公开(公告)号：US4005450A

公开(公告)日：1977-01-25

申请号：US532923

申请日：1974-12-16

申请人： Isao Yoshida ,  Takeshi Tokuyama ,  Shigeru Nishimatsu ,  Takahide Ikeda

发明人： Isao Yoshida ,  Takeshi Tokuyama ,  Shigeru Nishimatsu ,  Takahide Ikeda

IPC分类号： H01L21/00 ,  H01L21/265 ,  H01L29/00 ,  H01L29/78

CPC分类号： H01L29/7835 ,  H01L21/00 ,  H01L21/2652 ,  H01L29/00 ,  H01L29/78

摘要： An insulated gate field effect transistor formed on one main surface of a semiconductor substrate comprises a drain region the impurity concentration of which is lower than twice that of the semiconductor substrate and the conductivity type is reverse to that of the substrate and a region of a high impurity concentration, formed in the low impurity concentration region, the conductivity type of which is the same as that of the low impurity concentration region.

摘要翻译： 形成在半导体衬底的一个主表面上的绝缘栅场效应晶体管包括其杂质浓度低于半导体衬底的杂质浓度的两倍的漏区，并且导电类型与衬底的导电类型相反， 形成在低杂质浓度区域的杂质浓度，其导电类型与低杂质浓度区域的导电类型相同。

公开(公告)号：US5793097A

公开(公告)日：1998-08-11

申请号：US519096

申请日：1995-08-24

申请人： Hiromi Shimamoto ,  Takashi Uchino ,  Takeo Shiba ,  Kazuhiro Ohnishi ,  Yoichi Tamaki ,  Takashi Kobayashi ,  Toshiyuki Kikuchi ,  Takahide Ikeda

发明人： Hiromi Shimamoto ,  Takashi Uchino ,  Takeo Shiba ,  Kazuhiro Ohnishi ,  Yoichi Tamaki ,  Takashi Kobayashi ,  Toshiyuki Kikuchi ,  Takahide Ikeda

IPC分类号： H01C7/06 ,  H01L21/02 ,  H01L21/822 ,  H01L27/04 ,  H01L27/06 ,  H01L29/00 ,  H01L23/48 ,  H01L29/76

CPC分类号： H01L27/0652 ,  H01L27/0688 ,  H01L28/20

摘要： The present invention provides a polycrystalline silicon conducting structure (e.g., a resistor) whose resistance value is controlled, and can be less variable and less dependent on temperature with respect to any resistant value, and a process of producing the same. Use is made of at least a two-layer structure including a first polycrystalline silicon layer of large crystal grain size and a second polycrystalline silicon layer of small crystal grain size, and the first polycrystalline silicon layer has a positive temperature dependence of resistance while the second polycrystalline layer has a negative temperature dependence of resistance, or vice versa. Moreover, the polycrystalline silicon layer of large grain size can be formed by high dose ion implantation and annealing, or by depositing the layers by chemical vapor deposition at different temperatures so as to form large-grain and small-grain layers.

摘要翻译： 本发明提供了一种其电阻值被控制的多晶硅导电结构（例如电阻器），并且可以相对于任何电阻值而言可以变化较小并且对温度的依赖性较小，及其制造方法。 使用至少包括具有大晶粒尺寸的第一多晶硅层和小晶粒尺寸的第二多晶硅层的两层结构，并且第一多晶硅层具有正的温度对电阻的依赖性，而第二多晶硅层的第二 多晶层具有负电阻的温度依赖性，反之亦然。 此外，可以通过高剂量离子注入和退火，或者通过在不同温度下的化学气相沉积来沉积这些层，形成大晶粒和小晶粒层，可以形成大晶粒尺寸的多晶硅层。

公开(公告)号：US5324982A

公开(公告)日：1994-06-28

申请号：US769680

申请日：1991-10-02

申请人： Shinji Nakazato ,  Hideaki Uchida ,  Yoshikazu Saito ,  Masahiro Yamamura ,  Yutaka Kobayashi ,  Takahide Ikeda ,  Ryoichi Hori ,  Goro Kitsukawa ,  Kiyoo Itoh ,  Nobuo Tanba ,  Takao Watanabe ,  Katsuhiro Shimohigashi ,  Noriyuki Homma

发明人： Shinji Nakazato ,  Hideaki Uchida ,  Yoshikazu Saito ,  Masahiro Yamamura ,  Yutaka Kobayashi ,  Takahide Ikeda ,  Ryoichi Hori ,  Goro Kitsukawa ,  Kiyoo Itoh ,  Nobuo Tanba ,  Takao Watanabe ,  Katsuhiro Shimohigashi ,  Noriyuki Homma

IPC分类号： H01L27/02 ,  H01L27/06 ,  H01L27/092 ,  H01L27/105 ,  H01L27/108 ,  H01L27/04 ,  H01L29/70

CPC分类号： H01L27/10805 ,  H01L27/0214 ,  H01L27/0623 ,  H01L27/0922 ,  H01L27/0218 ,  H01L27/105 ,  Y10S257/901 ,  Y10S257/904

摘要： Disclosed is a semiconductor device, such as a semiconductor memory device, having structure wherein invasion of minority carriers from the semiconductor substrate into components of the device, formed on the substrate, can be avoided. The semiconductor memory device can be an SRAM or DRAM, for example, and includes a memory array and peripheral circuit on a substrate. In one aspect of the present invention, a buried layer of the same conductivity type as that of the substrate, but with a higher impurity concentration than that of the substrate, is provided beneath at least one of the peripheral circuit and memory array. A further region can extend from the buried layer, for example, to the surface of the semiconductor substrate, the buried layer and further region in combination acting as a shield to prevent minority carriers from penetrating to the device elements. As a second aspect of the present invention, first carrier absorbing areas (to absorb minority carriers) are located between the memory array and the switching circuit of the peripheral circuit, and second carrier absorbing areas are provided to surround input protective elements of the device. As a third embodiment of the present invention, a plurality of isolation regions of the same conductivity type are provided, with unequal voltages applied to these isolation regions, or unequal voltages applied to the substrate, on the one hand, and to these isolation regions, on the other.

摘要翻译： 公开了一种半导体器件，例如半导体存储器件，其结构可以避免少数载流子从半导体衬底侵入形成在衬底上的器件的部件。 半导体存储器件例如可以是SRAM或DRAM，并且在衬底上包括存储器阵列和外围电路。 在本发明的一个方面中，在外围电路和存储器阵列中的至少一个之下提供与衬底相同的导电类型但具有比衬底的杂质浓度更高的杂质浓度的掩埋层。 另外的区域可以例如从掩埋层延伸到半导体衬底的表面，掩埋层和组合的另外的区域用作屏蔽以防止少数载流子穿透到器件元件。 作为本发明的第二方面，第一载流子吸收区域（以吸收少数载流子）位于存储器阵列和外围电路的开关电路之间，并且第二载流子吸收区域被设置为环绕该器件的输入保护元件。 作为本发明的第三实施例，提供了相同导电类型的多个隔离区域，一方面施加到这些隔离区域的不同电压或施加到基板的不同电压以及这些隔离区域， 在另一。

公开(公告)号：US5026654A

公开(公告)日：1991-06-25

申请号：US159925

申请日：1988-02-24

申请人： Nobuo Tanba ,  Takahide Ikeda

发明人： Nobuo Tanba ,  Takahide Ikeda

IPC分类号： H01L21/285 ,  H01L21/331 ,  H01L21/8249 ,  H01L27/06 ,  H01L29/73

CPC分类号： H01L29/66272 ,  H01L21/28525 ,  H01L21/8249 ,  H01L27/0623

摘要： Disclosed is here a semicondutor integrated circuit device and a method of manufacturing the same in which bipolar transistors and MISFETs are formed on a semiconductor substrate. Emitter and base electrodes of the bipolar transistors and gate, source, and drain electrodes of the MISFETs are constituted with the same polycrystalline layer, thereby realizing a high integration and a high-speed operation of a Bi-CMOS device.

摘要翻译： 这里公开了半导体集成电路器件及其制造方法，其中双极晶体管和MISFET形成在半导体衬底上。 双极晶体管的发射极和基极和MISFET的栅极，源极和漏极都由相同的多晶层构成，从而实现了Bi-CMOS器件的高集成度和高​​速工作。

公开(公告)号：US4377421A

公开(公告)日：1983-03-22

申请号：US186743

申请日：1980-09-12

申请人： Yasuo Wada ,  Takahide Ikeda ,  Masao Tamura

发明人： Yasuo Wada ,  Takahide Ikeda ,  Masao Tamura

IPC分类号： H01L29/73 ,  H01L21/02 ,  H01L21/20 ,  H01L21/268 ,  H01L21/331 ,  H01L29/04 ,  H01L29/08 ,  H01L29/72 ,  H01L21/263

CPC分类号： H01L28/20 ,  H01L21/268 ,  H01L29/04 ,  H01L29/0804 ,  H01L29/72 ,  Y10S117/904 ,  Y10S148/092

摘要： An insulating film is formed on a semiconductor substrate, and the insulating film on that part of the semiconductor substrate where an emitter is to be formed, is removed to expose the surface of the above part. A polycrystalline or amorphous silicon film is deposited on the entire surface, and then irradiated with a laser beam to convert that portion of the polycrystalline or amorphous silicon film which is deposited on the surface of the semiconductor substrate without interposing the insulating film therebetween, into a single crystal of silicon, thereby forming a stacked emitter.

摘要翻译： 在半导体衬底上形成绝缘膜，并且去除要形成发射极的半导体衬底的那部分上的绝缘膜，以露出上述部分的表面。 多晶或非晶硅膜沉积在整个表面上，然后用激光束照射，以将沉积在半导体衬底的表面上的多晶硅或非晶硅膜的那部分转换成其间的绝缘膜， 硅单晶，从而形成堆叠的发射极。

公开(公告)号：US07238582B2

公开(公告)日：2007-07-03

申请号：US11000092

申请日：2004-12-01

申请人： Hiromi Shimamoto ,  Takashi Uchino ,  Takeo Shiba ,  Kazuhiro Ohnishi ,  Yoichi Tamaki ,  Takashi Kobayashi ,  Toshiyuki Kikuchi ,  Takahide Ikeda

发明人： Hiromi Shimamoto ,  Takashi Uchino ,  Takeo Shiba ,  Kazuhiro Ohnishi ,  Yoichi Tamaki ,  Takashi Kobayashi ,  Toshiyuki Kikuchi ,  Takahide Ikeda

IPC分类号： H01L21/8222

CPC分类号： H01L27/0652 ,  H01L27/0688 ,  H01L28/20

摘要： The present invention provides a polycrystalline silicon conducting structure (e.g., a resistor) whose resistance value is controlled, and can be less variable and less dependent on temperature with respect to any resistant value, and a process of producing the same. Use is made of at least a two-layer structure including a first polycrystalline silicon layer of large crystal grain size and a second polycrystalline silicon layer of small crystal grain size, and the first polycrystalline silicon layer has a positive temperature dependence of resistance while the second polycrystalline silicon layer has a negative temperature dependence of resistance, or vice versa. Moreover, the polycrystalline silicon layer of large grain size can be formed by high dose ion implantation and annealing, or by depositing the layers by chemical vapor deposition at different temperatures so as to form large-grain and small-grain layers.

摘要翻译： 本发明提供了一种其电阻值被控制的多晶硅导电结构（例如电阻器），并且可以相对于任何电阻值而言可以变化较小并且对温度的依赖性较小，及其制造方法。 使用至少包括具有大晶粒尺寸的第一多晶硅层和小晶粒尺寸的第二多晶硅层的两层结构，并且第一多晶硅层具有正的温度对电阻的依赖性，而第二多晶硅层的第二 多晶硅层具有负电阻的温度依赖性，反之亦然。 此外，可以通过高剂量离子注入和退火，或者通过在不同温度下的化学气相沉积来沉积这些层，形成大晶粒和小晶粒层，可以形成大晶粒尺寸的多晶硅层。

公开(公告)号：US06208010B1

公开(公告)日：2001-03-27

申请号：US08574110

申请日：1995-12-18

申请人： Shinji Nakazato ,  Hideaki Uchida ,  Yoshikazu Saito ,  Masahiro Yamamura ,  Yutaka Kobayashi ,  Takahide Ikeda ,  Ryoichi Hori ,  Goro Kitsukawa ,  Kiyoo Itoh ,  Nobuo Tanba ,  Takao Watanabe ,  Katsuhiro Shimohigashi ,  Noriyuki Homma

发明人： Shinji Nakazato ,  Hideaki Uchida ,  Yoshikazu Saito ,  Masahiro Yamamura ,  Yutaka Kobayashi ,  Takahide Ikeda ,  Ryoichi Hori ,  Goro Kitsukawa ,  Kiyoo Itoh ,  Nobuo Tanba ,  Takao Watanabe ,  Katsuhiro Shimohigashi ,  Noriyuki Homma

IPC分类号： H01L2900

CPC分类号： H01L27/10805 ,  H01L27/0214 ,  H01L27/0218 ,  H01L27/0623 ,  H01L27/0922 ,  H01L27/105 ,  Y10S257/901 ,  Y10S257/904

摘要： Disclosed is a semiconductor device, such as a semiconductor memory device, having structure wherein invasion of minority carriers from the semiconductor substrate into components of the device, formed on the substrate, can be avoided. The semiconductor memory device can be an SRAM or DRAM, for example, and includes a memory array and peripheral circuit on a substrate. In one aspect of the present invention, a buried layer of the same conductivity type as that of the substrate, but with a higher impurity concentration than that of the substrate, is provided beneath at least one of the peripheral circuit and memory array. A further region can extend from the buried layer, for example, to the surface of the semiconductor substrate, the buried layer and further region in combination acting as a shield to prevent minority carriers from penetrating to the device elements. As a second aspect of the present invention, first carrier absorbing areas (to absorb minority carriers) are located between the memory array and the switching circuit of the peripheral circuit, and second carrier absorbing areas are provided to surround input protective elements of the device. As a third embodiment of the present invention, a plurality of isolation regions of the same conductivity type are provided, with unequal voltages applied to these isolation regions, or unequal voltages applied to the substrate, on the one hand, and to these isolation regions, on the other.

摘要翻译： 公开了一种半导体器件，例如半导体存储器件，其结构可以避免少数载流子从半导体衬底侵入形成在衬底上的器件的部件。 半导体存储器件例如可以是SRAM或DRAM，并且在衬底上包括存储器阵列和外围电路。 在本发明的一个方面中，在外围电路和存储器阵列中的至少一个之下提供与衬底相同的导电类型但具有比衬底的杂质浓度更高的杂质浓度的掩埋层。 另外的区域可以例如从掩埋层延伸到半导体衬底的表面，掩埋层和组合的另外的区域用作屏蔽以防止少数载流子穿透到器件元件。 作为本发明的第二方面，第一载流子吸收区域（以吸收少数载流子）位于存储器阵列和外围电路的开关电路之间，并且第二载流子吸收区域被设置为环绕该器件的输入保护元件。 作为本发明的第三实施例，提供了相同导电类型的多个隔离区域，一方面施加到这些隔离区域的不同电压或施加到基板的不同电压以及这些隔离区域， 在另一。

公开(公告)号：US5726488A

公开(公告)日：1998-03-10

申请号：US243325

申请日：1994-05-16

申请人： Atsuo Watanabe ,  Yoshiaki Yazawa ,  Atsushi Hiraishi ,  Masataka Minami ,  Takahiro Nagano ,  Takahide Ikeda ,  Naohiro Momma

发明人： Atsuo Watanabe ,  Yoshiaki Yazawa ,  Atsushi Hiraishi ,  Masataka Minami ,  Takahiro Nagano ,  Takahide Ikeda ,  Naohiro Momma

IPC分类号： H01L21/8234 ,  H01L21/8238 ,  H01L21/8249 ,  H01L27/06 ,  H01L27/088 ,  H01L27/092 ,  H01L29/78 ,  H01L27/02

CPC分类号： H01L27/0623 ,  H01L21/8238 ,  H01L21/8249 ,  Y10S257/921

摘要： A semiconductor device has a well region formed in the surface of a substrate, and has functional portions such as MOSFET and bipolar transistor formed in the well region. The carrier concentration profile of the well region assumes the shape of a valley in the direction of depth thereof, and a minimum point thereof has a concentration of smaller than 5.times.10.sup.15 cm.sup.-3 and is located at a position within 1.6 .mu.m from the surface of the substrate. Preferably, the minimum point should have a concentration of greater than 5.times.10.sup.14 cm.sup.-3 but smaller than 5.times.10.sup.15 cm.sup.-3, and more preferably a concentration of greater than 1.times.10.sup.15 cm.sup.-3 but smaller than 5.times.10.sup.15 cm.sup.-3.

摘要翻译： 半导体器件具有在衬底的表面中形成的阱区，并且具有形成在阱区中的诸如MOSFET和双极晶体管的功能部分。 阱区域的载流子浓度分布呈深谷方向的谷状，其最小点浓度小于5×10 15 cm -3，位于距离其表面1.6m以内的位置 底物。 优选地，最小点应该具有大于5×10 14 cm -3但小于5×10 15 cm -3的浓度，更优选大于1×10 15 cm -3但小于5×10 15 cm -3的浓度。

公开(公告)号：US5619069A

公开(公告)日：1997-04-08

申请号：US458655

申请日：1995-06-02

申请人： Hiroyuki Ohta ,  Hideo Miura ,  Hiroo Masuda ,  Yoichi Tamaki ,  Takahide Ikeda ,  Asao Nishimura ,  Takashi Hashimoto

发明人： Hiroyuki Ohta ,  Hideo Miura ,  Hiroo Masuda ,  Yoichi Tamaki ,  Takahide Ikeda ,  Asao Nishimura ,  Takashi Hashimoto

IPC分类号： H01L29/73 ,  H01L21/331 ,  H01L21/8249 ,  H01L23/485 ,  H01L27/06 ,  H01L29/732 ,  H01L23/48

CPC分类号： H01L23/4855 ,  H01L23/485 ,  H01L2924/0002 ,  Y10S148/01 ,  Y10S148/124 ,  Y10S148/135

摘要： A bipolar device having a level difference between the contact area level of a base electrode and a base region in a silicon substrate, and the contact area level of an emitter electrode and an emitter region in the silicon substrate in the range of 0.03 .mu.m to 0.1 .mu.m by removing undesirable impurities from the emitter region and a predetermined horizontal distance between a sidewall and a device isolation film does not generate dislocation and show good electric characteristics.

摘要翻译： 具有硅基板中的基极的接触面积电平与基极区域之间的电平差的硅双极器件，以及硅基板的发射电极和发射极区域的接触面积电平为0.03μm〜 通过从发射极区域去除不需要的杂质并且侧壁和器件隔离膜之间的预定水平距离不产生位错并且显示出良好的电特性，0.1μm。

公开(公告)号：US5354699A

公开(公告)日：1994-10-11

申请号：US964824

申请日：1992-10-22

申请人： Takahide Ikeda ,  Kouichirou Yamada ,  Osamu Saito ,  Masanori Odaka ,  Nobuo Tamba ,  Katsumi Ogiue ,  Atsushi Hiraishi ,  Atsuo Watanabe ,  Mitsuru Hirao ,  Akira Fukami ,  Masayuki Ohayashi ,  Tadashi Kuramoto

发明人： Takahide Ikeda ,  Kouichirou Yamada ,  Osamu Saito ,  Masanori Odaka ,  Nobuo Tamba ,  Katsumi Ogiue ,  Atsushi Hiraishi ,  Atsuo Watanabe ,  Mitsuru Hirao ,  Akira Fukami ,  Masayuki Ohayashi ,  Tadashi Kuramoto

IPC分类号： H01L21/28 ,  H01L21/285 ,  H01L21/8249 ,  H01L27/06 ,  H01L21/265

CPC分类号： H01L21/28026 ,  H01L21/28525 ,  H01L21/8249 ,  H01L27/0623 ,  Y10S148/009

摘要： Disclosed is a bipolar-CMOS LSI manufactured by a simplified process and realizing a higher density of integration as well as a higher operating speed, in which a base lead-out electrode of a bipolar transistor and respective gate electrodes of a p-channel MISFET and an n-channel MISFET of CMOS transistors are made of an identical conductor film, and the conductor film of the gate electrode of the p-channel MISFET is of p-type, while that of the gate electrode of the n-channel MISFET is of n-type.

摘要翻译： 公开了通过简化的工艺制造的双极CMOS LSI，并实现更高的集成密度以及更高的工作速度，其中双极晶体管的基极引出电极和p沟道MISFET的各自的栅电极和 CMOS晶体管的n沟道MISFET由相同的导体膜制成，并且p沟道MISFET的栅电极的导体膜为p型，而n沟道MISFET的栅电极的导体膜为 n型。