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公开(公告)号：US20100157568A1
公开(公告)日：2010-06-24
申请号：US12342266
申请日：2008-12-23
申请人： Henrik Ewe , Joachim Mahler , Anton Prueckl
发明人： Henrik Ewe , Joachim Mahler , Anton Prueckl
CPC分类号： H01L23/3735 , H01L21/561 , H01L21/568 , H01L21/6835 , H01L23/3121 , H01L23/49827 , H01L23/49833 , H01L23/5389 , H01L24/24 , H01L24/82 , H01L24/97 , H01L2221/68345 , H01L2224/2402 , H01L2224/24137 , H01L2224/24226 , H01L2224/24246 , H01L2224/32225 , H01L2224/32245 , H01L2224/73267 , H01L2224/76155 , H01L2224/82001 , H01L2224/82031 , H01L2224/82039 , H01L2224/82102 , H01L2224/92244 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01023 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01057 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/01327 , H01L2924/014 , H01L2924/10329 , H01L2924/12042 , H01L2924/12044 , H01L2924/1305 , H01L2924/13055 , H01L2924/13062 , H01L2924/13091 , H01L2924/14 , H01L2924/15787 , H01L2924/181 , Y10T29/49117 , Y10T29/49126 , Y10T29/4913 , Y10T29/49144 , H01L2224/82 , H01L2924/00
摘要： One aspect is a method of manufacturing a semiconductor device and semiconductor device. One embodiment provides a plurality of modules. Each of the modules includes a carrier and at least one semiconductor chip attached to the carrier. A dielectric layer is applied to the modules to form a workpiece. The dielectric layer is structured to open at least one of the semiconductor chips. The workpiece is singulated to obtain a plurality of devices.
摘要翻译： 一个方面是制造半导体器件和半导体器件的方法。 一个实施例提供多个模块。 每个模块包括载体和连接到载体的至少一个半导体芯片。 将介电层施加到模块以形成工件。 介电层被构造成打开至少一个半导体芯片。 将工件分割成多个装置。
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公开(公告)号：US20110108971A1
公开(公告)日：2011-05-12
申请号：US12615648
申请日：2009-11-10
申请人： Henrik Ewe , Joachim Mahler , Anton Prueckl , Ivan Nikitin
发明人： Henrik Ewe , Joachim Mahler , Anton Prueckl , Ivan Nikitin
IPC分类号： H01L23/522 , H01L21/822
CPC分类号： H01L21/56 , H01L23/3121 , H01L23/3677 , H01L23/492 , H01L23/49844 , H01L23/5389 , H01L24/24 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/82 , H01L24/83 , H01L25/071 , H01L25/074 , H01L25/16 , H01L2224/04105 , H01L2224/24137 , H01L2224/24226 , H01L2224/29101 , H01L2224/29109 , H01L2224/29111 , H01L2224/29144 , H01L2224/29147 , H01L2224/2919 , H01L2224/29311 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/32245 , H01L2224/32507 , H01L2224/48227 , H01L2224/73267 , H01L2224/76155 , H01L2224/82102 , H01L2224/83191 , H01L2224/83801 , H01L2224/83805 , H01L2224/83825 , H01L2224/8384 , H01L2224/83855 , H01L2224/92 , H01L2224/92244 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/01327 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/10329 , H01L2924/12041 , H01L2924/12042 , H01L2924/12044 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13062 , H01L2924/13091 , H01L2924/14 , H01L2924/1579 , H01L2924/181 , H01L2924/19041 , H05K1/185 , H05K1/186 , H05K3/4644 , H05K2201/10674 , H05K2201/10969 , H01L2224/83 , H01L2224/82 , H01L2924/01014 , H01L2924/00 , H01L2924/01049 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A laminate electronic device comprises a first semiconductor chip, the first semiconductor chip defining a first main face and a second main face opposite to the first main face, and having at least one electrode pad on the first main face. The laminate electronic device further comprises a carrier having a first structured metal layer arranged at a first main surface of the carrier. The first structured metal layer is bonded to the electrode pad via a first bond layer of a conductive material, wherein the first bond layer has a thickness of less than 10 μm. A first insulating layer overlies the first main surface of the carrier and the first semiconductor chip.
摘要翻译： 层压电子器件包括第一半导体芯片，第一半导体芯片限定第一主面和与第一主面相对的第二主面，并且在第一主面上具有至少一个电极焊盘。 层压电子器件还包括具有布置在载体的第一主表面上的第一结构金属层的载体。 第一结构化金属层经由导电材料的第一接合层接合到电极焊盘，其中第一接合层的厚度小于10μm。 第一绝缘层覆盖在载体的第一主表面和第一半导体芯片上。
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公开(公告)号：US08120158B2
公开(公告)日：2012-02-21
申请号：US12615648
申请日：2009-11-10
申请人： Henrik Ewe , Joachim Mahler , Anton Prueckl , Ivan Nikitin
发明人： Henrik Ewe , Joachim Mahler , Anton Prueckl , Ivan Nikitin
IPC分类号： H01L23/02
CPC分类号： H01L21/56 , H01L23/3121 , H01L23/3677 , H01L23/492 , H01L23/49844 , H01L23/5389 , H01L24/24 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/82 , H01L24/83 , H01L25/071 , H01L25/074 , H01L25/16 , H01L2224/04105 , H01L2224/24137 , H01L2224/24226 , H01L2224/29101 , H01L2224/29109 , H01L2224/29111 , H01L2224/29144 , H01L2224/29147 , H01L2224/2919 , H01L2224/29311 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/32245 , H01L2224/32507 , H01L2224/48227 , H01L2224/73267 , H01L2224/76155 , H01L2224/82102 , H01L2224/83191 , H01L2224/83801 , H01L2224/83805 , H01L2224/83825 , H01L2224/8384 , H01L2224/83855 , H01L2224/92 , H01L2224/92244 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/01327 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/10329 , H01L2924/12041 , H01L2924/12042 , H01L2924/12044 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13062 , H01L2924/13091 , H01L2924/14 , H01L2924/1579 , H01L2924/181 , H01L2924/19041 , H05K1/185 , H05K1/186 , H05K3/4644 , H05K2201/10674 , H05K2201/10969 , H01L2224/83 , H01L2224/82 , H01L2924/01014 , H01L2924/00 , H01L2924/01049 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A laminate electronic device comprises a first semiconductor chip, the first semiconductor chip defining a first main face and a second main face opposite to the first main face, and having at least one electrode pad on the first main face. The laminate electronic device further comprises a carrier having a first structured metal layer arranged at a first main surface of the carrier. The first structured metal layer is bonded to the electrode pad via a first bond layer of a conductive material, wherein the first bond layer has a thickness of less than 10 μm. A first insulating layer overlies the first main surface of the carrier and the first semiconductor chip.
摘要翻译： 层压电子器件包括第一半导体芯片，第一半导体芯片限定第一主面和与第一主面相对的第二主面，并且在第一主面上具有至少一个电极焊盘。 层压电子器件还包括具有布置在载体的第一主表面上的第一结构金属层的载体。 第一结构化金属层经由导电材料的第一接合层接合到电极焊盘，其中第一接合层的厚度小于10μm。 第一绝缘层覆盖在载体的第一主表面和第一半导体芯片上。
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公开(公告)号：US20110127675A1
公开(公告)日：2011-06-02
申请号：US12628428
申请日：2009-12-01
申请人： Henrik Ewe , Joachim Mahler , Anton Prueckl , Stefan Landau
发明人： Henrik Ewe , Joachim Mahler , Anton Prueckl , Stefan Landau
IPC分类号： H01L23/538 , H01L21/50 , H01L21/56
CPC分类号： H01L23/481 , H01L21/56 , H01L21/6835 , H01L23/3107 , H01L23/5389 , H01L24/24 , H01L24/82 , H01L25/0655 , H01L25/18 , H01L2221/68372 , H01L2221/68377 , H01L2224/0557 , H01L2224/24137 , H01L2224/2518 , H01L2224/32245 , H01L2224/73267 , H01L2224/76155 , H01L2224/82102 , H01L2924/00014 , H01L2924/0002 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01023 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01068 , H01L2924/01072 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/10271 , H01L2924/10272 , H01L2924/10329 , H01L2924/12042 , H01L2924/12044 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13062 , H01L2924/13091 , H01L2924/14 , H01L2924/15192 , H01L2924/15787 , H01L2924/19041 , H01L2924/19105 , H05K1/05 , H05K1/185 , H05K1/188 , H05K3/4644 , H05K2201/09745 , H05K2201/09972 , H05K2203/0353 , H05K2203/1469 , H01L2924/00 , H01L2224/05552
摘要： A method of manufacturing a laminate electronic device is disclosed. One embodiment provides a carrier, the carrier defining a first main surface and a second main surface opposite to the first main surface. The carrier has a recess pattern formed in the first main surface. A first semiconductor chip is attached on one of the first and second main surface. A first insulating layer overlying the main surface of the carrier on which the first semiconductor chip is attached and the first semiconductor chip is formed. The carrier is then separated into a plurality of parts along the recess pattern.
摘要翻译： 公开了一种制造层压电子装置的方法。 一个实施例提供载体，载体限定第一主表面和与第一主表面相对的第二主表面。 载体具有形成在第一主表面中的凹陷图案。 第一半导体芯片附接在第一和第二主表面之一上。 覆盖在其上附着有第一半导体芯片的载体的主表面上的第一绝缘层和形成第一半导体芯片。 然后沿着凹槽图案将载体分离成多个部分。
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公开(公告)号：US09123687B2
公开(公告)日：2015-09-01
申请号：US13523525
申请日：2012-06-14
申请人： Henrik Ewe , Joachim Mahler , Anton Prueckl
发明人： Henrik Ewe , Joachim Mahler , Anton Prueckl
IPC分类号： H01L23/32 , H01L23/373 , H01L21/56 , H01L21/683 , H01L23/31 , H01L23/498 , H01L23/538 , H01L23/00
CPC分类号： H01L23/3735 , H01L21/561 , H01L21/568 , H01L21/6835 , H01L23/3121 , H01L23/49827 , H01L23/49833 , H01L23/5389 , H01L24/24 , H01L24/82 , H01L24/97 , H01L2221/68345 , H01L2224/2402 , H01L2224/24137 , H01L2224/24226 , H01L2224/24246 , H01L2224/32225 , H01L2224/32245 , H01L2224/73267 , H01L2224/76155 , H01L2224/82001 , H01L2224/82031 , H01L2224/82039 , H01L2224/82102 , H01L2224/92244 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01023 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01057 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/01327 , H01L2924/014 , H01L2924/10329 , H01L2924/12042 , H01L2924/12044 , H01L2924/1305 , H01L2924/13055 , H01L2924/13062 , H01L2924/13091 , H01L2924/14 , H01L2924/15787 , H01L2924/181 , Y10T29/49117 , Y10T29/49126 , Y10T29/4913 , Y10T29/49144 , H01L2224/82 , H01L2924/00
摘要： One aspect is a method of manufacturing a semiconductor device and semiconductor device. One embodiment provides a plurality of modules. Each of the modules includes a carrier and at least one semiconductor chip attached to the carrier. A dielectric layer is applied to the modules to form a workpiece. The dielectric layer is structured to open at least one of the semiconductor chips. The workpiece is singulated to obtain a plurality of devices.
摘要翻译： 一个方面是制造半导体器件和半导体器件的方法。 一个实施例提供多个模块。 每个模块包括载体和连接到载体的至少一个半导体芯片。 将介电层施加到模块以形成工件。 介电层被构造成打开至少一个半导体芯片。 将工件分割成多个装置。
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公开(公告)号：US08816504B2
公开(公告)日：2014-08-26
申请号：US13013022
申请日：2011-01-25
申请人： Henrik Ewe , Joachim Mahler , Anton Prueckl , Stefan Landau
发明人： Henrik Ewe , Joachim Mahler , Anton Prueckl , Stefan Landau
IPC分类号： H01L29/72
摘要： A device includes a first semiconductor chip with a first contact pad on a first face and a second semiconductor chip with a first contact pad on a first face. The second semiconductor chip is placed over the first semiconductor chip, wherein the first face of the first semiconductor chip faces the first face of the second semiconductor chip. Exactly one layer of an electrically conductive material is arranged between the first semiconductor chip and the second semiconductor chip. The exactly one layer of an electrically conductive material electrically couples the first contact pad of the first semiconductor chip to the first contact pad of the second semiconductor chip.
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7.发明授权Method of manufacturing a laminate electronic device including separating a carrier into a plurality of parts 有权一种制造层压电子装置的方法，包括将载体分离成多个部分公开(公告)号：US08664043B2
公开(公告)日：2014-03-04
申请号：US12628428
申请日：2009-12-01
申请人： Henrik Ewe , Joachim Mahler , Anton Prueckl , Stefan Landau
发明人： Henrik Ewe , Joachim Mahler , Anton Prueckl , Stefan Landau
IPC分类号： H01L21/44
CPC分类号： H01L23/481 , H01L21/56 , H01L21/6835 , H01L23/3107 , H01L23/5389 , H01L24/24 , H01L24/82 , H01L25/0655 , H01L25/18 , H01L2221/68372 , H01L2221/68377 , H01L2224/0557 , H01L2224/24137 , H01L2224/2518 , H01L2224/32245 , H01L2224/73267 , H01L2224/76155 , H01L2224/82102 , H01L2924/00014 , H01L2924/0002 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01023 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01068 , H01L2924/01072 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/10271 , H01L2924/10272 , H01L2924/10329 , H01L2924/12042 , H01L2924/12044 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13062 , H01L2924/13091 , H01L2924/14 , H01L2924/15192 , H01L2924/15787 , H01L2924/19041 , H01L2924/19105 , H05K1/05 , H05K1/185 , H05K1/188 , H05K3/4644 , H05K2201/09745 , H05K2201/09972 , H05K2203/0353 , H05K2203/1469 , H01L2924/00 , H01L2224/05552
摘要： A method of manufacturing a laminate electronic device is disclosed. One embodiment provides a carrier, the carrier defining a first main surface and a second main surface opposite to the first main surface. The carrier has a recess pattern formed in the first main surface. A first semiconductor chip is attached on one of the first and second main surface. A first insulating layer overlying the main surface of the carrier on which the first semiconductor chip is attached and the first semiconductor chip is formed. The carrier is then separated into a plurality of parts along the recess pattern.
摘要翻译： 公开了一种制造层压电子装置的方法。 一个实施例提供载体，载体限定第一主表面和与第一主表面相对的第二主表面。 载体具有形成在第一主表面中的凹陷图案。 第一半导体芯片附接在第一和第二主表面之一上。 覆盖在其上附着有第一半导体芯片的载体的主表面上的第一绝缘层和形成第一半导体芯片。 然后沿着凹槽图案将载体分离成多个部分。
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公开(公告)号：US08866302B2
公开(公告)日：2014-10-21
申请号：US13013022
申请日：2011-01-25
申请人： Henrik Ewe , Joachim Mahler , Anton Prueckl , Stefan Landau
发明人： Henrik Ewe , Joachim Mahler , Anton Prueckl , Stefan Landau
IPC分类号： H01L29/72
CPC分类号： H01L25/074 , H01L21/56 , H01L23/49517 , H01L23/49575 , H01L24/05 , H01L24/06 , H01L24/24 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/82 , H01L24/83 , H01L24/92 , H01L25/16 , H01L2224/04026 , H01L2224/04042 , H01L2224/05571 , H01L2224/05624 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05664 , H01L2224/05666 , H01L2224/05671 , H01L2224/06181 , H01L2224/24137 , H01L2224/24246 , H01L2224/24247 , H01L2224/29111 , H01L2224/29139 , H01L2224/29144 , H01L2224/29147 , H01L2224/2929 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29355 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/48137 , H01L2224/48145 , H01L2224/48227 , H01L2224/48247 , H01L2224/73265 , H01L2224/73267 , H01L2224/8203 , H01L2224/83191 , H01L2224/83192 , H01L2224/83193 , H01L2224/83439 , H01L2224/83447 , H01L2224/83455 , H01L2224/8346 , H01L2224/83801 , H01L2224/83815 , H01L2224/8382 , H01L2224/8384 , H01L2224/92244 , H01L2224/92247 , H01L2924/00014 , H01L2924/01029 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13062 , H01L2924/13091 , H01L2924/14 , H01L2924/1461 , H01L2924/1532 , H01L2924/181 , H01L2924/30107 , H01L2924/3512 , H01L2924/00 , H01L2924/00012 , H01L2924/01023 , H01L2924/01028 , H01L2924/01015 , H01L2924/0105 , H01L2924/01049 , H01L2924/01014 , H01L2924/01082 , H01L2924/01047 , H01L2924/01051 , H01L2224/05552 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A device includes a first semiconductor chip with a first contact pad on a first face and a second semiconductor chip with a first contact pad on a first face. The second semiconductor chip is placed over the first semiconductor chip, wherein the first face of the first semiconductor chip faces the first face of the second semiconductor chip. Exactly one layer of an electrically conductive material is arranged between the first semiconductor chip and the second semiconductor chip. The exactly one layer of an electrically conductive material electrically couples the first contact pad of the first semiconductor chip to the first contact pad of the second semiconductor chip.
摘要翻译： 一种器件包括在第一面上具有第一接触焊盘的第一半导体芯片和在第一面上具有第一接触焊盘的第二半导体芯片。 第二半导体芯片放置在第一半导体芯片上，其中第一半导体芯片的第一面面向第二半导体芯片的第一面。 在第一半导体芯片和第二半导体芯片之间布置有一层导电材料。 精确的一层导电材料将第一半导体芯片的第一接触焊盘电耦合到第二半导体芯片的第一接触焊盘。
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公开(公告)号：US20120267774A1
公开(公告)日：2012-10-25
申请号：US13523525
申请日：2012-06-14
申请人： Henrik Ewe , Joachim Mahler , Anton Prueckl
发明人： Henrik Ewe , Joachim Mahler , Anton Prueckl
CPC分类号： H01L23/3735 , H01L21/561 , H01L21/568 , H01L21/6835 , H01L23/3121 , H01L23/49827 , H01L23/49833 , H01L23/5389 , H01L24/24 , H01L24/82 , H01L24/97 , H01L2221/68345 , H01L2224/2402 , H01L2224/24137 , H01L2224/24226 , H01L2224/24246 , H01L2224/32225 , H01L2224/32245 , H01L2224/73267 , H01L2224/76155 , H01L2224/82001 , H01L2224/82031 , H01L2224/82039 , H01L2224/82102 , H01L2224/92244 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01023 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01057 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/01327 , H01L2924/014 , H01L2924/10329 , H01L2924/12042 , H01L2924/12044 , H01L2924/1305 , H01L2924/13055 , H01L2924/13062 , H01L2924/13091 , H01L2924/14 , H01L2924/15787 , H01L2924/181 , Y10T29/49117 , Y10T29/49126 , Y10T29/4913 , Y10T29/49144 , H01L2224/82 , H01L2924/00
摘要： One aspect is a method of manufacturing a semiconductor device and semiconductor device. One embodiment provides a plurality of modules. Each of the modules includes a carrier and at least one semiconductor chip attached to the carrier. A dielectric layer is applied to the modules to form a workpiece. The dielectric layer is structured to open at least one of the semiconductor chips. The workpiece is singulated to obtain a plurality of devices.
摘要翻译： 一个方面是制造半导体器件和半导体器件的方法。 一个实施例提供多个模块。 每个模块包括载体和连接到载体的至少一个半导体芯片。 将介电层施加到模块以形成工件。 介电层被构造成打开至少一个半导体芯片。 将工件分割成多个装置。
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公开(公告)号：US20120187565A1
公开(公告)日：2012-07-26
申请号：US13013022
申请日：2011-01-25
申请人： Henrik Ewe , Joachim Mahler , Anton Prueckl , Stefan Landau
发明人： Henrik Ewe , Joachim Mahler , Anton Prueckl , Stefan Landau
CPC分类号： H01L25/074 , H01L21/56 , H01L23/49517 , H01L23/49575 , H01L24/05 , H01L24/06 , H01L24/24 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/82 , H01L24/83 , H01L24/92 , H01L25/16 , H01L2224/04026 , H01L2224/04042 , H01L2224/05571 , H01L2224/05624 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05664 , H01L2224/05666 , H01L2224/05671 , H01L2224/06181 , H01L2224/24137 , H01L2224/24246 , H01L2224/24247 , H01L2224/29111 , H01L2224/29139 , H01L2224/29144 , H01L2224/29147 , H01L2224/2929 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29355 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/48137 , H01L2224/48145 , H01L2224/48227 , H01L2224/48247 , H01L2224/73265 , H01L2224/73267 , H01L2224/8203 , H01L2224/83191 , H01L2224/83192 , H01L2224/83193 , H01L2224/83439 , H01L2224/83447 , H01L2224/83455 , H01L2224/8346 , H01L2224/83801 , H01L2224/83815 , H01L2224/8382 , H01L2224/8384 , H01L2224/92244 , H01L2224/92247 , H01L2924/00014 , H01L2924/01029 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13062 , H01L2924/13091 , H01L2924/14 , H01L2924/1461 , H01L2924/1532 , H01L2924/181 , H01L2924/30107 , H01L2924/3512 , H01L2924/00 , H01L2924/00012 , H01L2924/01023 , H01L2924/01028 , H01L2924/01015 , H01L2924/0105 , H01L2924/01049 , H01L2924/01014 , H01L2924/01082 , H01L2924/01047 , H01L2924/01051 , H01L2224/05552 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A device includes a first semiconductor chip with a first contact pad on a first face and a second semiconductor chip with a first contact pad on a first face. The second semiconductor chip is placed over the first semiconductor chip, wherein the first face of the first semiconductor chip faces the first face of the second semiconductor chip. Exactly one layer of an electrically conductive material is arranged between the first semiconductor chip and the second semiconductor chip. The exactly one layer of an electrically conductive material electrically couples the first contact pad of the first semiconductor chip to the first contact pad of the second semiconductor chip.
摘要翻译： 一种器件包括在第一面上具有第一接触焊盘的第一半导体芯片和在第一面上具有第一接触焊盘的第二半导体芯片。 第二半导体芯片放置在第一半导体芯片上，其中第一半导体芯片的第一面面向第二半导体芯片的第一面。 在第一半导体芯片和第二半导体芯片之间布置有一层导电材料。 精确的一层导电材料将第一半导体芯片的第一接触焊盘电耦合到第二半导体芯片的第一接触焊盘。
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