公开(公告)号：US08111520B2

公开(公告)日：2012-02-07

申请号：US12344817

申请日：2008-12-29

申请人： Hyun-Soo Chung ,  Dong-Ho Lee ,  Dong-Han Kim ,  Seong-Deok Hwang ,  Ki-Hyuk Kim

发明人： Hyun-Soo Chung ,  Dong-Ho Lee ,  Dong-Han Kim ,  Seong-Deok Hwang ,  Ki-Hyuk Kim

IPC分类号： H05K1/18

CPC分类号： H05K1/185 ,  H01L23/49816 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/82 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/32145 ,  H01L2224/73267 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01082 ,  H05K3/3457 ,  H05K3/4694 ,  H05K2201/10719

摘要： A semiconductor module can include a printed circuit board (PCB) and a semiconductor package inserted into an inner space of the PCB. The semiconductor package may be electrically connected to the PCB. The PCB may thus surround the semiconductor package so that cracks may not be generated in the outer terminals.

摘要翻译： 半导体模块可以包括插入到PCB的内部空间中的印刷电路板（PCB）和半导体封装。 半导体封装可以电连接到PCB。 因此，PCB可以围绕半导体封装，从而可能不会在外部端子中产生裂纹。

公开(公告)号：US20090109642A1

公开(公告)日：2009-04-30

申请号：US12249047

申请日：2008-10-10

申请人： Hyun-Soo Chung ,  Dong-Ho Lee ,  Seong-Deok Hwang ,  Sun-Won Kang ,  Ki-Hyuk Kim

发明人： Hyun-Soo Chung ,  Dong-Ho Lee ,  Seong-Deok Hwang ,  Sun-Won Kang ,  Ki-Hyuk Kim

IPC分类号： H05K7/00

CPC分类号： H05K1/0271 ,  H01L23/498 ,  H01L25/0652 ,  H01L2224/16 ,  H01L2924/12044 ,  H05K1/181 ,  H05K2201/0133 ,  H05K2201/10674 ,  H05K2203/1572

摘要： Semiconductor devices and electronic devices using the same. The semiconductor module may include a first semiconductor chip, and a module substrate having a top surface on which the first semiconductor chip is mounted and a second surface opposite the top surface, wherein the module substrate includes a first buffer layer to relieve stress occurring due to a difference of thermal expansions between the first semiconductor chip and the module substrate.

摘要翻译： 半导体器件和使用其的电子器件。 半导体模块可以包括第一半导体芯片和具有安装有第一半导体芯片的顶表面的模块衬底和与顶表面相对的第二表面，其中模块衬底包括第一缓冲层，以缓解由于 第一半导体芯片和模块基板之间的热膨胀差异。

公开(公告)号：US08039937B2

公开(公告)日：2011-10-18

申请号：US12432003

申请日：2009-04-29

申请人： Hyun-Soo Chung ,  Seung-Kwan Ryu ,  Ju-Il Choi ,  Dong-Ho Lee ,  Seong-Deok Hwang

发明人： Hyun-Soo Chung ,  Seung-Kwan Ryu ,  Ju-Il Choi ,  Dong-Ho Lee ,  Seong-Deok Hwang

IPC分类号： H01L23/02

CPC分类号： H01L21/76898 ,  H01L23/3128 ,  H01L23/3178 ,  H01L23/481 ,  H01L24/03 ,  H01L24/05 ,  H01L24/06 ,  H01L24/16 ,  H01L24/19 ,  H01L24/20 ,  H01L24/82 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/02313 ,  H01L2224/02372 ,  H01L2224/02379 ,  H01L2224/0239 ,  H01L2224/036 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/05009 ,  H01L2224/05548 ,  H01L2224/06181 ,  H01L2224/11334 ,  H01L2224/11462 ,  H01L2224/12105 ,  H01L2224/13024 ,  H01L2224/13025 ,  H01L2224/16145 ,  H01L2224/16235 ,  H01L2224/94 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06586 ,  H01L2225/1058 ,  H01L2924/00 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/18162 ,  H01L2924/01028 ,  H01L2224/03

摘要： Provided are methods of fabricating semiconductor chips, semiconductor chips formed by the methods, and chip-stack packages having the semiconductor chips. One embodiment specifies a method that includes patterning a scribe line region of a semiconductor substrate to form a semiconductor strut spaced apart from edges of a chip region of the semiconductor substrate.

摘要翻译： 提供制造半导体芯片的方法，通过该方法形成的半导体芯片和具有半导体芯片的芯片堆叠封装。 一个实施例规定了一种方法，其包括图案化半导体衬底的划线区域以形成与半导体衬底的芯片区域的边缘间隔开的半导体支柱。

公开(公告)号：US08735276B2

公开(公告)日：2014-05-27

申请号：US13365378

申请日：2012-02-03

申请人： Hyun-Soo Chung ,  Jae-Shin Cho ,  Dong-Ho Lee ,  Dong-Hyeon Jang ,  Seong-Deok Hwang ,  Seung-Duk Baek

发明人： Hyun-Soo Chung ,  Jae-Shin Cho ,  Dong-Ho Lee ,  Dong-Hyeon Jang ,  Seong-Deok Hwang ,  Seung-Duk Baek

IPC分类号： H01L21/768

CPC分类号： H01L24/91 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/73 ,  H01L25/0657 ,  H01L2224/02166 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05599 ,  H01L2224/13099 ,  H01L2224/16145 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48463 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06568 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/00

摘要： Provided are semiconductor packages and methods of manufacturing the semiconductor package. The semiconductor packages may include a substrate including a chip pad, a redistributed line which is electrically connected to the chip pad and includes an opening. The semiconductor packages may also include an external terminal connection portion, and an external terminal connection pad which is disposed at an opening and electrically connected to the redistributed line. The present general inventive concept can solve the problem where an ingredient of gold included in a redistributed line may be prevented from being diffused into an adjacent bump pad to form a void or an undesired intermetallic compound. In a chip on chip structure, a plurality of bumps of a lower chip are connected to an upper chip to improve reliability, diversity and functionality of the chip on chip structure.

摘要翻译： 提供半导体封装和制造半导体封装的方法。 半导体封装可以包括衬底，其包括芯片焊盘，电连接到芯片焊盘并且包括开口的再分布线。 半导体封装还可以包括外部端子连接部分和设置在开口处并电连接到重新分配线路的外部端子连接焊盘。 本发明的总体构思可以解决包含在再分布线中的金的成分被阻止扩散到相邻的凸块焊盘中以形成空隙或不期望的金属间化合物的问题。 在片上芯片结构中，下部芯片的多个凸起连接到上部芯片以提高片上芯片结构的可靠性，分集性和功能性。

公开(公告)号：US20100032807A1

公开(公告)日：2010-02-11

申请号：US12588231

申请日：2009-10-08

申请人： Hyun-Soo Chung ,  Seung-Duk Baek ,  Dong-Ho Lee ,  Dong-Hyeon Jang ,  Seong-Deok Hwang

发明人： Hyun-Soo Chung ,  Seung-Duk Baek ,  Dong-Ho Lee ,  Dong-Hyeon Jang ,  Seong-Deok Hwang

IPC分类号： H01L23/544

CPC分类号： H01L23/3114 ,  H01L24/10 ,  H01L24/13 ,  H01L25/0655 ,  H01L25/50 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05022 ,  H01L2224/05024 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05171 ,  H01L2224/05548 ,  H01L2224/05647 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/274 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/3025 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2924/00014

摘要： A wafer level semiconductor module may include a module board and an IC chip set mounted on the module board. The IC chip set may include a plurality of IC chips having scribe lines areas between the adjacent IC chips. Each IC chip may have a semiconductor substrate having an active surface with a plurality of chip pads and a back surface. A passivation layer may be provided on the active surface of the semiconductor substrate of each IC chip and may having openings through which the chip pads may be exposed. Sealing portions may be formed in scribe line areas.

摘要翻译： 晶片级半导体模块可以包括安装在模块板上的模块板和IC芯片组。 IC芯片组可以包括在相邻IC芯片之间具有划线区域的多个IC芯片。 每个IC芯片可以具有具有多个芯片焊盘和后表面的有源表面的半导体衬底。 可以在每个IC芯片的半导体衬底的有源表面上提供钝化层，并且可以具有可以暴露芯片焊盘的开口。 密封部分可以形成在划线区域中。

公开(公告)号：US07626260B2

公开(公告)日：2009-12-01

申请号：US11751464

申请日：2007-05-21

申请人： Hyun-Soo Chung ,  Cha-Jea Jo ,  Dong-Ho Lee ,  Seong-Deok Hwang

发明人： Hyun-Soo Chung ,  Cha-Jea Jo ,  Dong-Ho Lee ,  Seong-Deok Hwang

IPC分类号： H01L23/34

CPC分类号： H01L23/473 ,  H01L25/0657 ,  H01L25/50 ,  H01L2225/06513 ,  H01L2225/06524 ,  H01L2225/06541 ,  H01L2225/06589 ,  H01L2924/0002 ,  H01L2924/10158 ,  H01L2924/00

摘要： Provided is a semiconductor device having a cooling path on its bottom surface. The stack-type semiconductor device having a cooling path comprises a stack-type semiconductor chip comprising a first semiconductor chip and a second semiconductor chip. The first semiconductor chip comprises a first surface in which a circuit unit is formed and a second surface in which a first cooling path is formed, and the second semiconductor chip comprises a first surface in which a circuit unit is formed and a second surface in which a second cooling path is formed. The second surface of the first semiconductor chip and the second surface of the second semiconductor chip are bonded to each other, and a third cooling path is formed in the middle of the stack-type semiconductor chip using the first and second cooling paths. Warpage of the stack-type semiconductor device is suppressed and heat is easily dissipated.

摘要翻译： 提供了在其底面上具有冷却路径的半导体器件。 具有冷却路径的叠层型半导体器件包括：堆叠型半导体芯片，包括第一半导体芯片和第二半导体芯片。 第一半导体芯片包括其中形成有电路单元的第一表面和形成有第一冷却路径的第二表面，并且第二半导体芯片包括其中形成电路单元的第一表面和第二表面，其中第二表面 形成第二冷却路径。 第一半导体芯片的第二表面和第二半导体芯片的第二表面彼此接合，并且使用第一和第二冷却路径在堆叠型半导体芯片的中间形成第三冷却路径。 堆叠型半导体器件的翘曲被抑制，并且易于散热。

公开(公告)号：US20120129334A1

公开(公告)日：2012-05-24

申请号：US13365378

申请日：2012-02-03

申请人： Hyun-Soo CHUNG ,  Jae-Shin Cho ,  Dong-Ho Lee ,  Dong-Hyeon Jang ,  Seong-Deok Hwang ,  Seung-Duk Baek

发明人： Hyun-Soo CHUNG ,  Jae-Shin Cho ,  Dong-Ho Lee ,  Dong-Hyeon Jang ,  Seong-Deok Hwang ,  Seung-Duk Baek

IPC分类号： H01L21/768

CPC分类号： H01L24/91 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/73 ,  H01L25/0657 ,  H01L2224/02166 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05599 ,  H01L2224/13099 ,  H01L2224/16145 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48463 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06568 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/00

摘要： Provided are semiconductor packages and methods of manufacturing the semiconductor package. The semiconductor packages may include a substrate including a chip pad, a redistributed line which is electrically connected to the chip pad and includes an opening. The semiconductor packages may also include an external terminal connection portion, and an external terminal connection pad which is disposed at an opening and electrically connected to the redistributed line. The present general inventive concept can solve the problem where an ingredient of gold included in a redistributed line may be prevented from being diffused into an adjacent bump pad to form a void or an undesired intermetallic compound. In a chip on chip structure, a plurality of bumps of a lower chip are connected to an upper chip to improve reliability, diversity and functionality of the chip on chip structure.

摘要翻译： 提供半导体封装和制造半导体封装的方法。 半导体封装可以包括衬底，其包括芯片焊盘，电连接到芯片焊盘并且包括开口的再分布线。 半导体封装还可以包括外部端子连接部分和设置在开口处并电连接到重新分配线路的外部端子连接焊盘。 本发明的总体构思可以解决包含在再分布线中的金的成分被阻止扩散到相邻的凸块焊盘中以形成空隙或不期望的金属间化合物的问题。 在片上芯片结构中，下部芯片的多个凸起连接到上部芯片以提高片上芯片结构的可靠性，分集性和功能性。

公开(公告)号：US08110922B2

公开(公告)日：2012-02-07

申请号：US12588231

申请日：2009-10-08

申请人： Hyun-Soo Chung ,  Seung-Duk Baek ,  Dong-Ho Lee ,  Dong-Hyeon Jang ,  Seong-Deok Hwang

发明人： Hyun-Soo Chung ,  Seung-Duk Baek ,  Dong-Ho Lee ,  Dong-Hyeon Jang ,  Seong-Deok Hwang

IPC分类号： H01L23/48

CPC分类号： H01L23/3114 ,  H01L24/10 ,  H01L24/13 ,  H01L25/0655 ,  H01L25/50 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05022 ,  H01L2224/05024 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05171 ,  H01L2224/05548 ,  H01L2224/05647 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/274 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/3025 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2924/00014

摘要： A wafer level semiconductor module may include a module board and an IC chip set mounted on the module board. The IC chip set may include a plurality of IC chips having scribe lines areas between the adjacent IC chips. Each IC chip may have a semiconductor substrate having an active surface with a plurality of chip pads and a back surface. A passivation layer may be provided on the active surface of the semiconductor substrate of each IC chip and may having openings through which the chip pads may be exposed. Sealing portions may be formed in scribe line areas.

摘要翻译： 晶片级半导体模块可以包括安装在模块板上的模块板和IC芯片组。 IC芯片组可以包括在相邻IC芯片之间具有划线区域的多个IC芯片。 每个IC芯片可以具有具有多个芯片焊盘和后表面的有源表面的半导体衬底。 可以在每个IC芯片的半导体衬底的有源表面上提供钝化层，并且可以具有可以暴露芯片焊盘的开口。 密封部分可以形成在划线区域中。

公开(公告)号：US07847416B2

公开(公告)日：2010-12-07

申请号：US12498913

申请日：2009-07-07

申请人： Hyun-Soo Chung ,  In-Young Lee ,  Son-Kwan Hwang ,  Dong-Ho Lee ,  Seong-Deok Hwang

发明人： Hyun-Soo Chung ,  In-Young Lee ,  Son-Kwan Hwang ,  Dong-Ho Lee ,  Seong-Deok Hwang

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L25/50 ,  H01L21/76898 ,  H01L25/0657 ,  H01L29/0657 ,  H01L2224/0401 ,  H01L2224/05548 ,  H01L2224/05567 ,  H01L2224/0557 ,  H01L2224/06181 ,  H01L2224/13025 ,  H01L2224/94 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2225/06555 ,  H01L2225/06586 ,  H01L2924/0002 ,  H01L2924/01006 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01093 ,  H01L2224/11 ,  H01L2224/05552

摘要： Wafer level packages and methods of fabricating the same are provided. In one embodiment, one of the methods comprises forming semiconductor chips having a connection pad on a wafer, patterning a bottom surface of the wafer to form a trench under the connection pad, patterning a bottom surface of the trench to form a via hole exposing the bottom surface of the connection pad, and forming a connecting device connected to the connection pad through the via hole. The invention provides a wafer level package having reduced thickness, lower fabrication costs, and increased reliability compared to conventional packages.

摘要翻译： 提供了晶片级封装及其制造方法。 在一个实施例中，方法之一包括形成在晶片上具有连接焊盘的半导体芯片，图案化晶片的底表面以在连接焊盘下方形成沟槽，图案化沟槽的底表面以形成通孔， 并且通过通孔形成连接到连接垫的连接装置。 本发明提供了与传统封装相比，具有减小的厚度，较低的制造成本和增加的可靠性的晶片级封装。

公开(公告)号：US20090184411A1

公开(公告)日：2009-07-23

申请号：US12353501

申请日：2009-01-14

申请人： Hyun-Soo CHUNG ,  Jae-Shin Cho ,  Dong-Ho Lee ,  Dong-Hyeon Jang ,  Seong-Deok Hwang ,  Seung-Duk Baek

发明人： Hyun-Soo CHUNG ,  Jae-Shin Cho ,  Dong-Ho Lee ,  Dong-Hyeon Jang ,  Seong-Deok Hwang ,  Seung-Duk Baek

IPC分类号： H01L23/48

CPC分类号： H01L24/91 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/73 ,  H01L25/0657 ,  H01L2224/02166 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05599 ,  H01L2224/13099 ,  H01L2224/16145 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48463 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06568 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/00

摘要： Provided are semiconductor packages and methods of manufacturing the semiconductor package. The semiconductor packages may include a substrate including a chip pad, a redistributed line which is electrically connected to the chip pad and includes an opening. The semiconductor packages may also include an external terminal connection portion, and an external terminal connection pad which is disposed at an opening and electrically connected to the redistributed line. The present general inventive concept can solve the problem where an ingredient of gold included in a redistributed line may be prevented from being diffused into an adjacent bump pad to form a void or an undesired intermetallic compound. In a chip on chip structure, a plurality of bumps of a lower chip are connected to an upper chip to improve reliability, diversity and functionality of the chip on chip structure.

摘要翻译： 提供半导体封装和制造半导体封装的方法。 半导体封装可以包括衬底，其包括芯片焊盘，电连接到芯片焊盘并且包括开口的再分布线。 半导体封装还可以包括外部端子连接部分和设置在开口处并电连接到重新分配线路的外部端子连接焊盘。 本发明的总体构思可以解决包含在再分布线中的金的成分被阻止扩散到相邻的凸块焊盘中以形成空隙或不期望的金属间化合物的问题。 在片上芯片结构中，下部芯片的多个凸起连接到上部芯片以提高片上芯片结构的可靠性，分集性和功能性。