  Mei Chang ,  Alan Morrison ,  Ashok Sinha

IPC分类号： H01L2100

CPC分类号： H01L21/68721 ,  H01J2237/022 ,  H01L21/68785

摘要： A conventional plasma etch chamber is modified to reduce particulate generation in the chamber that contaminates the chamber and substrates mounted on a pedestal support being processed therein. A clamping ring cover in the chamber is made of ceramic. Grooves are machined into the cover and metal antennas can be mounted in the grooves to act as a getter for particles and pre-particle, non-volatile contaminants in the chamber. The clamping ring for the substrate being processed is also made of ceramic. Fewer particles are generated by ion bombardment using ceramic versus prior art clamping rings made of aluminum. Further, the cylinder clamping ring support which surrounds the pedestal support is fitted with a plurality of openings or windows to allow escape of purge gases that carry particles through the windows and into the adjoining exhaust system of the chamber and thus also away from the substrate being processed. Markedly fewer particles are deposited onto substrates using the modified plasma etch chamber of the invention than was found for unmodified chambers.

摘要翻译： 修改常规等离子体蚀刻室以减少腔室中的颗粒产生，从而污染安装在其中处理的基座支撑件上的腔室和基底。 腔室中的夹紧环盖由陶瓷制成。 槽被加工成盖子，并且金属天线可以安装在凹槽中，以用作在室中的颗粒和预颗粒，非挥发性污染物的吸气剂。 用于被处理的基板的夹紧环也由陶瓷制成。 通过使用陶瓷的离子轰击产生的较少的颗粒与由铝制成的现有技术的夹紧环产生。 此外，围绕基座支撑件的气缸夹紧环支撑装配有多个开口或窗口，以允许通过窗口携带颗粒的吹扫气体逸出并进入室的相邻排气系统，并且因此也远离基板 处理。 使用本发明的改进的等离子体蚀刻室，显着减少颗粒沉积到基板上，而不是未修改的室。