公开(公告)号：US4731282A

公开(公告)日：1988-03-15

申请号：US854808

申请日：1986-04-23

申请人： Isao Tsukagoshi ,  Yutaka Yamaguchi ,  Tadamitsu Nakayama

发明人： Isao Tsukagoshi ,  Yutaka Yamaguchi ,  Tadamitsu Nakayama

IPC分类号： H01L23/498 ,  H01R4/04 ,  H05K3/32 ,  H05K3/36 ,  B32B5/16 ,  C09J7/02

CPC分类号： H01L23/49883 ,  H01R4/04 ,  H05K3/323 ,  H01L2224/83101 ,  H01L2924/0002 ,  H05K2201/0129 ,  H05K2201/0133 ,  H05K2201/0266 ,  H05K3/361 ,  Y10S428/929 ,  Y10T428/23943 ,  Y10T428/25 ,  Y10T428/252 ,  Y10T428/254 ,  Y10T428/256 ,  Y10T428/28

摘要： An anisotropic-electroconductive adhesive film containing a small quantity of electroconductive particles having a special shape in an adhesive component layer which has a limited thickness is useful for connecting micro-sized circuits, etc. due to its anisotropy in electroconductivity and good transparency.

摘要翻译： 含有少量导电粒子的各向异性导电粘合剂薄膜，由于其导电性的各向异性和良好的透明性而用于连接微小尺寸的电路等。

公开(公告)号：US5001542A

公开(公告)日：1991-03-19

申请号：US443169

申请日：1989-11-30

申请人： Isao Tsukagoshi ,  Yutaka Yamaguchi ,  Atsuo Nakajima ,  Yasushi Goto

发明人： Isao Tsukagoshi ,  Yutaka Yamaguchi ,  Atsuo Nakajima ,  Yasushi Goto

IPC分类号： H01R4/04 ,  C09J163/00 ,  G06K19/077 ,  H01B1/00 ,  H01B1/20 ,  H01L21/52 ,  H01L21/56 ,  H01L21/60 ,  H01L23/482 ,  H01L23/498 ,  H05K3/32

CPC分类号： H01L24/83 ,  H01L21/563 ,  H01L23/4828 ,  H01L23/49883 ,  H01L24/05 ,  H01L24/29 ,  H05K3/323 ,  H01L2224/0401 ,  H01L2224/05571 ,  H01L2224/274 ,  H01L2224/2919 ,  H01L2224/29339 ,  H01L2224/29355 ,  H01L2224/29386 ,  H01L2224/2939 ,  H01L2224/294 ,  H01L2224/29499 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/81136 ,  H01L2224/81801 ,  H01L2224/82365 ,  H01L2224/83101 ,  H01L2224/83851 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01024 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01054 ,  H01L2924/0106 ,  H01L2924/01073 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/09701 ,  H01L2924/15151 ,  H05K2201/0221 ,  H05K2201/0233 ,  H05K2201/10674 ,  H05K2203/1163 ,  H05K3/321

摘要： A composition comprising (A) an epoxy resin type adhesive, (B) particles obtained by coating a nucleus of a curing agent with a film, (C) pressure-deformable electroconductive particles having an average particles size larger than that of the particles (B), and if necessary (D) rigid particles having an average particle size smaller than that of the particles (B), is effective for connecting circuits electrically or connecting a semiconductor chip to a wiring substrate.

公开(公告)号：US5120665A

公开(公告)日：1992-06-09

申请号：US671472

申请日：1991-03-19

申请人： Isao Tsukagoshi ,  Yutaka Yamaguchi ,  Atsuo Nakajima ,  Yasushi Goto

发明人： Isao Tsukagoshi ,  Yutaka Yamaguchi ,  Atsuo Nakajima ,  Yasushi Goto

IPC分类号： H01R4/04 ,  C09J163/00 ,  G06K19/077 ,  H01B1/00 ,  H01B1/20 ,  H01L21/52 ,  H01L21/56 ,  H01L21/60 ,  H01L23/482 ,  H01L23/498 ,  H05K3/32

CPC分类号： H01L24/83 ,  H01L21/563 ,  H01L23/4828 ,  H01L23/49883 ,  H01L24/05 ,  H01L24/29 ,  H05K3/323 ,  H01L2224/0401 ,  H01L2224/05571 ,  H01L2224/274 ,  H01L2224/2919 ,  H01L2224/29339 ,  H01L2224/29355 ,  H01L2224/29386 ,  H01L2224/2939 ,  H01L2224/294 ,  H01L2224/29499 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/81136 ,  H01L2224/81801 ,  H01L2224/82365 ,  H01L2224/83101 ,  H01L2224/83851 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01024 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01054 ,  H01L2924/0106 ,  H01L2924/01073 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/09701 ,  H01L2924/15151 ,  H05K2201/0221 ,  H05K2201/0233 ,  H05K2201/10674 ,  H05K2203/1163 ,  H05K3/321

摘要： A composition comprising (A) an epoxy resin type adhesive, (B) particles obtained by coating a nucleus of a curing agent with a film, (C) pressure-deformable electroconductive particles having an average particle size larger than that of the particles (B), and if necessary (D) rigid particles having an average particle size smaller than that of the particles (B). Also, a method of using for the composition connecting circuits electrically or connecting a semiconductor chip to a wiring substrate.

公开(公告)号：US4740657A

公开(公告)日：1988-04-26

申请号：US13904

申请日：1987-02-12

申请人： Isao Tsukagoshi ,  Yutaka Yamaguchi ,  Atsuo Nakajima ,  Yoshikatsu Mikami ,  Kuniteru Muto ,  Yoshiyuki Ikezoe

发明人： Isao Tsukagoshi ,  Yutaka Yamaguchi ,  Atsuo Nakajima ,  Yoshikatsu Mikami ,  Kuniteru Muto ,  Yoshiyuki Ikezoe

IPC分类号： H01B1/22 ,  H01R4/04 ,  H05K3/32 ,  H05K3/36 ,  H01B1/16 ,  H01R43/00

CPC分类号： H01R4/04 ,  H01B1/22 ,  H05K3/323 ,  H01L2224/293 ,  H01L2224/29399 ,  H01L2224/81903 ,  H01L2224/83851 ,  H01L2224/9211 ,  H01L2924/01019 ,  H01L2924/01079 ,  H05K2201/0221 ,  H05K2201/0233 ,  H05K2201/068 ,  H05K3/361 ,  Y10T29/49194

摘要： Excellent connection of conductors with high reliability can be accomplished by using an adhesive composition or flim capable of exhibiting anisotropic-electroconductivity comprising electroconductive particles comprising polymeric core materials coated with thin metal layers, and electrically insulating adhesive component.

公开(公告)号：US6113728A

公开(公告)日：2000-09-05

申请号：US464118

申请日：1995-06-05

申请人： Isao Tsukagoshi ,  Yutaka Yamaguchi ,  Atsuo Nakajima ,  Yasushi Goto

发明人： Isao Tsukagoshi ,  Yutaka Yamaguchi ,  Atsuo Nakajima ,  Yasushi Goto

IPC分类号： H01L21/56 ,  H01L21/58 ,  H01L21/60 ,  H01L23/482 ,  H05K3/32 ,  B32B31/00 ,  C09J5/10

CPC分类号： H01L24/83 ,  H01L21/563 ,  H01L23/4828 ,  H01L24/13 ,  H01L24/29 ,  H05K3/323 ,  H01L2224/13019 ,  H01L2224/16225 ,  H01L2224/274 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/29399 ,  H01L2224/29499 ,  H01L2224/32225 ,  H01L2224/73104 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/83101 ,  H01L2224/83136 ,  H01L2224/83191 ,  H01L2224/83855 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01054 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/14 ,  H01L2924/15151 ,  H01L2924/15788 ,  H01L2924/1579 ,  H01L2924/351 ,  H05K2201/0221 ,  H05K2201/0233 ,  H05K2201/10674 ,  H05K2203/1163 ,  H05K3/321 ,  Y10T156/1075 ,  Y10T29/4913

摘要： An adhesive film comprising (a) a liquid epoxy resin, (b) a solid resin having one or more functional groups, (c) a microcapsule type curing agent, and if necessary (d) a coupling agent, is effective for connecting semiconductor chips and wiring boards under heat and pressure.

摘要翻译： 一种粘合膜，其包含（a）液体环氧树脂，（b）具有一个或多个官能团的固体树脂，（c）微胶囊型固化剂，并且如果需要（d）偶联剂，对于连接半导体芯片是有效的 和加热和压力下的接线板。

公开(公告)号：US5843251A

公开(公告)日：1998-12-01

申请号：US853868

申请日：1992-03-20

申请人： Isao Tsukagoshi ,  Yutaka Yamaguchi ,  Atsuo Nakajima ,  Yasushi Goto

发明人： Isao Tsukagoshi ,  Yutaka Yamaguchi ,  Atsuo Nakajima ,  Yasushi Goto

IPC分类号： H01L21/56 ,  H01L21/58 ,  H01L21/60 ,  H01L23/482 ,  H05K3/32 ,  B32B31/00

CPC分类号： H01L24/83 ,  H01L21/563 ,  H01L23/4828 ,  H01L24/13 ,  H01L24/29 ,  H05K3/323 ,  H01L2224/13019 ,  H01L2224/16225 ,  H01L2224/274 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/29399 ,  H01L2224/29499 ,  H01L2224/32225 ,  H01L2224/73104 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/83101 ,  H01L2224/83136 ,  H01L2224/83191 ,  H01L2224/83855 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01054 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/14 ,  H01L2924/15151 ,  H01L2924/15788 ,  H01L2924/1579 ,  H01L2924/351 ,  H05K2201/0221 ,  H05K2201/0233 ,  H05K2201/10674 ,  H05K2203/1163 ,  H05K3/321 ,  Y10T156/1075 ,  Y10T29/4913

摘要： An adhesive film comprising (a) a liquid epoxy resin, (b) a solid resin having one or more functional groups, (c) a microcapsule type curing agent, and if necessary (d) a coupling agent, is effective for connecting semiconductor chips and wiring boards under heat and pressure.

公开(公告)号：US5155906A

公开(公告)日：1992-10-20

申请号：US672110

申请日：1991-03-19

申请人： Yasushi Goto ,  Atsuo Nakajima ,  Isao Tsukagoshi ,  Tomohisa Ohta ,  Yutaka Yamaguchi

发明人： Yasushi Goto ,  Atsuo Nakajima ,  Isao Tsukagoshi ,  Tomohisa Ohta ,  Yutaka Yamaguchi

IPC分类号： H01R43/00 ,  H05K3/22 ,  H05K3/28 ,  H05K3/32 ,  H05K3/36

CPC分类号： H05K3/225 ,  H05K3/288 ,  H05K2203/0769 ,  H05K2203/0783 ,  H05K2203/176 ,  H05K3/321 ,  H05K3/361 ,  Y10T29/49155 ,  Y10T29/49721

摘要： Circuit connections can be repaired with high accuracy and high reliability by peeling a mutually connected circuit portion to be repaired and placing a porous sheet with predetermined shape on the peeled circuit surface, impregnating the porous sheet with a peeling solution, removing the porous sheet containing unnecessary adhesive dissolved by the peeling solution, while cleaning the circuit surface contacted with the peeling solution, and reconnecting the cleaned circuit surface to a circuit surface to be connected via an adhesive.

公开(公告)号：US20100294329A1

公开(公告)日：2010-11-25

申请号：US12680258

申请日：2008-09-25

申请人： Naoki Fukushima ,  Isao Tsukagoshi

发明人： Naoki Fukushima ,  Isao Tsukagoshi

IPC分类号： H01L31/042 ,  H01B5/00 ,  H01B13/00

CPC分类号： H01L31/0508 ,  H01L31/0512 ,  Y02E10/50

摘要： The member for conductor connection of the invention is a member for conductor connection having an adhesive layer 3 formed on at least one side of a metal foil 1, wherein the metal foil 1 comprises a plurality of projections 2 of substantially equal height integrated with the metal foil 1, on the side on which the adhesive layer 3 is formed, and the adhesive layer 3 is formed to a substantially uniform thickness along the projections 2.

摘要翻译： 本发明的导体连接用构件是用于导体连接的构件，其具有形成在金属箔1的至少一侧上的粘合剂层3，其中金属箔1包括与金属一体化的基本相等高度的多个突起2 箔1，在其上形成有粘合剂层3的一侧，并且粘合剂层3沿着突起2形成为基本均匀的厚度。

公开(公告)号：US20070273342A1

公开(公告)日：2007-11-29

申请号：US11753283

申请日：2007-05-24

申请人： Tadashi Kataoka ,  Shigeru Sakata ,  Takahide Ozawa ,  Isao Tsukagoshi ,  Zheng Dai

发明人： Tadashi Kataoka ,  Shigeru Sakata ,  Takahide Ozawa ,  Isao Tsukagoshi ,  Zheng Dai

IPC分类号： G05F1/10 ,  H02J3/12

CPC分类号： H02P9/006 ,  H02P2101/10

摘要： An electric power supply apparatus includes a distributed power generator such as a gas turbine generator and a power converter such as an inverter apparatus for converting electric power generated by the distributed power generator into AC electric power (alternating-current power) having a required frequency and a required voltage and supplying the AC electric power to a load. The electric power supply apparatus further includes a control unit having output voltage vs. output current characteristics for determining an output voltage corresponding to an output current of the power converter. The output voltage vs. output current characteristics has a first dropping characteristic for causing output electric power of the electric generator to be limited, between a first output current exceeding a power generation capability of the electric generator and a second output current exceeding a power converting capability of the power converter.

摘要翻译： 电力供给装置包括燃气轮机发电机等分布式发电机和用于将由分散发电机产生的电力转换为具有所需频率的交流电力（交流电力）的逆变器装置的功率转换器，以及 所需的电压并将AC电力提供给负载。 电力供给装置还包括具有用于确定与功率转换器的输出电流对应的输出电压的输出电压与输出电流特性的控制单元。 输出电压与输出电流特性之间具有第一下降特性，用于在超过发电机的发电能力的第一输出电流与超过功率转换能力的第二输出电流之间限制发电机的输出功率 的功率转换器。

公开(公告)号：US20070148985A1

公开(公告)日：2007-06-28

申请号：US11648561

申请日：2007-01-03

申请人： Nobutaka Mizutani ,  Fitrianto . ,  Isao Tsukagoshi ,  Keizo Hirose ,  Satohiko Hoshino

发明人： Nobutaka Mizutani ,  Fitrianto . ,  Isao Tsukagoshi ,  Keizo Hirose ,  Satohiko Hoshino

IPC分类号： C23F1/00 ,  B44C1/22 ,  H01L21/311

CPC分类号： H01L21/76808 ,  H01L21/67178

摘要： A porous low-k film, a sacrificial film that can be dissolved in a pure water, an antireflection film and a resist film are successively formed on a dielectric film on a wafer and subsequently exposing the resist film to light in a prescribed pattern and developing the resist film so as to form a prescribed circuit pattern in the resist film. Then, the wafer W is etched so as to form a via hole in the porous low-k film, followed by processing the wafer with a hydrogen peroxide solution so as to denature the resist film. Further, the sacrificial film is dissolved in a pure water so as to strip the resist film and the antireflection film from the water. As a result, a via hole excellent in the accuracy of the shape is formed without doing damage to the dielectric film.