公开(公告)号：US06651013B1

公开(公告)日：2003-11-18

申请号：US09714372

申请日：2000-11-16

申请人： How T. Lin ,  Christopher J. Majka ,  Matthew Francis Seward

发明人： How T. Lin ,  Christopher J. Majka ,  Matthew Francis Seward

IPC分类号： G01R3100

CPC分类号： G01R31/086

摘要： A method and apparatus for locating a short between two nets in an electrical wire network of a microelectronic structure (e.g., chip, chip carrier, circuit card, etc.). A first net and a second net of the electrical wire are electrically shorted at an unknown point PS on the first net. Points PA and PB on the first net such are selected such that PS is located on a path between PA and PB along the first net. A constant current pulse source is electrically connected between PA and PB and is activated. Voltage drops VAB (from PA to PB) and VAC (from PA to a point PC on the second net) are measured. A length LAS of the path from PA to PS is calculated as a function of VAC/VAB. Computer graphics may be used to graphically display the location of the short within the microelectronic structure.

摘要翻译： 一种用于定位微电子结构（例如，芯片，芯片载体，电路卡等）的电线网络中的两个网之间的短路的方法和装置。 电线的第一网和第二网在第一网上的未知点PS处电短路。 选择第一网上的点PA和PB，使得PS位于沿着第一网的PA和PB之间的路径上。 恒流脉冲源电连接在PA和PB之间并被激活。 测量电压降VAB（从PA到PB）和VAC（从PA到第二网上的点PC）。 作为VAC / VAB的函数计算从PA到PS的路径的长度LAS。 计算机图形可用于在微电子结构内以图形方式显示短路的位置。

公开(公告)号：US06712261B2

公开(公告)日：2004-03-30

申请号：US10102129

申请日：2002-03-20

申请人： Richard R. Hall ,  How T. Lin ,  Christopher J. Majka ,  Matthew F. Seward ,  Ronald V. Smith

发明人： Richard R. Hall ,  How T. Lin ,  Christopher J. Majka ,  Matthew F. Seward ,  Ronald V. Smith

IPC分类号： B23K3102

CPC分类号： H01L21/486 ,  B23K1/20 ,  H05K3/4046 ,  H05K2201/10234 ,  H05K2201/10287

摘要： An arrangement and method for the insertion the leading end of a length of a metallic element into a through hole which is formed in a substrate, and for heat deforming the inserted leading portion of the metallic element into a predetermined configuration prior to severing therefrom the remaining length of the metallic element.

摘要翻译： 一种用于将金属元件的长度的前端插入到形成在基板中的通孔中并且用于在将金属元件的插入的前导部分从其中切断之前将插入的前导部分变形为预定构造的布置和方法 金属元件的长度。

公开(公告)号：US07108809B2

公开(公告)日：2006-09-19

申请号：US10262754

申请日：2002-10-01

申请人： Benson Chan ,  Richard R. Hall ,  How T. Lin ,  Christopher J. Majka ,  John H. Sherman

发明人： Benson Chan ,  Richard R. Hall ,  How T. Lin ,  Christopher J. Majka ,  John H. Sherman

IPC分类号： B29D11/00

CPC分类号： B29D11/00 ,  B29C33/42

摘要： An optical coupler arrangement which is employed for replicating surface features of diverse types of optical devices. Also disclosed is to a novel method of accurately replicating surface features of optical devices; particularly through the utilization of the novel optical coupler arrangement.

摘要翻译： 用于复制各种类型的光学器件的表面特征的光耦合器装置。 还公开了一种准确地复制光学器件的表面特征的新颖方法; 特别是通过利用新颖的光耦合装置。

公开(公告)号：US06982387B2

公开(公告)日：2006-01-03

申请号：US09884778

申请日：2001-06-19

申请人： Richard R. Hall ,  How T. Lin ,  Christopher J. Majka ,  Matthew F. Seward ,  Ronald V. Smith

发明人： Richard R. Hall ,  How T. Lin ,  Christopher J. Majka ,  Matthew F. Seward ,  Ronald V. Smith

IPC分类号： H01R12/04 ,  H05K1/11

CPC分类号： H05K3/4046 ,  H05K3/4614 ,  H05K2201/0382 ,  H05K2201/096 ,  H05K2201/10234 ,  H05K2201/10416

摘要： A method and associated structure for forming a conductive path within a laminate. A conductive element is presses into an opening in the laminate such that portion of at least one end of the conductive element extends beyond a surface of the laminate. A compressive pressure is applied to the portion of the at least one end of the conductive element. The compressive pressure applied to the at least one end of the conductive element forms a contact pad extending beyond the surface of the laminate. The conductive element may include an inner element covered by an outer element.

摘要翻译： 一种用于在层压板内形成导电路径的方法和相关结构。 导电元件被压入层压板中的开口中，使得导电元件的至少一端的一部分延伸超过层压体的表面。 对导电元件的至少一个端部的部分施加压缩压力。 施加到导电元件的至少一个端部的压缩压力形成延伸超过层压体表面的接触垫。 导电元件可以包括被外部元件覆盖的内部元件。

公开(公告)号：US20120015532A1

公开(公告)日：2012-01-19

申请号：US12837640

申请日：2010-07-16

申请人： Voya R. Markovich ,  Ronald V. Smith ,  How T. Lin ,  Frank D. Egitto ,  Rabindra N. Das ,  William E. Wilson ,  Rajinder S. Rai

发明人： Voya R. Markovich ,  Ronald V. Smith ,  How T. Lin ,  Frank D. Egitto ,  Rabindra N. Das ,  William E. Wilson ,  Rajinder S. Rai

IPC分类号： H01R12/00 ,  H01L21/66

CPC分类号： H05K3/3436 ,  H05K1/111 ,  H05K2201/10378 ,  Y02P70/613 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49147 ,  Y10T29/4919

摘要： A flexible, high density decal and the use thereof methods of forming detachable electrical interconnections between a flexible chip carrier and a printed wiring board. The flexible decal has fine-pitch pads on a first surface and pads of a pitch wider than the fine pitch on a second surface, the fine-pitch pads on the first surface designed to electrically connect to a semiconductor device, and the wider-pitch pads on the second surface designed to electrically connect to a printed wiring board or the like. The pads on the first surface are conductively wired to the pads on the second surface through one or more insulating levels in the flexible decal.

摘要翻译： 柔性，高密度贴花及其在柔性芯片载体和印刷线路板之间形成可拆卸电互连的方法。 柔性贴花在第一表面上具有细间距焊盘，并且在第二表面上具有比微细间距更宽的间距的焊盘，设计成电连接到半导体器件的第一表面上的细间距焊盘和较宽间距 第二表面上的焊盘被设计成电连接到印刷线路板等。 第一表面上的焊盘通过柔性贴花中的一个或多个绝缘水平导电地连接到第二表面上的焊盘。

公开(公告)号：US07803688B2

公开(公告)日：2010-09-28

申请号：US12380616

申请日：2009-03-02

申请人： Rabindra N. Das ,  Frank D. Egitto ,  John M. Lauffer ,  How T. Lin ,  Voya R. Markovich

发明人： Rabindra N. Das ,  Frank D. Egitto ,  John M. Lauffer ,  How T. Lin ,  Voya R. Markovich

IPC分类号： H01L21/20

CPC分类号： H05K1/162 ,  H01L27/12 ,  H01L28/40 ,  H05K1/0306 ,  H05K3/125 ,  H05K3/4667 ,  H05K2201/0187 ,  H05K2201/09509 ,  H05K2203/013

摘要： A capacitive substrate and method of making same in which first and second glass layers are used. A first conductor is formed on a first of the glass layers and a capacitive dielectric material is positioned over the conductor. The second conductor is then positioned on the capacitive dielectric and the second glass layer positioned over the second conductor. Conductive thru-holes are formed to couple to the first and second conductors, respectively, such that the conductors and capacitive dielectric material form a capacitor when the capacitive substrate is in operation.

摘要翻译： 电容性基板及其制造方法，其中使用第一和第二玻璃层。 第一导体形成在第一玻璃层上，并且电容电介质材料位于导体上方。 然后将第二导体定位在电容电介质上，并且第二玻璃层位于第二导体上。 形成导电通孔以分别耦合到第一和第二导体，使得当电容基板工作时，导体和电容电介质材料形成电容器。

公开(公告)号：US07738249B2

公开(公告)日：2010-06-15

申请号：US11976468

申请日：2007-10-25

申请人： Benson Chan ,  Frank D. Egitto ,  How T. Lin ,  Roy H. Magnuson ,  Voya R. Markovich ,  David L. Thomas

发明人： Benson Chan ,  Frank D. Egitto ,  How T. Lin ,  Roy H. Magnuson ,  Voya R. Markovich ,  David L. Thomas

IPC分类号： H05K7/20

CPC分类号： H05K1/0206 ,  H01L2924/0002 ,  H05K1/0272 ,  H05K3/0061 ,  H05K3/44 ,  H05K2201/064 ,  H05K2201/09745 ,  H05K2201/10674 ,  Y10S428/901 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T428/24917 ,  H01L2924/00

摘要： An electrical assembly which includes a circuitized substrate including a first plurality of dielectric and electrically conductive circuit layers alternatively oriented in a stacked orientation, a thermal cooling structure bonded to one of the dielectric layers and at least one electrical component mounted on the circuitized substrate. The circuitized substrate includes a plurality of electrically conductive and thermally conductive thru-holes located therein, selected ones of the thermally conductive thru-holes thermally coupled to the electrical component(s) and extending through the first plurality of dielectric and electrically conductive circuit layers and being thermally coupled to the thermal cooling structure, each of these selected ones of thermally conductive thru-holes providing a thermal path from the electrical component to the thermal cooling structure during assembly operation. The thermal cooling structure is adapted for having cooling fluid pass there-through during operation of the assembly. A method of making the substrate is also provided.

摘要翻译： 一种电气组件，其包括电路化衬底，其包括以层叠取向交替取向的第一多个电介质和导电电路层，结合到所述电介质层之一的热冷结构和安装在所述电路化衬底上的至少一个电气部件。 电路化衬底包括位于其中的多个导电和导热通孔，选择的导热通孔热耦合到电气部件并延伸穿过第一多个电介质和导电电路层，并且 热耦合到热冷却结构，这些选择的导热通孔中的每一个在组装操作期间提供从电气部件到热冷却结构的热路径。 热冷却结构适于在组件的操作期间使冷却流体通过。 还提供了制造基板的方法。

公开(公告)号：US20090206051A1

公开(公告)日：2009-08-20

申请号：US12380616

申请日：2009-03-02

申请人： Rabindra N. Das ,  Frank D. Egitto ,  John M. Lauffer ,  How T. Lin ,  Voya R. Markovich

发明人： Rabindra N. Das ,  Frank D. Egitto ,  John M. Lauffer ,  How T. Lin ,  Voya R. Markovich

IPC分类号： H01G13/00 ,  B05D5/12 ,  C23C14/34 ,  C23C14/30 ,  B05D3/00

CPC分类号： H05K1/162 ,  H01L27/12 ,  H01L28/40 ,  H05K1/0306 ,  H05K3/125 ,  H05K3/4667 ,  H05K2201/0187 ,  H05K2201/09509 ,  H05K2203/013

摘要： A capacitive substrate and method of making same in which first and second glass layers are used. A first conductor is formed on a first of the glass layers and a capacitive dielectric material is positioned over the conductor. The second conductor is then positioned on the capacitive dielectric and the second glass layer positioned over the second conductor. Conductive thru-holes are formed to couple to the first and second conductors, respectively, such that the conductors and capacitive dielectric material form a capacitor when the capacitive substrate is in operation.

摘要翻译： 电容性基板及其制造方法，其中使用第一和第二玻璃层。 第一导体形成在第一玻璃层上，并且电容电介质材料位于导体上方。 然后将第二导体定位在电容电介质上，并且第二玻璃层位于第二导体上。 形成导电通孔以分别耦合到第一和第二导体，使得当电容基板工作时，导体和电容电介质材料形成电容器。

公开(公告)号：US06635866B2

公开(公告)日：2003-10-21

申请号：US09838645

申请日：2001-04-19

申请人： Benson Chan ,  Richard R. Hall ,  How T. Lin ,  John H. Sherman

发明人： Benson Chan ,  Richard R. Hall ,  How T. Lin ,  John H. Sherman

IPC分类号： H01J502

CPC分类号： G02B6/4292 ,  G02B6/3885 ,  G02B6/3897 ,  G02B6/4232 ,  G02B6/4249

摘要： An optical coupler that provides for the direct mounting of integrated circuit(s). The coupler includes a two-part housing with grooves for accommodating optical fibers that are held in place when the two parts are put together. Circuitry is formed on the housing and solder balls, when heated to a liquid state and cooled (reflowed), are used to attach integrated circuit(s) onto the housing. At least one of these integrated circuit(s) is an optical die that is positioned in close proximity to the optical fibers to provide for the receipt and/or transmission of optical signals. The reflowing of the solder balls forms an electrical connection between the circuitry on the housing and the integrated circuit(s) and provides for alignment of these components. The housing is attached to a circuitized substrate using reflowed solder balls or wirebonds.

公开(公告)号：US5315227A

公开(公告)日：1994-05-24

申请号：US010888

申请日：1993-01-29

申请人： Mark V. Pierson ,  How T. Lin

发明人： Mark V. Pierson ,  How T. Lin

IPC分类号： B60L8/00 ,  B60L11/18 ,  H02J7/35 ,  H02J7/00

CPC分类号： B60L11/1818 ,  B60L11/1824 ,  B60L11/1833 ,  B60L11/1844 ,  H02J7/355 ,  B60L2200/26 ,  B60L2210/30 ,  B60L2230/22 ,  B60L2230/30 ,  Y02E60/721 ,  Y02T10/7005 ,  Y02T10/7088 ,  Y02T10/7241 ,  Y02T90/121 ,  Y02T90/125 ,  Y02T90/127 ,  Y02T90/128 ,  Y02T90/14 ,  Y02T90/163 ,  Y04S10/126 ,  Y10S136/291 ,  Y10S136/293

摘要： A solar recharge station is described having a contact area, a battery bank charge area and a solar panel array for maintaining the battery bank charged. The contact area includes electric contacts formed for engagement automatically by contacts on an electric powered vehicle as the vehicle enters the contact area. The battery bank is connected so that its energy is available for either recharging the vehicle or other use, and in case the vehicle needs a recharge but the battery banks lacks sufficient charge, ordinary house voltage is used.

摘要翻译： 描述了具有接触区域，电池组充电区域和用于维持电池组充电的太阳能电池板阵列的太阳能充电站。 接触区域包括当车辆进入接触区域时由电动车辆上的触点自动地接合形成的电触头。 电池组被连接，使得其能量可用于对车辆或其他用途进行充电，并且如果车辆需要充电，但是电池组缺少足够的电量，则使用普通房屋电压。