公开(公告)号：US06985362B2

公开(公告)日：2006-01-10

申请号：US09947125

申请日：2001-09-05

申请人： Hiroyuki Mori ,  Yutaka Tsukada ,  Kimihiro Yamanaka

发明人： Hiroyuki Mori ,  Yutaka Tsukada ,  Kimihiro Yamanaka

IPC分类号： H05K7/02

CPC分类号： H05K1/0271 ,  H01L23/49822 ,  H01L23/49838 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H05K3/4602 ,  H05K3/4644 ,  H05K2201/09781 ,  H05K2201/10674 ,  H05K2201/2009 ,  H01L2224/0401

摘要： A printed circuit board on which a semiconductor chip is flip chip mounted, comprising a circuit pattern to which a conductive bump, provided in a corner portion of a semiconductor chip, is connected, an insulating layer for holding the circuit pattern, and a protection pad which is positioned on the insulating layer relative to the circuit pattern, to which the conductive bump is connected.

公开(公告)号：US20100259910A1

公开(公告)日：2010-10-14

申请号：US12295582

申请日：2007-03-30

申请人： Katsura Hayashi ,  Yutaka Tsukada ,  Kimihiro Yamanaka ,  Masaharu Shirai ,  Isamu Kirikihira

发明人： Katsura Hayashi ,  Yutaka Tsukada ,  Kimihiro Yamanaka ,  Masaharu Shirai ,  Isamu Kirikihira

IPC分类号： H05K7/00 ,  H05K1/00

CPC分类号： H05K1/0366 ,  B32B5/28 ,  B32B15/14 ,  H01L23/145 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/10253 ,  H05K3/4602 ,  H05K2201/0278 ,  H05K2201/029 ,  H05K2201/068 ,  Y10T428/24058 ,  Y10T428/24132 ,  Y10T428/249924 ,  Y10T428/2927 ,  Y10T428/2933 ,  Y10T442/2475 ,  Y10T442/30 ,  Y10T442/3049 ,  Y10T442/3919 ,  H01L2924/00 ,  H01L2224/0401

摘要： The invention relates to a circuit board having high density circuit and excellent connection reliability and lamination reliability. A resin fabric cloth (4) is provided by arranging single fibers (4a) or fiber bundles composed of a plurality of single fibers, which single fiber has a linear thermal expansion coefficient smaller than that of silicon, at least in two directions and alternately weaving them. In the board, the resin fabric cloth is covered with a resin portion (5) made of a resin material having a linear thermal expansion coefficient larger than that of silicon.

摘要翻译： 本发明涉及具有高密度电路和优异的连接可靠性和层叠可靠性的电路板。 树脂织物布（4）通过布置单个纤维（4a）或由多根单纤维构成的纤维束，该单丝纤维的线性热膨胀系数至少在两个方向上具有小的线性热膨胀系数，并交替编织 他们。 在该板上，树脂织物被树脂部分（5）覆盖，树脂部分（5）由具有大于硅的线性热膨胀系数的树脂材料制成。

公开(公告)号：US20100254098A1

公开(公告)日：2010-10-07

申请号：US12738606

申请日：2008-10-17

申请人： Yutaka Tsukada ,  Kimihiro Yamanaka ,  Kenji Terada

发明人： Yutaka Tsukada ,  Kimihiro Yamanaka ,  Kenji Terada

IPC分类号： H05K1/18 ,  H05K1/11 ,  C23F1/02

CPC分类号： H01L23/49827 ,  H01L2224/16 ,  H01L2924/00011 ,  H01L2924/00014 ,  H05K1/036 ,  H05K1/0366 ,  H05K1/115 ,  H05K3/002 ,  H05K3/0055 ,  H05K3/426 ,  H05K3/4602 ,  H05K2201/0287 ,  H05K2201/09536 ,  H05K2201/0959 ,  H05K2203/1476 ,  H01L2224/0401

摘要： Provided are a circuit board which meets requirement of suppressing peeling of a through hole conductor, a mounting structure and a method for manufacturing the circuit board. A circuit board (2) is provided with a base (5) and a through hole conductor (11). The base is provided with a fiber layer (9) and a through hole (S). The fiber layer has a single fiber (8) arranged along one direction and a resin for covering the single fiber (8). The through hole (S) penetrates the fiber layer (9), and the through hole conductor is formed in the through hole. The single fiber (8) partially protrudes to the side of the through hole conductor (11) from an inner wall surface of the through hole (S), and the protruded part is covered with the through hole conductor (11).

摘要翻译： 提供一种电路板，其满足抑制通孔导体的剥离的要求，安装结构和制造电路板的方法。 电路板（2）设有基座（5）和通孔导体（11）。 基部设有纤维层（9）和通孔（S）。 纤维层具有沿着一个方向布置的单个纤维（8）和用于覆盖单个纤维（8）的树脂。 通孔（S）穿过纤维层（9），通孔导体形成在通孔中。 单通道（8）从通孔（S）的内壁表面部分地突出到通孔导体（11）的侧面，并且突出部分被通孔导体（11）覆盖。

公开(公告)号：US08284557B2

公开(公告)日：2012-10-09

申请号：US12738606

申请日：2008-10-17

申请人： Yutaka Tsukada ,  Kimihiro Yamanaka ,  Kenji Terada

发明人： Yutaka Tsukada ,  Kimihiro Yamanaka ,  Kenji Terada

IPC分类号： H05K1/00 ,  H05K1/18 ,  H05K7/00

CPC分类号： H01L23/49827 ,  H01L2224/16 ,  H01L2924/00011 ,  H01L2924/00014 ,  H05K1/036 ,  H05K1/0366 ,  H05K1/115 ,  H05K3/002 ,  H05K3/0055 ,  H05K3/426 ,  H05K3/4602 ,  H05K2201/0287 ,  H05K2201/09536 ,  H05K2201/0959 ,  H05K2203/1476 ,  H01L2224/0401

摘要： Provided are a circuit board which meets requirement of suppressing peeling of a through hole conductor, a mounting structure and a method for manufacturing the circuit board. A circuit board (2) is provided with a base (5) and a through hole conductor (11). The base is provided with a fiber layer (9) and a through hole (S). The fiber layer has a single fiber (8) arranged along one direction and a resin for covering the single fiber (8). The through hole (S) penetrates the fiber layer (9), and the through hole conductor is formed in the through hole. The single fiber (8) partially protrudes to the side of the through hole conductor (11) from an inner wall surface of the through hole (S), and the protruded part is covered with the through hole conductor (11).

摘要翻译： 提供一种电路板，其满足抑制通孔导体的剥离的要求，安装结构和制造电路板的方法。 电路板（2）设有基座（5）和通孔导体（11）。 基部设有纤维层（9）和通孔（S）。 纤维层具有沿着一个方向布置的单个纤维（8）和用于覆盖单个纤维（8）的树脂。 通孔（S）穿过纤维层（9），通孔导体形成在通孔中。 单通道（8）从通孔（S）的内壁表面部分地突出到通孔导体（11）的侧面，并且突出部分被通孔导体（11）覆盖。

公开(公告)号：US08446734B2

公开(公告)日：2013-05-21

申请号：US12295582

申请日：2007-03-30

申请人： Katsura Hayashi ,  Yutaka Tsukada ,  Kimihiro Yamanaka ,  Masaharu Shirai ,  Isamu Kirikihira

发明人： Katsura Hayashi ,  Yutaka Tsukada ,  Kimihiro Yamanaka ,  Masaharu Shirai ,  Isamu Kirikihira

IPC分类号： H05K7/00

CPC分类号： H05K1/0366 ,  B32B5/28 ,  B32B15/14 ,  H01L23/145 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/10253 ,  H05K3/4602 ,  H05K2201/0278 ,  H05K2201/029 ,  H05K2201/068 ,  Y10T428/24058 ,  Y10T428/24132 ,  Y10T428/249924 ,  Y10T428/2927 ,  Y10T428/2933 ,  Y10T442/2475 ,  Y10T442/30 ,  Y10T442/3049 ,  Y10T442/3919 ,  H01L2924/00 ,  H01L2224/0401

摘要： The invention relates to a circuit board having high density circuit and excellent connection reliability and lamination reliability. A resin fabric cloth (4) is provided by arranging single fibers (4a) or fiber bundles composed of a plurality of single fibers, which single fiber has a linear thermal expansion coefficient smaller than that of silicon, at least in two directions and alternately weaving them. In the board, the resin fabric cloth is covered with a resin portion (5) made of a resin material having a linear thermal expansion coefficient larger than that of silicon.

摘要翻译： 本发明涉及具有高密度电路和优异的连接可靠性和层叠可靠性的电路板。 树脂织物布（4）通过布置单个纤维（4a）或由多根单纤维构成的纤维束，该单丝纤维的线性热膨胀系数至少在两个方向上具有小的线性热膨胀系数，并交替编织 他们。 在该板上，树脂织物被树脂部分（5）覆盖，树脂部分（5）由具有大于硅的线性热膨胀系数的树脂材料制成。

公开(公告)号：US06667559B2

公开(公告)日：2003-12-23

申请号：US10162830

申请日：2002-06-04

申请人： Yutaka Tsukada ,  Kimihiro Yamanaka

发明人： Yutaka Tsukada ,  Kimihiro Yamanaka

IPC分类号： H01L2348

CPC分类号： H05K1/112 ,  H01L24/11 ,  H01L2224/0401 ,  H01L2224/05567 ,  H01L2224/05572 ,  H01L2224/11334 ,  H01L2224/13099 ,  H01L2924/0002 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/351 ,  H05K3/4644 ,  H05K2201/09472 ,  H05K2201/09509 ,  H05K2203/041 ,  H01L2924/00014 ,  H01L2224/05552 ,  H01L2924/00

摘要： A ball grid array module is provided. In particular, the ball grid array module includes a substrate with two layers of insulation positioned thereon. At least one cavity having a side wall and a bottom wall is positioned in the first and second layers of insulation. The ball grid array module is adapted for having a solder ball positioned on the bottom wall of the cavity. During heating and reflow of the solder ball, positioning of the solder ball in the cavity prevents dislodging of the solder ball.

公开(公告)号：US06427898B2

公开(公告)日：2002-08-06

申请号：US09832073

申请日：2001-04-10

申请人： Yohji Maeda ,  Yutaka Tsukada

发明人： Yohji Maeda ,  Yutaka Tsukada

IPC分类号： B23K3706

CPC分类号： H05K3/3457 ,  B23K3/0623 ,  B23K2101/40 ,  H01L21/4846 ,  H05K2203/0126

摘要： A bump forming apparatus comprises a container for retaining therein a solder melt, a solder forming member having a side wall portion and a ceiling portion which form, above a substrate's flat surface, a chamber for receiving therein the solder melt. The solder forming member also includes a height regulator portion provided on an exterior of the side wall portion and having a flat surface for restricting the height of the solder melt during formation. Heating means for heating the solder melt may also be provided. A hole in the solder forming portion allows solder melt to flow from the container to the chamber. Pressurizing means for pressurizing the solder melt in the container to thus expedite passage of solder melt into the chamber of the forming member may be used. Depressurization means for reducing the inside pressure of the container to cause the unused metal to return from the chamber into the container may also be used.

摘要翻译： 凸块形成装置包括用于在其中保持焊料熔体的容器，具有侧壁部分的焊料形成部件和在基板的平坦表面上形成用于在其中容纳焊料熔体的室的顶部。 焊料形成部件还包括设置在侧壁部分的外部并具有用于限制形成期间焊料熔体的高度的平坦表面的高度调节部分。 还可以提供用于加热焊料熔体的加热装置。 焊料形成部分中的孔允许焊料熔体从容器流到室。 可以使用用于对容器中的焊料熔体加压以加速焊料熔体进入成形构件的室的加压装置。 也可以使用用于降低容器的内部压力以使未使用的金属从室返回到容器中的减压装置。

公开(公告)号：US06378201B1

公开(公告)日：2002-04-30

申请号：US08497614

申请日：1995-06-30

申请人： Yutaka Tsukada ,  Shuhei Tsuchida

发明人： Yutaka Tsukada ,  Shuhei Tsuchida

IPC分类号： H01K310

CPC分类号： H05K3/4602 ,  H05K1/0265 ,  H05K3/0023 ,  H05K3/181 ,  H05K3/426 ,  H05K3/429 ,  H05K3/4661 ,  H05K2201/0352 ,  H05K2201/09327 ,  H05K2201/09509 ,  H05K2203/1438 ,  H05K2203/1581 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49165

摘要： A multilayer printed circuit board and a corresponding fabrication method are disclosed, which circuit board achieves a relatively high degree of wiring density and a relatively high degree of wiring design freedom. These advantages are obtained in the inventive printed circuit board by electrically connecting power conductors or ground conductors using through holes. On the other hand, signal conductors in any two adjacent signal wiring layers are electrically connected using via holes extending only through an intervening electrically insulating layer. Preferably, the electrically insulating layer is a layer of photosensitive resin and the via holes are formed using conventional photolithographic techniques.

摘要翻译： 公开了一种多层印刷电路板和相应的制造方法，该电路板实现相对高的布线密度和相对高的布线设计自由度。 通过使用通孔电连接电源导体或接地导体，在本发明的印刷电路板中获得这些优点。 另一方面，任何两个相邻信号布线层中的信号导体使用仅通过中间电绝缘层延伸的通孔电连接。 优选地，电绝缘层是感光树脂层，并且通孔使用常规的光刻技术形成。

公开(公告)号：US5488200A

公开(公告)日：1996-01-30

申请号：US255596

申请日：1994-06-08

申请人： Yutaka Tsukada

发明人： Yutaka Tsukada

IPC分类号： H01L21/56 ,  H01L21/60 ,  H05K1/18

CPC分类号： H01L24/98 ,  H01L21/563 ,  H01L24/81 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16 ,  H01L2224/73203 ,  H01L2224/81801 ,  H01L2924/01006 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/181 ,  H01L2924/351 ,  Y10T29/49144 ,  Y10T29/49815 ,  Y10T29/49821

摘要： A face-down bonded semiconductor chip 4 encapsulated with a resin 14 is removed from the substrate 2 with a cutting end mill 26. The resin 14 and bump electrodes 6 remaining on the substrate 2 are then cut with a finishing end mill to a height of about one half of the original height to planarize the surface. Another chip 4A having bump electrodes 6A is aligned with the bump electrodes 6 on the substrate 2, and bonded face down on the substrate. Finally, resin 14A is flowed into the gap between the chip 4A and the substrate 2 and around the chip 4A to encapsulate the chip.

摘要翻译： 用切割端铣刀26从基板2去除用树脂14封装的面朝下粘结的半导体芯片4.然后用精加工端铣刀将保留在基板2上的树脂14和凸起电极6切割成高度 约为原始高度的一半，以使表面平坦化。 具有凸起电极6A的另一个芯片4A与衬底2上的凸起电极6对准，并且在衬底上面朝下地粘合。 最后，将树脂14A流入芯片4A与衬底2之间的间隙以及芯片4A周围以封装芯片。

公开(公告)号：US08045829B2

公开(公告)日：2011-10-25

申请号：US12095372

申请日：2006-11-27

申请人： Katsura Hayashi ,  Yutaka Tsukada

发明人： Katsura Hayashi ,  Yutaka Tsukada

IPC分类号： G02B6/12 ,  G02B6/10 ,  B05D5/12 ,  B29C65/00

CPC分类号： G02B6/42 ,  G02B6/138 ,  G02B6/4214 ,  G02B6/43

摘要： The present invention provides a method for manufacturing an optical waveguide. The inventive method includes steps of providing a transfer member comprising a transfer sheet and a first metal film. The transfer sheet and the first metal film are detachable from each other. A laminated body made of a core layer disposed between two clad layers is formed on the transfer member. The invention also relates to optical waveguides produced by the inventive process and devices incorporating the optical waveguides of the invention.

摘要翻译： 本发明提供一种光波导的制造方法。 本发明的方法包括提供包括转印片和第一金属膜的转印元件的步骤。 转印片和第一金属膜可以彼此分离。 在转印部件上形成由设置在两个包层之间的芯层构成的层叠体。 本发明还涉及由本发明的方法生产的光波导和结合本发明的光波导的器件。