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1.ADHESIVE COMPOSITION, CIRCUIT CONNECTING MATERIAL, CONNECTION STRUCTURE OF CIRCUIT MEMBER, AND SEMICONDUCTOR DEVICE 有权
标题翻译: 胶粘组合物,电路连接材料,电路构件的连接结构和半导体器件公开(公告)号:US20120273974A1
公开(公告)日:2012-11-01
申请号:US13494474
申请日:2012-06-12
申请人: Shigeki Katogi , Hiroyuki Izawa , Houko Sutou , Masami Yusa , Tohru Fujinawa
发明人: Shigeki Katogi , Hiroyuki Izawa , Houko Sutou , Masami Yusa , Tohru Fujinawa
IPC分类号: C09J175/14 , H05K1/11 , H01L23/535 , H01B1/12
CPC分类号: C08G18/672 , C08G18/3212 , C08G18/44 , C08G18/73 , C08L75/16 , C08L2666/20 , C09J133/066 , C09J133/14 , C09J175/16 , H01L24/29 , H01L24/83 , H01L2224/29101 , H01L2224/2919 , H01L2224/293 , H01L2224/29386 , H01L2224/294 , H01L2224/32225 , H01L2224/83101 , H01L2224/83851 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01045 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01067 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/0781 , H01L2924/07811 , H01L2924/09701 , H01L2924/10329 , H01L2924/10336 , H01L2924/10349 , H01L2924/15788 , H01L2924/19042 , H05K3/323 , H05K2201/0129 , C08G18/664 , C08G18/6674 , C08G18/6607 , C08G18/48 , H01L2924/00
摘要: The adhesive composition of the invention comprises a radical generator, a thermoplastic resin and a urethane (meth)acrylate having two or more radical-polymerizing groups in the molecule and a weight-average molecular weight of 3000-30,000.
摘要翻译: 本发明的粘合剂组合物包括自由基发生剂,热塑性树脂和分子中具有两个或更多个自由基聚合基团的聚氨酯(甲基)丙烯酸酯,重均分子量为3000-3000。
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2.Adhesive composition, circuit connecting material, connection structure of circuit member, and semiconductor device 有权
标题翻译: 粘合剂组合物,电路连接材料,电路构件的连接结构和半导体器件公开(公告)号:US08696942B2
公开(公告)日:2014-04-15
申请号:US13494474
申请日:2012-06-12
申请人: Shigeki Katogi , Hiroyuki Izawa , Houko Sutou , Masami Yusa , Tohru Fujinawa
发明人: Shigeki Katogi , Hiroyuki Izawa , Houko Sutou , Masami Yusa , Tohru Fujinawa
CPC分类号: C08G18/672 , C08G18/3212 , C08G18/44 , C08G18/73 , C08L75/16 , C08L2666/20 , C09J133/066 , C09J133/14 , C09J175/16 , H01L24/29 , H01L24/83 , H01L2224/29101 , H01L2224/2919 , H01L2224/293 , H01L2224/29386 , H01L2224/294 , H01L2224/32225 , H01L2224/83101 , H01L2224/83851 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01045 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01067 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/0781 , H01L2924/07811 , H01L2924/09701 , H01L2924/10329 , H01L2924/10336 , H01L2924/10349 , H01L2924/15788 , H01L2924/19042 , H05K3/323 , H05K2201/0129 , C08G18/664 , C08G18/6674 , C08G18/6607 , C08G18/48 , H01L2924/00
摘要: The adhesive composition of the invention comprises a radical generator, a thermoplastic resin and a urethane(meth)acrylate having two or more radical-polymerizing groups in the molecule and a weight-average molecular weight of 3000-30,000.
摘要翻译: 本发明的粘合剂组合物包括自由基发生剂,热塑性树脂和在分子中具有两个或更多个自由基聚合基团的聚氨酯(甲基)丙烯酸酯,重均分子量为3000-3000。
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3.Adhesive composition, circuit connecting material, connection structure of circuit member, and semiconductor device 有权
标题翻译: 粘合剂组合物,电路连接材料,电路构件的连接结构和半导体器件公开(公告)号:US08518303B2
公开(公告)日:2013-08-27
申请号:US11908897
申请日:2006-03-15
申请人: Shigeki Katogi , Hiroyuki Izawa , Houko Sutou , Masami Yusa , Tohru Fujinawa
发明人: Shigeki Katogi , Hiroyuki Izawa , Houko Sutou , Masami Yusa , Tohru Fujinawa
CPC分类号: C08G18/672 , C08G18/3212 , C08G18/44 , C08G18/73 , C08L75/16 , C08L2666/20 , C09J133/066 , C09J133/14 , C09J175/16 , H01L24/29 , H01L24/83 , H01L2224/29101 , H01L2224/2919 , H01L2224/293 , H01L2224/29386 , H01L2224/294 , H01L2224/32225 , H01L2224/83101 , H01L2224/83851 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01045 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01067 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/0781 , H01L2924/07811 , H01L2924/09701 , H01L2924/10329 , H01L2924/10336 , H01L2924/10349 , H01L2924/15788 , H01L2924/19042 , H05K3/323 , H05K2201/0129 , C08G18/664 , C08G18/6674 , C08G18/6607 , C08G18/48 , H01L2924/00
摘要: The adhesive composition of the invention comprises a radical generator, a thermoplastic resin and a urethane(meth)acrylate having two or more radical-polymerizing groups in the molecule and a weight-average molecular weight of 3000-30,000.
摘要翻译: 本发明的粘合剂组合物包括自由基发生剂,热塑性树脂和在分子中具有两个或更多个自由基聚合基团的聚氨酯(甲基)丙烯酸酯,重均分子量为3000-3000。
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4.ADHESIVE COMPOSITION, CIRCUIT CONNECTING MATERIAL, CONNECTION STRUCTURE OF CIRCUIT MEMBER, AND SEMICONDUCTOR DEVICE 有权
标题翻译: 胶粘组合物,电路连接材料,电路构件的连接结构和半导体器件公开(公告)号:US20090309220A1
公开(公告)日:2009-12-17
申请号:US11908897
申请日:2006-03-15
申请人: Shigeki Katogi , Hiroyuki Izawa , Houko Sutou , Masami Yusa , Tohru Fujinawa
发明人: Shigeki Katogi , Hiroyuki Izawa , Houko Sutou , Masami Yusa , Tohru Fujinawa
CPC分类号: C08G18/672 , C08G18/3212 , C08G18/44 , C08G18/73 , C08L75/16 , C08L2666/20 , C09J133/066 , C09J133/14 , C09J175/16 , H01L24/29 , H01L24/83 , H01L2224/29101 , H01L2224/2919 , H01L2224/293 , H01L2224/29386 , H01L2224/294 , H01L2224/32225 , H01L2224/83101 , H01L2224/83851 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01045 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01067 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/0781 , H01L2924/07811 , H01L2924/09701 , H01L2924/10329 , H01L2924/10336 , H01L2924/10349 , H01L2924/15788 , H01L2924/19042 , H05K3/323 , H05K2201/0129 , C08G18/664 , C08G18/6674 , C08G18/6607 , C08G18/48 , H01L2924/00
摘要: The adhesive composition of the invention comprises a radical generator, a thermoplastic resin and a urethane (meth)acrylate having two or more radical-polymerizing groups in the molecule and a weight-average molecular weight of 3000-30,000.
摘要翻译: 本发明的粘合剂组合物包括自由基发生剂,热塑性树脂和在分子中具有两个或更多个自由基聚合基团的聚氨酯(甲基)丙烯酸酯,重均分子量为3000-3000。
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5.ADHESIVE COMPOSITION, CIRCUIT CONNECTING MATERIAL, CONNECTING STRUCTURE FOR CIRCUIT MEMBER, AND SEMICONDUCTOR DEVICE 有权
标题翻译: 胶粘组合物,电路连接材料,电路连接结构和半导体器件公开(公告)号:US20110176288A1
公开(公告)日:2011-07-21
申请号:US11629068
申请日:2005-06-08
申请人: Shigeki Katogi , Houko Sutou , Hiroyuki Izawa , Toshiaki Shirasaka , Masami Yusa , Takanobu Kobayashi
发明人: Shigeki Katogi , Houko Sutou , Hiroyuki Izawa , Toshiaki Shirasaka , Masami Yusa , Takanobu Kobayashi
IPC分类号: H05K1/02 , C09J175/08 , C09J171/03 , C09J4/06 , H01B1/20 , H05K7/02
CPC分类号: H05K3/323 , C09J4/06 , H01B1/22 , H01L24/29 , H01L24/32 , H01L24/83 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2224/2919 , H01L2224/2929 , H01L2224/29299 , H01L2224/293 , H01L2224/32225 , H01L2224/838 , H01L2224/83851 , H01L2924/00013 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01018 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01045 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/07811 , H01L2924/09701 , H01L2924/10253 , H01L2924/10329 , H01L2924/10336 , H01L2924/10349 , H05K2201/0129 , H01L2924/00 , H01L2224/29099 , H01L2224/29199 , H01L2224/05599
摘要: The adhesive composition of the invention comprises a thermoplastic resin, a radical polymerizing compound, a radical polymerization initiator and a radical polymerization regulator. According to the present invention it is possible to provide an adhesive composition, a circuit connecting material, a connection structure for a circuit member and a semiconductor device whereby curing treatment can be carried out with sufficient speed at low temperature, curing treatment can be carried out with a wide process margin, and adequately stable adhesive strength can be obtained.
摘要翻译: 本发明的粘合剂组合物包含热塑性树脂,自由基聚合化合物,自由基聚合引发剂和自由基聚合调节剂。 根据本发明,可以提供一种粘合剂组合物,电路连接材料,用于电路元件的连接结构和半导体器件,由此可以在低温下以足够的速度进行固化处理,可以进行固化处理 具有宽的加工边缘,并且可以获得足够稳定的粘合强度。
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6.Adhesive composition, circuit connecting material, connecting structure for circuit member, and semiconductor device 有权
标题翻译: 粘合剂组合物,电路连接材料,电路构件的连接结构和半导体器件公开(公告)号:US08309658B2
公开(公告)日:2012-11-13
申请号:US13299079
申请日:2011-11-17
申请人: Shigeki Katogi , Houko Sutou , Hiroyuki Izawa , Toshiaki Shirasaka , Masami Yusa , Takanobu Kobayashi
发明人: Shigeki Katogi , Houko Sutou , Hiroyuki Izawa , Toshiaki Shirasaka , Masami Yusa , Takanobu Kobayashi
IPC分类号: C08F8/00
CPC分类号: H05K3/323 , C09J4/06 , H01B1/22 , H01L24/29 , H01L24/32 , H01L24/83 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2224/2919 , H01L2224/2929 , H01L2224/29299 , H01L2224/293 , H01L2224/32225 , H01L2224/838 , H01L2224/83851 , H01L2924/00013 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01018 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01045 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/07811 , H01L2924/09701 , H01L2924/10253 , H01L2924/10329 , H01L2924/10336 , H01L2924/10349 , H05K2201/0129 , H01L2924/00 , H01L2224/29099 , H01L2224/29199 , H01L2224/05599
摘要: The adhesive composition of the invention comprises a thermoplastic resin, a radical polymerizing compound, a radical polymerization initiator and a radical polymerization regulator. According to the present invention it is possible to provide an adhesive composition, a circuit connecting material, a connection structure for a circuit member and a semiconductor device whereby curing treatment can be carried out with sufficient speed at low temperature, curing treatment can be carried out with a wide process margin, and adequately stable adhesive strength can be obtained.
摘要翻译: 本发明的粘合剂组合物包含热塑性树脂,自由基聚合化合物,自由基聚合引发剂和自由基聚合调节剂。 根据本发明,可以提供一种粘合剂组合物,电路连接材料,用于电路元件的连接结构和半导体器件,由此可以在低温下以足够的速度进行固化处理,可以进行固化处理 具有宽的加工边缘,并且可以获得足够稳定的粘合强度。
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公开(公告)号:US08138268B2
公开(公告)日:2012-03-20
申请号:US11629068
申请日:2005-06-08
申请人: Shigeki Katogi , Houko Sutou , Hiroyuki Izawa , Toshiaki Shirasaka , Masami Yusa , Takanobu Kobayashi
发明人: Shigeki Katogi , Houko Sutou , Hiroyuki Izawa , Toshiaki Shirasaka , Masami Yusa , Takanobu Kobayashi
IPC分类号: C08F8/00
CPC分类号: H05K3/323 , C09J4/06 , H01B1/22 , H01L24/29 , H01L24/32 , H01L24/83 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2224/2919 , H01L2224/2929 , H01L2224/29299 , H01L2224/293 , H01L2224/32225 , H01L2224/838 , H01L2224/83851 , H01L2924/00013 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01018 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01045 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/07811 , H01L2924/09701 , H01L2924/10253 , H01L2924/10329 , H01L2924/10336 , H01L2924/10349 , H05K2201/0129 , H01L2924/00 , H01L2224/29099 , H01L2224/29199 , H01L2224/05599
摘要: The adhesive composition of the invention comprises a thermoplastic resin, a radical polymerizing compound, a radical polymerization initiator and a radical polymerization regulator. According to the present invention it is possible to provide an adhesive composition, a circuit connecting material, a connection structure for a circuit member and a semiconductor device whereby curing treatment can be carried out with sufficient speed at low temperature, curing treatment can be carried out with a wide process margin, and adequately stable adhesive strength can be obtained.
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8.ADHESIVE COMPOSITION, FILM-LIKE ADHESIVE, AND CONNECTION STRUCTURE FOR CIRCUIT MEMBER 审中-公开
标题翻译: 胶粘组合物,薄膜粘合剂和电路连接结构公开(公告)号:US20120048606A1
公开(公告)日:2012-03-01
申请号:US12673443
申请日:2008-07-29
IPC分类号: H05K1/02 , C08F230/08 , C09J133/10 , H01B1/12 , C08K5/521 , C09J175/04 , C09J179/08 , C08F220/18 , C09J163/00
CPC分类号: H05K3/323 , C08G77/442 , C08L83/00 , C09J133/04 , C09J183/10 , H01L24/29 , H01L24/32 , H01L24/83 , H01L2224/29 , H01L2224/29101 , H01L2224/2919 , H01L2224/2929 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29355 , H01L2224/29393 , H01L2224/32225 , H01L2224/83851 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01045 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01074 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01084 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/07811 , H01L2924/09701 , H01L2924/10253 , H01L2924/10329 , H01L2924/10336 , H01L2924/10349 , H01L2924/19042 , H05K2201/0212 , H01L2924/00 , H01L2924/00014 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299
摘要: The adhesive composition of the invention contains (a) organic fine particles comprising at least one selected from the group consisting of alkyl (meth)acrylate ester-butadiene-styrene copolymer or complexes thereof, alkyl (meth)acrylate ester-silicone copolymer or complexes thereof and silicone-(meth)acrylic acid copolymer or complexes thereof.
摘要翻译: 本发明的粘合剂组合物含有(a)包含选自(甲基)丙烯酸烷基酯 - 丁二烯 - 苯乙烯共聚物或其络合物中的至少一种的有机细颗粒,(甲基)丙烯酸烷基酯 - 硅氧烷共聚物或其配合物 硅氧烷 - (甲基)丙烯酸共聚物或其复合物。
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9.ADHESIVE COMPOSITION, USE THEREOF, CONNECTION STRUCTURE FOR CIRCUIT MEMBERS, AND METHOD FOR PRODUCING SAME 审中-公开
标题翻译: 胶粘组合物,其用途,电路构件的连接结构及其制造方法公开(公告)号:US20130075142A1
公开(公告)日:2013-03-28
申请号:US13637182
申请日:2011-03-24
申请人: Hiroyuki Izawa , Shigeki Katogi
发明人: Hiroyuki Izawa , Shigeki Katogi
IPC分类号: C09J175/06 , H05K1/09 , H05K1/03 , C09J171/08 , C09J9/02
CPC分类号: C09J175/06 , C08F230/02 , C08K5/49 , C08K5/521 , C09D4/06 , C09J9/02 , C09J11/06 , C09J171/08 , H01B1/22 , H01L24/13 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/81 , H01L24/83 , H01L2224/13124 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/13164 , H01L2224/16238 , H01L2224/2919 , H01L2224/32225 , H01L2224/73204 , H01L2224/81193 , H01L2224/81903 , H01L2224/83101 , H01L2224/83192 , H01L2224/83851 , H01L2224/83862 , H01L2224/9211 , H01L2924/01004 , H01L2924/01019 , H01L2924/0102 , H01L2924/01046 , H01L2924/01077 , H01L2924/01079 , H01L2924/07811 , H01L2924/09701 , H01L2924/15788 , H05K1/0313 , H05K1/09 , H05K1/141 , H05K3/323 , H05K2201/0129 , H05K2201/10977 , H01L2224/16225 , H01L2924/00 , H01L2924/00014 , H01L2924/00012 , H01L2224/81 , H01L2224/83
摘要: An adhesive composition for connection between a first circuit member having a first connecting terminal on the main surface and a second circuit member having a second connecting terminal on the main surface, wherein the first circuit member and/or second circuit member are made of a base material containing a thermoplastic resin with a glass transition temperature of no higher than 200° C., the first connecting terminal and/or second connecting terminal are made of ITO and/or IZO, and the adhesive composition includes a phosphate group-containing compound, the free phosphate concentration of the cured adhesive composition being no greater than 100 ppm by mass.
摘要翻译: 一种用于在主表面上具有第一连接端子的第一电路构件和在主表面上具有第二连接端子的第二电路构件之间的连接的粘合剂组合物,其中第一电路构件和/或第二电路构件由基座 含有玻璃化转变温度不高于200℃的热塑性树脂的材料,第一连接端子和/或第二连接端子由ITO和/或IZO制成,并且粘合剂组合物包含含磷酸基的化合物, 固化的粘合剂组合物的游离磷酸盐浓度不大于100质量ppm。
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公开(公告)号:US07759388B2
公开(公告)日:2010-07-20
申请号:US12253060
申请日:2008-10-16
申请人: Nobuyasu Suzuki , Toshihiko Yoshimura , Hiroyuki Izawa , Kazuyuki Sagi , Shingo Makino , Eiji Nakanishi , Masahiro Murata , Takashi Tsuji
发明人: Nobuyasu Suzuki , Toshihiko Yoshimura , Hiroyuki Izawa , Kazuyuki Sagi , Shingo Makino , Eiji Nakanishi , Masahiro Murata , Takashi Tsuji
IPC分类号: A61K31/4035 , C07D209/48
CPC分类号: C07D207/452 , A61K31/395 , A61K31/4015 , A61K31/403 , A61K31/4035 , A61K31/435 , A61K31/4355 , A61K31/4365 , A61K31/437 , A61K31/438 , A61K31/4412 , A61K31/45 , A61K31/472 , A61K31/48 , A61K31/4985 , A61K31/55 , C07D207/38 , C07D209/46 , C07D209/48 , C07D209/52 , C07D209/66 , C07D209/76 , C07D211/88 , C07D217/24 , C07D217/26 , C07D221/14 , C07D221/20 , C07D223/10 , C07D223/18 , C07D403/12 , C07D471/04 , C07D487/04 , C07D495/04
摘要: Specific phenylalanine derivatives or pharmaceutically acceptable salts thereof have an antagonistic effect on the α 4 integrins and, therefore, are usable as therapeutic agents or preventive agents for diseases in which α 4 integrin-depending adhesion process participates in the pathology, such as inflammatory diseases, rheumatoid arthritis, inflammatory bowel diseases, systemic lupus erythematosus, multiple sclerosis, Sjögren's syndrome, asthma, psoriasis, allergy, diabetes, cardiovascular diseases, arterial sclerosis, restenosis, tumor proliferation, tumor metastasis and transplantation rejection.
摘要翻译: 特定的苯丙氨酸衍生物或其药学上可接受的盐对α4整联蛋白具有拮抗作用,因此可用作治疗剂或其中α4整联蛋白依赖性粘附过程参与疾病如疾病的疾病的治疗剂或预防剂, 类风湿关节炎,炎性肠病,系统性红斑狼疮,多发性硬化症,Sjögren综合征,哮喘,牛皮癣,过敏,糖尿病,心血管疾病,动脉硬化,再狭窄,肿瘤增生,肿瘤转移和移植排斥。
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