公开(公告)号：US5263247A

公开(公告)日：1993-11-23

申请号：US924142

申请日：1992-08-03

申请人： Einosuke Adachi ,  Yasumichi Hatanaka ,  Hiroyuki Nakajima ,  Satoru Hayashi

发明人： Einosuke Adachi ,  Yasumichi Hatanaka ,  Hiroyuki Nakajima ,  Satoru Hayashi

IPC分类号： F16B19/10 ,  H01R9/20 ,  H01R12/58 ,  H01R43/20 ,  H05K1/02 ,  H05K1/18 ,  H05K3/32 ,  H05K7/06 ,  H01R9/09

CPC分类号： H05K3/325 ,  F16B19/10 ,  H01R12/58 ,  H01R43/205 ,  H01R9/20 ,  H01R12/7088 ,  H05K2201/10272 ,  H05K2201/10295 ,  Y10T29/49142 ,  Y10T29/49149 ,  Y10T29/49153 ,  Y10T29/49954

摘要： A method of preparing a large-current printed circuit board comprises inserting a fastener with a bottom flange in a through-hole formed in a printed circuit board so that the bottom flange is engaged with a surface of the printed circuit board, putting a washer having substantially the same outer diameter so the flange around the fastener at the other surface of the board, forming a radial extension at the outer side of the washer by caulking the fastener, whereby the fastener is fixed to the printed circuit board by means of the radial extension and the bottom flange wherein the washer is interposed between the radial extension and the printed circuit board.

摘要翻译： 一种制备大电流印刷电路板的方法包括：将具有底部凸缘的紧固件插入形成在印刷电路板中的通孔中，使得底部凸缘与印刷电路板的表面接合，将具有 基本上相同的外径，使得在板的另一表面处的紧固件周围的凸缘通过铆接紧固件在垫圈的外侧形成径向延伸，由此紧固件通过径向固定到印刷电路板 延伸部和底部凸缘，其中垫圈插入在径向延伸部和印刷电路板之间。

公开(公告)号：US5381598A

公开(公告)日：1995-01-17

申请号：US72154

申请日：1993-06-04

申请人： Einosuke Adachi ,  Yasumichi Hatanaka ,  Kiroyuki Nakajima ,  Satoru Hayashi

发明人： Einosuke Adachi ,  Yasumichi Hatanaka ,  Kiroyuki Nakajima ,  Satoru Hayashi

IPC分类号： F16B19/10 ,  H01R9/20 ,  H01R12/58 ,  H01R43/20 ,  H05K1/02 ,  H05K1/18 ,  H05K3/32 ,  H05K7/06 ,  H01R9/09 ,  H01R4/02 ,  H05K3/34

CPC分类号： H05K3/325 ,  F16B19/10 ,  H01R12/58 ,  H01R43/205 ,  H01R9/20 ,  H01R12/7088 ,  H05K2201/10272 ,  H05K2201/10295 ,  Y10T29/49142 ,  Y10T29/49149 ,  Y10T29/49153 ,  Y10T29/49954

摘要： A method of preparing a large-current printed circuit board comprises inserting a fastener with a bottom flange in a through-hole formed in a printed circuit board so that the bottom flange is engaged with a surface of the printed circuit board, putting a washer having substantially the same outer diameter so the flange around the fastener at the other surface of the board, forming a radial extension at the outer side of the washer by caulking the fastener, whereby the fastener is fixed to the printed circuit board by means of the radial extension and the bottom flange wherein the washer is interposed between the radial extension and the printed circuit board.

摘要翻译： 一种制备大电流印刷电路板的方法包括：将具有底部凸缘的紧固件插入形成在印刷电路板中的通孔中，使得底部凸缘与印刷电路板的表面接合，将具有 基本上相同的外径，使得在板的另一表面处的紧固件周围的凸缘通过铆接紧固件在垫圈的外侧形成径向延伸，由此紧固件通过径向固定到印刷电路板 延伸部和底部凸缘，其中垫圈插入在径向延伸部和印刷电路板之间。

公开(公告)号：US20070141750A1

公开(公告)日：2007-06-21

申请号：US11637097

申请日：2006-12-12

申请人： Toshihiro Iwasaki ,  Shiori Idaka ,  Yasumichi Hatanaka

发明人： Toshihiro Iwasaki ,  Shiori Idaka ,  Yasumichi Hatanaka

IPC分类号： H01L21/00

CPC分类号： H01L25/0657 ,  H01L24/11 ,  H01L24/13 ,  H01L24/81 ,  H01L24/97 ,  H01L25/50 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05027 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05171 ,  H01L2224/05184 ,  H01L2224/056 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/1147 ,  H01L2224/1181 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13644 ,  H01L2224/1403 ,  H01L2224/14051 ,  H01L2224/141 ,  H01L2224/16058 ,  H01L2224/16145 ,  H01L2224/73204 ,  H01L2224/81013 ,  H01L2224/81193 ,  H01L2224/81203 ,  H01L2224/8182 ,  H01L2224/97 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/19041 ,  H01L2224/81 ,  H01L2924/00014 ,  H01L2224/13099

摘要： A method of manufacturing a semiconductor device includes a first step of forming solder film on metal posts of a mother chip, a second step of forming solder balls after the first step by printing a solder paste on the mother chip and heating the mother chip so that the solder paste is ref lowed, a third step of bonding the metal posts of the mother chip and metal posts of a daughter chip to each other in a thermocompression bonding manner by means of the solder film after the second step, and a fourth step of flip-chip-connecting the mother chip on a circuit substrate by using the solder balls. In the second step, the mother chip is heated in a nitrogen atmosphere in which the oxygen concentration is 500 ppm or less.

摘要翻译： 一种制造半导体器件的方法包括：在母芯片的金属柱上形成焊料膜的第一步骤;第一步骤之后，通过在母芯片上印刷焊膏并加热母芯片，形成焊球的第二步骤， 焊膏被降低，第三步骤是通过在第二步骤之后的焊料膜以热压接方式将母芯片的金属柱和子芯片的金属柱彼此接合，并且第四步骤 通过使用焊球将母芯片倒装芯片连接在电路基板上。 在第二步中，在氧浓度为500ppm以下的氮气氛中加热母体芯片。

公开(公告)号：US20130312810A1

公开(公告)日：2013-11-28

申请号：US13983601

申请日：2012-04-05

申请人： Tsuneo Hamaguchi ,  Yoshimi Yabugaki ,  Shinsuke Miyamoto ,  Yasumichi Hatanaka

发明人： Tsuneo Hamaguchi ,  Yoshimi Yabugaki ,  Shinsuke Miyamoto ,  Yasumichi Hatanaka

IPC分类号： H01L31/05 ,  H01L31/18

CPC分类号： H01L31/18 ,  H01L31/022425 ,  H01L31/0504 ,  H01L31/0512 ,  Y02E10/50

摘要： In a solar battery module including a plurality of solar battery elements each including electrodes that are electrically connected by an electrically conductive wiring member, the electrode and the wiring member are welded by solder on the electrode, resin is arranged while covering at least a side surface of a solder-bonded portion between the solder and the electrode, and a wetted height of the resin on a side surface of the wiring member is lower than the top of wiring member, so that welding by the solder can be reinforced and the bonding reliability can be improved.

摘要翻译： 在包括多个太阳能电池元件的太阳能电池模块中，每个太阳能电池元件各自包括通过导电布线构件电连接的电极，电极和布线构件通过焊料焊接在电极上，树脂被布置成至少覆盖侧表面 焊料与电极之间的焊料接合部分，并且布线部件的侧面上的树脂的浸湿高度低于布线部件的顶部，从而可以增强焊料的焊接，并且焊接可靠性 可以改进。

公开(公告)号：US07078330B2

公开(公告)日：2006-07-18

申请号：US10790757

申请日：2004-03-03

申请人： Akira Maeda ,  Takeyuki Maegawa ,  Shigeru Matsuno ,  Takuo Ozawa ,  Takanori Sone ,  Shoji Miyashita ,  Yasumichi Hatanaka ,  Masato Koyama ,  Takahiro Nagamine ,  Susumu Arai

发明人： Akira Maeda ,  Takeyuki Maegawa ,  Shigeru Matsuno ,  Takuo Ozawa ,  Takanori Sone ,  Shoji Miyashita ,  Yasumichi Hatanaka ,  Masato Koyama ,  Takahiro Nagamine ,  Susumu Arai

IPC分类号： H01L21/44

CPC分类号： H01L24/12 ,  H01L24/11 ,  H01L2224/05001 ,  H01L2224/05026 ,  H01L2224/05571 ,  H01L2224/13099 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12042 ,  H05K3/244 ,  H05K3/3463 ,  H05K3/363 ,  H01L2924/00 ,  H01L2224/05611 ,  H01L2924/00014 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05155

摘要： A metal electrode is formed on a substrate. The metal electrode includes a first layer, a second layer, and a third layer lying, from an outermost surface of the metal electrode toward the substrate, in this order. The first layer contains tin as a principal constituent and the second layer contains a metallic element which produces an eutectic reaction with tin, wherein the melting point of the first layer is higher than the melting point of the second layer. The third layer is an underlying metallic layer for the first and second layers.

摘要翻译： 在基板上形成金属电极。 金属电极包括从金属电极的最外表面朝向衬底的第一层，第二层和第三层。 第一层含有锡作为主要成分，第二层含有与锡产生共晶反应的金属元素，其中第一层的熔点高于第二层的熔点。 第三层是第一层和第二层的底层金属层。

公开(公告)号：US06777814B2

公开(公告)日：2004-08-17

申请号：US10170588

申请日：2002-06-14

申请人： Toshihiro Iwasaki ,  Michitaka Kimura ,  Keiichiro Wakamiya ,  Yasumichi Hatanaka

发明人： Toshihiro Iwasaki ,  Michitaka Kimura ,  Keiichiro Wakamiya ,  Yasumichi Hatanaka

IPC分类号： H01L2348

CPC分类号： H01L24/81 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/1134 ,  H01L2224/13111 ,  H01L2224/16 ,  H01L2224/73204 ,  H01L2224/81801 ,  H01L2224/83192 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01051 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H03H3/08

摘要： A semiconductor device includes a semiconductor chip, and a circuit substrate disposed such that the circuit substrate faces the semiconductor chip and is electrically connected to the semiconductor chip through a connection conductor. A pad electrode and a terminal electrode are formed on a surface of the semiconductor chip and a surface of the circuit substrate, respectively. The connection conductor is connected between the pad electrode and the terminal electrode. The surface of the semiconductor and the surface of the circuit substrate face each other. A conductive dummy pattern is formed on the facing surface of the semiconductor chip or the circuit substrate. A space between the facing surfaces is filled with nonconductive resin. With this arrangement, it is possible to make uniform the temperature distribution between the facing surfaces, thereby making the temperature and the viscosity of the nonconductive resin uniform to reduce attenuation of ultrasonic waves.

摘要翻译： 半导体器件包括半导体芯片和电路基板，电路基板设置成电路基板面向半导体芯片，并通过连接导体电连接到半导体芯片。 在半导体芯片的表面和电路基板的表面上分别形成焊盘电极和端子电极。 连接导体连接在焊盘电极和端子电极之间。 半导体的表面和电路基板的表面彼此面对。 在半导体芯片或电路基板的相对表面上形成导电虚设图形。 面对表面之间的空间填充有非导电树脂。 通过这种布置，可以使相对表面之间的温度分布均匀，从而使非导电树脂的温度和粘度均匀，以减少超声波的衰减。

公开(公告)号：US06677677B2

公开(公告)日：2004-01-13

申请号：US10106198

申请日：2002-03-27

申请人： Michitaka Kimura ,  Toshihiro Iwasaki ,  Yasumichi Hatanaka ,  Keiichiro Wakamiya

发明人： Michitaka Kimura ,  Toshihiro Iwasaki ,  Yasumichi Hatanaka ,  Keiichiro Wakamiya

IPC分类号： H01L2348

CPC分类号： H01L24/81 ,  H01L23/50 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/10135 ,  H01L2224/10165 ,  H01L2224/14 ,  H01L2224/16 ,  H01L2224/16237 ,  H01L2224/17517 ,  H01L2224/81136 ,  H01L2224/81139 ,  H01L2224/8114 ,  H01L2224/81141 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/351 ,  H01L2924/00

摘要： The semiconductor device has a flip chip structure. The chip is electrically connected to the chip mounting member via function bumps provided on the chip. Dummy bumps acting against a local bending force of the chip are interposed between the chip and the chip mounting member.

摘要翻译： 半导体器件具有倒装芯片结构。 芯片通过设置在芯片上的功能凸块与芯片安装部件电连接。 作用在芯片的局部弯曲力的虚拟凸起插入在芯片和芯片安装部件之间。

公开(公告)号：US07951699B2

公开(公告)日：2011-05-31

申请号：US11637097

申请日：2006-12-12

申请人： Toshihiro Iwasaki ,  Shiori Idaka ,  Yasumichi Hatanaka

发明人： Toshihiro Iwasaki ,  Shiori Idaka ,  Yasumichi Hatanaka

IPC分类号： H01L21/603 ,  H01L33/62

CPC分类号： H01L25/0657 ,  H01L24/11 ,  H01L24/13 ,  H01L24/81 ,  H01L24/97 ,  H01L25/50 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05027 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05171 ,  H01L2224/05184 ,  H01L2224/056 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/1147 ,  H01L2224/1181 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13644 ,  H01L2224/1403 ,  H01L2224/14051 ,  H01L2224/141 ,  H01L2224/16058 ,  H01L2224/16145 ,  H01L2224/73204 ,  H01L2224/81013 ,  H01L2224/81193 ,  H01L2224/81203 ,  H01L2224/8182 ,  H01L2224/97 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/19041 ,  H01L2224/81 ,  H01L2924/00014 ,  H01L2224/13099

摘要： A method of manufacturing a semiconductor device includes a first step of forming solder film on metal posts of a mother chip, a second step of forming solder balls after the first step by printing a solder paste on the mother chip and heating the mother chip so that the solder paste is ref lowed, a third step of bonding the metal posts of the mother chip and metal posts of a daughter chip to each other in a thermocompression bonding manner by means of the solder film after the second step, and a fourth step of flip-chip-connecting the mother chip on a circuit substrate by using the solder balls. In the second step, the mother chip is heated in a nitrogen atmosphere in which the oxygen concentration is 500 ppm or less.

摘要翻译： 一种制造半导体器件的方法包括：在母芯片的金属柱上形成焊料膜的第一步骤;第一步骤之后，通过在母芯片上印刷焊膏并加热母芯片，形成焊球的第二步骤， 焊膏被降低，第三步骤是通过在第二步骤之后的焊料膜以热压接方式将母芯片的金属柱和子芯片的金属柱彼此接合，并且第四步骤 通过使用焊球将母芯片倒装芯片连接在电路基板上。 在第二步中，在氧浓度为500ppm以下的氮气氛中加热母体芯片。

公开(公告)号：US06756686B2

公开(公告)日：2004-06-29

申请号：US10224342

申请日：2002-08-21

申请人： Toshihiro Iwasaki ,  Keiichiro Wakamiya ,  Michitaka Kimura ,  Yasumichi Hatanaka

发明人： Toshihiro Iwasaki ,  Keiichiro Wakamiya ,  Michitaka Kimura ,  Yasumichi Hatanaka

IPC分类号： H01L2348

CPC分类号： H01L23/49838 ,  H01L23/16 ,  H01L24/81 ,  H01L2224/05026 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/1134 ,  H01L2224/13144 ,  H01L2224/81136 ,  H01L2224/81206 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01057 ,  H01L2924/01068 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/00014

摘要： A semiconductor device includes a first substrate, a second substrate, a plurality of conductors, and supporting members. The first substrate has a plurality of electrode portions disposed on one side thereof. The second substrate has a plurality of electrode portions disposed on one side thereof. The conductors are for connecting the plurality of electrode portions of the first substrate to the plurality of electrode portions of the second substrate. The supporting members supporting the first substrate and the second substrate are disposed on a location where resonance caused by ultrasonic oscillation externally supplied is restrained in the state where the first substrate is connected to the second substrate. The supporting members prevent irregular oscillation and resonance caused by the ultrasonic oscillation.

摘要翻译： 半导体器件包括第一衬底，第二衬底，多个导体和支撑构件。 第一基板具有设置在其一侧的多个电极部。 第二基板具有设置在其一侧的多个电极部。 导体用于将第一基板的多个电极部分连接到第二基板的多个电极部分。 支撑第一基板和第二基板的支撑构件设置在在第一基板连接到第二基板的状态下被限制在由外部提供的超声波振荡引起的共振的位置。 支撑构件防止超声波振荡引起的不规则振荡和共振。